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SN54AHCT32, SN74AHCT32
SCLS248M – OCTOBER 1995 – REVISED OCTOBER 2014
SNx4AHCT32 Quadruple 2-Input Positive-OR Gates
1 Features
3 Description
•
•
The SNx4AHCT32 devices are quadruple 2-input
positive-OR gates. These devices perform the
Boolean function Y = A ´ B or Y = A + B in positive logic.
1
•
•
Inputs are TTL-Voltage Compatible
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model
– 200-V Machine Model
On Products Compliant to MIL-PRF-38535,
All Parameters are Tested Unless Otherwise
Noted. On All Other Products, Production
Processing Does Not Necessarily Include Testing
of All Parameters
2 Applications
•
•
•
•
Device Information(1)
PART NUMBER
SNx4AHCT32
PACKAGE
BODY SIZE (NOM)
TVSOP (14)
3.60 mm x 4.40 mm
SOIC (14)
8.65 mm × 3.91 mm
VQFN (14)
3.50 mm x 3.50 mm
SSOP (14)
6.20 mm x 5.30 mm
TSSOP (14)
5.00 mm x 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Electronic Points of Sale
Telecom Infrastructure
Network Switches
Test and Measurement
4 Simplified Schematic
A
B
A
B
A
B
A
B
Y
Y
Y
Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54AHCT32, SN74AHCT32
SCLS248M – OCTOBER 1995 – REVISED OCTOBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
4
4
4
5
5
5
6
6
6
Absolute Maximum Ratings ......................................
Handling Ratings.......................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Noise Characteristics ................................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 7
Detailed Description .............................................. 8
9.1
9.2
9.3
9.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
8
8
8
8
10 Application and Implementation.......................... 9
10.1 Application Information............................................ 9
10.2 Typical Application ................................................. 9
11 Power Supply Recommendations ..................... 10
12 Layout................................................................... 10
12.1 Layout Guidelines ................................................. 10
12.2 Layout Example .................................................... 10
13 Device and Documentation Support ................. 11
13.1
13.2
13.3
13.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
11
11
11
11
14 Mechanical, Packaging, and Orderable
Information ........................................................... 11
5 Revision History
Changes from Revision N (July 2003) to Revision M
Page
•
Updated document to new TI data sheet format. ................................................................................................................... 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
•
Added Military Disclaimer to Features list. ............................................................................................................................. 1
•
Added Applications. ................................................................................................................................................................ 1
•
Added Pin Functions table...................................................................................................................................................... 3
•
Added Handling Ratings table. ............................................................................................................................................... 4
•
Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. ......................................... 4
•
Added Thermal Information table. .......................................................................................................................................... 5
•
Added –40°C to 125°C for SN74AHCT32 in the Electrical Characteristics table. ................................................................. 5
•
Added –40°C to 125°C for SN74AHCT32 in the Switching Characteristics table. ................................................................ 5
•
Added Typical Characteristics. ............................................................................................................................................... 6
•
Added Detailed Description section........................................................................................................................................ 8
•
Added Application and Implementation section...................................................................................................................... 9
•
