SN74AHCT244Q
SGDS024A – FEBRUARY 2002 – REVISED MAY 2023
SN74AHCT244Q Octal Buffer/driver with 3-State Outputs
1 Features
2 Description
•
This octal buffer/driver is designed specifically to
improve both the performance and density of 3state memory-address drivers, clock drivers, and busoriented receivers and transmitters.
•
•
•
Q devices meet automotive performance
requirements
Customer-specific configuration control can be
supported along with major-change approval
EPIC™ (Enhanced-Performance Implanted
CMOS) process
Inputs are TTL-Voltage compatible Latch-Up
performance exceeds 250 mA per JESD 17
Package Information
PART NUMBER
SN74AHCT244Q
PACKAGE1
BODY SIZE (NOM)
DW (SOIC, 20)
12.80 mm × 7.50 mm
PW (TSSOP, 20)
6.5 mm × 4.4 mm
1. For all available packages, see the orderable
addendum at the end of the data sheet.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
SN74AHCT244Q
www.ti.com
SGDS024A – FEBRUARY 2002 – REVISED MAY 2023
Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 Recommended Operating Conditions.........................4
5.3 Thermal Information....................................................4
5.4 Electrical Characteristics.............................................5
5.5 Switching Characteristics............................................5
5.6 Noise Characteristics.................................................. 6
5.7 Operating Characteristics........................................... 6
6 Parameter Measurement Information............................ 7
7 Detailed Description........................................................8
7.1 Overview..................................................................... 8
7.2 Functional Block Diagram........................................... 8
7.3 Device Functional Modes............................................8
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (February 2002) to Revision A (May 2023)
Page
• Added Package Information table, Pin Functions table, and Thermal Information table....................................1
2
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SGDS024A – FEBRUARY 2002 – REVISED MAY 2023
4 Pin Configuration and Functions
Figure 4-1. DW or PW Package (Top View)
Pin Functions
PIN
Name
NO.
I/O1
DESCRIPTION
1OE
1
I
Bank 1, output enable, active low
1A1
2
I
Bank 1, channel 1 input
2Y4
3
O
Bank 2, channel 4 output
1A2
4
I
Bank 1, channel 2 input
2Y3
5
O
Bank 2, channel 3 output
1A3
6
I
Bank 1, channel 3 input
2Y2
7
O
Bank 2, channel 2 output
1A4
8
I
Bank 1, channel 4 input
2Y1
9
O
Bank 2, channel 1 output
GND
10
—
Ground
2A1
11
I
Bank 2, channel 1 input
1Y4
12
O
Bank 1, channel 4 output
2A2
13
I
Bank 2, channel 2 input
1Y3
14
O
Bank 1, channel 3 output
2A3
15
I
Bank 2, channel 3 input
1Y2
16
O
Bank 1, channel 2 output
2A4
17
I
Bank 2, channel 4 input
1Y1
18
O
Bank 1, channel 1 output
2OE
19
I
Bank 2, output enable, active low
VCC
20
—
Positive supply
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SGDS024A – FEBRUARY 2002 – REVISED MAY 2023
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
VCC
1
VI ( )
(1)
MIN
MAX
Supply voltage range
–0.5
7
UNIT
V
Input voltage range
–0.5
7
V
VO ( )
Output voltage range
–0.5
VCC + 0.5
V
IIK
Input clamp current
(VI < 0)
–20
mA
IOK
Output clamp current
(VO < 0 or VO > VCC)
±20
mA
IO
Continuous output current
(VO = 0 to VCC)
±25
mA
±75
mA
150
°C
1
Continuous current through VCC or GND
Tstg
(1)
(2)
Storage temperature range
–65
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 Recommended Operating Conditions
(see Note 1)
MIN
MAX
4.5
5.5
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
High-level output current
–8
mA
IOL
Low-level output current
8
mA
TA
