SN74HC367D

SN54HC367, SN74HC367 SCLS309E – JANUARY 1996 – REVISED MARCH 2022 SNx4HC367 Hex Buffers and Line Drivers with 3-State Outputs 1 Features 2 Description • • The SNx4HC367 is a hex buffer with 3-state outputs. The device is configured into two banks, one with four drivers and one with two drivers, each controlled by its own output enable pin. • • • • • Wide operating voltage range of 2 V to 6 V High-current 3-state outputs drive bus lines, buffer memory address registers, or drive up to 15 LSTTL loads True outputs Low power consumption, 80-μA max ICC Typical tpd = 10 ns ±6-mA output drive at 5 V Low input current of 1µA max Device Information PACKAGE BODY SIZE (NOM) SN54HC367J CDIP (16) 24.38 mm × 6.92 mm SN74HC367D SOIC (16) 9.90 mm × 3.90 mm SN74HC367N PDIP (16) 19.31 mm × 6.35 mm SN74HC367NS SO (16) 6.20 mm × 5.30 mm SN74HC367PW TSSOP (16) 5.00 mm × 4.40 mm (1) 1OE 1A1 1A2 1A3 1A4 1 2OE 2 3 4 5 6 7 9 10 (1) PART NUMBER 1Y1 2A1 1Y2 2A2 For all available packages, see the orderable addendum at the end of the data sheet. 15 12 11 14 13 2Y1 2Y2 1Y3 1Y4 Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 (1) 5.2 Recommended Operating Conditions ..................... 4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics ...........................................5 5.6 Operating Characteristics........................................... 6 6 Parameter Measurement Information............................ 7 7 Detailed Description........................................................8 7.1 Overview..................................................................... 8 7.2 Functional Block Diagram........................................... 8 7.3 Device Functional Modes............................................8 8 Power Supply Recommendations..................................9 9 Layout...............................................................................9 9.1 Layout Guidelines....................................................... 9 10 Device and Documentation Support..........................10 10.1 Documentation Support.......................................... 10 10.2 Receiving Notification of Documentation Updates..10 10.3 Support Resources................................................. 10 10.4 Trademarks............................................................. 10 10.5 Electrostatic Discharge Caution..............................10 10.6 Glossary..................................................................10 11 Mechanical, Packaging, and Orderable Information.................................................................... 10 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (September 2003) to Revision E (March 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the doucment to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 4 Pin Configuration and Functions J, D, N, NS, or PW package 16-Pin CDIP, SOIC, PDIP, SO, or TSSOP Top View Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 3 SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage range (2) IIK Input clamp current IOK Output clamp current IO Continuous output current (2) MIN MAX -0.5 7 Junction temperature Tstg Storage temperature (1) (2) V (VI < 0 or VI > VCC) ±20 mA (VO < 0 or VO > VCC) ±20 mA (VO = 0 to VCC) ±35 mA ±70 mA 150 °C 150 °C Continuous current through VCC or GND TJ UNIT -65 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. (1) 5.2 Recommended Operating Conditions SN54HC367 VCC NOM MAX 2 5 6 Supply voltage VCC = 2 V VIH High-level input voltage VCC = 4.5 V VI Input voltage VO Output voltage TA (1) 2 5 6 3.15 4.2 4.2 VCC = 4.5 V 0 0.5 0.5 1.35 0 VCC 0 V VCC V VCC = 4.5 V 500 500 VCC = 6 V 400 400 125 V VCC 1000 -55 V 1.8 VCC 1000 Operating free-air temperature UNIT V 1.35 1.8 0 VCC = 2 V Input transition rise/fall time MAX 3.15 VCC = 6 V tt NOM 1.5 VCC = 2 V Low-level input voltage MIN 1.5 VCC = 6 V VIL SN74HC367 MIN -40 85 ns °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report Implications of Slow or Floating SMOS Inputs, literature number SCBA004. 