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SN74LV245ANSR

SN74LV245ANSR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SO-20_12.6X5.3MM

  • 描述:

    IC TXRX NON-INVERT 5.5V 20SO

  • 详情介绍
  • 数据手册
  • 价格&库存
SN74LV245ANSR 数据手册
Product Folder Sample & Buy Support & Community Tools & Software Technical Documents SN54LV245A, SN74LV245A SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 SNx4LV245A Octal Bus Transceivers With 3-State Outputs 1 Features 2 Applications • • • • • • • • • 1 • • • • • 2-V to 5.5-V VCC Operation Max tpd of 6.5 ns at 5 V Typical VOLP (Output Ground Bounce) 2.3 V at VCC = 3.3 V, TA = 25°C Support Mixed-Mode Voltage Operation on All Ports Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Servers LED Displays Network Switches Telecom Infrastructure Motor Drivers I/O Expanders 3 Description These octal bus transceivers are designed for 2-V to 5.5-V VCC operation. Device Information PART NUMBER SNx4LV245A PACKAGE BODY SIZE (NOM) SSOP (20) 7.20 mm × 5.30 mm TVSOP (20) 5.00 mm × 4.40 mm TSSOP (20) 6.50 mm × 4.40 mm VQFN (20) 4.50 mm × 3.50 mm SOIC (20) 12.80 mm × 7.50 mm 4 Simplified Schematic DIR OE A1 B1 To Seven Other Channels 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. SN54LV245A, SN74LV245A SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic............................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 5 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 5 5 6 6 7 7 8 8 8 8 9 Absolute Maximum Ratings ...................................... Handling Ratings....................................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics, VCC = 2.5 V ± 0.2 V ........ Switching Characteristics, VCC = 3.3 V ± 0.3 V ........ Switching Characteristics, VCC = 5 V ± 0.5 V ........... Noise Characteristics ................................................ Operating Characteristics........................................ Typical Characteristics ............................................ Parameter Measurement Information ................ 10 9 Detailed Description ............................................ 11 9.1 9.2 9.3 9.4 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 11 11 11 11 10 Application and Implementation........................ 12 10.1 Application Information.......................................... 12 10.2 Typical Application ............................................... 12 11 Power Supply Recommendations ..................... 13 12 Layout................................................................... 13 12.1 Layout Guidelines ................................................. 13 12.2 Layout Example .................................................... 13 13 Device and Documentation Support ................. 14 13.1 13.2 13.3 13.4 Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 14 14 14 14 14 Mechanical, Packaging, and Orderable Information ........................................................... 14 5 Revision History Changes from Revision N (August 2012) to Revision O Page • Updated document to new TI data sheet format. ................................................................................................................... 1 • Deleted Ordering Information table. ....................................................................................................................................... 1 • Added Applications. ................................................................................................................................................................ 1 • Added Device Information table. ............................................................................................................................................ 1 • Added Pin Functions table...................................................................................................................................................... 3 • Added Handling Ratings table. ............................................................................................................................................... 5 • Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. ......................................... 6 • Added –40°C to 125°C for SN74LV245A in Electrical Characteristics table.......................................................................... 7 • Added –40°C to 125°C for SN74LV245A in all three Switching Characteristics tables. ........................................................ 7 • Added Typical Characteristics. ............................................................................................................................................... 9 • Added Detailed Description section...................................................................................................................................... 11 • Added Application and Implementation section.................................................................................................................... 