SN54HC139, SN74HC139
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
SNx4HC139 Dual 2-Line To 4-Line Decoders/Demultiplexers
1 Features
2 Description
•
The SNx4HC139 contains two two-to-four decoders
with one active low output strobe G. When the outputs
of one channel are gated by the strobe input, they are
all forced into the high state. When the outputs are not
disabled by the strobe input, only the selected output
is low while all others are high.
•
•
•
•
•
•
•
Targeted specifically for high-speed memory
decoders and data-transmission systems
Wide operating voltage range of 2 V to 6 V
Outputs can drive up to 10 LSTTL loads
Low power consumption, 80-μA max ICC
Typical tpd = 10 ns
±4-mA output drive at 5 V
Low input current of 1 μA max
Incorporate two enable inputs to simplify
cascading and/or data reception
Device Information
(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74HC139D
SOIC (16)
9.90 mm × 3.90
SN74HC139DB
SSOP (16)
6.20 mm × 5.30 mm
SN74HC139N
PDIP (16)
19.31 mm × 6.35 mm
SN74HC139NS
SO (16)
6.20 mm × 5.30 mm
SN74HC139PW
TSSOP (16)
5.00 mm × 4.40 mm
SN54HC139J
CDIP (16)
24.38 mm × 6.92 mm
SNJ54HC139FK
LCCC (20)
8.89 mm × 8.45 mm
SNJ54HC139W
CFP (16)
10.16 mm × 6.73 mm
(1)
DECODER
For all available packages, see the orderable addendum at
the end of the data sheet.
OUTPUT
ENABLE
00
xY0
xA0
01
xY1
10
xY2
xA1
11
xY3
xG
Pin numbers shown are for the D, DB, J, N, NS, PW, W
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC139, SN74HC139
www.ti.com
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 Recommended Operating Conditions(1) .................... 4
5.3 Thermal Information....................................................4
5.4 Electrical Characteristics.............................................5
5.5 Switching Characteristics ...........................................5
5.6 Operating Characteristics........................................... 5
6 Parameter Measurement Information............................ 6
7 Detailed Description........................................................7
7.1 Overview..................................................................... 7
7.2 Functional Block Diagram........................................... 7
7.3 Device Functional Modes............................................7
8 Power Supply Recommendations..................................8
9 Layout...............................................................................8
9.1 Layout Guidelines....................................................... 8
10 Device and Documentation Support............................9
10.1 Receiving Notification of Documentation Updates....9
10.2 Support Resources................................................... 9
10.3 Trademarks............................................................... 9
10.4 Electrostatic Discharge Caution................................9
10.5 Glossary....................................................................9
11 Mechanical, Packaging, and Orderable
Information...................................................................... 9
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (September 2003) to Revision E (February 2022)
Page
• Updated the numbering, formatting, tables, figures, and cross-refrences throughout the document to reflect
modern data sheet standards............................................................................................................................. 1
2
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC139 SN74HC139
SN54HC139, SN74HC139
www.ti.com
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
4 Pin Configuration and Functions
J , W, D, DB, N, NS, OR PW Package
16-Pin CDIP, CFP, SOIC, SSOP, PDIP, SO, TSSOP
Top View
FK package
20-Pin LCCC
Top View
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC139 SN74HC139
3
SN54HC139, SN74HC139
www.ti.com
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage range
current(2)
MIN
MAX
–0.5
7
UNIT
V
IIK
Input clamp
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
150
°C
150
°C
Continuous current through VCC or GND
TJ
Junction temperature
Tstg
Storage temperature
(1)
(2)
–65
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 Recommended Operating Conditions(1)
SN54HC139
VCC
Supply voltage
VCC = 2 V
VIH
High-level input voltage
VCC = 4.5 V
VCC = 6 V
SN74HC139
MIN
NOM
MAX
2
5
6
Low-level input voltage
VI
Input voltage
VO
Output voltage
TA
(1)
2
5
6
3.15
3.15
4.2
4.2
VCC = 4.5 V
0.5
0.5
1.35
1.8
0
0
VCC
0
V
VCC
V
VCC = 4.5 V
500
500
VCC = 6 V
400
400
125
V
VCC
1000
−55
V
1.8
VCC
1000
Operating free-air temperature
UNIT
V
1.35
0
VCC = 2 V
Input transition rise/fall time
MAX
1.5
VCC = 6 V
Δt/Δv
NOM
1.5
VCC = 2 V
VIL
MIN
−40
85
ns
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application
report,Implications of Slow or Floating CMOS Inputs, literature numberSCBA004.