Operating free-air temperature
125
°C
(1)
2
V
V
0.8
V
0
5.5
V
0
VCC
V
–40
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
5.3 Thermal Information
SN74AHCT244Q
THERMAL METRIC(1)
RθJA
(1)
4
Junction-to-ambient thermal resistance
DW (SOIC)
PW (TSSOP)
20 PINS
20 PINS
58
83
UNIT
°C/W
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
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SGDS024A – FEBRUARY 2002 – REVISED MAY 2023
5.4 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
IOH = -50 μΑ
VOH
IOL = 50 μΑ
II
ICC
MIN
TYP
4.4
4.5
MAX
UNIT
4.4
3.94
V
3.8
0.1
0.1
0.36
0.44
V
5.5 V
±0.25
±2.5
μA
VI = 5.5 V or GND
0 V to 5.5
V
±0.1
±1
μA
5.5 V
4
40
μA
5.5 V
1.35
1.5
mA
IO = 0
One input at 3.4 V, Other
inputs at VCC or GND
Ci
VI = VCC or GND
5V
2.5
CO
Vo = VCC or gnd
5V
3
(1)
MIN
MAX
Vo = VCC or GND
VI = VCC or GND,
(1)
TA = 25°C
4.5 V
IOL = 8 mA
IOZ
VCC
4.5 V
IOH = -8 mA
VOL
ΔICC
TEST CONDITIONS
10
pF
pF
This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC.
5.5 Switching Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 6-1)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE
A
Y
CL = 15 pF
OE
Y
CL = 15 pF
OE
Y
CL = 15 pF
A
Y
CL = 50 pF
OE
Y
CL = 50 pF
OE
Y
CL = 50 pF
tsk(o)
TA = 25°C
MIN
CL = 50 pF
MIN
MAX
7.4
1
8.5
5.4
7.4
1
8.5
7.7
10.4
1
12
7.7
10.4
1
12
5
9.4
1
10
5
9.4
1
10
5.9
8.4
1
9.5
5.9
8.4
1
9.5
8.2
11.4
1
13
8.2
11.4
1
13
8.8
11.4
1
13
8.8
11.4
1
13
TYP
MAX
5.4
1
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UNIT
ns
ns
ns
ns
ns
ns
ns
5
SN74AHCT244Q
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SGDS024A – FEBRUARY 2002 – REVISED MAY 2023
5.6 Noise Characteristics
VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 1)
PARAMETER
MIN
VOH(V)
Quiet output, minimum dynamic VOH
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
(1)
TYP
MAX
4.1
UNIT
V
2
V
0.8
V
Characteristics are for surface-mount packages only.
5.7 Operating Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST CONDITIONS
No load, f = 1 MHz
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TYP
UNIT
8.2
pF
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SGDS024A – FEBRUARY 2002 – REVISED MAY 2023
6 Parameter Measurement Information
A.
B.
C.
D.
CL includes probe and jig capacitance.
Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2
is for an output with internal conditions such that the output is high except when disabled by the output control.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
The outputs are measured one at a time with one input transition per measurement.
Figure 6-1. Load Circuit and Voltage Waveforms
TEST
S1
tPLH/tPHL
Open
tPLZ/tPZL
VCC
tPHZ/tPZH
GND
Open Drain
VCC
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SGDS024A – FEBRUARY 2002 – REVISED MAY 2023
7 Detailed Description
7.1 Overview
The SN74AHCT244Q is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs.
When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in
the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
7.2 Functional Block Diagram
Figure 7-1. Logic Diagram (Positive Logic)
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Figure 7-2. Logic Symbol
7.3 Device Functional Modes
Table 7-1. Function Table (Each 4-Bit Buffer/driver)
INPUTS
8
OE
A
L
H
OUTPUT Y
H
L
L
L
H
X
Z
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PACKAGE OPTION ADDENDUM
www.ti.com
11-May-2023
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74AHCT244QDWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT244Q
Samples
SN74AHCT244QPWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB244Q
Samples
SN74AHCT244QPWRG4
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
HB244Q
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of