12 • Added Power Supply Recommendations and Layout sections............................................................................................ 13 2 Submit Documentation Feedback Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A SN54LV245A, SN74LV245A www.ti.com SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 6 Pin Configuration and Functions 2 19 3 18 4 5 17 16 6 15 7 14 8 13 9 12 10 11 A1 A2 A3 A4 A5 A6 A7 A8 1 20 A2 A1 DIR VCC OE VCC VCC OE B1 B2 B3 B4 B5 B6 B7 B8 2 19 OE 3 18 B1 4 17 B2 16 B3 5 15 B4 14 B5 6 7 8 13 B6 12 B7 9 10 SN54LV245A . . . FK PACKAGE (TOP VIEW) A3 A4 A5 A6 A7 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 B1 B2 B3 B4 B5 11 B8 20 DIR 1 GND DIR A1 A2 A3 A4 A5 A6 A7 A8 GND SN74LV245A . . . RGY PACKAGE (TOP VIEW) A8 GND B8 B7 B6 SN54LV245A . . . J OR W PACKAGE SN74LV245A . . . DB, DGV, DW, NS, OR PW PACKAGE (TOP VIEW) Pin Functions PIN NO. NAME I/O DESCRIPTION 1 DIR I Direction Pin 2 A1 I/O A1 I/O 3 A2 I/O A2 I/O 4 A3 I/O A3 I/O 5 A4 I/O A4 I/O 6 A5 I/O A5 I/O 7 A6 I/O A6 I/O 8 A7 I/O A7 I/O 9 A8 I/O A8 I/O 10 GND — Ground Pin 11 B8 I/O B8 I/O 12 B7 I/O B7 I/O 13 B6 I/O B6 I/O 14 B5 I/O B5 I/O 15 B4 I/O B4 I/O 16 B3 I/O B3 I/O 17 B2 I/O B2 I/O 18 B1 I/O B1 I/O 19 OE I 20 VCC — Output Enable Power Pin Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A Submit Documentation Feedback 3 SN54LV245A, SN74LV245A SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 GQN PACKAGE (TOP VIEW) 1 4 2 3 www.ti.com Pin Assignments 4 1 2 3 4 A A A1 DIR VCC OE B B A3 B2 A2 B1 C C A5 A4 B4 B3 D D A7 B6 A6 B5 E E GND A8 B8 B7 Submit Documentation Feedback Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A SN54LV245A, SN74LV245A www.ti.com SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VCC Supply voltage range Except I/O ports (2) VI Input voltage range VO Voltage range applied to any output in the high-impedance or power-off state (2) I/O ports (2) (3) (2) (3) MIN MAX –0.5 7 –0.5 7 –0.5 7 –0.5 7 –0.5 VCC + 0.5 UNIT V V V VO Output voltage range applied in the high or low state IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current VO = 0 to VCC ±35 mA ±70 mA Continuous current through VCC or GND (1) (2) (3) V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 5.5-V maximum. 7.2 Handling Ratings Tstg V(ESD) (1) (2) MIN MAX UNIT –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 0 2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) 0 1000 Storage temperature range Electrostatic discharge V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A Submit Documentation Feedback 5 SN54LV245A, SN74LV245A SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 www.ti.com 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) SN54LV245A (2) VCC Supply voltage VCC = 2 V VIH High-level input voltage MIN MAX 2 5.5 Low-level input voltage VI Output voltage High-level output current VCC × 0.7 VCC = 3 V to 3.6 V VCC × 0.7 VCC × 0.7 VCC = 4.5 V to 5.5 V VCC × 0.7 Δt/Δv Input transition rise or fall rate 0.5 VCC = 2.3 V to 2.7 V VCC × 0.3 VCC × 0.3 VCC = 3 V to 3.6 V VCC × 0.3 VCC × 0.3 VCC = 4.5 V to 5.5 V VCC × 0.3 VCC × 0.3 0 5.5 0 5.5 High or low state 0 VCC 0 VCC 3-state 0 5.5 0 5.5 –50 –50 VCC = 2.3 V to 2.7 V –2 –2 VCC = 3 V to 3.6 V –8 –8 –16 –16 50 50 VCC = 2.3 V to 2.7 V 2 2 VCC = 3 V to 3.6 V 8 8 VCC = 4.5 V to 5.5 V 16 16 VCC = 2.3 V to 2.7 V 200 200 VCC = 3 V to 3.6 V 100 100 20 20 (1) (2) Operating free-air temperature V VCC × 0.7 VCC = 4.5 V to 5.5 V TA UNIT V 0.5 VCC = 2 V Low-level output current 5.5 VCC × 0.7 VCC = 4.5 V to 5.5 V IOL 2 VCC = 2.3 V to 2.7 V VCC = 2 V IOH MAX 1.5 Input voltage VO MIN 1.5 VCC = 2 V VIL SN74LV245A –55 125 –40 125 V V V µA mA µA mA ns/V °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). Product Preview 7.4 Thermal Information SN74LV245A THERMAL METRIC (1) DB DGV DW NS PW RGY UNIT 20 PINS RθJA Junction-to-ambient thermal resistance 94.6 114.8 77.5 76.6 101.5 34.1 RθJC(top) Junction-to-case (top) thermal resistance 56.3 30.1 43.7 43.0 35.6 38.4 RθJB Junction-to-board thermal resistance 49.8 56.3 45.1 44.1 52.5 12.0 ψJT Junction-to-top characterization parameter 18.3 0.9 16.9 16.7 2.2 0.8 ψJB Junction-to-board characterization parameter 49.4 55.6 44.7 43.7 52.0 12.0 RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — — 7.1 (1) 6 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). Submit Documentation Feedback Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A SN54LV245A, SN74LV245A www.ti.com SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 7.