SN74ALVC32D

SN74ALVC32 QUADRUPLE 2-INPUT POSITIVE-OR GATE www.ti.com SCES108G – JULY 1997 – REVISED NOVEMBER 2004 FEATURES • • • • • D, DGV, NS, OR PW PACKAGE (TOP VIEW) Operates From 1.65 V to 3.6 V Max tpd of 2.8 ns at 3.3 V ±24-mA Output Drive at 3.3 V Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 1A 1B 1Y 2A 2B 2Y GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y DESCRIPTION/ORDERING INFORMATION This quadruple 2-input positive-OR gate is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVC32 performs the Boolean function Y = A ⋅ B or Y = A + B in positive logic. ORDERING INFORMATION PACKAGE (1) TA SOIC - D -40°C to 85°C SOP - NS TSSOP - PW TVSOP - DGV (1) ORDERABLE PART NUMBER Tube SN74ALVC32D Tape and reel SN74ALVC32DR Tape and reel SN74ALVC32NSR Tube SN74ALVC32PW Tape and reel SN74ALVC32PWR Tape and reel SN74ALVC32DGVR TOP-SIDE MARKING ALVC32 ALVC32 VA32 VA32 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each gate) INPUTS B OUTPUT Y H X H X H H L L L A LOGIC DIAGRAM, EACH GATE (POSITIVE LOGIC) A Y B Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1997–2004, Texas Instruments Incorporated SN74ALVC32 QUADRUPLE 2-INPUT POSITIVE-OR GATE www.ti.com SCES108G – JULY 1997 – REVISED NOVEMBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Output voltage range (2) (3) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current Continuous current through VCC or GND D package θJA Package thermal impedance (4) Tstg Storage temperature range (2) (3) (4) mA -50 mA ±50 mA ±100 mA 86 DGV package 127 NS package °C/W 76 PW package (1) V -50 113 -65 °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) 2 V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V 0 3.6 V 0 VCC V VCC = 1.65 V -4 VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 -40 mA mA 5 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74ALVC32 QUADRUPLE 2-INPUT POSITIVE-OR GATE www.ti.com SCES108G – JULY 1997 – REVISED NOVEMBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = -100 µA 1.65 V to 3.6 V 1.65 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = -24 mA 3V 2 IOL = 100 µA IOH = -12 mA (1) V 0.2 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 II VI = VCC or GND ICC VI = VCC or GND, IO = 0 One input at VCC - 0.6 V, Other inputs at VCC or GND UNIT 1.2 1.65 V to 3.6 V IOL = 24 mA Ci MAX IOL = 4 mA IOL = 12 mA ∆ICC TYP (1) VCC - 0.2 IOH = -4 mA VOH VOL MIN 2.7 V 0.4 3V 0.55 V ±5 µA 3.6 V 10 µA 3 V to 3.6 V 750 µA 3.6 V VI = VCC or GND 3.3 V 4 pF All typical values are at VCC = 3.3 V, TA = 25°C. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or B Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 2.7 V VCC = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN MAX MIN MAX 1 4.7 1 3.1 2.9 1 2.8 UNIT ns OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd Power dissipation capacitance per gate TEST CONDITIONS CL = 0, f = 10 MHz VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V TYP TYP TYP 23 24 26 UNIT pF 3 SN74ALVC32 QUADRUPLE 2-INPUT POSITIVE-OR GATE www.ti.com SCES108G – JULY 1997 – REVISED NOVEMBER 2004 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VOH VM VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN74ALVC32D ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC32 SN74ALVC32DGVR ACTIVE TVSOP DGV 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 VA32 SN74ALVC32DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC32 SN74ALVC32NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ALVC32 SN74ALVC32PW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 VA32 SN74ALVC32PWE4 ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 VA32 SN74ALVC32PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 VA32 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of