SN54HC253, SN74HC253
SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
SNx4HC253 Dual 4-Line To 1-Line Data Selectors/Multiplexers With 3-State Outputs
1 Features
2 Description
•
•
•
The SNx4HC253 devices contain two independent
data selectors/multiplexers with full binary decoding
to select 1-of-4 data sources and features strobecontrolled (OE) 3-state outputs.
•
•
•
•
•
•
3-State version of ’HC153
Wide operating voltage range of 2 V to 6 V
High-current inverting outputs drive up to 15
LSTTL loads
Low power consumption, 80-μA max ICC
Typical tpd = 9 ns
±6-mA output drive at 5 V
Low input current of 1 μA max
Permit multiplexing from n lines to one line
Perform parallel-to-serial conversion
Device Information
(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74HC253D
SOIC (16)
9.90 mm × 3.90 mm
SN74HC253DB
SSOP (16)
6.20 mm × 5.30 mm
SN74HC253N
PDIP (16)
19.31 mm × 6.35 mm
SN74HC253NS
SO (16)
6.20 mm × 5.30 mm
SN54HC253J
CDIP (16)
24.38 mm × 6.92 mm
SNJ54HC253FK
LCCC (20)
8.89 mm × 8.45 mm
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
Pin numbers shown are for the D, DB, J, N, NS, and W packages.
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC253, SN74HC253
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 Recommended Operating Conditions(1) .................... 4
5.3 Thermal Information....................................................4
5.4 Electrical Characteristics.............................................5
5.5 Switching Characteristics ...........................................5
5.6 Switching Characteristics ...........................................6
5.7 Operating Characteristics........................................... 6
6 Parameter Measurement Information............................ 7
7 Detailed Description........................................................8
7.1 Overview..................................................................... 8
7.2 Functional Block Diagram........................................... 8
7.3 Device Functional Modes............................................9
8 Power Supply Recommendations................................10
9 Layout.............................................................................10
9.1 Layout Guidelines..................................................... 10
10 Device and Documentation Support..........................11
10.1 Receiving Notification of Documentation Updates.. 11
10.2 Support Resources................................................. 11
10.3 Trademarks............................................................. 11
10.4 Electrostatic Discharge Caution.............................. 11
10.5 Glossary.................................................................. 11
11 Mechanical, Packaging, and Orderable
Information.................................................................... 11
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (September 2003) to Revision F (February 2022)
Page
• Updated numbering, formating, tables, figures, and cross-references throughout the document to reflect
modern data sheet standards............................................................................................................................. 1
2
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
4 Pin Configuration and Functions
J, D, DB, N, or NS Package
16-Pin CDIP, SOIC, SSOP, PDIP, SO
Top View
FK Package
20-Pin LCCC
Top View
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage range
current(2)
MIN
MAX
–0.5
7
UNIT
V
IIK
Input clamp
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
150
°C
150
°C
Continuous current through VCC or GND
TJ
Junction temperature
Tstg
Storage temperature
(1)
(2)
–65
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 Recommended Operating Conditions(1)
SN54HC253
VCC
Supply voltage
VCC = 2 V
VIH
High-level input voltage
VCC = 4.5 V
VCC = 6 V
NOM
MAX
2
5
6
Low-level input voltage
VI
Input voltage
VO
Output voltage
TA
(1)
MAX
2
5
6
3.15
3.15
4.2
4.2
VCC = 4.5 V
0
0.5
0.5
1.35
1.35
0
V
VCC
0
VCC
V
VCC
V
1000
VCC = 4.5 V
500
500
VCC = 6 V
400
400
−55
V
1.8
VCC
1000
Operating free-air temperature
UNIT
V
1.8
0
VCC = 2 V
Input transition rise/fall time
NOM
1.5
VCC = 6 V
Δt/Δv
MIN
1.5
VCC = 2 V
VIL
SN74HC253
MIN
125
−40
85
ns
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
5.3 Thermal Information
(1)
THERMAL METRIC
R θJA
(1)
4
Junction-to-ambient thermal
resistance
D (SOIC)
DB (SSOP)
N (PDIP)
NS (SO)
16 PINS
16 PINS
16 PINS
16 PINS
UNIT
73
82
67
64
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
5.4 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
(1)
TEST CONDITIONS
IOH = −20 μA
VOH
IOH = −6 mA
IOH = −7.8 mA
TA = 25°C
SN54HC253
MAX
MIN
SN74HC253
MIN
TYP
MAX
MIN
2
1.9
1.998
1.9
1.9
4.5
4.4
4.499
4.4
4.4
6
5.9
5.999
5.9
5.9
4.5
3.98
4.3
3.7
3.84
6
5.48
5.8
5.2
5.34
MAX
UNIT
V
2
0.002
0.1
0.1
0.1
IOL = 20 μA
4.5
0.001
0.1
0.1
0.1
6
0.001
0.1
0.1
0.1
IOL = 6 mA
4.5
0.17
0.26
0.4
0.33
IOL = 7.8 mA
6
0.15
0.26
0.4
0.33
VOL
V
II
VI = VCC or 0
6
±0.1
±100
±1000
±1000
nA
IOZ
VO = VCC or 0
6
±0.01
±0.5
±10
±5
μA
ICC
VI = VCC or 0 IO = 0
8
160
80
μA
3
10
10
10
pF
6
Ci
(1)
VCC (V)
2 to 6
VI = VIH or VIL, unless otherwise noted.