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP VOH VOL –40°C to 85°C SN74LV245A SN54LV245A (1) VCC MAX MIN TYP –40°C to 125°C SN74LV245A MAX MIN TYP UNIT MAX IOH = –50 µA 2 V to 5.5 V IOH = –2 mA 2.3 V 2 2 2 IOH = –8 mA 3V 2.48 2.48 2.48 IOH = –16 mA 4.5 V 3.8 3.8 3.8 IOL = 50 µA 2 V to 5.5 V IOL = 2 mA 2.3 V 0.4 0.4 0.4 IOL = 8 mA 3V 0.44 0.44 0.44 IOL = 16 mA 4.5 V 0.55 0.55 0.55 ±1 ±1 ±1 µA II Control inputs VI = 5.5 V or GND 0 to 5.5 V IOZ A or B port VCC – 0.1 VCC – 0.1 VCC – 0.1 0.1 V 0.1 0.1 V VO = VCC or GND 5.5 V ±5 ±5 ±5 µA ICC VI = VCC or GND, IO = 0 5.5 V 20 20 20 µA Ioff VI or VO = 0 to 5.5 V 0 5 5 5 µA Ci Control inputs VI = VCC or GND Cio A or B port VO = VCC or GND (1) 3.3 V 3 3 5V 3 3 3.3 V 5.5 5.5 5V 5.5 5.5 pF pF Product Preview 7.6 Switching Characteristics, VCC = 2.5 V ± 0.2 V over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or B LOAD CAPACITANCE MAX MIN MAX MIN MAX MIN MAX B or A 8.3 (2) 13 (2) 1 (2) 15 (2) 1 15 1 17 (2) (2) (2) (2) CL = 15 pF MIN –40°C to 125°C SN74LV245A SN74LV245A TYP ten OE A or B 1 22 1 24 tdis OE A or B 11.8 (2) 18.1 (2) 1 (2) 20 (2) 1 20 1 22 tpd A or B B or A 11.2 15.9 1 18 1 18 1 21 ten OE A or B 14.1 22.7 1 26 1 26 1 28 tdis OE A or B 17.6 23.1 1 25 1 25 1 27 CL = 50 pF tsk(o) (1) (2) SN54LV245A (1) TA = 25°C 11.8 19.9 1 22 2 UNIT ns ns 2 Product Preview On products compliant to MIL-PRF-38535, this parameter is not production tested. Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A Submit Documentation Feedback 7 SN54LV245A, SN74LV245A SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 www.ti.com 7.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or B SN54LV245A (1) TA = 25°C LOAD CAPACITANCE MIN TYP MAX MIN MAX MIN B or A 5.9 (2) 8.4 (2) 1 (2) 10 (2) (2) (2) (2) 15.5 (2) CL = 15 pF 8.2 (1) (2) MIN MAX 1 10 1 11 1 15.5 1 16.5 OE A or B tdis OE A or B 9.6 (2) 16.5 (2) 1 (2) 19.5 (2) 1 19.5 1 20.5 tpd A or B B or A 7.9 11.9 1 13.5 1 13.5 1 14.5 ten OE A or B 9.9 16.7 1 19 1 19 1 20 tdis OE A or B 13.9 19.8 1 22 1 22 1 23 tsk(o) 1 UNIT MAX ten CL = 50 pF 13.2 –40°C to 125°C SN74LV245A SN74LV245A 1.5 ns ns 1.5 Product Preview On products compliant to MIL-PRF-38535, this parameter is not production tested. 7.8 Switching Characteristics, VCC = 5 V ± 0.5 V over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) PARAMETER tpd LOAD CAPACITANCE TO (OUTPUT) A or B B or A 4.3 (2) (2) MIN CL = 15 pF TYP 5.7 MAX –40°C to 125°C SN74LV245A SN74LV245A UNIT MIN MAX MIN MAX MIN 5.5 (2) 1 (2) 6.5 (2) 1 6.5 1 7 (2) (2) 10.6 (2) 1 10 1 10.5 12.8 (2) 1 (2) 14.7 (2) 1 14.2 1 14.7 OE A or B tdis OE A or B 7.8 (2) tpd A or B B or A 5.6 7.5 1 8.5 1 8.5 1 9 ten OE A or B 7 10.6 1 12 1 12 1 12.5 tdis OE A or B 10.9 14.7 1 16 1 16 1 16.5 CL = 50 pF 8.5 1 MAX ten tsk(o) (1) (2) SN54LV245A (1) TA = 25°C FROM (INPUT) 1 ns ns 1 Product Preview On products compliant to MIL-PRF-38535, this parameter is not production tested. 7.9 Noise Characteristics (1) VCC = 3.3 V, CL = 50 pF, TA = 25°C SN74LV245A PARAMETER MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 0.5 0.8 V VOL(V) Quiet output, minimum dynamic VOL –0.4 –0.8 V VOH(V) Quiet output, minimum dynamic VOH 2.9 VIH(D) High-level dynamic input voltage VIL(D) Low-level dynamic input voltage (1) V 2.31 V 0.99 V Characteristics are for surface-mount packages only. 7.10 Operating Characteristics TA = 25°C PARAMETER Cpd 8 Power dissipation capacitance Submit Documentation Feedback TEST CONDITIONS Outputs enabled CL = 50 pF, f = 10 MHz VCC TYP 3.3 V 20 5V 25 UNIT pF Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A SN54LV245A, SN74LV245A www.ti.com SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 7.11 Typical Characteristics 10 14 TPD in ns TPD in ns 12 8 6 TPD (ns) TPD (ns) 10 4 8 6 4 2 2 0 -100 0 -50 0 50 Temperature qC) 100 150 0 1 D001 Figure 1. TPD vs Temperature at 3.3V Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A 2 3 VCC 4 5 6 D001 Figure 2. TPD vs VCC Submit Documentation Feedback 9 SN54LV245A, SN74LV245A SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 www.ti.com 8 Parameter Measurement Information VCC From Output Under Test RL = 1 kΩ From Output Under Test Test Point CL (see Note A) S1 Open TEST GND S1 Open VCC GND VCC tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain CL (see Note A) LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC 50% VCC Input 50% VCC 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC 50% VCC Input 50% VCC tPHL tPLH In-Phase Output 50% VCC VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) 50% VCC VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 50% VCC 50% VCC 0V tPZL tPLZ ≈VCC 50% VCC tPZH tPLH tPHL Out-of-Phase Output 0V VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. t PZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms 10 Submit Documentation Feedback Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A SN54LV245A, SN74LV245A www.ti.com SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 9 Detailed Description 9.1 Overview The SNx4LV245A devices are designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are effectively isolated. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. 