SN74GTLPH306
8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER
www.ti.com
FEATURES
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TI-OPC™ Circuitry Limits Ringing on
Unevenly Loaded Backplanes
OEC™ Circuitry Improves Signal Integrity and
Reduces Electromagnetic Interference
Bidirectional Interface Between GTLP Signal
Levels and LVTTL Logic Levels
LVTTL Interfaces Are 5-V Tolerant
Medium-Drive GTLP Outputs (50 mA)
LVTTL Outputs (–24 mA/24 mA)
GTLP Rise and Fall Times Designed for
Optimal Data-Transfer Rate and Signal
Integrity in Distributed Loads
Ioff and Power-Up 3-State Support Hot
Insertion
Bus Hold on A-Port Data Inputs
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SCES284E – OCTOBER 1999 – REVISED APRIL 2005
DGV, DW, OR PW PACKAGE
(TOP VIEW)
OE
VCC
A1
A2
A3
A4
GND
A5
A6
A7
A8
GND
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
DIR
VREF
B1
B2
B3
B4
GND
B5
B6
B7
B8
GND
DESCRIPTION/ORDERING INFORMATION
The SN74GTLPH306 is a medium-drive, 8-bit bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL
signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic
levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard
LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing ( VCC.
The package thermal impedance is calculated in accordance with JESD 51-7.
3
SN74GTLPH306
8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER
www.ti.com
SCES284E – OCTOBER 1999 – REVISED APRIL 2005
Recommended Operating Conditions (1) (2) (3) (4)
VCC
Supply voltage
VTT
Termination voltage
VREF
Reference voltage
VI
Input voltage
VIH
High-level input voltage
VIL
Low-level input voltage
IIK
Input clamp current
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
Power-up ramp rate
TA
Operating free-air temperature
(1)
(2)
(3)
(4)
4
MIN
NOM
MAX
UNIT
V
3.15
3.3
3.45
GTL
1.14
1.2
1.26
GTLP
1.35
1.5
1.65
GTL
0.74
0.8
0.87
GTLP
0.87
1
1.1
B port
VTT
Except B port
B port
Except B port
VCC
5.5
VREF + 0.05
VREF – 0.05
Except B port
V
V
V
2
B port
V
0.8
V
–18
mA
A port
–24
mA
A port
24
B port
50
Outputs enabled
10
ns/V
µs/V
20
–40
mA
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Proper connection sequence for use of the B-port I/O precharge feature is GND and BIAS VCC = 3.3 V first, I/O second, and VCC = 3.3 V
last, because the BIAS VCC precharge circuitry is disabled when any VCC pin is connected. The control and VREF inputs can be
connected anytime, but normally are connected during the I/O stage. If B-port precharge is not required, any connection sequence is
acceptable, but generally, GND is connected first.
VTT and RTT can be adjusted to accommodate backplane impedances if the dc recommended IOL ratings are not exceeded.
VREF can be adjusted to optimize noise margins, but normally is two-thirds VTT. TI-OPC circuitry is enabled in the A-to-B direction and is
activated when VTT > 0.7 V above VREF. If operated in the A-to-B direction, VREF should be set to within 0.6 V of VTT to minimize current
drain.
SN74GTLPH306
8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER
www.ti.com
SCES284E – OCTOBER 1999 – REVISED APRIL 2005
Electrical Characteristics
over recommended operating free-air temperature range for GTLP (unless otherwise noted)
PARAMETER
VIK
VOH
A port
VCC = 3.15 V,
II = –18 mA
VCC = 3.15 V to 3.45 V,
IOH = –100 µA
VCC – 0.2
IOH = –12 mA
2.4
IOH = –24 mA
2
VCC = 3.15 V
VCC = 3.15 V to 3.45 V,
A port
VOL
B port
A-port and
control inputs
II (2)
MIN TYP (1) MAX
TEST CONDITIONS
VCC = 3.15 V
VCC = 3.15 V
–1.2
IOL = 100 µA
0.2
IOL = 12 mA
0.4
IOL = 24 mA
0.5
IOL = 40 mA
0.4
IOL = 50 mA
0.55
V
±5
VI = 5.5 V
B port
V
V
VI = 0 or VCC
VCC = 3.45 V
UNIT
±20
VI = 0 to 1.5 V
µA
±5
IBHL (3)
A port
VCC = 3.15 V,
VI = 0.8 V
75
µA
IBHH (4)
A port
VCC = 3.15 V,
VI = 2 V
–75
µA
IBHLO (5)
A port
VCC = 3.45 V,
VI = 0 to VCC
500
µA
(6)
A port
VCC = 3.45 V,
VI = 0 to VCC
–500
IBHHO
ICC
A or B port
∆ICC
Ci
Cio
(1)
(2)
(3)
(4)
(5)
(6)
(7)
VCC = 3.45 V, IO = 0,
VI (A-port or control input) = VCC or GND,
VI (B port) = VTT or GND
µA
Outputs high
20
Outputs low
20
Outputs disabled
20
VCC = 3.45 V, One A-port or control input at VCC – 0.6 V,
Other A-port or control inputs at VCC or GND
(7)
mA
1.5
mA
pF
Control inputs
VI = 3.15 V or 0
4.5
5
A port
VO = 3.15 V or 0
7.5
9
B port
VO = 1.5 V or 0
7.5
9
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
For I/O ports, the parameter II includes the off-state output leakage current.
The bus-hold circuit can sink at least the minimum low sustaining current at VILmax. IBHL should be measured after lowering VIN to GND
and then raising it to VILmax.
