SN74CB3Q16211
SCDS167A – MAY 2004 – REVISED JULY 2022
SN74CB3Q16211 24-Bit Switch 2.5-V/3.3-V Low-Voltage FET Bus Switch
1 Features
2 Applications
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Member of the Texas Instruments
Widebus® family
High-bandwidth data path (up to 500 MHz(1))
5-V tolerant I/Os with device powered up or
powered down
Low and flat ON-state resistance (ron)
characteristics over operating range
(ron = 5 Ω typical)
Rail-to-rail switching on data I/O ports
– 0-V to 5-V switching with 3.3-V VCC
– 0-V to 3.3-V switching with 2.5-V VCC
Bidirectional data flow, with near-zero propagation
delay
Low input or output capacitance minimizes loading
and signal distortion
(Cio(OFF) = 4 pF typical)
Fast switching frequency (fOE = 20 MHz maximum)
Data and control inputs provide undershoot clamp
diodes
Low power consumption (ICC = 1 mA typical)
VCC operating range from 2.3 V to 3.6 V
Data I/Os support 0-V to 5-V signaling levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V)
Control inputs can be driven by TTL or
5-V/3.3-V CMOS outputs
Ioff supports partial-power-down mode operation
Latch-up Performance Exceeds 100 mA Per JESD
78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Supports both digital and analog applications:
PCI interface, differential signal interface, memory
interleaving, bus isolation, low-distortion signal
gating 1
AV receiver
Blu-ray recorder and player
Embedded PC
Portable audio dock
DLP front projection system
3 Description
The SN74CB3Q16211 device is a high-bandwidth
FET bus switch utilizing a charge pump to elevate
the gate voltage of the pass transistor, providing
a low and flat ON-state resistance (ron). The low
and flat ON-state resistance allows for minimal
propagation delay and supports rail-to-rail switching
on the data input/output (I/O) ports. The device
also features low data I/O capacitance to minimize
capacitive loading and signal distortion on the data
bus. Specifically designed to support high-bandwidth
applications, the SN74CB3Q16211 device provides
an optimized interface solution ideally suited for
broadband communications, networking, and dataintensive computing systems.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE
TSSOP (56)
14.00 mm × 6.10 mm
TVSOP (56)
11.30 mm × 4.40 mm
SSOP (56)
18.40 mm × 7.49 mm
BGA MICROSTAR
JUNIOR (56)
7.00 mm × 4.50 mm
SN74CB3Q16211
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
54
2
1A1
1B1
SW
42
14
1A12
1B12
SW
56
1OE
A
B
VCC
41
15
2A1
Charge
Pump
2B1
SW
29
28
2A12
SW
2B12
55
2OE
EN†
† EN is the internal enable signal applied to the switch.
Simplified Schematic, Each FET Switch (SW)
1
Terminal numbers shown are for the DGG, DGV, and DL
packages.
Logic Diagram (Positive Logic)
For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report, CBT-C,
CB3T, and CB3Q Signal-Switch Families.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74CB3Q16211
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SCDS167A – MAY 2004 – REVISED JULY 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Description (continued).................................................. 2
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 Handling Ratings.........................................................4
7.3 Recommended Operating Conditions.........................4
7.4 Electrical Characteristics.............................................5
7.5 Switching Characteristics............................................5
7.6 Typical Characteristics................................................ 6
8 Parameter Measurement Information............................ 7
9 Device and Documentation Support..............................8
9.1 Documentation Support.............................................. 8
9.2 Receiving Notification of Documentation Updates......8
9.3 Support Resources..................................................... 8
9.4 Trademarks................................................................. 8
9.5 Electrostatic Discharge Caution..................................8
9.6 Glossary......................................................................8
10 Mechanical, Packaging, and Orderable
Information...................................................................... 8
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (May 2004) to Revision A (July 2022)
Page
• Updated document to new TI data sheet format - no specification changes...................................................... 1
• Removed Ordering Information table..................................................................................................................1
• Added Applications............................................................................................................................................. 1
• Added Device Information table..........................................................................................................................1
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Changed the BGA package from: GQL to: ZQL in the Pin Configuration and Functions section.......................3
• Moved Tstg to Handling Ratings table................................................................................................................. 4
• Added Mechanical, Packaging, and Orderable Information section................................................................... 8
5 Description (continued)
The SN74CB3Q16211 device is organized as two 12-bit bus switches with separate output-enable (1 OE, 2 OE)
inputs. It can be used as two 12-bit bus switches or as one 24-bit bus switch. When OE is low, the associated
12-bit bus switch is ON and the A port is connected to the B port, allowing bidirectional data flow between ports.
