SN54HC153, SN74HC153
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
SNx4HC153 Dual 4-Line To 1-Line Data Selectors/Multiplexers
1 Features
2 Description
•
•
•
•
•
•
•
•
•
The SNx4HC153 is a dual data selector/multiplexer
containing full binary decoding to select one of
four data sources. Both channels are controlled by
the same address select inputs, and each channel
includes its own strobe (G) input. A high level at the
strobe terminal forces the repective output low.
Wide operating voltage range of 2 V to 6 V
Outputs can drive up to 15 LSTTL loads
Low power consumption, 80-μA max ICC
Typical tpd = 9 ns
±6-mA output drive at 5 V
Low input current of 1 μA max
Permit multiplexing from n lines to one line
Perform parallel-to-serial conversion
Strobe (enable) line provided for cascading
(N lines to n lines)
Device Information
(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74HC153D
SOIC (16)
9.90 mm × 3.90 mm
SN74HC153N
PDIP (16)
19.31 mm × 6.35 mm
SN74HC153NS
SO (16)
6.20 mm × 5.30 mm
SN74HC153PW
TSSOP (16)
5.00 mm × 4.40 mm
SN54HC153J
CDIP (16)
24.38 mm × 6.92 mm
SNJ54HC153FK
LCCC (20)
8.89 mm × 8.45 mm
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
Pin numbers are for the D, J, N, NS, PW, and W packages.
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC153, SN74HC153
www.ti.com
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 Recommended Operating Conditions(1) .................... 4
5.3 Thermal Information....................................................4
5.4 Electrical Characteristics.............................................5
5.5 Switching Characteristics ...........................................5
5.6 Switching Characteristics ...........................................6
5.7 Operating Characteristics........................................... 6
6 Parameter Measurement Information............................ 7
7 Detailed Description........................................................8
7.1 Overview..................................................................... 8
7.2 Functional Block Diagram........................................... 8
7.3 Device Functional Modes............................................9
8 Power Supply Recommendations................................10
9 Layout.............................................................................10
9.1 Layout Guidelines..................................................... 10
10 Device and Documentation Support..........................11
10.1 Receiving Notification of Documentation Updates.. 11
10.2 Support Resources................................................. 11
10.3 Trademarks............................................................. 11
10.4 Electrostatic Discharge Caution.............................. 11
10.5 Glossary.................................................................. 11
11 Mechanical, Packaging, and Orderable
Information.................................................................... 11
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2003) to Revision E (February 2022)
Page
• Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect
modern data sheet standards............................................................................................................................. 1
2
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
SN54HC153, SN74HC153
www.ti.com
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
4 Pin Configuration and Functions
J, W, D, N, NS, or PW Package
16-Pin CDIP, CFP, SOIC, PDIP, SO, or TSSOP
Top View
NC - No internal connection
FK Package
20-Pin LCCC
Top View
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
3
SN54HC153, SN74HC153
www.ti.com
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage range
current(2)
MIN
MAX
–0.5
7
UNIT
V
IIK
Input clamp
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
±70
mA
150
°C
150
°C
Continuous current through VCC or GND
TJ
Junction temperature
Tstg
Storage temperature
(1)
(2)
–65
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Section 5.2 is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 Recommended Operating Conditions(1)
SN54HC153
VCC
NOM
MAX
2
5
6
Supply voltage
VCC = 2 V
VIH
High-level input voltage
VCC = 4.5 V
VI
Input voltage
VO
Output voltage
5
6
3.15
4.2
VCC = 4.5 V
0
Input transition rise/fall time VCC = 4.5 V
Operating free-air temperature
−55
UNIT
V
V
0.5
0.5
1.35
1.35
1.8
0
VCC = 6 V
(1)
2
4.2
VCC = 2 V
TA
MAX
3.15
VCC = 6 V
Δt/Δv
NOM
1.5
VCC = 2 V
Low-level input voltage
MIN
1.5
VCC = 6 V
VIL
SN74HC153
MIN
V
1.8
VCC
0
VCC
0
VCC
V
VCC
V
1000
1000
500
500
400
400
125
−40
85
ns
°C
All unused inputs of the device must be held at VCCor GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
5.3 Thermal Information
THERMAL
R θJA
(1)
4
METRIC(1)
Junction-to-ambient thermal
resistance
D (SOIC)
N (PDIP)
NS (SO)
PW (TSSOP)
16 PINS
16 PINS
16 PINS
16 PINS
UNIT
73
67
64
108
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
SN54HC153, SN74HC153
www.ti.com
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
5.4 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
(1)
TEST CONDITIONS
IOH = −20 μA
VOH
IOH = −6 mA
IOH = −7.8 mA
II
SN74HC153
MIN
TYP
2
1.9
1.998
1.9
1.9
4.5
4.4
4.499
4.4
4.4
6
5.9
5.999
5.9
5.9
4.5
3.98
4.3
3.7
3.84
6
5.48
5.8
5.2
5.34
MAX
MIN
MAX
MIN
MAX
UNIT
V
2
0.002
0.1
0.1
0.1
4.5
0.001
0.1
0.1
0.1
6
0.001
0.1
0.1
0.1
IOL = 6 mA
4.5
0.17
0.26
0.4
0.33
IOL = 7.8 mA
6
0.15
0.26
0.4
0.33
VI = VCC or 0
6
±0.1
±100
±1000
±1000
nA
VI = VCC or 0, IO = 0
6
8
160
80
μA
10
10
10
pF
Ci
(1)
SN54HC153
IOL = 20 μA
VOL
ICC
TA = 25°C
VCC
(V)
2 to 6
3
V
VI = VIH or VIL, unless otherwise noted.