Added Power Supply Recommendations and Layout sections............................................................................................ 10
2
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SCLS248M – OCTOBER 1995 – REVISED OCTOBER 2014
6 Pin Configuration and Functions
SN54AHCT32 . . . J OR W PACKAGE
SN74AHCT32 . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
12
4
11
5
10
6
9
7
8
1B
1Y
2A
2B
2Y
14
1B
1A
NC
VCC
4B
1
1Y
NC
2A
NC
2B
13 4B
2
3
12 4A
4
4Y
10 3B
9 3A
11
5
6
7
8
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3B
2Y
GND
NC
3Y
3A
3
VCC
4B
4A
4Y
3B
3A
3Y
VCC
13
3Y
14
2
1A
1
GND
1A
1B
1Y
2A
2B
2Y
GND
SN54AHCT32 . . . FK PACKAGE
(TOP VIEW)
SN74AHCT32 . . . RGY PACKAGE
(TOP VIEW)
NC − No internal connection
Pin Functions
PIN
SN74AHCT32
NAME
SN54AHCT32
I/O
DESCRIPTION
D, DB, DGV,
N, NS, PW
RGY
J, W
FK
1A
1
1
1
2
I
1A Input
1B
2
2
2
3
I
1B Input
1Y
3
3
3
4
O
1Y Output
2A
4
4
4
6
I
2A Input
2B
5
5
5
8
I
2B Input
2Y
6
6
6
9
O
2Y Output
3Y
8
8
8
12
O
3Y Output
3A
9
9
9
13
I
3A Input
3B
10
10
10
14
I
3B Input
4Y
11
11
11
16
O
4Y Output
4A
12
12
12
18
I
4A Input
4B
13
13
13
19
I
4B Input
GND
7
7
7
10
—
Ground Pin
—
No Connection
1
5
NC
—
—
—
7
11
15
17
VCC
14
14
14
20
I
Power Pin
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Product Folder Links: SN54AHCT32 SN74AHCT32
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SCLS248M – OCTOBER 1995 – REVISED OCTOBER 2014
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7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
Supply voltage range
–0.5
7
UNIT
V
(2)
–0.5
7
V
–0.5
VCC + 0.5
VI
Input voltage range
VO
Output voltage range (2)
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
Continuous current through VCC or GND
(1)
(2)
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
7.2 Handling Ratings
Tstg
Storage temperature range
V(ESD)
(1)
(2)
Electrostatic discharge
MIN
MAX
UNIT
°C
–65
150
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
0
1000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
0
750
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
SN54AHCT32
SN74AHCT32
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
0
5.5
VO
Output voltage
0
VCC
IOH
High-level output current
–8
–8
IOL
Low-level output current
8
8
mA
∆t/∆v
Input transition rise or fall rate
20
20
ns/V
TA
Operating free-air temperature
125
°C
(1)
4
2
2
0.8
–55
V
125
V
0.8
V
0
5.5
V
0
VCC
V
–40
mA
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs (SCBA004).
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7.4 Thermal Information
SN74AHCT32
THERMAL METRIC (1)
D
DB
DGV
N
NS
PW
RGY
UNIT
14 PINS
RθJA
Junction-to-ambient thermal
resistance
97.5
109.5
133.3
59.7
92.2
125.1
59.0
RθJC(top)
Junction-to-case (top) thermal
resistance
58.7
62.1
55.6
47.3
49.8
53.7
72.5
RθJB
Junction-to-board thermal
resistance
51.8
56.9
66.3
39.5
51.0
66.9
35.0
ψJT
Junction-to-top
characterization parameter
22.6
22.6
7.8
32.4
15.7
7.6
3.9
ψJB
Junction-to-board
characterization parameter
51.6
56.3
56.6
39.4
50.6
66.3
35.1
RθJC(bot)
Junction-to-case (bottom)
thermal resistance
—
—
—
—
—
—
15.4
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
7.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −50 µA
VOH
4.5 V
IOH = −8 mA
IOL = 50 µA
VOL
TA = 25°C
VCC
MIN
TYP
4.4
4.5
SN54AHCT32
MAX
3.94
4.5 V
IOL = 8 mA
MIN
–40°C to 125°C
SN74AHCT32
SN74AHCT32
MAX
MIN
MAX
MIN
4.4
4.4
4.4
3.8
3.8
3.8
UNIT
MAX
V
0.1
0.1
0.1
0.1
0.36
0.44
0.44
0.44
V
II
VI = 5.5 V or GND
0 V to
5.5 V
±0.1
±1 (1)
±1
±1
µA
ICC
VI = VCC or GND, IO = 0
5.5 V
2
20
20
20
µA
ΔICC (2)
One input at 3.4 V,
Other inputs at VCC or GND
5.5 V
1.35
1.5
1.5
1.5
mA
Ci
VI = VCC or GND
10
10
10
10
pF
(1)
(2)
5V
2
On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
7.6 Switching Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 2)
PARAMETER
tPLH
tPHL
tPLH
tPHL
(1)
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A or B
Y
CL = 15 pF
A or B
Y
CL = 50 pF
TA = 25°C
SN54AHCT32
–40°C to 125°C
SN74AHCT32
SN74AHCT32
UNIT
TYP
MAX
MIN
MAX
MIN
MAX
MIN
MAX
5 (1)
6.9 (1)
1 (1)
8 (1)
1
8
1
9
5 (1)
6.9 (1)
1 (1)
8 (1)
1
8
1
9
5.5
7.9
1
9
1
9
1
10
5.5
7.9
1
9
1
9
1
10
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
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7.7 Noise Characteristics
VCC = 5 V, CL = 50 pF, TA = 25°C (1)
SN74AHCT32
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.4
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
–0.4
–0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
4.5
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
(1)
V
2
V
0.8
V
Characteristics are for surface-mount packages only.
