SN74HC4852N

                SCLS573 − MARCH 2004 D Injection Current Cross−Coupling D D D D D D, DGV, N, OR PW PACKAGE (TOP VIEW) VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA I/O diode current, IIOK (VIO < 0 or VIO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Switch through current, IS (VIO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
                SCLS573 − MARCH 2004 recommended operating conditions (see Note 4) MIN VCC VIH Supply voltage 2 VCC = 2 V VCC = 3 V High-level input voltage, control inputs VCC = 3.3 V VCC = 4.5 V VCC = 6 V VCC = 2 V VIL VI VIO Low-level input voltage, control inputs 2.3 V 3.15 4.2 0.5 0.9 VCC = 4.5 V VCC = 6 V 1.35 1 V 1.8 0 Input/output voltage 0 VCC = 3.3 V VCC = 4.5 V V 2.1 Control input voltage Input transition rise or fall rate 6 UNIT 1.5 VCC = 3 V VCC = 3.3 V VCC = 2 V VCC = 3 V ∆t/∆v MAX VCC VCC V V 1000 800 700 ns 500 VCC = 6 V 400 TA Operating free-air temperature −40 125 °C NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 
                SCLS573 − MARCH 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER ron ∆ron II IS(off) IS(on) ICC CIC TEST CONDITIONS IS ≤ 2 mA VI = VCC to GND, VINH = VIL (see Figure 5) On-state switch resistance IS ≤ 2 mA VI = VCC/2 VINH = VIL Difference in on-state resistance between switches Control input current Off-state switch leakage current (any one channel) VI = VCC or GND VI = VCC or GND VINH = VIH (see Figure 6) Off-state switch leakage current (common channel) VI = VCC or GND VINH = VIH (see Figure 7) On-state switch leakage current VI = VCC or GND, VINH = VIL (see Figure 8) Supply current Control input capacitance VI = VCC or GND A, B, INH VCC MIN TA = 25°C TYP MAX −40 TO 85°C MIN MAX −40 TO 1255C MIN MAX 2.V 500 650 670 700 3V 215 280 320 360 3.3 V 210 270 305 345 4.5 V 160 210 240 270 6V 150 195 220 250 2.V 4 18 22 24 3V 2 12 14 16 3.3 V 2 12 14 16 4.5 V 2 8 12 16 6V 3 9 13 18 ±0.1 ±0.1 ±1 ±0.1 ±0.5 ±1 6V UNIT Ω Ω µA µA A 6V 6V ±0.2 ±2 ±4 ±0.1 ±0.5 ±1 µA 2 5 10 µA 3.5 10 10 10 pF 6V CIS Common terminal capacitance Switch off 22 40 40 40 pF COS Switch terminal capacitance Switch off 6.7 15 15 15 pF injection-current coupling specifications, TA = −40°C to 125°C (see Figure 1) PARAMETER VCC 3.3 V 5V 3.3 V V∆out 5V Maximum shift of output voltage of enabled analog channel 3.3 V 5V 3.3 V 5V TEST CONDITIONS II‡ ≤ 1 mA, RS ≤ 3.9 kΩ II‡ ≤ 10 mA, II‡ ≤ 1 mA, RS ≤ 20 kΩ II‡ ≤ 10 mA, † Typical values are measured at TA = 25°C. ‡ II = total current injected into all disabled channels. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP† MAX 0.05 1 0.1 1 0.345 5 0.067 5 0.05 2 0.11 2 0.05 20 0.024 20 UNIT mV 
                SCLS573 − MARCH 2004 switching characteristics over recommended operating free-air temperature range, VCC = 2 V, CL = 50 pF (unless otherwise noted) (see Figures 9−14) PARAMETER FROM (INPUT) TO (OUTPUT) MIN TA = 25°C TYP MAX −40 TO 85°C −40 TO 125°C MIN MAX MIN MAX UNIT tPLH tPHL Propagation delay time COM or Yn Yn or COM 14.5 19.5 33 12 34 11 35 ns tPLH tPHL Propagation delay time Channel Select COM or Yn 19.6 24.5 38 15.4 40 13.8 42 ns tPZH tPZL Enable delay time INH COM or Yn 19.4 23.6 47.5 15.8 52.5 14.5 57.5 ns tPHZ tPLZ Disable delay time INH COM or Yn 39.5 48.4 100 39.3 105 39 115 ns switching