5.3 Thermal Information THERMAL METRIC RθJA (1) 4 Junction-to-ambient thermal (1) resistance D (SOIC) N (PDIP) NS (SO) PW (TSSOP) 16 PINS 16 PINS 16 PINS 16 PINS UNIT 73 67 64 108 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 5.4 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) TEST (1) CONDITIONS PARAMETER VCC (V) IOH = −20 μA MAX MIN SN74HC367 TYP 2 1.9 1.998 1.9 1.9 4.5 4.4 4.499 4.4 4.4 6 5.9 5.999 5.9 5.9 4.5 3.98 4.3 3.7 3.84 6 5.48 5.8 5.2 5.34 IOH = −5.2 mA MAX MIN UNIT MAX V 2 0.002 0.1 0.1 0.1 IOL = 20 μA 4.5 0.001 0.1 0.1 0.1 6 0.001 0.1 0.1 0.1 IOL = 4 mA 4.5 0.17 0.26 0.4 0.33 IOL = 5.2 mA 6 0.15 0.26 0.4 0.33 VOL V II VI = VCC or 0 6 ±0.1 ±100 ±1000 ±1000 nA IOZ VO = VCC or 0 6 ±0.01 ±0.5 ±10 ±5 μA ICC VI = VCC or 0, IO =0 6 8 160 80 μA 10 10 10 pF Ci (1) SN54HC367 MIN VOH IOH = −4 mA TA = 25°C 2 to 6 3 VI = VIH or VIL, unless otherwise noted. 5.5 Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (See Figure 6) PARAMETER tpd ten tdis tt Propagation delay Enable time Diable time FROM (INPUT) TO (OUTPUT) VCC (V) A Y OE OE Transition time Y Y Any TA = 25°C MIN SN54HC367 MIN MAX SN74HC367 TYP MAX MIN MAX 2 50 95 145 120 4.5 12 19 29 24 6 10 16 25 20 2 100 190 285 238 4.5 26 38 57 48 6 21 32 48 41 2 50 175 265 240 4.5 21 35 53 48 6 19 30 45 41 2 28 60 90 75 4.5 8 12 18 15 6 6 10 15 13 ns ns ns ns Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 5 SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 5.5 Switching Characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (See Figure 6) PARAMETER tpd ten tt Propagation delay Enable time FROM (INPUT) TO (OUTPUT) VCC (V) A Y OE Transition time Y Any TA = 25°C MIN SN54HC367 MIN MAX SN74HC367 TYP MAX MIN MAX 2 70 120 180 150 4.5 17 24 36 30 6 14 20 31 25 2 140 230 345 285 4.5 30 46 69 57 6 28 39 59 48 2 45 210 315 265 4.5 17 42 63 53 6 13 36 53 45 ns ns ns 5.6 Operating Characteristics TA = 25°C Cpd 6 Power dissipation capacitance per buffer/driver Test Conditions TYP UNIT No load 35 pF Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 6 Parameter Measurement Information Figure 6-1. Load Circuit Figure 6-2. Voltage Waveforms Propagation Delay and Output Transition Times Figure 6-3. Voltage Waveforms Enable and Disable Times for 3-State Outputs Figure 6-4. Voltage Waveforms Input Rise and Fall TImes A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when diabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when diabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following charactersitics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tpd is the maximum between tPLH and tPHL. H. tt is the maximum between tTLH and tTHL. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 7 SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 7 Detailed Description 7.1 Overview These hex buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC367 devices are organized as dual 4-line and 2-line buffers/drivers with active-low output-enable (1OE and 2OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 7.2 Functional Block Diagram 1OE 1A1 1A2 1A3 1A4 1 15 2OE 2 3 4 5 6 7 9 10 1Y1 2A1 1Y2 2A2 12 11 14 13 2Y1 2Y2 1Y3 1Y4 Pin numbers hown are for the D, J, N, NS, PW, and W packages. Figure 7-1. Functional Block Diagram 7.3 Device Functional Modes Table 7-1. Function Table (each buffer/driver) INPUTS OE 8 OUTPUT A Y H X Z L H H L L L Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 8 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 9 Layout 9.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 9 SN54HC367, SN74HC367 www.ti.com SCLS309E – JANUARY 1996 – REVISED MARCH 2022 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC367 SN74HC367 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) 8500201EA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8500201EA SNJ54HC367J JM38510/65708BEA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65708BEA M38510/65708BEA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65708BEA SN54HC367J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54HC367J SN74HC367D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC367 SN74HC367DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC367 SN74HC367DRE4 ACTIVE SOIC D 16 2500 TBD Call TI Call TI -40 to 85 SN74HC367DT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC367 SN74HC367N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC367N SN74HC367NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC367 SN74HC367PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC367 SN74HC367PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC367 SN74HC367PWT ACTIVE TSSOP PW 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC367 SNJ54HC367J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8500201EA SNJ54HC367J (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2022 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of