When OE is high, the associated 12-bit bus switch is OFF, and a high-impedance state exists between the A and
B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Table 5-1. Function Table
(Each 12-Bit Bus Switch)
2
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L
B
A port = B port
H
Z
Disconnect
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6 Pin Configuration and Functions
NC
1A1
1A2
1A3
1A4
1A5
1A6
GND
1A7
1A8
1A9
1A10
1A11
1A12
2A1
2A2
VCC
2A3
GND
2A4
2A5
2A6
2A7
2A8
2A9
2A10
2A11
2A12
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1OE
2OE
1B1
1B2
1B3
1B4
1B5
GND
1B6
1B7
1B8
1B9
1B10
1B11
1B12
2B1
2B2
2B3
GND
2B4
2B5
2B6
2B7
2B8
2B9
2B10
2B11
2B12
Figure 6-1. DGG, DGV, or DL Package, 56-Pin TSSOP and TVSOP (Top View)
1
2
3
4
5
6
A
B
C
D
1
2
3
4
5
6
A
1A2
1A1
NC
1OE
2OE
1B1
B
1A5
1A4
1A3
1B2
1B3
1B4
C
1A7
GND
1A6
1B5
GND
1B6
D
1A10
1A8
1A9
1B8
1B7
1B9
E
1A12
1A11
1B10
1B11
F
2A1
2A2
2B1
1B12
G
GND
2A3
2B3
GND
2B2
2A5
2A6
2B6
2B5
2B4
E
H
VCC
2A4
F
J
2A7
2A8
2A9
2B9
2B8
2B7
K
2A10
2A11
2A12
2B12
2B11
2B10
G
NC − No internal connection
Figure 6-3. Functions Table
H
J
K
Figure 6-2. ZQL Package, 56-Pin BGA (Top View)
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
–0.5
4.6
V
VIN
Control input voltage
range(2) (3)
–0.5
7
V
VI/O
Switch I/O voltage range(2) (3) (4)
–0.5
7
V
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
±64
mA
±100
mA
VCC
II/O
Supply voltage range(2)
ON-state switch
current(5)
Continuous current through VCC or GND terminals
θJA
(1)
(2)
(3)
(4)
(5)
(6)
Package thermal impedance(6)
DGG package
64
DGV package
48
DL package
56
GQL package
42
UNIT
°C/W
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
7.2 Handling Ratings
PARAMETER
Tstg
DEFINITION
Storage temperature range
MIN
MAX
UNIT
–65
150
°C
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
(1)
4
MIN
MAX
2.3
3.6
UNIT
VCC = 2.3 V to 2.7 V
1.7
5.5
VCC = 2.7 V to 3.6 V
2
5.5
VCC = 2.3 V to 2.7 V
0
0.7
VCC = 2.7 V to 3.6 V
0
0.8
0
5.5
V
–40
85
°C
V
V
V
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application
report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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7.4 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)(1)
PARAMETER
VIK
VCC = 3.6 V,
IIN
MIN TYP(2)
TEST CONDITIONS
MAX
II = –18 mA
Control inputs VCC = 3.6 V,
VIN = 0 to 5.5 V
IOZ (3)
VCC = 3.6 V,
VO = 0 to 5.5 V,
VI = 0
Switch OFF,
VIN = VCC or GND
Ioff
VCC = 0,
VO = 0 to 5.5 V,
VI = 0
ICC
VCC = 3.6 V,
II/O = 0,
Switch ON or OFF,
VIN = VCC or GND
Other inputs at VCC or GND
∆ICC (4)
Control inputs VCC = 3.6 V,
One input at 3 V,
ICCD (5)
Per control
input
A and B ports open,
Control input switching at 50% duty cycle
Cin
Control inputs VCC = 3.3 V,
VCC = 3.6 V,
1
UNIT
–1.8
V
±1
µA
±1
µA
1
µA
3
mA
30
VIN = 5.5 V, 3.3 V, or 0
µA
mA/
MHz
0.15
0.25
3.5
5
pF
Cio(OFF)
VCC = 3.3 V,
VIN = VCC or GND,
Switch OFF,
VI/O = 5.5 V, 3.3 V, or 0
4
5
pF
Cio(ON)
VCC = 3.3 V,
VIN = VCC or GND,
Switch ON,
VI/O = 5.5 V, 3.3 V, or 0
10
12.5
pF
VCC = 2.3 V,
TYP at VCC = 2.5 V
VI = 0,
IO = 30 mA
5
8
VI = 1.7 V,
IO = –15 mA
5
9
VI = 0,
IO = 30 mA
5
6.5
VI = 2.4 V,
IO = –15 mA
5
8
ron (6)
VCC = 3 V
(1)
(2)
(3)
(4)
(5)
(6)
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see
Figure 7-2).