5.5 Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 6)
PARAMETER
tt
SN74HC253
VCC (V)
A or B
Any Y
6
16
26
38
32
2
54
126
210
175
4.5
16
28
42
35
6
13
23
36
30
Data
(Any C)
tdis
SN54HC253
TO
(OUTPUT)
tpd
ten
TA = 25°C
FROM
(INPUT)
OE
OE
Y
Y
Y
Y
MIN
TYP
MAX
MIN
MAX
MIN
MAX
2
62
150
225
190
4.5
19
30
45
38
2
28
100
150
125
4.5
11
20
30
25
6
9
17
26
21
2
21
135
203
170
4.5
14
30
45
38
6
12
35
38
31
2
28
60
90
75
4.5
8
12
18
15
6
6
10
15
13
UNIT
ns
ns
ns
ns
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
5.6 Switching Characteristics
over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 6)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A or B
Any Y
tpd
Data
(Any C)
ten
Y
OE
Y
tt
Y
VCC (V)
TA = 25°C
MIN
SN54HC253
MIN
SN74HC253
TYP
MAX
MAX
MIN
2
76
235
355
295
4.5
23
47
71
59
6
20
41
60
51
2
68
220
335
275
4.5
20
44
67
55
6
17
38
57
51
2
44
185
280
230
4.5
16
37
56
46
6
14
32
48
40
2
45
210
315
265
4.5
17
42
63
53
6
13
36
53
45
UNIT
MAX
ns
ns
ns
5.7 Operating Characteristics
TA = 25℃
PARAMETER
Cpd
6
TEST CONDITIONS
Power dissipation capacitance per multiplexer
No load
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TYP
45
UNIT
pF
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
6 Parameter Measurement Information
tpd is the maximum between tPLH and tPHL
tt is the maximum between tTLH and tTHL
Figure 6-1. Load Circuit
Figure 6-2. Voltage Waveforms
Propagation Delay and Output Transition Times
Figure 6-3. Voltage Waveforms
Enable and Disable Times for 3-State Outputs
Figure 6-4. Voltage Waveform
Input Rise and Fall Times
A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when diabled by the
output control.
Waveform 2 is for an output with internal conditions such that the output is high except when diabled by the
output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators
having the following charactersitics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
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7 Detailed Description
7.1 Overview
Each of these data selectors/multiplexers contains inverters and drivers to supply full binary decoding data
selection to the AND-OR gates. Separate output-control inputs are provided for each of the two 4-line sections.
The 3-state outputs can interface with and drive data lines of bus-organized systems. With all but one of the
common outputs disabled (in the high-impedance state), the low impedance of the single enabled output drives
the bus line to a high or low logic level. Each output has its own output-enable (OE) input. The outputs are
disabled when their respective OE is high.
7.2 Functional Block Diagram
8
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
7.3 Device Functional Modes
Table 7-1. Function Table
INPUTS
SELECT(1)
(1)
DATA
OE
OUTPUT Y
B
A
C0
C1
C2
C3
X
X
X
X
X
X
H
Z
L
L
L
X
X
X
L
L
L
L
H
X
X
X
L
H
L
H
X
L
X
X
L
L
L
H
X
H
X
X
L
H
H
L
X
X
L
X
L
L
H
L
X
X
H
X
L
H
H
H
X
X
X
L
L
L
H
H
X
X
X
H
L
H
Select inputs A and B are common to both sections.
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
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8 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps
to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The
bypass capacitor should be installed as close to the power terminal as possible for best results.
9 Layout
9.1 Layout Guidelines
When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many
cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a
triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left
unconnected because the undefined voltages at the outside connections result in undefined operational states.
All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the
input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular
unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever
makes more sense for the logic function or is more convenient.
10
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SCLS133F – DECEMBER 1982 – REVISED FEBRUARY 2022
10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
10.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
5962-88682012A
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
596288682012A
SNJ54HC
253FK
5962-8868201EA
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8868201EA
SNJ54HC253J
Samples
SN54HC253J
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SN54HC253J
Samples
SN74HC253D
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC253
Samples
SN74HC253DBR
ACTIVE
SSOP
DB
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC253
Samples
SN74HC253DR
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
HC253
Samples
SN74HC253DT
ACTIVE
SOIC
D
16
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC253
Samples
SN74HC253N
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC253N
Samples
SN74HC253NE4
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC253N
Samples
SN74HC253NSR
ACTIVE
SO
NS
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC253
Samples
SNJ54HC253FK
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
596288682012A
SNJ54HC
253FK
SNJ54HC253J
ACTIVE
CDIP
J
16
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8868201EA
SNJ54HC253J
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
Samples
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2022
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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