SN54AS821A, SN74AS821A
10-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS230A – DECEMBER 1983 – REVISED AUGUST 1995
•
•
•
•
•
•
SN54AS821A . . . JT PACKAGE
SN74AS821A . . . DW OR NT PACKAGE
(TOP VIEW)
Functionally Equivalent to AMD’s AM29821
Provide Extra Data Width Necessary for
Wider Address/Data Paths or Buses With
Parity
Outputs Have Undershoot-Protection
Circuitry
Power-Up High-Impedance State
Buffered Control Inputs to Reduce
dc Loading Effects
Package Options Include Plastic
Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK), and Standard Plastic
(NT) and Ceramic (JT) 300-mil DIPs
OE
1D
2D
3D
4D
5D
6D
7D
8D
9D
10D
GND
description
These 10-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing wider buffer
registers, I/O ports, bidirectional bus drivers with
parity, and working registers.
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
9Q
10Q
CLK
2D
1D
OE
NC
VCC
1Q
2Q
SN54AS821A . . . FK PACKAGE
(TOP VIEW)
4
3D
4D
5D
NC
6D
7D
8D
The ten flip-flops are edge-triggered D-type
flip-flops. On the positive transition of the clock
(CLK) input, the Q outputs are true to the data (D)
input.
3 2 1 28 27 26
25
6
24
7
23
8
22
9
21
10
20
19
11
12 13 14 15 16 17 18
3Q
4Q
5Q
NC
6Q
7Q
8Q
9D
10D
GND
NC
CLK
10Q
9Q
A buffered output-enable (OE) input can be used
to place the ten outputs in either a normal logic
state (high or low logic levels) or a highimpedance state. In the high-impedance state, the
outputs neither load nor drive the bus lines
significantly. The high-impedance state and
increased drive provide the capability to drive bus
lines without interface or pullup components.
5
NC – No internal connection
OE does not affect the internal operation of the flip-flops. Previously stored data can be retained or new data
can be entered while the outputs are in the high-impedance state.
The SN54AS821A is characterized for operation over the full military temperature range of – 55°C to 125°C. The
SN74AS821A is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
L
X
Q0
H
X
X
Z
Copyright 1995, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
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1
SN54AS821A, SN74AS821A
10-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS230A – DECEMBER 1983 – REVISED AUGUST 1995
logic symbol†
OE
CLK
1D
2D
3D
4D
5D
6D
7D
8D
9D
10D
1
EN
13
C1
2
23
1D
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
9Q
10Q
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the DW, JT, and NT packages.
logic diagram (positive logic)
OE
CLK
1
13
C1
1D
2
1D
23
1Q
To Nine Other Channels
Pin numbers shown are for the DW, JT, and NT packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Voltage applied to a disabled 3-state output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Operating free-air temperature range, TA: SN54AS821A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
SN74AS821A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
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SN54AS821A, SN74AS821A
10-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS230A – DECEMBER 1983 – REVISED AUGUST 1995
recommended operating conditions
SN54AS821A
SN74AS821A
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
0.8
V
High-level output current
– 24
– 24
mA
IOL
tw*
Low-level output current
32
48
mA
Pulse duration, CLK high or low
9
8
ns
tsu*
th*
Setup time, data before CLK↑
7
6
ns
Hold time, data after CLK↑
0
0
ns
High-level input voltage
2
2
V
V
TA
Operating free-air temperature
– 55
125
0
70
* On products compliant to MIL-STD-883, Class B, this parameter is based on characterization data but is not production tested.