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
7.5 Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 8-1)
PARAMETER
(1)
(2)
VCC = 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
FROM (INPUT)
TO (OUTPUT)
fOE (1)
OE
A or B
10
20
tpd (2)
A or B
B or A
0.15
0.25
ns
ten
OE
A or B
1.5
8
1.5
8
ns
tdis
OE
A or B
1
7.5
1
7.5
ns
MIN
MAX
MIN
MAX
UNIT
MHz
Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0).
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
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7.6 Typical Characteristics
ron − ON−State Resistance − Ω
16
VCC = 3.3 V
TA = 25°C
IO = −15 mA
14
12
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VI − V
Figure 7-1. Typical ron vs VI
12
VCC = 3.3 V
TA = 25°C
A and B Ports Open
10
ICC − mA
8
One OE Switching
6
4
2
0
0
2
4
6
8
10
12
14
16
18
20
OE Switching Frequency − MHz
Figure 7-2. Typical ICC vs OE Switching Frequency
6
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8 Parameter Measurement Information
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
Input Generator
VI
S1
RL
VO
50 Ω
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
500 Ω
500 Ω
VCC or GND
VCC or GND
30 pF
50 pF
tPLZ/tPZL
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2 × VCC
2 × VCC
500 Ω
500 Ω
GND
GND
30 pF
50 pF
0.15 V
0.3 V
tPHZ/tPZH
2.5 V ± 0.2 V
3.3 V ± 0.3 V
GND
GND
500 Ω
500 Ω
VCC
VCC
30 pF
50 pF
0.15 V
0.3 V
V∆
VCC
Output
Control
(VIN)
VCC/2
VCC/2
0V
tPLZ
tPZL
VCC
VCC/2
VCC/2
0V
tPLH
VCC/2
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
VCC
VCC/2
VCC/2
VOL
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
VOL + V∆
VOL
tPHZ
tPZH
tPHL
VOH
Output
Open
GND
50 Ω
VG2
Output
Control
(VIN)
2 × VCC
VCC/2
VOH – V∆
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. t PZL and tPZH are the same as ten.
G. tPLH and t PHLare the same as t pd(s). The t pd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 8-1. Test Circuit and Voltage Waveforms
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9 Device and Documentation Support
9.1 Documentation Support
9.1.1 Related Documentation
For related documentation, see the following:
•
Texas Instruments, CBT-C, CB3T, and CB3Q Signal-Switch Families application report
9.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
9.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
9.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
Widebus® is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
9.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
9.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
8
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74CB3Q16211DGGR
ACTIVE
TSSOP
DGG
56
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3Q16211
SN74CB3Q16211DGVR
ACTIVE
TVSOP
DGV
56
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
BW211
SN74CB3Q16211DL
ACTIVE
SSOP
DL
56
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3Q16211
SN74CB3Q16211DLR
ACTIVE
SSOP
DL
56
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3Q16211
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of