5.3 Thermal Information
THERMAL METRIC
RθJA
(1)
4
Junction-to-ambient thermal
(1)
resistance
D (SOIC)
DB (SSOP)
N (PDIP)
NS (SO)
PW (TSSOP)
14 PINS
14 PINS
14 PINS
14 PINS
14 PINS
UNIT
73
82
67
64
108
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC139 SN74HC139
SN54HC139, SN74HC139
www.ti.com
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
5.4 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST
(1)
CONDITIONS
VCC (V)
IOH = −20 μA
2
1.9
1.998
1.9
1.9
4.5
4.4
4.499
4.4
4.4
6
5.9
5.999
5.9
5.9
4.5
3.98
4.3
3.7
3.84
6
5.48
5.8
5.2
5.34
MAX
MIN
MAX
UNIT
V
2
0.002
0.1
0.1
0.1
4.5
0.001
0.1
0.1
0.1
6
0.001
0.1
0.1
0.1
IOL = 4 mA
4.5
0.17
0.26
0.4
0.33
IOL = 5.2 mA
6
0.15
0.26
0.4
0.33
VI = VCC or 0
6
±0.1
±100
±1000
±1000
nA
IO = 0
6
8
160
80
μA
10
10
10
pF
Ci
(1)
MIN
IOL = 20 μA
VOL
II
MAX
SN74HC139
TYP
IOH = −5.2 mA
ICC
SN54HC139
MIN
VOH
IOH = −4 mA
TA = 25°C
2 to 6
3
V
VI = VIH or VIL, unless otherwise noted.
5.5 Switching Characteristics
over recommended operating free-air temperature range, CL= 50 pF (unless otherwise noted) (see Figure 6-1)
PARAMETER
FROM
(INPUT)
A or B
TO
(OUTPUT)
Y
tpd
G
tt
Y
Y
VCC (V)
TA = 25°C
MIN
SN54HC139
MIN
SN74HC139
TYP
MAX
MAX
MIN
MAX
2
47
175
255
220
4.5
14
35
51
44
6
12
30
44
38
2
39
175
255
220
4.5
11
35
51
44
6
10
30
44
38
2
38
75
110
95
4.5
8
15
22
19
6
6
13
19
16
UNIT
ns
ns
5.6 Operating Characteristics
TA = 25℃
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per decoder
No load
TYP
25
UNIT
pF
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC139 SN74HC139
5
SN54HC139, SN74HC139
www.ti.com
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
6 Parameter Measurement Information
Figure 6-1. Load Circuit and Voltage Waveforms
6
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC139 SN74HC139
SN54HC139, SN74HC139
www.ti.com
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
7 Detailed Description
7.1 Overview
The SNx4HC139 devices are designed for high- performance memory-decoding or data-routing applications
requiring very short propagation delay times. In high-performance memory systems, these decoders can
minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable
circuit, the delay time of these decoders and the enable time of the memory usually are less than the typical
access time of the memory. This means that the effective system delay introduced by the decoders is negligible.
The SNx4HC139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low
enable (G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers
feature fully buffered inputs, each of which represents only one normalized load to its driving circuit.
7.2 Functional Block Diagram
DECODER
OUTPUT
ENABLE
00
xY0
xA0
01
xY1
10
xY2
xA1
11
xY3
xG
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
7.3 Device Functional Modes
INPUTS
G
OUTPUTS
SELECT
B
A
Y0
Y1
Y2
Y3
H
X
X
H
H
H
H
L
L
L
L
H
H
H
L
L
H
H
L
H
H
L
H
L
H
H
L
H
L
H
H
H
H
H
L
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC139 SN74HC139
7
SN54HC139, SN74HC139
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
www.ti.com
8 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps
to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The
bypass capacitor should be installed as close to the power terminal as possible for best results.
9 Layout
9.1 Layout Guidelines
When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many
cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a
triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left
unconnected because the undefined voltages at the outside connections result in undefined operational states.
All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the
input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular
unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever
makes more sense for the logic function or is more convenient.
8
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC139 SN74HC139
SN54HC139, SN74HC139
www.ti.com
SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022
10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
10.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC139 SN74HC139
9
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jun-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
5962-8409201VFA
ACTIVE
CFP
W
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8409201VF
A
SNV54HC139W
84092012A
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
84092012A
SNJ54HC
139FK
8409201EA
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8409201EA
SNJ54HC139J
Samples
8409201FA
ACTIVE
CFP
W
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8409201FA
SNJ54HC139W
Samples
JM38510/65803BEA
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
JM38510/
65803BEA
Samples
M38510/65803BEA
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
JM38510/
65803BEA
Samples
SN54HC139J
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SN54HC139J
Samples
SN74HC139D
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SN74HC139DBR
ACTIVE
SSOP
DB
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SN74HC139DE4
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SN74HC139DR
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SN74HC139DRE4
ACTIVE
SOIC
D
16
2500
TBD
Call TI
Call TI
-40 to 85
Samples
SN74HC139DRG4
ACTIVE
SOIC
D
16
2500
TBD
Call TI
Call TI
-40 to 85
Samples
SN74HC139DT
ACTIVE
SOIC
D
16
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SN74HC139N
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC139N
Samples
SN74HC139NE4
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC139N
Samples
SN74HC139NSR
ACTIVE
SO
NS
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
Addendum-Page 1
Samples
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
20-Jun-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74HC139PW
ACTIVE
TSSOP
PW
16
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SN74HC139PWG4
ACTIVE
TSSOP
PW
16
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SN74HC139PWR
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SN74HC139PWT
ACTIVE
TSSOP
PW
16
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC139
Samples
SNJ54HC139FK
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
84092012A
SNJ54HC
139FK
SNJ54HC139J
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8409201EA
SNJ54HC139J
Samples
SNJ54HC139W
ACTIVE
CFP
W
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8409201FA
SNJ54HC139W
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of