SN74F2373
25-Ω OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SDFS100 – JANUARY 1996
D
D
D
D
D
DB, DW, OR N PACKAGE
(TOP VIEW)
Eight Latches in a Single Package
3-State True Outputs With 25-Ω Sink
Resistors
Full Parallel Access for Loading
Buffered Control Inputs
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB) Packages, and Plastic (N) DIPs
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
description
This 8-bit latch features 3-state outputs designed
to sink up to 12 mA, and include 25-Ω sink resitors
to reduce overshoot and undershoot.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
LE
The eight latches of the SN74F2373 are transparent D-type latches. While the latch-enable (LE) input is high,
the Q outputs follow the data (D) inputs. When the LE is taken low, the Q outputs are latched at the logic levels
set up at the D inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal
logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither
load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability
to drive bus lines without need for interface or pullup components.
OE input does not affect the internal operations of the latches. Old data can be retained or new data can be
entered while the outputs are in the high-impedance state.
The SN74F373 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count
and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN74F373 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each latch)
INPUTS
OE
LE
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74F2373
25-Ω OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SDFS100 – JANUARY 1996
logic symbol†
OE
LE
1D
2D
3D
4D
5D
6D
7D
8D
1
11
3
logic diagram (positive logic)
EN
OE
C1
1D
2
4
5
7
6
8
9
13
12
14
15
17
16
18
19
LE
1
11
1Q
C1
2Q
1D
3Q
3
1D
4Q
5Q
6Q
7Q
To Seven Other Channels
8Q
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
schematic diagram
VCC
Q
25 Ω
(nominal)
Typical Output Configuration
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2
1Q
SN74F2373
25-Ω OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SDFS100 – JANUARY 1996
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 1.2 V to 7 V
Input current range, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA to 5 mA
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . – 0.5 V to 5.5 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating free-air temperature range,TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded if the input current ratings are observed.
recommended operating conditions
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
IOH
IOL
High-level output current
TA
Operating free-air temperature
High-level input voltage
MIN
NOM
MAX
UNIT
4.5
5
5.5
V
2
V
Input clamp current
Low-level output current
0
0.8
V
– 18
mA
–3
mA
12
mA
70
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4
4.5
5V
VCC = 4.75 V,
II = – 18 mA
IOH = – 1 mA
IOH = – 3 mA
IOH = -1 mA to – 3 mA
MIN
TYP‡
2.5
3.4
2.4
3.3
MAX
UNIT
– 1.2
V
V
2.7
VOL
VCC = 4
4.5
5V
IOL = 1 mA
IOL = 12 mA
IOZ(H)
VCC = 5.5 V,
VO = 2.7 V
50
µA
IOZ(L)
VCC = 5.5 V,
VO = 0.5 V
– 50
µA
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
VI = 7 V
VI = 2.7 V
0.1
mA
20
µA
IIL
IOS§
VCC = 5.5 V,
VCC = 5.5 V,
VI = 0.5 V
VO = 0
– 0.6
mA
– 150
mA
ICC(H)
VCC = 5.5 V,
See Note 2, Condition A
38
55
mA
ICC(L)
VCC = 5.5 V,
See Note 2, Condition B
46
66
mA
62
mA
ICC(Z)
0.2
0.5
0.5
0.75
– 60
VCC = 5.5 V,
See Note 2, Condition C
43
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
NOTE 2:
ICC is measured with the outputs open under the following conditions:
A. OE at ground (0) and all other inputs at 4.5 V.
B. LE at 4.5 V and all other inputs grounded.
C. OE at 4.5 V and all other inputs grounded.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
3
SN74F2373
25-Ω OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SDFS100 – JANUARY 1996
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
VCC = 5 V,
TA = 25°C
MIN
MIN
MAX
UNIT
MAX
tw
Pulse duration, LE high
6
6
ns
tsu
Setup time, data before LE↓
2
2
ns
th
Hold time, data after LE↓
5
6
ns
switching characteristics (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
Q
tPLH
tPHL
LE
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
VCC = 5 V,
CL = 50 PF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = 25°C
MIN
TYP
MAX
VCC = 4.5 V TO 5.5 V, CL
= 50 PF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = MIN TO MAX†
MIN
MAX
2.2
4.4
7
2.1
9
1.2
4.1
5.5
1.2
7
4.2
7.3
11.5
4.2
13
2.2
4.2
7
2.2
8
1.2
4.1
11
1.2
12
1.2
6
8.3
1.2
9.5
1.2
4.2
6.5
1.2
7.5
1.2
3.5
6
1.2
6
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
SN74F2373
25-Ω OCTAL TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
SDFS100 – JANUARY 1996
PARAMETER MEASUREMENT INFORMATION
7 V (tPZL, tPLZ, O.C.)
S1
Open
(all others)
From Output
Under Test
Test
Point
CL
(see Note A)
R1
From Output
Under Test
R1
Test
Point
CL
(see Note A)
R2
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
RL = R1 = R2
LOAD CIRCUIT FOR
3-STATE AND OPEN-COLLECTOR OUTPUTS
High-Level
Pulse
(see Note C)
3V
1.5 V
0V
tw
3V
Timing Input
(see Note C)
3V
1.5 V
Low-Level
Pulse
0V
th
tsu
Data Input
(see Note C)
1.5 V
1.5 V
0V
3V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V
1.5 V
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
Output
Control
(low-level enable)
3V
Input
(see Note C)
1.5 V
1.5 V
1.5 V
0V
tPZL
1.5 V
tPLZ
0V
tPLH
In-Phase
Output
(see Note E)
tPHL
1.5 V
Out-of-Phase
Output
(see Note E)
VOL
1.5 V
VOL
tPHZ
VOH
1.5 V
1.5 V
0.3 V
tPZH
tPLH
tPHL
3.5 V
Waveform 1
(see Notes B and E)
VOH
Waveform 2
(see Notes B and E)
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (see Note D)
1.5 V
0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, tr = tf ≤ 2.5 ns, duty cycle = 50%.
D. When measuring propagation delay times of 3-state outputs, switch S1 is open.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74F2373DBLE
OBSOLETE
SSOP
DB
20
SN74F2373DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373DBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74F2373N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74F2373NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74F2373DBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
SN74F2373DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74F2373DBR
SN74F2373DWR
SSOP
DB
20
2000
346.0
346.0
33.0
SOIC
DW
20
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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