SN74CBT3245A
OCTAL FET BUS SWITCH
SCDS002Q − NOVEMBER 1992 − REVISED DECEMBER 2004
D Standard ’245-Type Pinout
D 5-Ω Switch Connection Between Two Ports
D TTL-Compatible Input Levels
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
A1
A2
A3
A4
A5
A6
A7
A8
VCC
20
2
1
20
19 OE
18 B1
2
3
17 B2
16 B3
4
5
15 B4
14 B5
6
7
13 B6
12 B7
8
9
NC − No internal connection
10
11
B8
1
GND
NC
A1
A2
A3
A4
A5
A6
A7
A8
GND
NC
RGY PACKAGE
(TOP VIEW)
DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
NC − No internal connection
GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
4
terminal assignments
A
1
2
3
4
B
A
A1
NC
VCC
OE
C
B
A3
B2
A2
B1
C
A5
A4
B4
B3
D
A7
B6
A6
B5
E
GND
A8
B8
B7
D
E
NC − No internal connection
description/ordering information
The SN74CBT3245A provides eight bits of high-speed TTL-compatible bus switching. The SOIC, SSOP,
TSSOP, and TVSOP packages provide a standard ’245 device pinout. The low on-state resistance of the switch
allows connections to be made with minimal propagation delay.
The device is organized as one 8-bit switch. When the output-enable (OE) input is low, the switch is on, and
port A is connected to port B. When OE is high, the switch is open, and the high-impedance state exists between
the two ports.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2004, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74CBT3245A
OCTAL FET BUS SWITCH
SCDS002Q − NOVEMBER 1992 − REVISED DECEMBER 2004
description/ordering information (continued)
ORDERING INFORMATION
QFN − RGY
SN74CBT3245ARGYR
Tube
SN74CBT3245ADW
Tape and reel
SN74CBT3245ADWR
SSOP − DB
Tape and reel
SN74CBT3245ADBR
CU245A
SSOP (QSOP) − DBQ
Tape and reel
SN74CBT3245ADBQR
CBT3245A
Tube
SN74CBT3245APW
Tape and reel
SN74CBT3245APWR
Tape and reel
SN74CBT3245ADGVR
TSSOP − PW
TVSOP − DGV
VFBGA − GQN
Tape and reel
VFBGA − ZQN (Pb-free)
†
SN74CBT3245AGQNR
SN74CBT3245AZQNR
CU245A
CBT3245A
CU245A
CU245A
CU245A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUT
OE
FUNCTION
L
A port = B port
H
Disconnect
logic diagram (positive logic)
2
18
A1
B1
9
11
A8
B8
19
OE
Pin numbers shown are for the DB, DBQ, DGV, DW, PW, and RGY packages.
2
TOP-SIDE
MARKING
Tape and reel
SOIC − DW
−40°C
40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74CBT3245A
OCTAL FET BUS SWITCH
SCDS002Q − NOVEMBER 1992 − REVISED DECEMBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 2): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
MIN
MAX
VCC
Supply voltage
4
5.5
VIH
High-level control input voltage
2
VIL
Low-level control input voltage
TA
Operating free-air temperature
−40
UNIT
V
V
0.8
V
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
VCC = 4.5 V,
II = −18 mA
II
VCC = 5.5 V,
VI = 5.5 V or GND
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
Control inputs
VCC = 5.5 V,
One input at 3.4 V,
Other inputs at VCC or GND
Control inputs
VI = 3 V or 0
ICC
ΔICC
§
Ci
Cio(OFF)
ron¶
VO = 3 V or 0,
VCC = 4.5 V
MIN
TYP‡
MAX
−1.2
V
±5
μA
50
μA
3.5
mA
4
OE = VCC
VI = 0
VI = 2.4 V,
UNIT
pF
4
pF
II = 64 mA
5
7
II = 30 mA
5
7
II = 15 mA
10
15
Ω
‡
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
§ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
CC or GND.
¶ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74CBT3245A
OCTAL FET BUS SWITCH
SCDS002Q − NOVEMBER 1992 − REVISED DECEMBER 2004
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
†
VCC = 4 V
VCC = 5 V
± 0.5 V
MIN
MIN
FROM
(INPUT)
TO
(OUTPUT)
tpd†
A or B
B or A
0.35
0.25
ns
ten
OE
A or B
6.4
1.9
5.9
ns
tdis
OE
A or B
5.7
2.1
6
ns
PARAMETER
MAX
UNIT
MAX
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
PARAMETER MEASUREMENT INFORMATION
7V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
Output
Control
LOAD CIRCUIT
1.5 V
1.5 V
0V
tPZL
3V
Input
1.5 V
1.5 V
0V
tPLH
1.5 V
tPLZ
3.5 V
1.5 V
1.5 V
VOL
tPHZ
VOH
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
VOL
tPZH
tPHL
VOH
Output
Output
Waveform 1
S1 at 7 V
(see Note B)
1.5 V
VOH − 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns,
tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
17-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74CBT3245ADBQR
ACTIVE
SSOP
DBQ
20
2500
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CBT3245A
Samples
SN74CBT3245ADBR
ACTIVE
SSOP
DB
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CU245A
Samples
SN74CBT3245ADGVR
ACTIVE
TVSOP
DGV
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CU245A
Samples
SN74CBT3245ADW
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBT3245A
Samples
SN74CBT3245ADWG4
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBT3245A
Samples
SN74CBT3245ADWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CBT3245A
Samples
SN74CBT3245APW
ACTIVE
TSSOP
PW
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CU245A
Samples
SN74CBT3245APWE4
ACTIVE
TSSOP
PW
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CU245A
Samples
SN74CBT3245APWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CU245A
Samples
SN74CBT3245ARGYR
ACTIVE
VQFN
RGY
20
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
CU245A
Samples
SN74CBT3245AZQNR
OBSOLETE
BGA
MICROSTAR
JUNIOR
ZQN
20
TBD
Call TI
Call TI
CU245A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of