SN74AHCT08Q-Q1
SGDS021B – FEBRUARY 2002 – REVISED DECEMBER 2022
SN74AHCT08Q-Q1 Automotive Quadruple 2-Input Positive-AND Gates
1 Features
3 Description
•
•
The SN74AHCT08Q-Q1 devices are quadruple 2input positive-AND gates. These devices perform the
Boolean function Y = A ´ B or Y = A + B in positive logic.
•
•
Qualified for automotive applications
EPIC™ (enhanced-performance implanted CMOS)
process
Inputs are TTL-voltage compatible
Latch-up performance exceeds 250 mA per JESD
17
PART NUMBER
PACKAGE
D (SOIC, 14)
2 Applications
•
•
Package Information(1)
SN74AHCT08Q-Q1 PW (TSSOP, 14)
Combine power good signals
Combine enable signals
BQA (WQFN, 14)(2)
(1)
(2)
BODY SIZE (NOM)
8.65 mm × 3.91 mm
5.00 mm × 4.40 mm
3.00 mm × 2.50 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
Preview package
A
Y
B
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74AHCT08Q-Q1
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SGDS021B – FEBRUARY 2002 – REVISED DECEMBER 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics.............................................5
6.6 Switching Characteristics, VCC = 5 V ± 0.5 V..............5
6.7 Noise Characteristics.................................................. 5
6.8 Operating Characteristics........................................... 6
6.9 Typical Characteristics................................................ 6
7 Parameter Measurement Information............................ 7
8 Detailed Description........................................................8
8.1 Overview..................................................................... 8
8.2 Functional Block Diagram........................................... 8
8.3 Feature Description.....................................................8
8.4 Device Functional Modes............................................8
9 Application and Implementation.................................... 9
9.1 Application Information............................................... 9
9.2 Typical Application...................................................... 9
10 Power Supply Recommendations..............................10
11 Layout........................................................................... 10
11.1 Layout Guidelines................................................... 10
11.2 Layout Example...................................................... 10
12 Device and Documentation Support..........................11
12.1 Receiving Notification of Documentation Updates.. 11
12.2 Support Resources................................................. 11
12.3 Trademarks............................................................. 11
12.4 Electrostatic Discharge Caution.............................. 11
12.5 Glossary.................................................................. 11
13 Mechanical, Packaging, and Orderable
Information.................................................................... 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (February 2002) to Revision B (December 2022)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Added the BQA package information to the data sheet......................................................................................1
2
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5 Pin Configuration and Functions
1A
1B
1Y
2A
2B
2Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4B
4A
4Y
3B
3A
3Y
Figure 5-1. D or PW Package, 14-Pin SOIC or
TSSOP (Top View)
1A
VCC
1
14
1B
2
13
4B
1Y
3
12
4A
2A
4
11
4Y
2B
5
10
3B
2Y
6
9
3A
PAD
7
8
GND
3Y
Figure 5-2. BQA (Preview) Package, 14-Pin WQFN
(Top View)
Table 5-1. Pin Functions
PIN
NAME
NO.
1A
1
1B
1Y
TYPE
DESCRIPTION
Input
Channel 1, Input A
2
Input
Channel 1, Input B
3
Output
2A
4
Input
Channel 2, Input A
2B
5
Input
Channel 2, Input B
2Y
6
Output
GND
7
—
3Y
8
Output
3A
9
Input
Channel 3, Input A
3B
10
Input
Channel 3, Input B
4Y
11
Output
4A
12
Input
Channel 4, Input A
4B
13
Input
Channel 4, Input B
VCC
14
—
Positive Supply
—
The thermal pad can be connected to GND or left floating. Do not connect to any other
signal or supply
Thermal Pad(1)
(1)
Channel 1, Output Y
Channel 2, Output Y
Ground
Channel 3, Output Y
Channel 4, Output Y
BQA package only.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
MIN
MAX
UNIT
Supply voltage range
–0.5
7
V
range(2)
–0.5
7
V
–0.5
VCC + 0.5
V
VI
Input voltage
VO
Output voltage range(2)
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
Storage temperature range
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
Electrostatic discharge
Human body model (HBM), per AEC Q100-002 HBM ESD
Classification Level 2(1)
±2000
Charged device model (CDM), per AEC Q100-011 CDM ESD
Classification Level C4B
±1000
UNIT
V
AEC Q100-002 indicate that HBM stressing shall be in accordrance with the ANSI/ESDA/JEDEC JS-001 specification
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
4.5
5.5
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
V
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
IOH
High-level output current
IOL
Low-level output current
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
2
V
–8
–40
V
V
mA
8
mA
20
ns/V
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI Application Report,
Implications of Slow or Floating CMOS Inputs
.