characteristics over recommended operating free-air temperature range, VCC = 3 V, CL = 50 pF (unless otherwise noted) (see Figures 9−14) PARAMETER FROM (INPUT) TO (OUTPUT) TA = 25°C MIN TYP MAX −40 TO 85°C −40 TO 125°C MIN MAX MIN MAX UNIT tPLH tPHL Propagation delay time COM or Yn Yn or COM 8.6 12 16.5 6.5 18 5.8 19.5 ns tPLH tPHL Propagation delay time Channel Select COM or Yn 12.4 14.6 20 9.3 21.5 8.2 23 ns tPZH tPZL Enable delay time INH COM or Yn 12.1 13.8 45 9.2 50 8.5 55 ns tPHZ tPLZ Disable delay time INH COM or Yn 35.2 44.5 90 35.5 100 35 110 ns switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V, CL = 50 pF (unless otherwise noted) (see Figures 9−14) PARAMETER FROM (INPUT) TO (OUTPUT) MIN TA = 25°C TYP MAX −40 TO 85°C −40 TO 125°C MIN MAX MIN MAX UNIT tPLH tPHL Propagation delay time COM or Yn Yn or COM 7.9 11 15 5.8 16.5 5 18.5 ns tPLH tPHL Propagation delay time Channel Select COM or Yn 11.4 13.5 17.5 8.5 19 7.5 22 ns tPZH tPZL Enable delay time INH COM or Yn 11.2 12.7 42.5 8.4 47.5 7.4 52.5 ns tPHZ tPLZ Disable delay time INH COM or Yn 34.6 43.9 85 34.6 95 34.5 105 ns POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 
                SCLS573 − MARCH 2004 switching characteristics over recommended operating free-air temperature range, VCC = 4.5 V, CL = 50 pF (unless otherwise noted) (see Figures 9−14) PARAMETER FROM (INPUT) TO (OUTPUT) MIN TA = 25°C TYP MAX −40 TO 85°C −40 TO 125°C MIN MAX MIN MAX UNIT tPLH tPHL Propagation delay time COM or Yn Yn or COM 6.3 8.6 11.6 4.6 12.5 4.5 13.5 ns tPLH tPHL Propagation delay time Channel Select COM or Yn 9.3 11 14 6.5 15 5.6 17 ns tPZH tPZL Enable delay time INH COM or Yn 8 9.9 40 5.3 45 4.4 50 ns tPHZ tPLZ Disable delay time INH COM or Yn 28.5 41.4 80 28.2 90 28 100 ns switching characteristics over recommended operating free-air temperature range, VCC = 6 V, CL = 50 pF (unless otherwise noted) (see Figures 9−14) PARAMETER FROM (INPUT) TO (OUTPUT) TA = 25°C MIN TYP MAX −40 TO 85°C −40 TO 125°C MIN MAX MIN MAX UNIT tPLH tPHL Propagation delay time COM or Yn Yn or COM 5.5 8 10.2 4.1 11 3.6 12 ns tPLH tPHL Propagation delay time Channel Select COM or Yn 7.4 9.5 12.6 4.7 14.5 3.8 16.5 ns tPZH tPZL Enable delay time INH COM or Yn 6.8 8.4 39 4.8 40 3.8 40 ns tPHZ tPLZ Disable delay time INH COM or Yn 14.4 38 78 13.5 80 13 80 ns operating characteristics, TA = 25°C (see Figure 15) PARAMETER Cpd 6 Power dissipation capacitance VCC 3.3 V 5V POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TEST CONDITIONS TYP UNIT 48 No load 60 pF 
                SCLS573 − MARCH 2004 APPLICATION INFORMATION VCC = 5 V IIO VIN2 < VSS or VCC < VIN2 Any Disabled Channel VSS < VIN1 < VCC Enabled Channel Vout = VI1 V ± V∆out RS Figure 1. Injection-Current Coupling Specification 5V 5V 5V VCC VCC HC4052A Sensor Channel 1Y0 Channel 1Y1 Microcontroller Channel 1Y2 Channel 1Y3 1-COM A/D − Input 1 2-COM A/D − Input 2 Channel 2Y0 Channel 2Y1 (8y Identical Circuitry) Channel 2Y2 Channel 2Y3 Figure 2. Actual Technology Requires 32 Passive Components and One Extra 6-V Regulator to Suppress Injection Current Into a Standard HC4052 Multiplexer POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 
