SN74HCT244QPWRQ1

SN74HCT244-Q1 SCLS509C – JUNE 2003 – REVISED JUNE 2022 SN74HCT244-Q1 Octal Buffer and Line Driver With 3-State Outputs 1 Features 2 Description • • This octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HCT244 device is organized as two 4-bit buffers/ drivers with separate output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. • • • • • • • • Qualified for automotive applications ESD protection exceeds 1000 V per MIL-STD-883, Method 3015; exceeds 200 V using machine model (C = 200 pF, R = 0) Operating voltage range of 4.5 V to 5.5 V High-current outputs drive up to 15 LSTTL loads Low power consumption, 80-μA max ICC Typical tpd = 13 ns ±6-mA output drive at 5 V Low input current of 1 μA max Inputs are TTL-voltage compatible 3-state outputs drive bus lines or buffer memory address registers Device Information (1) PART NUMBER PACKAGE BODY SIZE (NOM) SN74HCT244QPW-Q1 TSSOP (20) 6.50 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74HCT244-Q1 www.ti.com SCLS509C – JUNE 2003 – REVISED JUNE 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 5.2 Recommended Operating Conditions(1) .................... 4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics ...........................................5 5.6 Switching Characteristics............................................5 5.7 Operating Characteristics........................................... 5 6 Parameter Measurement Information............................ 6 7 Detailed Description........................................................7 7.1 Overview..................................................................... 7 7.2 Functional Block Diagram........................................... 7 7.3 Device Functional Modes............................................7 8 Power Supply Recommendations..................................8 9 Layout...............................................................................8 9.1 Layout Guidelines....................................................... 8 10 Device and Documentation Support............................9 10.1 Receiving Notification of Documentation Updates....9 10.2 Support Resources................................................... 9 10.3 Trademarks............................................................... 9 10.4 Electrostatic Discharge Caution................................9 10.5 Glossary....................................................................9 11 Mechanical, Packaging, and Orderable Information...................................................................... 9 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (February 2022) to Revision C (June 2022) Page • Junction-to-ambient thermal resistance values increased. PW was 83 is now 131.8........................................ 4 Changes from Revision A (February 2008) to Revision B (February 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the doucment to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN74HCT244-Q1 SN74HCT244-Q1 www.ti.com SCLS509C – JUNE 2003 – REVISED JUNE 2022 4 Pin Configuration and Functions 1OE 1 20 1A1 2 19 2OE 2Y4 3 18 1Y1 1A2 2Y3 4 17 5 16 2A4 1Y2 1A3 6 15 2A3 2Y2 1A4 2Y1 GND 7 8 9 10 14 13 12 11 1Y3 2A2 1Y4 2A1 VCC PW Package 20-Pin TSSOP Top View Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN74HCT244-Q1 3 SN74HCT244-Q1 www.ti.com SCLS509C – JUNE 2003 – REVISED JUNE 2022 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage range current(2) MIN MAX –0.5 7 UNIT V IIK Input clamp VI < 0 or VI > VCC ± 20 mA IOK Output clamp current(2) VO < 0 or VO > VCC ± 20 mA IO Continuous output current VO = 0 to VCC ± 35 mA ± 70 mA 150 ℃ 150 ℃ Continuous current through VCC or GND TJ Junction temperature Tstg Storage temperature range (1) (2) –65 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 5.2 Recommended Operating Conditions(1) VCC Supply voltage VIH High-level input voltage VCC = 4.5 V to 5.5 V VIL Low-level input voltage VCC = 4.5 V to 5.5 V VI Input voltage VO Output voltage Δt/Δv Input transition rise/fall time TA Operating free-air temperature (1) MIN NOM MAX 4.5 5 5.5 2 UNIT V V 0.8 V 0 VCC V 0 VCC V −40 500 ns 125 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 5.3 Thermal Information PW (TSSOP) THERMAL METRIC 20 PINS UNIT RθJA Junction-to-ambient thermal resistance 131.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 72.2 °C/W RθJB Junction-to-board thermal resistance 82.8 °C/W ψJT Junction-to-top characterization parameter 21.5 °C/W ψJB Junction-to-board characterization parameter 82.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) 4 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN74HCT244-Q1 SN74HCT244-Q1 www.ti.com SCLS509C – JUNE 2003 – REVISED JUNE 2022 5.4 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VOH VI = VIH or VIL VOL VI = VIH or VIL II VI = VCC or 0 IOH = −20 μA IOH = −6 mA IOL = 20 μA IOL = 6 mA TYP 4.4 4.499 4.4 3.98 4.3 3.7 MAX UNIT V 0.1 0.1 0.17 0.26 0.4 5.5 V ±0.1 ±100 ±1000 nA ±0.01 ±0.5 ±10 μA 8 160 μA IOZ VO = VCC or 0, VI = VIH or VIL 5.5 V VI = VCC or 0, IO = 0 5.5 V One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC MAX MIN MIN 0.001 4.5 V 5.5 V Ci (1) 4.5 V ICC ΔICC (1) TA = 25°C VCC 4.5 V to 5.5 V 1.4 2.4 3 10 V 3 mA 10 pF This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. 5.5 Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 6-1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y ten OE Y tdis OE Y tt Y VCC TA = 25°C MIN MIN MAX TYP MAX 4.5 V 15 28 42 5.5 V 13 25 38 4.5 V 21 35 53 5.5 V 19 32 48 4.5 V 19 35 53 5.5 V 18 32 48 4.5 V 8 12 18 5.5 V 7 11 16 UNIT ns ns ns ns 5.6 Switching Characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 6-1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y ten OE Y tt Y VCC TA = 25°C MIN MIN MAX TYP MAX 4.5 V 21 45 68 5.5 V 18 40 61 4.5 V 25 52 79 5.5 V 22 47 71 4.5 V 17 42 63 5.5 V 14 38 57 UNIT ns ns ns 5.7 Operating Characteristics TA = 25℃ PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per buffer/driver No load TYP 40 UNIT pF Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN74HCT244-Q1 5 SN74HCT244-Q1 www.ti.com SCLS509C – JUNE 2003 – REVISED JUNE 2022 6 Parameter Measurement Information A. B. C. D. E. F. G. CL includes probe and test-fixture capacitance. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. The outputs are measured one at a time with one input transition per measurement. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. tPLH and tPHL are the same as tpd. Figure 6-1. Load Circuit and Voltage Waveforms 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN74HCT244-Q1 SN74HCT244-Q1 www.ti.com SCLS509C – JUNE 2003 – REVISED JUNE 2022 7 Detailed Description 7.1 Overview This octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HCT244 device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the highimpedance state. 7.2 Functional Block Diagram 7.3 Device Functional Modes Table 7-1. Function Table (Each Buffer/Driver) INPUTS OE A OUTPUT Y L H H L L L H X Z Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN74HCT244-Q1 7 SN74HCT244-Q1 www.ti.com SCLS509C – JUNE 2003 – REVISED JUNE 2022 8 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 9 Layout 9.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN74HCT244-Q1 SN74HCT244-Q1 www.ti.com SCLS509C – JUNE 2003 – REVISED JUNE 2022 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN74HCT244-Q1 9 PACKAGE OPTION ADDENDUM www.ti.com 30-Jun-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN74HCT244QPWRG4Q1 ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 HT244Q Samples SN74HCT244QPWRQ1 ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 HT244Q Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of