4
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6.4 Thermal Information
SN74AHCT08Q-Q1
THERMAL METRIC(1)
RθJA
(1)
Junction-to-ambient thermal resistance
D
(SOIC)
PW
(TSSOP)
BQA
(WQFN)
14 PINS
14 PINS
14 PINS
86
113
88.3
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = –50 µA
VOH
4.5 V
IOH = –8 mA
IOL = 50 µA
VOL
TA = 25°C
MIN
TYP
4.4
4.5
-40°C to 125°C
MAX
MAX
4.4
3.94
UNIT
V
3.8
4.5 V
IOL = 8 mA
MIN
0.1
0.1
0.36
0.44
V
II
VI = 5.5 V or GND
0 V to
5.5 V
±0.1
±1
µA
ICC
VI = VCC or GND, IO = 0
5.5 V
2
20
µA
ΔICC (1)
One input at 3.4 V,
Other inputs at VCC or GND
5.5 V
1.35
1.5
mA
Ci
VI = VCC or GND
10
10
pF
(1)
5V
4
This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
6.6 Switching Characteristics, VCC = 5 V ± 0.5 V
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 7-1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A or B
Y
CL = 15 pF
A or B
Y
CL = 50 pF
TA = 25°C
MIN
-40°C to 125°C
TYP
MAX
MIN
MAX
5
6.9
1
8
5
6.9
1
8
5.5
7.9
1
9
5.5
7.9
1
9
UNIT
ns
ns
6.7 Noise Characteristics
VCC = 5 V, CL = 50 pF, TA = 25°C(1)
PARAMETER
SN74AHCT08Q-Q1
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.4
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
–0.4
–0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
(1)
4.4
V
2
V
0.8
V
Characteristics are for surface-mount packages only.
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6.8 Operating Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
f = 1 MHz
TYP
18
UNIT
pF
6.9 Typical Characteristics
4.5
4
3.5
TPD (ns)
3
2.5
2
1.5
1
0.5
TPD in ns
0
-100
-50
0
50
Temperature (qC)
100
150
D001
Figure 6-1. TPD vs Temperature
6
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7 Parameter Measurement Information
VCC
Test
Point
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
S1
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
3V
1.5 V
Input
1.5 V
th
tsu
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
VOH
In-Phase
Output
50% VCC
tPHL
Out-of-Phase
Output
50% VCC
VOL
3V
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
1.5 V
0V
tPZL
≈VCC
tPZH
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
tPLZ
50% VCC
tPLH
50% VCC
1.5 V
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 7-1. Load Circuit and Voltage Waveforms
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8 Detailed Description
8.1 Overview
The SN74AHCT08Q-Q1 devices are quadruple 2-input positive-AND gates with low drive that will produce slow
rise and fall times. This slow transition reduces ringing on the output signal. The device has TTL inputs that allow
up translation from 3.3 V to 5 V. The inputs are high impedance when VCC = 0 V.
8.2 Functional Block Diagram
A
Y
B
8.3 Feature Description
•
•
Slow rise and fall time on outputs allow for low-noise outputs
TTL inputs allow up translation from 3.3 V to 5 V
8.4 Device Functional Modes
Table 8-1 is the function table for the SN74AHCT08Q-Q1.
Table 8-1. Function Table
(Each Gate)
INPUTS
8
A
B
OUTPUT
Y
H
H
H
L
X
L
X
L
L
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The SN74AHCT08Q-Q1 devices are low-drive CMOS devices that can be used for a multitude of bus-interface
type applications where output ringing is a concern. The low drive and slow edge rates will minimize overshoot
and undershoot on the outputs. The TTL inputs can except voltages down to 3.3 V and translate up to 5 V.
9.2 Typical Application
3.3-V Bus Driver
VCC
5 V Regulated
0.1 µF
5-V Accessory
Figure 9-1. Typical Application Diagram
9.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. The high drive will also create
fast edges into light loads, so routing and load conditions should be considered to prevent ringing.
9.2.2 Detailed Design Procedure
1. Recommended input conditions:
• Rise time and fall time specs: See (Δt/ΔV) in the Recommended Operating Conditions table.
• Specified High and low levels: See (VIH and VIL) in the Recommended Operating Conditions table.
• Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC
2. Recommend output conditions:
• Load currents should not exceed 25 mA per output and 50 mA total for the part
• Outputs should not be pulled above VCC
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9.2.3 Application Curves
Figure 9-2. Switching Characteristics Comparison
10 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply voltage rating located in the
Recommended Operating Conditions table.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, 0.1 μF is recommended. If there are multiple VCC pins, 0.01 μF or 0.022 μF is recommended for each
power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and
1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as
possible for best results.
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices, inputs should never float.
In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two
inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not
be left unconnected because the undefined voltages at the outside connections result in undefined operational
states. Figure 11-1 shows the rules that must be observed under all circumstances. All unused inputs of digital
logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should
be applied to any particular unused input depends on the function of the device. Generally they will be tied to
GND or VCC; whichever makes more sense or is more convenient. It is generally acceptable to float outputs
unless the part is a transceiver. If the transceiver has an output enable pin, then it will disable the outputs section
of the part when asserted. This will not disable the input section of the IOs, so they cannot float when disabled.
11.2 Layout Example
Vcc
Unused Input
Input
Output
Unused Input
Output
Input
Figure 11-1. Layout Diagram
10
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
EPIC™ is a trademark of Texas Instruments.
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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15-Dec-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
PCAHCT08QWBQARQ1
ACTIVE
WQFN
BQA
14
3000
TBD
Call TI
Call TI
-40 to 125
SN74AHCT08QDRG4Q1
ACTIVE
SOIC
D
14
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT08Q
Samples
SN74AHCT08QDRQ1
ACTIVE
SOIC
D
14
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT08Q
Samples
SN74AHCT08QPWRG4Q1
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB08Q
Samples
SN74AHCT08QPWRQ1
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB08Q
Samples
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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