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SN74LV05A
SCLS391J – APRIL 1998 – REVISED DECEMBER 2014
SN74LV05A Hex Inverters With Open-Drain Outputs
1 Features
2 Applications
•
•
•
•
•
•
•
•
1
•
•
•
•
•
2-V to 5.5-V VCC Operation
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
> 2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on All
Ports
Ioff Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2500-V Human-Body Model
– 200-V Machine Model
– 2000-V Charged-Device Model
Electronic Points of Sale
I/O Modules: Digital PLC/DCS Inputs
Motor Drives and Controls
Servers
Network Switches
Tests and Measurements
3 Description
The SN74LV05A device contains six independent
inverters designed for 2-V to 5.5-V VCC operation.
This device performs the Boolean function Y = A.
Device Information(1)
PART NUMBER
SN74LV05A
PACKAGE
BODY SIZE (NOM)
TVSOP (14)
3.60 mm x 4.40 mm
SOIC (14)
8.65 mm × 3.91 mm
SOP (14)
10.30 mm x 5.30 mm
SSOP (14)
6.20 mm x 5.30 mm
TSSOP (14)
5.00 mm x 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
A
Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LV05A
SCLS391J – APRIL 1998 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
4
4
5
5
5
6
6
6
6
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics, VCC = 2.5 V ± 0.2 V ........
Switching Characteristics, VCC = 3.3 V ± 0.3 V ........
Switching Characteristics, VCC = 5 V ± 0.5 V ...........
Noise Characteristics ................................................
Operating Characteristics........................................
Typical Characteristics ............................................
Parameter Measurement Information .................. 7
9
Detailed Description .............................................. 8
9.1
9.2
9.3
9.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
8
8
8
8
10 Application and Implementation.......................... 9
10.1 Application Information............................................ 9
10.2 Typical Application ................................................. 9
11 Power Supply Recommendations ..................... 10
12 Layout................................................................... 11
12.1 Layout Guidelines ................................................. 11
12.2 Layout Example .................................................... 11
13 Device and Documentation Support ................. 11
13.1
13.2
13.3
13.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
11
11
11
11
14 Mechanical, Packaging, and Orderable
Information ........................................................... 11
5 Revision History
Changes from Revision I (April 2005) to Revision J
Page
•
Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
•
MAX operating temperature to 125°C in Recommended Operating Conditions table. .......................................................... 5
2
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6 Pin Configuration and Functions
SN74LV05A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
1A
1Y
2A
2Y
3A
3Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
Pin Functions
PIN
NO.
NAME
TYPE
DESCRIPTION
1
1A
I
1A Input
2
1Y
O
1Y Output
3
2A
I
2A Input
4
2Y
O
2Y Output
5
3A
I
3A Input
6
3Y
O
3Y Output
7
GND
—
Ground Pin
8
4Y
O
4Y Output
9
4A
I
4A Input
10
5Y
O
5Y Output
11
5A
I
5A Input
12
6Y
O
6Y Output
6A Input
13
6A
I
14
VCC
—
Power Pin
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SN74LV05A
SCLS391J – APRIL 1998 – REVISED DECEMBER 2014
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
Supply voltage range
–0.5
7
UNIT
V
(2)
VI
Input voltage range
–0.5
7
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
7
V
VO
Output voltage range (2) (3)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
Storage temperature range
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 5.5-V maximum.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
4
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
2500
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
2000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Supply voltage
VCC = 2 V
VIH
High-level input voltage
MIN
MAX
2
5.5
Low-level input voltage
VI
Input voltage
VO
Output voltage
VCC = 2.3 V to 2.7 V
VCC × 0.7
VCC = 3 V to 3.6 V
VCC × 0.7
VCC = 4.5 V to 5.5 V
VCC × 0.7
V
0.5
VCC = 2.3 V to 2.7 V
VCC × 0.3
VCC = 3 V to 3.6 V
VCC × 0.3
VCC = 4.5 V to 5.5 V
Low-level output current
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
VCC × 0.3
5.5
0
5.5
V
50
µA
VCC = 2.3 V to 2.7 V
2
VCC = 3 V to 3.6 V
6
VCC = 4.5 V to 5.5 V
12
VCC = 2.3 V to 2.7 V
200
VCC = 3 V to 3.6 V
100
VCC = 4.5 V to 5.5 V
(1)
V
0
VCC = 2 V
IOL
V
1.5
VCC = 2 V
VIL
UNIT
V
mA
ns/V
20
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs (SCBA004).
