SN74LV32A-EP
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
SCLS565B – JANUARY 2004 – REVISED JANUARY 2006
FEATURES
•
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of –55°C
to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
2-V to 5.5-V VCC Operation
Max tpd of 7.5 ns at 5 V
Typical VOLP (Output Ground Bounce)
2.3 V at VCC = 3.3 V, TA = 25°C
•
•
Supports Mixed-Mode Voltage Operation on
All Ports
Ioff Supports Partial-Power-Down Mode
Operation
PW PACKAGE
(TOP VIEW)
1A
1B
1Y
2A
2B
2Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4B
4A
4Y
3B
3A
3Y
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
This quadruple 2-input positive-OR gate is designed for 2-V to 5.5-V VCC operation
The SN74LV32A-EP performs the Boolean function Y + A ) B or Y + A • B in positive logic.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
PACKAGE (1)
TA
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 105°C
TSSOP – PW
Tape and reel
SN74LV32ATPWREP
LV32AEP
–55°C to 125°C
TSSOP – PW
Tape and reel
SN74LV32AMPWREP
LV32AEP
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH GATE)
INPUTS
A
B
OUTPUT
Y
H
X
H
X
H
H
L
L
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2006, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are
tested unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN74LV32A-EP
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
SCLS565B – JANUARY 2004 – REVISED JANUARY 2006
LOGIC DIAGRAM, EACH GATE (POSITIVE LOGIC)
A
Y
B
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
Supply voltage range
–0.5
7
UNIT
V
range (2)
VI
Input voltage
–0.5
7
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
7
V
VO
Output voltage range (2) (3)
–0.5
VCC + 0.5
IIK
Input clamp current
IOK
IO
–20
mA
Output clamp current
VO < 0
–50
mA
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
113
°C/W
150
°C
Continuous current through VCC or GND
impedance (4)
θJA
Package thermal
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
2
V
VI < 0
–65
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 5.5 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
SN74LV32A-EP
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
Recommended Operating Conditions
SCLS565B – JANUARY 2004 – REVISED JANUARY 2006
(1)
Supply voltage
VCC
VCC = 2 V
High-level input voltage
VIH
MIN
MAX
2
5.5
Low-level input voltage
VI
Input voltage
VO
Output voltage
VCC = 2.3 V to 2.7 V
VCC × 0.7
VCC = 3 V to 3.6 V
VCC × 0.7
VCC = 4.5 V to 5.5 V
VCC × 0.7
VCC = 2.3 V to 2.7 V
VCC × 0.3
VCC = 3 V to 3.6 V
VCC × 0.3
VCC × 0.3
5.5
0
VCC
V
–50
μA
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
–6
Δt/Δv
Input transition rise or fall rate
50
VCC = 2.3 V to 2.7 V
2
VCC = 3 V to 3.6 V
6
VCC = 4.5 V to 5.5 V
12
VCC = 2.3 V to 2.7 V
200
VCC = 3 V to 3.6 V
100
VCC = 4.5 V to 5.5 V
TA
(1)
Operating free-air temperature
mA
–12
VCC = 2 V
Low-level output current
V
–2
VCC = 4.5 V to 5.5 V
IOL
V
0
VCC = 2 V
High-level output current
V
0.5
VCC = 4.5 V to 5.5 V
IOH
V
1.5
VCC = 2 V
VIL
UNIT
μA
mA
ns/V
20
SN74LV32AM
–55
125
SN74LV32AT
–40
105
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74LV32A-EP
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
SCLS565B – JANUARY 2004 – REVISED JANUARY 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
TEST CONDITIONS
VCC
2 V to 5.5 V
IOH = –2 mA
2.3 V
IOH = –6 mA
3V
2.48
4.5 V
3.8
IOH = –12 mA
VOL
TYP
MAX
2 V to 5.5 V
V
0.1
IOL = 2 mA
2.3 V
0.4
IOL = 6 mA
3V
0.44
IOL = 12 mA
4.5 V
0.55
II
VI = 5.5 V or GND
VI = VCC or GND,
Ioff
VI or VO = 0 to 5.5 V
UNIT
VCC – 0.1
2
IOL = 50 μA
ICC
Ci
MIN
IOH = –50 μA
V
0 to 5.5 V
±1
μA
5.5 V
20
μA
5
μA
IO = 0
0
VI = VCC or GND
3.3 V
3.3
5V
3.3
pF
Switching Characteristics
over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tpd
A or B
Y
CL = 50 pF
TA = 25°C
MIN
TYP
MAX
9.6
16.2
MIN
MAX
1
20
UNIT
ns
Switching Characteristics
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tpd
A or B
Y
CL = 50 pF
TA = 25°C
MIN
TYP
MAX
6.9
11.4
MIN
MAX
1
13
UNIT
ns
Switching Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
4
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tpd
A or B
Y
CL = 50 pF
TA = 25°C
MIN
TYP
MAX
4.9
7.5
MIN
MAX
1
8.5
UNIT
ns
SN74LV32A-EP
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
Noise Characteristics
SCLS565B – JANUARY 2004 – REVISED JANUARY 2006
(1)
VCC = 3.3 V, CL = 50 pF, TA = 25°C
TYP
MAX
VOL(P)
Quiet output, maximum dynamic VOL
MIN
0.2
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
–0.1
–0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
(1)
3.1
UNIT
V
2.31
V
0.99
V
TYP
UNIT
Characteristics are for surface-mount packages only.
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
f = 10 MHz
VCC
3.3 V
9.5
5V
11.5
pF
5
SN74LV32A-EP
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
SCLS565B – JANUARY 2004 – REVISED JANUARY 2006
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
CL
(see Note A)
VCC
S1
Open
TEST
GND
CL
(see Note A)
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
0V
50% VCC
50% VCC
0V
Data Input
VCC
0V
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
tPZL
tPLH
50% VCC
VCC
Output
Control
tPHL
50% VCC
50% VCC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
50% VCC
tPLH
VCC
50% VCC
VOLTAGE WAVEFORMS
PULSE DURATION
50% VCC
th
tsu
VCC
In-Phase
Output
VCC
50% VCC
tw
Input
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
Timing Input
Input
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Output
Waveform 1
S1 at VCC
(see Note B)
0V
tPLZ
50% VCC
≈VCC
VOL + 0.3 V
VOL
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
50% VCC
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuits and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74LV32AMPWREP
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
LV32AEP
SN74LV32ATPWREP
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 105
LV32AEP
V62/04693-01XE
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 105
LV32AEP
V62/04693-02XE
ACTIVE
TSSOP
PW
14
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
LV32AEP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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