SN54HC241, SN74HC241
SCLS300E – JANUARY 1996 – REVISED MAY 2022
SNx4HC241 Octal Buffers and Line Drivers With 3-State Outputs
1 Features
2 Description
•
•
•
•
•
•
•
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and transmitters.
The ’HC241 devices are organized as two 4-bit
buffers/drivers with separate output-enable (1OE and
2OE) inputs. When 1OE is low or 2OE is high, the
device passes noninverted data from the A inputs to
the Y outputs. When 1OE is high or 2OE is low, the
outputs for the respective buffers/drivers are in the
high-impedance state.
Wide operating voltage range of 2 V to 6 V
High-current outputs drive up to 15 LSTTL loads
Low power consumption, 80-μA max ICC
Typical tpd =11 ns
±6-mA output drive at 5 V
Low input current of 1 μA max
3-state outputs drive bus lines or buffer memory
address registers
Device Information
(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74HC241DW
SOIC (20)
12.80 mm × 7.50 mm
SN74HC241N
PDIP (20)
25.40 mm × 6.35 mm
SN74HC241NSR
SO (20)
15.00 mm × 5.30 mm
SN74HC241PW
TSSOP (20)
6.50 mm × 4.40 mm
SN54HC241J
CDIP (20)
26.92 mm × 6.92 mm
SNJ54HC241FK
LCCC (20)
8.89 mm × 8.45 mm
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 Recommended Operating Conditions(1) .................... 4
5.3 Thermal Information....................................................4
5.4 Electrical Characteristics.............................................5
5.5 Switching Characteristics ...........................................5
5.6 Switching Characteristics............................................6
5.7 Operating Characteristics........................................... 6
6 Parameter Measurement Information............................ 7
7 Detailed Description........................................................8
7.1 Overview..................................................................... 8
7.2 Functional Block Diagram........................................... 8
7.3 Device Functional Modes............................................8
8 Power Supply Recommendations..................................9
9 Layout...............................................................................9
9.1 Layout Guidelines....................................................... 9
10 Device and Documentation Support..........................10
10.1 Receiving Notification of Documentation Updates..10
10.2 Support Resources................................................. 10
10.3 Trademarks............................................................. 10
10.4 Electrostatic Discharge Caution..............................10
10.5 Glossary..................................................................10
11 Mechanical, Packaging, and Orderable
Information.................................................................... 10
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (January 2022) to Revision E (May 2022)
Page
• Junction-to-ambient thermal resistance values increased. DW was 58 is now 109.1, N was 69 is now 84.6,
NS was 60 is now 113.4, PW was 83 is now 131.8............................................................................................ 4
Changes from Revision C (August 2003) to Revision D (January 2022)
Page
• Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect
modern data sheet standards............................................................................................................................. 1
2
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
4 Pin Configuration and Functions
J, DW, N, NS, or PW package
20-Pin CDIP, SOIC, PDIP, SO, or TSSOP
Top View
FK Package
20-Pin LCCC
Top View
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
3
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage range
current(2)
MIN
MAX
–0.5
7
UNIT
V
IIK
Input clamp
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
±70
mA
150
℃
150
℃
Continuous current through VCC or GND
TJ
Junction temperature
Tstg
Storage temperature range
(1)
(2)
–65
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 Recommended Operating Conditions(1)
SN54HC241
VCC
Supply voltage
VCC = 2 V
VIH
High-level input voltage
VCC = 4.5 V
VCC = 6 V
NOM
MAX
2
5
6
Low-level input voltage
VI
Input voltage
VO
Output voltage
TA
(1)
MAX
2
5
6
3.15
3.15
4.2
4.2
VCC = 4.5 V
0
0.5
0.5
1.35
1.35
0
V
VCC
0
VCC
V
VCC
V
1000
VCC = 4.5 V
500
500
VCC = 6 V
400
400
−55
V
1.8
VCC
1000
Operating free-air temperature
UNIT
V
1.8
0
VCC = 2 V
Input transition rise/fall time
NOM
1.5
VCC = 6 V
Δt/Δv
MIN
1.5
VCC = 2 V
VIL
SN74HC241
MIN
125
−40
85
ns
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implicationsof Slow or Floating CMOS Inputs, literature number SCBA004.
