SN74CBT16390DGGR

SN74CBT16390 16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH SCDS035E – OCTOBER 1997 – REVISED OCTOBER 2000 D D D D D DGG, DGV, OR DL PACKAGE (TOP VIEW) Member of Texas Instruments’ Widebus Family 5-Ω Switch Connection Between Two Ports TTL-Compatible Input Levels Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) A1 2B1 2B2 A3 2B3 2B4 A5 2B5 2B6 A7 2B7 2B8 GND VCC A9 2B9 2B10 A11 2B11 2B12 A13 2B13 2B14 A15 2B15 2B16 NC NC description The SN74CBT16390 is a 16-bit to 32-bit switch used in applications in which two separate data paths must be multiplexed onto, or demultiplexed from, a single path. This device can be used for memory interleaving, in which two different banks of memory must be addressed simultaneously. This device also can be used to connect or isolate the PCI bus to one or two slots simultaneously. Two output enables (OE1 and OE2) control the data flow. When OE1 is low, A port is connected to 1B port. When OE2 is low, A port is connected to 2B port. When both OE1 and OE2 are low, the A port is connected to both 1B and 2B ports. The control inputs can be driven with a 5-V CMOS, 5-V TTL, or an LVTTL driver. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 1B1 1B2 A2 1B3 1B4 A4 1B5 1B6 A6 1B7 1B8 A8 GND VCC 1B9 1B10 A10 1B11 1B12 A12 1B13 1B14 A14 1B15 1B16 A16 OE1 OE2 NC – No internal connection ORDERING INFORMATION Tube SN74CBT16390DL Tape and reel SN74CBT16390DLR TSSOP – DGG Tape and reel SN74CBT16390DGGR TVSOP – DGV Tape and reel SN74CBT16390DGVR SSOP – DL –40°C 40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA TOP-SIDE MARKING CBT16390 CBT16390 CY390 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. Copyright  2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74CBT16390 16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH SCDS035E – OCTOBER 1997 – REVISED OCTOBER 2000 FUNCTION TABLE INPUTS OE1 FUNCTION OE2 L L A = 1B and A = 2B L H A = 1B H L A = 2B H H Isolation logic diagram (positive logic) 56 1 A1 1B1 2 2B1 A16 32 31 1B16 26 2B16 30 OE1 29 OE2 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC VIH Supply voltage VIL TA Low-level control input voltage High-level control input voltage MIN MAX 4.5 5.5 2 Operating free-air temperature –40 UNIT V V 0.8 V 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74CBT16390 16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH SCDS035E – OCTOBER 1997 – REVISED OCTOBER 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK II ICC ∆ICC‡ Control inputs Ci Control inputs TEST CONDITIONS VCC = 4.5 V, VCC = 0, II = –18 mA VI = 5.5 V VCC = 5.5 V, VCC = 5.5 V, VI = 5.5 V or GND IO = 0, VCC = 5.5 V, VI = 3 V or 0 One input at 3.4 V, Cio(OFF) VO = 3 V or 0 ron§ VCC = 4.5 V VI = 0 MIN TYP† MAX UNIT –1.2 V 10 ±1 VI = VCC or GND Other input at VCC or GND II = 64 mA II = 30 mA µA 3 µA 2.5 mA 5 pF 5.5 pF 5 7 5 7 Ω VI = 2.4 V, II = 15 mA 7 12 † All typical values are at VCC = 5 V, TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. § Measured by the voltage drop between A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd¶ A or B B or A ten OE A or B MIN 1.3 MAX UNIT 0.25 ns 5.9 ns tdis A or B 1 5.3 ns OE ¶ The propagation delay is based on the RC time constant of the typical on-state resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74CBT16390 16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH SCDS035E – OCTOBER 1997 – REVISED OCTOBER 2000 PARAMETER MEASUREMENT INFORMATION 7V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V Output Control LOAD CIRCUIT 1.5 V 1.5 V 0V tPLZ tPZL 3V Input 1.5 V 1.5 V 0V tPLH 1.5 V 3.5 V 1.5 V 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPHZ tPZH tPHL VOH Output Output Waveform 1 S1 at 7 V (see Note B) 1.5 V VOH VOH – 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN74CBT16390DGGR ACTIVE TSSOP DGG 56 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16390 SN74CBT16390DGVR ACTIVE TVSOP DGV 56 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CY390 SN74CBT16390DL ACTIVE SSOP DL 56 20 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CBT16390 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of