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V to 5.5 V,
II = – 18 mA
IOH = – 2 mA
VCC = 4
4.5
5V
IOH = – 15 mA
IOH = – 24 mA
VOL
VCC = 4
4.5
5V
IOL = 32 mA
IOL = 48 mA
IOZH
IOZL
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VI = 0.4 V
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
VI = 7 V
VI = 2.7 V
IIL
IO‡
VCC = 5.5 V,
VCC = 5.5 V,
VI = 0.4 V
VO = 2.25 V
ICC
VCC = 5.5 V
VOH
SN54AS821A
MIN TYP†
MAX
SN74AS821A
MIN TYP†
MAX
– 1.2
VCC – 2
2.4
– 1.2
VCC – 2
2.4
3.2
2
UNIT
V
V
3.2
2
0.25
0.5
0.35
V
µA
50
50
– 50
– 50
µA
0.1
0.1
mA
20
20
µA
– 0.5
mA
– 112
mA
– 0.5
– 30
0.5
– 112
– 30
Outputs high
55
88
55
88
Outputs low
68
109
68
109
Outputs disabled
70
113
70
113
mA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
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3
SN54AS821A, SN74AS821A
10-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS230A – DECEMBER 1983 – REVISED AUGUST 1995
switching characteristics (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = MIN to MAX†
SN54AS821A
tPLH
tPHL
CLK
An Q
Any
tPZH
tPZL
OE
An Q
Any
tPHZ
tPLZ
OE
Any Q
SN74AS821A
MIN
MAX
MIN
MAX
3.5
9
3.5
7.5
3.5
14
3.5
13
4
12
3
11
4
13
4
12
1
10
1
8
1
10
1
8
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
SN54AS821A, SN74AS821A
10-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS230A – DECEMBER 1983 – REVISED AUGUST 1995
PARAMETER MEASUREMENT INFORMATION
SERIES 54ALS/74ALS AND 54AS/74AS DEVICES
7V
RL = R1 = R2
VCC
S1
RL
R1
Test
Point
From Output
Under Test
CL
(see Note A)
From Output
Under Test
RL
Test
Point
From Output
Under Test
CL
(see Note A)
CL
(see Note A)
LOAD CIRCUIT FOR
BI-STATE
TOTEM-POLE OUTPUTS
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
3.5 V
Timing
Input
Test
Point
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
3.5 V
High-Level
Pulse
1.3 V
R2
1.3 V
1.3 V
0.3 V
0.3 V
Data
Input
tw
th
tsu
3.5 V
1.3 V
3.5 V
Low-Level
Pulse
1.3 V
0.3 V
1.3 V
0.3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
3.5 V
Output
Control
(low-level
enabling)
1.3 V
1.3 V
0.3 V
tPZL
Waveform 1
S1 Closed
(see Note B)
tPLZ
[3.5 V
1.3 V
tPHZ
tPZH
Waveform 2
S1 Open
(see Note B)
1.3 V
VOL
0.3 V
VOH
1.3 V
0.3 V
[0 V
3.5 V
1.3 V
Input
1.3 V
0.3 V
tPHL
tPLH
VOH
In-Phase
Output
1.3 V
1.3 V
VOL
tPLH
tPHL
VOH
Out-of-Phase
Output
(see Note C)
1.3 V
1.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
POST OFFICE BOX 655303
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5
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9078001M3A
ACTIVE
LCCC
FK
28
1
TBD
5962-9078001MKA
ACTIVE
CFP
W
24
1
TBD
POST-PLATE N / A for Pkg Type
A42
N / A for Pkg Type
5962-9078001MLA
ACTIVE
CDIP
JT
24
1
TBD
A42 SNPB
N / A for Pkg Type
SN54AS821AJT
ACTIVE
CDIP
JT
24
1
TBD
A42 SNPB
N / A for Pkg Type
SN74AS821ADW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS821ADWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS821ADWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS821ADWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS821ADWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS821ADWRG4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS821ANT
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AS821ANTE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SNJ54AS821AFK
ACTIVE
LCCC
FK
28
1
TBD
SNJ54AS821AJT
ACTIVE
CDIP
JT
24
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54AS821AW
ACTIVE
CFP
W
24
1
TBD
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2007
TAPE AND REEL BOX INFORMATION
Device
SN74AS821ADWR
Package Pins
DW
24
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
SITE 60
330
24
10.75
15.7
2.7
12
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
24
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74AS821ADWR
DW
24
SITE 60
346.0
346.0
0.0
Pack Materials-Page 2
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
13
24
B
1
24
28
A MAX
1.280
(32,51)
1.460
(37,08)
A MIN
1.240
(31,50)
1.440
(36,58)
B MAX
0.300
(7,62)
0.291
(7,39)
B MIN
0.245
(6,22)
0.285
(7,24)
DIM
12
0.070 (1,78)
0.030 (0,76)
0.100 (2,54) MAX
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
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MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.090 (2,29)
0.045 (1,14)
0.045 (1,14)
0.026 (0,66)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
1
0.360 (9,14)
0.240 (6,10)
24
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5 / B 03/95
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
Index point is provided on cap for terminal identification only.
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MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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MECHANICAL DATA
MPDI004 – OCTOBER 1994
NT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
PINS **
A
24
28
A MAX
1.260
(32,04)
1.425
(36,20)
A MIN
1.230
(31,24)
1.385
(35,18)
B MAX
0.310
(7,87)
0.315
(8,00)
B MIN
0.290
(7,37)
0.295
(7,49)
DIM
24
13
0.280 (7,11)
0.250 (6,35)
1
12
0.070 (1,78) MAX
B
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0°– 15°
0.010 (0,25) M
0.010 (0,25) NOM
4040050 / B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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