9.2 Functional Block Diagram DIR OE A1 B1 To Seven Other Channels Figure 4. Logic Diagram (Positive Logic) 9.3 Feature Description • • Allows down voltage translation from 5 V to 3.3 V – Inputs accept voltage levels up to 5.5 V Slow edge rates minimize output ringing 9.4 Device Functional Modes Table 1. Function Table INPUTS OE DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A Submit Documentation Feedback 11 SN54LV245A, SN74LV245A SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 www.ti.com 10 Application and Implementation 10.1 Application Information The SNx4LV245A is a low-drive CMOS device that can be used for a multitude of bus-interface type applications where output ringing is a concern. The low drive and slow edge rates will minimize overshoot and undershoot on the outputs. The inputs can accept voltages to 5.5 V at any valid VCC making the device ideal for down translation. 10.2 Typical Application Regulated 5 V Regulated 5 V OE VCC OE DIR A1 5-V LEDs, relays, or other system boards DIR B1 3.3-V µC or other system boards B8 A8 VCC GND µC 5-V LEDs, relays or other system boards A1 B1 A8 B8 GND µC 5-V LEDs, relays or other system boards Figure 5. Typical Application Schematic 10.2.1 Design Requirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention, because it can drive currents that would exceed maximum limits. Outputs can be combined to produce higher drive, but the high drive will also create faster edges into light loads; therefore, routing and load conditions should be considered to prevent ringing. 10.2.2 Detailed Design Procedure 1. Recommended Input Conditions: – Rise time and fall time specifications, see (Δt/ΔV) in Recommended Operating Conditions table. – Specified high and low levels, see (VIH and VIL) in Recommended Operating Conditions table. – Inputs are overvoltage tolerant, allowing them to go as high as 5.5 V at any valid VCC. 2. Recommend Output Conditions: – Load currents should not exceed 35 mA per output and 70 mA total for the part. – Outputs should not be pulled above VCC. 12 Submit Documentation Feedback Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A SN54LV245A, SN74LV245A www.ti.com SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 Typical Application (continued) 10.2.3 Application Curves AC245 HC245 LV245 LV Figure 6. Switching Characteristics Comparison 11 Power Supply Recommendations The power supply can be any voltage between the Min and Max supply voltage rating located in the Recommended Operating Conditions table. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, 0.1 μF is recommended and if there are multiple VCC terminals then 0.01 μF or 0.022 μF is recommended for each power terminal. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μF and 1 μF are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 12 Layout 12.1 Layout Guidelines When using multiple bit logic devices inputs should not ever float. In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Specified in Figure 7 are the rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or VCC, whichever makes more sense or is more convenient. It is generally acceptable to float outputs unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when asserted. This will not disable the input section of the I/Os so they cannot float when disabled. 12.2 Layout Example Vcc Input Unused Input Output Unused Input Output Input Figure 7. Layout Diagram Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A Submit Documentation Feedback 13 SN54LV245A, SN74LV245A SCLS382O – SEPTEMBER 1997 – REVISED SEPTEMBER 2014 www.ti.com 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY SN54LV245A Click here Click here Click here Click here Click here SN74LV245A Click here Click here Click here Click here Click here 13.2 Trademarks All trademarks are the property of their respective owners. 13.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Documentation Feedback Copyright © 1997–2014, Texas Instruments Incorporated Product Folder Links: SN54LV245A SN74LV245A PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN74LV245ADBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245ADGVR ACTIVE TVSOP DGV 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245ADW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245ADWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245ANSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 74LV245A Samples SN74LV245APW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245APWG4 ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245APWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245APWRE4 ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245APWRG3 ACTIVE TSSOP PW 20 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245APWRG4 ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LV245A Samples SN74LV245ARGYR ACTIVE VQFN RGY 20 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 LV245A Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
SN74LV245ANSR
物料型号:SN54LV245A, SN74LV245A