5.3 Thermal Information
THERMAL METRIC
4
DW (SOIC)
N (PDIP)
NS (SO)
PW (TSSOP)
20 PINS
20 PINS
20 PINS
20 PINS
UNIT
109.1
84.6
113.4
131.8
°C/W
76
72.5
78.6
72.2
°C/W
RθJA
Junction-to-ambient thermal
(1)
resistance
RθJC(top)
Junction-to-case (top) thermal
resistance
RθJB
Junction-to-board thermal
resistance
77.6
65.3
78.4
82.8
°C/W
ψJT
Junction-to-top characterization
parameter
51.5
55.3
47.1
21.5
°C/W
ψJB
Junction-to-top characterization
parameter
77.1
65.2
78.1
82.4
°C/W
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
5.3 Thermal Information (continued)
DW (SOIC)
N (PDIP)
NS (SO)
PW (TSSOP)
20 PINS
20 PINS
20 PINS
20 PINS
UNIT
N/A
N/A
N/A
N/A
°C/W
THERMAL METRIC
RθJC(bot)
(1)
Junction-to-case (bottom) thermal
resistance
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
5.4 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = −20 μA
VOH
VI = VIH or VIL
IOH = −6 mA
IOH = −7.8 mA
VOL
TA = 25°C
SN54HC241
MAX
MIN
SN74HC241
MIN
TYP
MAX
MIN
2V
1.9
1.998
1.9
1.9
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
MAX
V
2V
0.002
0.1
0.1
0.1
IOL = 20 μA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
IOL = 6 mA
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
VI = VIHor VIL
IOL = 7.8 mA
UNIT
V
II
VI = VCC or 0
6V
±0.1
±100
±1000
±1000
nA
IOZ
VO = VCC or 0
6V
±0.01
±0.5
±10
±5
μA
ICC
VI = VCC or 0,
8
160
80
μA
3
10
10
10
pF
IO = 0
6V
Ci
2 V to 6 V
5.5 Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Parameter Measurement
Information)
PARAMETER
tpd
ten
tdis
tt
FROM
(INPUT)
A
OE or OE
OE or OE
TO
(OUTPUT)
Y
Y
Y
Y
VCC
TA = 25°C
MIN
SN54HC241
MIN
SN74HC241
TYP
MAX
MAX
MIN
MAX
2V
39
115
170
145
4.5 V
12
23
34
29
6V
11
20
29
25
2V
60
150
225
190
4.5 V
17
30
45
38
6V
15
26
38
32
2V
40
150
225
190
4.5 V
18
30
45
38
6V
17
26
38
32
2V
28
60
90
75
4.5 V
8
12
18
15
6V
6
10
15
13
UNIT
ns
ns
ns
ns
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
5
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
5.6 Switching Characteristics
over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Parameter
Measurement Information)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
tpd
A
Y
ten
OE or OE
Y
tt
Y
TA = 25°C
MIN
SN54HC241
MIN
SN74HC241
TYP
MAX
MAX
MIN
2V
50
165
245
210
4.5 V
16
33
49
42
UNIT
MAX
6V
14
28
42
35
2V
100
200
300
250
4.5 V
20
40
60
50
6V
17
34
51
43
2V
45
210
315
265
4.5 V
17
42
63
53
6V
13
36
53
45
ns
ns
ns
5.7 Operating Characteristics
TA = 25℃
PARAMETER
Cpd
6
TEST CONDITIONS
Power dissipation capacitance per buffer/driver
No load
Submit Document Feedback
TYP
35
UNIT
pF
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
6 Parameter Measurement Information
Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators
having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tt < 6 ns.