                SCLS573 − MARCH 2004 APPLICATION INFORMATION VCC 5V VCC HC4052A Sensor Channel 1Y0 Channel 1Y1 Microcontroller Channel 1Y2 Channel 1Y3 1-COM A/D − Input 1 2-COM A/D − Input 2 Channel 2Y0 Channel 2Y1 (8x Identical Circuitry) Channel 2Y2 Channel 2Y3 Figure 3. Solution by Applying the HC4852 Multiplexer Gate = VCC (Disabled) Common Analog Output Vout > VCC Disabled Analog Mux Input VIn > VCC + 0.7 V P+ P+ + + + N − Substrate (on VCC potential) Figure 4. Diagram of Bipolar Coupling Mechanism (Appears if VIn Exceeds VCC, Driving Injection Current Into the Substrate) 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
                SCLS573 − MARCH 2004 PARAMETER MEASUREMENT INFORMATION VCC VINH = VIL VCC VI = VCC to GND VO (ON) GND r on + VI – VO W IT IS V VI − VO Figure 5. On-State Resistance Test Circuit VCC 16 GND VCC OFF A VCC NC VINH =VIH OFF COMMON O/I 6 8 Figure 6. Maximum Off-Channel Leakage Current, Any One Channel, Test Setup VCC VCC VCC 16 GND VCC 16 A ON ANALOG I/O OFF VCC VINH =VIH OFF GND A COMMON O/I 6 OFF VCC NC COMMON O/I ANALOG I/O VINH =VIL 8 6 8 Figure 7. Maximum Off-Channel Leakage Current, Common Channel, Test Setup POST OFFICE BOX 655303 Figure 8. Maximum On-Channel Leakage Current, Channel to Channel, Test Setup • DALLAS, TEXAS 75265 9 
                SCLS573 − MARCH 2004 PARAMETER MEASUREMENT INFORMATION VCC 16 VCC ON/OFF ANALOG I/O COMMON O/I TEST POINT OFF/ON CL† VCC CHANNEL SELECT 50% GND tPLH 6 tPHL 8 ANALOG OUT 50% CHANNEL SELECT † Includes all probe and jig capacitance Figure 9. Propagation Delays, Channel Select to Analog Out Figure 10. Propagation Delay, Channel Select to Analog Out, Test Setup VCC 16 ANALOG I/O COMMON O/I TEST POINT CL† VCC ANALOG IN 50% GND tPLH ANALOG OUT ON tPHL 6 50% 8 † Includes all probe and jig capacitance Figure 11. Propagation Delays, Analog In to Analog Out 10 POST OFFICE BOX 655303 Figure 12. Propagation Delay, Analog In to Analog Out, Test Setup • DALLAS, TEXAS 75265 
                SCLS573 − MARCH 2004 PARAMETER MEASUREMENT INFORMATION tf tf 90% 50% 10% ENABLE tPZL ANALOG OUT tPZH ANALOG OUT 2 50 % ON/OFF 2 TEST POINT CL VOL tPHZ 90% VCC 10 kΩ ANALOG I/O 1 HIGH IMPEDANCE 10% 16 VCC GND tPLZ 50 % Position 1 when testing tPHZ and tPZH Position 2 when testing tPLZ and tPZL 1 VCC ENABLE VOH 6 8 HIGH IMPEDANCE Figure 13. Propagation Delays, Enable to Analog Out Figure 14. Propagation Delay, Enable to Analog Out, Test Setup VCC A 16 VCC ON/OFF COMMON O/I NC ANALOG I/O OFF/ON VCC 6 11 8 CHANNEL SELECT Figure 15. Power-Dissipation Capacitance, Test Setup POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 PACKAGE OPTION ADDENDUM www.ti.com 13-Aug-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN74HC4852D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HC4852 SN74HC4852DGVR ACTIVE TVSOP DGV 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HC4852 SN74HC4852DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HC4852 SN74HC4852DRG4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC4852 SN74HC4852N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 SN74HC4852N SN74HC4852PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HC4852 SN74HC4852PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HC4852 SN74HC4852PWRE4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC4852 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of