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SN74HSTL16918DGGR

SN74HSTL16918DGGR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TSSOP48

  • 描述:

    IC MEMORY ADDRESS LATCH 48-TSSOP

  • 数据手册
  • 价格&库存
SN74HSTL16918DGGR 数据手册
SN74HSTL16918 9-BIT TO 18-BIT HSTL-TO-LVTTL MEMORY ADDRESS LATCH SCES096C – APRIL 1997 – REVISED JANUARY 1999 D D D D D DGG PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus Family Inputs Meet JEDEC HSTL Std JESD 8-6 and Outputs Meet Level III Specifications ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JESD 17 Packaged in Plastic Thin Shrink Small-Outline Package 2Q1 1Q1 GND D1 D2 VCC D3 D4 GND 1LE GND VREF GND 2LE GND D5 D6 D7 VCC D8 D9 GND 2Q9 1Q9 description This 9-bit to 18-bit D-type latch is designed for 3.15-V to 3.45-V VCC operation. The D inputs accept HSTL levels and the Q outputs provide LVTTL levels. The SN74HSTL16918 is particularly suitable for driving an address bus to two banks of memory. Each bank of nine outputs is controlled with its own latch-enable (LE) input. Each of the nine D inputs is tied to the inputs of two D-type latches that provide true data (Q) at the outputs. While LE is low, the Q outputs of the corresponding nine latches follow the D inputs. When LE is taken high, the Q outputs are latched at the levels set up at the D inputs. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 VCC VCC 1Q2 2Q2 GND 1Q3 2Q3 VCC 1Q4 2Q4 GND 1Q5 2Q5 GND 1Q6 2Q6 VCC 1Q7 2Q7 GND 1Q8 2Q8 VCC VCC The SN74HSTL16918 is characterized for operation from 0°C to 70°C. FUNCTION TABLE INPUTS LE D OUTPUT Q L H H L L H X L Q0† † Output level before the indicated steady-state input conditions were established Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments Incorporated. Copyright  1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74HSTL16918 9-BIT TO 18-BIT HSTL-TO-LVTTL MEMORY ADDRESS LATCH SCES096C – APRIL 1997 – REVISED JANUARY 1999 logic diagram (positive logic) 10 1LE 4 D1 1D 2 1Q1 C1 14 1D 2LE 1 2Q1 C1 To Eight Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This current flows only when the output is in the high state and VO > VCC. 3. The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions (see Note 4) MIN VCC VREF Supply voltage 3.15 Reference voltage 0.68 VI VIH Input voltage AC high-level input voltage All inputs VIL VIH AC low-level input voltage All inputs DC high-level input voltage All inputs VIL IOH DC low-level input voltage All inputs IOL TA Low-level output current 0 NOM 0.75 MAX UNIT 3.45 V 0.9 V 1.5 V VREF+200 mV V VREF–200 mV VREF+100 mV Operating free-air temperature V VREF–100 mV –24 High-level output current 0 V V mA 24 mA 70 °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74HSTL16918 9-BIT TO 18-BIT HSTL-TO-LVTTL MEMORY ADDRESS LATCH SCES096C – APRIL 1997 – REVISED JANUARY 1999 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VOH VCC = 3.15 V, VCC = 3.15 V, II = –18 mA IOH = –24 mA VOL VCC = 3.15 V, IOL = 24 mA VI = 0 or 1.5 V Control inputs II Data inputs VCC = 3.45 V Ci Control inputs Data inputs TYP† UNIT –1.2 V V 0.5 V ±5 ±5 µA 90 VCC = 3.45 V, VCC = 0 or 3.3 V, VI = 0 or 1.5 V VI = 0 or 3.3 V 50 VCC = 0 or 3.3 V, VCC = 0, VI = 0 or 3.3 V VO = 0 2.5 Co Outputs † All typical values are at VCC = 3.3 V, TA = 25°C. MAX 2.4 VI = 0 or 1.5 V VREF = 0.68 V or 0.9 V VREF ICC MIN 100 2 mA pF 4 pF timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) VCC = 3.3 V ± 0.15 V MIN tw tsu Pulse duration, LE low th tldr‡ Hold time D after LE↑ Data race condition time D after LE↓ Setup time, D before LE↑ UNIT MAX 3 ns 2 ns 1 ns 0 ns ‡ This is the maximum time after LE switches low that the data input can return to the latched state from the opposite state without producing a glitch on the output. switching characteristics over recommended operating free-air temperature range, VREF = 0.75 V PARAMETER tpd d FROM (INPUT) TO (OUTPUT) D Q LE VCC = 3.3 V ± 0.15 V MIN MAX 1.9 3.4 1.9 4.2 UNIT ns simultaneous switching characteristics over recommended operating free-air temperature range, VREF = 0.75 V§ PARAMETER tpd d FROM (INPUT) TO (OUTPUT) D Q LE VCC = 3.3 V ± 0.15 V MIN MAX 1.9 4.4 1.9 5.2 UNIT ns § All outputs switching POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74HSTL16918 9-BIT TO 18-BIT HSTL-TO-LVTTL MEMORY ADDRESS LATCH SCES096C – APRIL 1997 – REVISED JANUARY 1999 PARAMETER MEASUREMENT INFORMATION 1.25 V VREF LE From Output Under Test 0.25 V CL = 80 pF (see Note A) tsu 500 Ω th 1.25 V Data Input VREF VREF 0.25 V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES LOAD CIRCUIT Input (see Note B) 1.25 V VREF VREF 0.25 V tPLH tw tPHL 1.25 V Input VREF VREF VOH Output 1.5 V 0.25 V VOL VOLTAGE WAVEFORMS PULSE DURATION NOTES: A. B. C. D. VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 1 ns, tf ≤ 1 ns. The outputs are measured one at a time with one transition per measurement. tPHL and tPLH are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 1.5 V POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN74HSTL16918DGGR ACTIVE TSSOP DGG 48 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HSTL16918 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
SN74HSTL16918DGGR 价格&库存

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