7.4 Thermal Information
SN74LV05A
THERMAL METRIC
(1)
D
DB
DGV
NS
PW
UNIT
14 PINS
RθJA
Junction-to-ambient thermal resistance
94.9
107.4
130.4
91.4
122.6
RθJC(top)
Junction-to-case (top) thermal resistance
56.3
59.9
53.4
49.0
51.3
RθJB
Junction-to-board thermal resistance
49.2
54.7
63.5
50.2
64.4
ψJT
Junction-to-top characterization parameter
20.7
21.0
7.3
15.3
6.8
ψJB
Junction-to-board characterization parameter
48.9
51.2
62.8
49.8
63.8
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
7.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C
MIN
TYP
–40°C to 85°C
MAX
MIN
–40°C to 125°C
MAX
MIN
MAX
UNIT
IOL = 50 µA
2 V to
5.5 V
0.1
0.1
0.1
IOL = 2 mA
2.3 V
0.4
0.4
0.4
IOL = 6 mA
3V
0.44
0.44
0.44
IOL = 12 mA
4.5 V
0.55
0.55
0.6
II
VI = 5.5 V or GND
0 to
5.5 V
±1
±1
±1
µA
ICC
VI = VCC or GND,
5.5
20
20
20
µA
Ioff
VI or VO = 0 to 5.5 V
0
5
5
5
µA
Ci
VI = VCC or GND
VOL
IO = 0
3.3 V
2.5
pF
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5
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SCLS391J – APRIL 1998 – REVISED DECEMBER 2014
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7.6 Switching Characteristics, VCC = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
tPHL
tPLH
tPHL
(1)
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A
Y
CL = 15 pF
A
Y
CL = 50 pF
TA = 25°C
MIN
TYP
–40°C to 85°C
–40°C to 125°C
MAX
MIN
MAX
MIN
MAX
3.6 (1) 10.4 (1)
1
13
1
13.5
5.8 (1) 12.2 (1)
1
15
1
16.5
6.1
15.2
1
18
1
18.5
8.1
16.6
1
19.5
1
21
UNIT
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
7.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
tPHL
tPLH
tPHL
(1)
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A
Y
CL = 15 pF
A
Y
CL = 50 pF
TA = 25°C
MIN
–40°C to 85°C
–40°C to 125°C
TYP
MAX
MIN
MAX
MIN
2.9 (1)
7.1 (1)
1
8.5
1
9
(1)
7.1 (1)
1
8.5
1
9.5
4.7
10.6
1
12
1
12.5
5.8
10.6
1
12
1
13
4
MAX
UNIT
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
7.8 Switching Characteristics, VCC = 5 V ± 0.5 V
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
tPHL
tPLH
tPHL
(1)
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A
Y
CL = 15 pF
A
Y
CL = 50 pF
TA = 25°C
MIN
–40°C to 85°C
–40°C to 125°C
TYP
MAX
MIN
MAX
MIN
MAX
2.2 (1)
5.5 (1)
1
6.5
1
7
(1)
(1)
1
6.5
1
7.5
3.4
7.5
1
8.5
1
9
4.2
7.5
1
8.5
1
9.5
2.9
5.5
UNIT
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
7.9 Noise Characteristics (1)
VCC = 3.3 V, CL = 50 pF, TA = 25°C
SN74LV05A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.55
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
–0.04
–0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
3.12
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
(1)
V
2.31
V
0.97
V
Characteristics are for surface-mount packages only.