The bus-hold circuit can source at least the minimum high sustaining current at VIHmin. IBHH should be measured after raising VIN to VCC
and then lowering it to VIHmin.
An external driver must source at least IBHLO to switch this node from low to high.
An external driver must sink at least IBHHO to switch this node from high to low.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Hot-Insertion Specifications for A Port
over recommended operating free-air temperature range
PARAMETER
Ioff
TEST CONDITIONS
VCC = 0,
VI or VO = 0 to 5.5 V
IOZPU
VCC = 0 to 1.5 V,
VO = 0.5 V to 3 V,
IOZPD
VCC = 1.5 V to 0,
VO = 0.5 V to 3 V,
MIN
MAX
UNIT
10
µA
OE = 0
±30
µA
OE = 0
±30
µA
MAX
UNIT
Hot-Insertion Specifications for B Port
over recommended operating free-air temperature range
PARAMETER
Ioff
TEST CONDITIONS
VCC = 0,
VI or VO = 0 to 1.5 V
IOZPU
VCC = 0 to 1.5 V,
VO = 0.5 V to 1.5 V,
IOZPD
VCC = 1.5 V to 0,
VO = 0.5 V to 1.5 V,
MIN
10
µA
OE = 0
±30
µA
OE = 0
±30
µA
5
SN74GTLPH306
8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER
www.ti.com
SCES284E – OCTOBER 1999 – REVISED APRIL 2005
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VTT = 1.5 V and VREF = 1 V for GTLP (see Figure 1)
PARAMETER
tPLH
tPHL
ten
tdis
tr
A
B
OE
B
MIN TYP (1) MAX
1
7.5
1
7.5
1
8
1
8
UNIT
ns
ns
Rise time, B outputs (20% to 80%)
2.2
ns
tf
Fall time, B outputs (80% to 20%)
2.1
ns
Rise time, A outputs (10% to 90%)
4.1
ns
tf
Fall time, A outputs (90% to 10%)
3.3
ns
tPHL
ten
tdis
6
TO
(OUTPUT)
tr
tPLH
(1)
FROM
(INPUT)
B
A
OE
A
All typical values are at VCC = 3.3 V, TA = 25°C.
1
7
1
7
1
8
1
8
ns
ns
SN74GTLPH306
8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER
www.ti.com
SCES284E – OCTOBER 1999 – REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
1.5 V
6V
Open
GND
CL = 50 pF
(see Note A)
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
500 Ω
25 Ω
From Output
Under Test
CL = 30 pF
(see Note A)
S1
Open
6V
GND
Test
Point
LOAD CIRCUIT FOR B OUTPUTS
LOAD CIRCUIT FOR A OUTPUTS
3V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
VOH
1V
Output
1V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
(A port to B port)
1V
0V
tPLH
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
(B port to A port)
tPLZ
3V
1.5 V
VOL + 0.3 V
VOL
tPZH
VOH
Output
1.5 V
0V
Output
Waveform 1
S1 at 6 V
(see Note B)
tPHL
1.5 V
1.5 V
tPZL
1.5 V
1V
Input
3V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
tPHZ
VOH
1.5 V
VOH − 0.3 V
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
(A port)
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≈ 10 MHz, ZO = 50 Ω, tr ≈ 2 ns, tf ≈ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
7
SN74GTLPH306
8-BIT LVTTL-TO-GTLP BUS TRANSCEIVER
www.ti.com
SCES284E – OCTOBER 1999 – REVISED APRIL 2005
Distributed-Load Backplane Switching Characteristics
The preceding switching characteristics table shows the switching characteristics of the device into a lumped
load (Figure 1). However, the designer's backplane application probably is a distributed load. The physical
representation is shown in Figure 2. This backplane, or distributed load, can be approximated closely to a
resistor inductance capacitance (RLC) circuit, as shown in Figure 3. This device has been designed for optimum
performance in this RLC circuit. The following switching characteristics table shows the switching characteristics
of the device into the RLC load, to help the designer better understand the performance of the GTLP device in
this typical backplane. See www.ti.com/sc/gtlp for more information.
1.5 V
1.5 V
0.25”
ZO = 70 Ω
2”
Conn.
Conn.
1”
1”
Conn.
1”
2”
0.25”
38 Ω
38 Ω
1.5 V
19 Ω
From Output
Under Test
Conn.
LL = 19 nH
1”
Test
Point
CL = 9 pF
Rcvr
Rcvr
Rcvr
Slot 2
Slot 9
Slot 10
Drvr
Slot 1
Figure 3. Medium-Drive RLC Network
Figure 2. Medium-Drive Test Backplane
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VTT = 1.5 V and VREF = 1 V for GTLP (see Figure 3)
PARAMETER
tPLH
tPHL
ten
tdis
(1)
8
FROM
(INPUT)
TO
(OUTPUT)
A
B
OE
B
TYP (1)
3.6
4.1
4.4
4.6
UNIT
ns
ns
tr
Rise time, B outputs (20% to 80%)
1.2
ns
tf
Fall time, B outputs (80% to 20%)
2.2
ns
All typical values are at VCC = 3.3 V, TA = 25°C. All values are derived from TI-SPICE models.
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74GTLPH306DGVR
ACTIVE
TVSOP
DGV
24
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
GH306
Samples
SN74GTLPH306DW
ACTIVE
SOIC
DW
24
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
GTLPH306
Samples
SN74GTLPH306DWR
ACTIVE
SOIC
DW
24
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
GTLPH306
Samples
SN74GTLPH306PW
ACTIVE
TSSOP
PW
24
60
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
GH306
Samples
SN74GTLPH306PWR
ACTIVE
TSSOP
PW
24
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
GH306
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of