器件简介:这些八路总线收发器设计用于2V至5.5V的电源电压操作。它们支持在所有端口上的混合模式电压操作,具有低功耗特性,适用于服务器、LED显示、网络交换机、电信基础设施、电机驱动器和I/O扩展器等多种应用。

引脚分配:文档提供了详细的引脚分配图和功能表,例如DIR(方向引脚)、OE(输出使能)、A1-A8和B1-B8为数据输入输出引脚,GND为地线,VCC为电源引脚。

参数特性: - 工作电压范围:2V至5.5V - 最大传输延迟时间(tpd)为6.5纳秒(在5V电源下) - 输出低电平电压(VOL)在3.3V电源下小于0.8V - 输出高电平电压(VOH)在3.3V电源下大于2.3V - ESD保护符合JESD22标准,包括人体模型2000V、机器模型200V和带电设备模型1000V

功能详解:这些设备用于异步通信,根据DIR输入的逻辑电平,将数据从A总线传输到B总线或反之。OE输入可以用来禁用设备,从而有效隔离总线。在上电或下电期间,为了确保高阻态,OE应通过上拉电阻连接到VCC。

应用信息:SNx4LV245A是低驱动CMOS设备,适用于输出振铃问题的总线接口应用。输入可以接收高达5.5V的电压,适用于降低电压转换。

封装信息:提供多种封装选项,包括SSOP(20)、TVSOP(20)、TSSOP(20)、VQFN(20)和SOIC(20),每种封装的尺寸和引脚数量都有详细说明。
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