7.8 Operating Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
f = 1 MHz
TYP
UNIT
11.5
pF
7.9 Typical Characteristics
6
5
TPD (ns)
4
3
2
1
TPD in ns
0
-100
-50
0
50
Temperature (qC)
100
150
D001
Figure 1. TPD vs Temperature
6
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SCLS248M – OCTOBER 1995 – REVISED OCTOBER 2014
8 Parameter Measurement Information
VCC
Test
Point
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
S1
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
3V
1.5 V
Input
1.5 V
th
tsu
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
3V
Output
Control
VOL + 0.3 V
VOL
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
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9 Detailed Description
9.1 Overview
The SNx4AHCT32 is a quadruple 2-input positive-OR gate with low drive that will produce slow rise and fall
times. This slow transition reduces ringing on the output signal. The device has TTL inputs that allow up
translation from 3.3 V to 5 V. The inputs are high impedance when VCC = 0 V.
9.2 Functional Block Diagram
A
Y
B
A
Y
B
A
Y
B
A
Y
B
9.3 Feature Description
•
•
Slow rise and fall time on outputs allows for low-noise outputs
TTL inputs allow up translation from 3.3 V to 5 V
9.4 Device Functional Modes
Table 1. Function Table
(Each Gate)
INPUTS
B
OUTPUT
Y
H
X
H
X
H
H
L
L
L
A
8
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SCLS248M – OCTOBER 1995 – REVISED OCTOBER 2014
10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The SNx4AHCT32 is a low-drive CMOS device that can be used for a multitude of bus-interface type applications
where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and undershoot on
the outputs. The TTL inputs can accept voltages down to 3.3 V and can translate up to 5 V.
10.2 Typical Application
3.3- or 5-V Bus Driver
VCC
5-V Regulated
0.1 µF
5-V Accessory
Figure 3. Typical Application Diagram for a Single Gate
10.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. The high drive will also create fast
edges into light loads, so routing and load conditions should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions:
– For rise time and fall time specifications, see Δt/ΔV in the Recommended Operating Conditions table.
– For specified high and low levels, see VIH and VIL in the Recommended Operating Conditions table.
– Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC.
2. Recommend Output Conditions:
– Load currents should not exceed 25 mA per output and 50 mA total for the part.
– Outputs should not be pulled above VCC.
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Typical Application (continued)
10.2.3 Application Curves
ACT32
HCT32
AHCT32
Figure 4. Switching Characteristics Comparison
11 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply-voltage rating located in Recommended
Operating Conditions.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, 0.1μF is recommended. If there are multiple VCC pins then a 0.01 μF or a 0.022 μF is recommended for
each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF
and a 1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as
possible for best results.
12 Layout
12.1 Layout Guidelines
When using multiple bit logic devices, inputs should never float.
In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two
inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be
left unconnected because the undefined voltages at the outside connections result in undefined operational
states. Specified in the Figure 5 are the rules that must be observed under all circumstances. All unused inputs
of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that
should be applied to any particular unused input depends on the function of the device. Generally they will be
tied to GND or VCC, whichever makes more sense or is more convenient. It is generally acceptable to float
outputs, unless the part is a transceiver. If the transceiver has an output enable pin it will disable the outputs
section of the part when asserted. This will not disable the input section of the I/Os so they also cannot float
when disabled.
12.2 Layout Example
Vcc
Unused Input
Input
Output
Output
Unused Input
Input
Figure 5. Layout Diagram
10
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SCLS248M – OCTOBER 1995 – REVISED OCTOBER 2014
13 Device and Documentation Support
13.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN54AHCT32
Click here
Click here
Click here
Click here
Click here
SN74AHCT32
Click here
Click here
Click here
Click here
Click here
13.2 Trademarks
All trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 1995–2014, Texas Instruments Incorporated
Product Folder Links: SN54AHCT32 SN74AHCT32
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9682601Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629682601Q2A
SNJ54AHCT
32FK
5962-9682601QCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9682601QC
A
SNJ54AHCT32J
5962-9682601QDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9682601QD
A
SNJ54AHCT32W
SN74AHCT32D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AHCT32
SN74AHCT32DBR
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB32
SN74AHCT32DGVR
ACTIVE
TVSOP
DGV
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB32
SN74AHCT32DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT32
SN74AHCT32DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT32
SN74AHCT32N
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 125
SN74AHCT32N
SN74AHCT32NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHCT32
SN74AHCT32PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB32
SN74AHCT32PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB32
SN74AHCT32PWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB32
SN74AHCT32PWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HB32
SN74AHCT32RGYR
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
HB32
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
24-Aug-2018
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SNJ54AHCT32FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629682601Q2A
SNJ54AHCT
32FK
SNJ54AHCT32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9682601QC
A
SNJ54AHCT32J
SNJ54AHCT32W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9682601QD
A
SNJ54AHCT32W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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