SCBS005D − OCTOBER 1987 − REVISED APRIL 1994
•
•
•
•
SN54BCT241 . . . J OR W PACKAGE
SN74BCT241 . . . DB, DW OR N PACKAGE
(TOP VIEW)
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
ESD Protection Exceeds 2000 V
Per MIL-STD-883C, Method 3015
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
description
2Y4
1A1
1OE
VCC
1A2
2Y3
1A3
2Y2
1A4
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
The SN54BCT241 is characterized for operation
over the full military temperature range of − 55°C
to 125°C. The SN74BCT241 is characterized for
operation from 0°C to 70°C.
2OE
SN54BCT241 . . . FK PACKAGE
(TOP VIEW)
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Taken together with the ′BCT240
and ′BCT244, these devices provide the choice of
selected combinations of inverting and
noninverting outputs, symmetrical OE (active-low
output-enable) inputs, and complementary OE
and OE inputs.
FUNCTION TABLES
INPUTS
1OE
1A
OUTPUT
1Y
L
H
H
L
L
L
H
X
Z
INPUTS
2OE
2A
OUTPUT
2Y
H
H
H
H
L
L
L
X
Z
Copyright 1994, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
• DALLAS, TEXAS 75265
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POST OFFICE BOX 655303
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2−1
SCBS005D − OCTOBER 1987 − REVISED APRIL 1994
logic symbol†
1OE
1A1
1A2
1A3
1A4
1
logic diagram (positive logic)
1
1OE
EN
2
18
4
16
6
14
8
12
1A1
1Y1
2OE
2A1
2A2
2A3
2A4
18
4
16
6
14
8
12
1Y1
1Y2
1Y3
1A2
1Y2
1Y4
1A3
19
2
1Y3
EN
11
9
13
7
15
5
17
3
1A4
1Y4
2Y1
2Y2
2Y3
2OE
19
2Y4
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
2A1
2A2
2A3
2A4
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 7 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . − 0.5 V to 5.5 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to VCC
Input clamp current, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA
Current into any output in the low state: SN54BCT241 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74BCT241 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Operating free-air temperature range: SN54BCT241 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 55°C to 125°C
SN74BCT241 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2−2
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
SCBS005D − OCTOBER 1987 − REVISED APRIL 1994
recommended operating conditions
SN54BCT241
SN74BCT241
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
0.8
V
Input clamp current
−18
−18
mA
IOH
IOL
High-level output current
−12
−15
mA
64
mA
TA
Operating free-air temperature
70
°C
High-level input voltage
2
2
Low-level output current
V
48
−55
125
V
0
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VCC = 4.5 V,
VOH
SN54BCT241
TYP†
MAX
TEST CONDITIONS
VCC = 4.5 V
MIN
II = −18 mA
IOH = − 3 mA
SN74BCT241
TYP†
MAX
MIN
−1.2
IOH = − 12 mA
IOH = − 15 mA
2.4
3.3
2
3.2
0.38
−1.2
2.4
3.3
2
3.1
UNIT
V
V
VOL
VCC = 4.5 V
IOL = 48 mA
IOL = 64 mA
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
VI = 7 V
VI = 2.7 V
−1
−1
VCC = 5.5 V,
VI = 0.5 V
−1.6
−1.6
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VO = 0.5 V
50
50
−50
−50
µA
VCC = 5.5 V,
VCC = 5.5 V,
VO = 0
Outputs open
−225
mA
23
43
23
43
mA
VCC = 5.5 V,
VCC = 5.5 V,
Outputs open
53
85
53
85
mA
Outputs open
4
10
4
10
mA
VCC = 5 V,
VCC = 5 V,
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
6
0.42
1OE or 2OE
IIL
IOZH
IOZL
IOS‡
ICCH
ICCL
ICCZ
Ci
Any A input
0.55
−100
0.1
mA
20
20
µA
−100
Co
11
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
•
•
V
0.1
−225
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
0.55
mA
µA
6
pF
11
pF
2−3
SCBS005D − OCTOBER 1987 − REVISED APRIL 1994
switching characteristics (see Note 2)
PARAMETER
FROM
(INPUT)
VCC = 5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = 25°C
′BCT241
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE or OE
Y
tPHZ
tPLZ
OE or OE
Y
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = MIN to MAX†
SN54BCT241 SN74BCT241
MIN
TYP
MAX
MIN
MAX
MIN
MAX
0.5
2.5
4.5
0.5
5.2
0.5
4.9
1
3
5.4
1
6.3
1
5.9
1
5.7
7.8
1
9.1
1
8.7
1
5.2
8.6
1
10
1
9.4
1
5.8
6.8
1
8.4
1
8.1
1
7
8.1
1
11
1
9.9
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and voltage waveforms are shown in Section 1.
2−4
•
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•
UNIT
ns
ns
ns
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74BCT241DBLE
OBSOLETE
SSOP
DB
20
TBD
Call TI
Call TI
0 to 70
SN74BCT241NSR
OBSOLETE
SO
NS
20
TBD
Call TI
Call TI
0 to 70
SN74BCT241NSRE4
OBSOLETE
SO
NS
20
TBD
Call TI
Call TI
0 to 70
SN74BCT241NSRG4
OBSOLETE
SO
NS
20
TBD
Call TI
Call TI
0 to 70
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54BCT241, SN74BCT241 :
• Catalog: SN74BCT241
• Military: SN54BCT241
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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