For clock inputs, fmax is measured when the input duty cycle is 50%.
The outputs are measured one at a time with one input transition per measurement.
VCC
Test
Point
S1
RL
From Output
Under Test
CL(1)
S2
(1) CL includes probe and test-fixture capacitance.
Figure 6-1. Load Circuit for 3-State Outputs
VCC
Input
50%
VCC
Output
Control
50%
50%
50%
0V
0V
tPHL(1)
tPLH(1)
tPZL(3)
VOH
Output
50%
VOL
tPHL
(1)
tPLH
50%
50%
10%
VOL
(1)
tPZH
VOH
Output
§ 9CC
Output
Waveform 1
S1 at VLOAD(1)
50%
Output
Waveform 2
S1 at GND(2)
50%
VOL
(1) The greater between tPLH and tPHL is the same as tpd.
tPLZ(4)
(3)
tPHZ
(4)
90%
VOH
50%
§0V
(1) S1 = CLOSED; S2 = OPEN.
(2) S1 = OPEN; s2 = CLOSED.
(3) tPLZ and tPHZ are the same as tdis.
(4) tPZL and tPZH are the same as ten.
Figure 6-2. Voltage Waveforms, Propagation
Delays for Standard CMOS Inputs
Figure 6-3. Voltage Waveforms, Standard CMOS
Inputs Propagation Delays
90%
VCC
90%
Input
10%
10%
tr(1)
0V
tf(1)
90%
VOH
90%
Output
10%
10%
tr(1)
tf(1)
VOL
(1) The greater between tr and tf is the same as tt.
Figure 6-4. Voltage Waveforms, Input and Output Transition Times for Standard CMOS Inputs
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
7
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
7 Detailed Description
7.1 Overview
These octal buffers and line drivers are designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC241 devices
are organized as two 4-bit buffers/drivers with separate output-enable (1OE and 2OE) inputs. When 1OE is low
or 2OE is high, the device passes noninverted data from the A inputs to the Y outputs. When 1OE is high or 2OE
is low, the outputs for the respective buffers/drivers are in the high-impedance state.
7.2 Functional Block Diagram
7.3 Device Functional Modes
Table 7-1. Function Table
INPUTS
1OE
1A
OUTPUT
1Y
L
H
H
L
L
L
H
X
Z
Table 7-2. Function Table
INPUTS
8
2OE
2A
OUTPUT
2Y
H
H
H
H
L
L
L
X
Z
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
8 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps
to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The
bypass capacitor should be installed as close to the power terminal as possible for best results.
9 Layout
9.1 Layout Guidelines
When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many
cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a
triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left
unconnected because the undefined voltages at the outside connections result in undefined operational states.
All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the
input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular
unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever
makes more sense for the logic function or is more convenient.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
9
SN54HC241, SN74HC241
www.ti.com
SCLS300E – JANUARY 1996 – REVISED MAY 2022
10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
10.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
10
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: SN54HC241 SN74HC241
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
JM38510/65704BRA
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
JM38510/
65704BRA
Samples
M38510/65704BRA
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
JM38510/
65704BRA
Samples
SN54HC241J
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SN54HC241J
Samples
SN74HC241DW
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC241
Samples
SN74HC241DWE4
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC241
Samples
SN74HC241DWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC241
Samples
SN74HC241DWRG4
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC241
Samples
SN74HC241N
ACTIVE
PDIP
N
20
20
RoHS &
Non-Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC241N
Samples
SN74HC241NSR
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC241
Samples
SN74HC241PW
ACTIVE
TSSOP
PW
20
70
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC241
Samples
SN74HC241PWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC241
Samples
SNJ54HC241FK
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SNJ54HC
241FK
Samples
SNJ54HC241J
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SNJ54HC241J
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
工商网监
湘ICP备2023018690号