5.5 Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 6)
PARAMETER
FROM
(INPUT)
A or B
tpd
Data
(Any C)
G
tt
TO
(OUTPUT)
Y
Y
Y
Y
VCC (V)
TA = 25°C
MIN
SN54HC153
MIN
SN74HC153
TYP
MAX
MAX
MIN
MAX
2
90
150
225
190
4.5
21
30
45
38
6
17
26
38
32
2
73
126
189
158
4.5
17
28
42
35
6
14
23
35
29
2
38
95
150
125
4.5
11
19
28
24
6
9
16
24
20
2
20
60
90
75
4.5
8
12
18
15
6
6
10
15
13
UNIT
ns
ns
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
5
SN54HC153, SN74HC153
www.ti.com
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
5.6 Switching Characteristics
over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 6)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A or B
tpd
Y
Data
(Any C)
Y
G
Y
tt
Y
VCC (V)
TA = 25°C
MIN
TYP
SN54HC153
MAX
MIN
SN74HC153
MAX
MIN
UNIT
MAX
2
105
235
355
295
4.5
27
47
71
59
6
21
41
60
51
2
93
220
335
274
4.5
23
44
67
55
6
19
38
57
48
2
60
185
280
230
4.5
17
37
56
46
6
14
32
48
40
2
45
210
315
265
4.5
17
42
63
53
6
13
36
53
45
ns
ns
5.7 Operating Characteristics
TA = 25℃
PARAMETER
Cpd
6
TEST CONDITIONS
Power dissipation capacitance per multiplexer
No load
Submit Document Feedback
TYP
40
UNIT
pF
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
SN54HC153, SN74HC153
www.ti.com
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
6 Parameter Measurement Information
tpd is the maximum between tPLH and tPHL
Figure 6-1. Load Circuit
Figure 6-2. Voltage Waveforms
Propagation Delay and Output Transition Times
Figure 6-3. Voltage Waveform
Input Rise and Fall Times
A. CL includes probe and jig capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators
having the following charactersitics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
7
SN54HC153, SN74HC153
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
www.ti.com
7 Detailed Description
7.1 Overview
Each of these data selectors/multiplexers contains inverters and drivers to supply full binary decoding data
selection to the AND-OR gates. Separate strobe (G) inputs are provided for each of the two 4-line sections.
7.2 Functional Block Diagram
Pin numbers are for the D, J, N, NS, PW, and W packages.
8
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
SN54HC153, SN74HC153
www.ti.com
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
7.3 Device Functional Modes
INPUTS
SELECT(1)
(1)
DATA
G
OUTPUT Y
B
A
C0
C1
C2
C3
X
X
X
X
X
X
H
L
L
L
L
X
X
X
L
L
L
L
H
X
X
X
L
H
L
H
X
L
X
X
L
L
L
H
X
H
X
X
L
H
H
L
X
X
L
X
L
L
H
L
X
X
H
X
L
H
H
H
X
X
X
L
L
L
H
H
X
X
X
H
L
H
Select inputs A and B are common to both sections.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
9
SN54HC153, SN74HC153
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
www.ti.com
8 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps
to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The
bypass capacitor should be installed as close to the power terminal as possible for best results.
9 Layout
9.1 Layout Guidelines
When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many
cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a
triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left
unconnected because the undefined voltages at the outside connections result in undefined operational states.
All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the
input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular
unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever
makes more sense for the logic function or is more convenient.
10
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
SN54HC153, SN74HC153
www.ti.com
SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
10.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC153 SN74HC153
11
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
5962-8409301VEA
ACTIVE
CDIP
J
16
25
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8409301VE
A
SNV54HC153J
5962-8409301VFA
ACTIVE
CFP
W
16
25
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8409301VF
A
SNV54HC153W
84093012A
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
84093012A
SNJ54HC
153FK
8409301EA
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8409301EA
SNJ54HC153J
Samples
SN54HC153J
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SN54HC153J
Samples
SN74HC153D
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
Samples
SN74HC153DR
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
HC153
Samples
SN74HC153DRE4
ACTIVE
SOIC
D
16
2500
TBD
Call TI
Call TI
-40 to 85
SN74HC153N
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC153N
Samples
SN74HC153NE4
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC153N
Samples
SN74HC153NSR
ACTIVE
SO
NS
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
Samples
SN74HC153PW
ACTIVE
TSSOP
PW
16
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
Samples
SN74HC153PWR
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
HC153
Samples
SN74HC153PWT
ACTIVE
TSSOP
PW
16
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
Samples
SNJ54HC153FK
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
84093012A
SNJ54HC
153FK
SNJ54HC153J
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8409301EA
SNJ54HC153J
Addendum-Page 1
Samples
Samples
Samples
Samples
Samples
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of