7.10 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
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f = 10 MHz
VCC
TYP
3.3 V
2.5
5V
3
UNIT
pF
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7.11 Typical Characteristics
4
7
3.5
6
TPD in ns
5
2.5
TPD (ns)
TPD (ns)
3
2
4
3
1.5
2
1
1
0.5
TPD in ns
0
-100
0
-50
0
50
Temperature (qC)
100
150
0
1
2
3
VCC
D001
Figure 1. TPD vs Temperature
4
5
6
D001
Figure 2. TPD vs VCC at 25°C
8 Parameter Measurement Information
VCC
VCC
RL = 1 kΩ
From Output
Under Test
50% VCC
Input
Test
Point
50% VCC
tPHL
0V
tPLH
≈VCC
CL
(see Note A)
50% VCC
Output
LOAD CIRCUIT FOR
OPEN-DRAIN OUTPUTS
VOL + 0.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
Figure 3. Load Circuit and Voltage Waveforms
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9 Detailed Description
9.1 Overview
The SN74LV05A device contains six independent inverters designed for 2-V to 5.5-V VCC operation.
This device performs the Boolean function Y = A.
The open-drain outputs require pull-up resistors to perform correctly and can be connected to other open-drain
outputs to implement active-low, wired-OR or active-high wired-AND functions.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
9.2 Functional Block Diagram
A
Y
Figure 4. Logic Diagram (Positive Logic)
9.3 Feature Description
•
•
•
Wide operating voltage range
– Operates from 2 V to 5.5 V
Allows down-voltage translation
– Inputs accept voltages to 5.5 V
Ioff feature
– Allows voltages on the inputs and outputs when VCC is 0 V
9.4 Device Functional Modes
Table 1. Function Table
(Each Inverter)
INPUT
A
8
OUTPUT
Y
H
L
L
H
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
SN74LV05A is a low-drive, open-drain CMOS device that can be used for a multitude of buffer type functions.
The inputs are 5.5-V tolerant and the outputs are open-drain and 5.5-V tolerant, allowing it to translate up to 5.5
V or down to any other voltage between GND and 5.5 V.
10.2 Typical Application
Basic LED Driver
Buffer Function
VPU
VPU
Wired OR
μC or Logic
μC or Logic
μC or Logic
LV05A
LV05A
μC or Logic
LV05A
Figure 5. Typical Application Schematic
10.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. The high drive will also create fast
edges into light loads, so routing and load conditions should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions
– For rise time and fall time specifications, see Δt/ΔV in the Recommended Operating Conditions table.
– For specified High and low levels, see VIH and VIL in the Recommended Operating Conditions table.
– Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC.
2. Recommend Output Conditions
– Load currents should not exceed 35 mA per output and 50 mA total for the part.
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Typical Application (continued)
10.2.3 Application Curves
3.5
VOUT input high
VOUT input low
3
2.5
VCC
2
1.5
1
0.5
0
-0.5
0
0.5
1
1.5
2
VOUT
2.5
3
3.5
4
D001
Figure 6. Output at Power Up with 4k Pull-Up 3.3 V
11 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply voltage rating located in the
Recommended Operating Conditions table.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, 0.1 μF is recommended. If there are multiple VCC pins, 0.01 μF or 0.022 μF is recommended for each
power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and
1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as
possible for best results.
10
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12 Layout
12.1 Layout Guidelines
When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of
digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used,
or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the
undefined voltages at the outside connections result in undefined operational states.
Specified in Figure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic
devices must be connected to a high or low bias to prevent them from floating. The logic level that should be
applied to any particular unused input depends on the function of the device. Generally they will be tied to GND
or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a
transceiver.
12.2 Layout Example
Vcc
Input
Unused Input
Output
Output
Unused Input
Input
Figure 7. Layout Diagram
13 Device and Documentation Support
13.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN74LV05A
Click here
Click here
Click here
Click here
Click here
13.2 Trademarks
All trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN74LV05AD
ACTIVE
SOIC
D
14
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV05A
Samples
SN74LV05ADGVR
ACTIVE
TVSOP
DGV
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV05A
Samples
SN74LV05ADR
ACTIVE
SOIC
D
14
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV05A
Samples
SN74LV05ANSR
ACTIVE
SO
NS
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
74LV05A
Samples
SN74LV05APW
ACTIVE
TSSOP
PW
14
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV05A
Samples
SN74LV05APWR
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV05A
Samples
SN74LV05APWT
ACTIVE
TSSOP
PW
14
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
LV05A
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of