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SN74LV4051A
SCLS428I – MAY 1999 – REVISED SEPTEMBER 2015
SN74LV4051A 8-Channel Analog Multiplexers and Demultiplexers
1 Features
3 Description
•
•
The SN74LV4051A 8-channel CMOS analog
multiplexers and demultiplexers are designed for 2-V
to 5.5-V VCC operation.
1
•
•
•
•
•
•
2-V to 5.5-V VCC Operation
Support Mixed-Mode Voltage Operation on
All Ports
High On-Off Output-Voltage Ratio
Low Crosstalk Between Switches
Individual Switch Controls
Extremely Low Input Current
Latch-Up Performance Exceeds 100-mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
The SN74LV4051A devices handle both analog and
digital signals. Each channel permits signals with
amplitudes up to 5.5-V (peak) to be transmitted in
either direction.
Applications include: signal gating, chopping,
modulation or demodulation (modem), and signal
multiplexing for analog-to-digital and digital-to-analog
conversion systems.
Device Information(1)
PART NUMBER
2 Applications
•
•
•
Telecommunications
eCall
Infotainment
SN74LV4051A
PACKAGE
BODY SIZE (NOM)
TSSOP (16)
5.00 mm × 6.30 mm
SOIC (16)
9.90 mm × 6.00 mm
SSOP (16)
6.20 mm × 7.80 mm
TVSOP (16)
3.60 mm × 6.40 mm
PDIP (16)
19.30 mm × 6.35 mm
SO (16)
3.60 mm × 6.40 mm
VQFN (16)
3.50 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
SN74LV4051A
SCLS428I – MAY 1999 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
7
8
1
1
1
2
3
4
Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 5
Electrical Characteristics .......................................... 5
Operating Characteristics.......................................... 6
Switching Characteristics: VCC = 2.5 V ± 0.2 V ....... 6
Switching Characteristics: VCC = 3.3 V ± 0.3 V ....... 6
Switching Characteristics: VCC = 5 V ± 0.5 V .......... 7
Analog Switch Characteristics ................................ 7
Typical Characteristics ............................................ 8
Parameter Measurement Information .................. 9
Detailed Description ............................................ 12
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
12
12
12
12
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Application ................................................. 13
10 Power Supply Recommendations ..................... 15
11 Layout................................................................... 15
11.1 Layout Guidelines ................................................. 15
11.2 Layout Example .................................................... 15
12 Device and Documentation Support ................. 16
12.1
12.2
12.3
12.4
12.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
16
16
16
16
16
13 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (April 2005) to Revision I
Page
•
Added Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Detailed
Description section, Applications and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...... 1
•
Deleted SN54LV4051A part number from the data sheet ..................................................................................................... 1
•
Removed Ordering Information table. .................................................................................................................................... 1
•
Deleted θJA from the Absolute Maximum Ratings table ....................................................................................................... 4
2
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SCLS428I – MAY 1999 – REVISED SEPTEMBER 2015
5 Pin Configuration and Functions
D, DB, DGB, N, NS, PW Package
16-Pin SOIC, SSOP, TVSOP, PDIP, SO, TSSOP
Top View
3
14
4
13
5
12
6
11
7
10
8
9
VCC
Y2
Y1
Y0
Y3
A
B
Y6
COM
Y7
Y5
INH
GND
VCC
15
1
16
2
15
3
14
Y2
Y1
13 Y0
12 Y3
11 A
10 B
4
5
6
7
8
9
C
16
2
Y4
1
GND
Y4
Y6
COM
Y7
Y5
INH
GND
GND
RGY Package
16-Pin VQFN With Exposed Thermal Pad
Top View
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
A
11
I
Selector line A for outputs (see Device Functional Modes for specific information)
B
10
I
Selector line B for outputs (see Device Functional Modes for specific information)
C
9
I
COM
3
GND
7, 8
—
Ground
INH
6
I (1)
Enables the outputs of the device. Logic low level with turn the outputs on, high level will turn
them off.
Y0
13
I/O (1)
Input/Output to mux
Y1
14
I/O (1)
Input/Output to mux
Y2
15
I/O
(1)
Input/Output to mux
Y3
12
I/O (1)
Input/Output to mux
Y4
1
I/O (1)
Input/Output of mux
Y5
5
I/O (1)
Input/Output to mux
Y6
2
I/O
(1)
Input/Output to mux
Y7
4
I/O (1)
Input/Output to mux
VCC
16
—
(1)
O/I
Selector line C for outputs (see Device Functional Modes for specific information)
(1)
Output/Input of mux
Device power
These I/O descriptions represent the device when used as a multiplexer, when this device is operated as a demultiplexer pins Y0-Y7
may be considered outputs (O) and the COM pin may be considered inputs (I).
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
UNIT
Supply voltage range
–0.5
7.0
V
(2)
–0.5
7.0
V
–0.5
VCC + 0.5
V
VI
Input voltage range
VIO
Switch I/O voltage range (2) (3)
IIK
Input clamp current
VI < 0
−20
mA
IIOK
I/O diode current
VIO < 0
−50
mA
IT
Switch through current
VIO = 0 to VCC
±25
mA
±50
mA
150
°C
150
°C
Continuous current through VCC or GND
TJ
Max Junction temperature
Tstg
Storage temperature
(1)
(2)
(3)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 5.5-V maximum.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
MIN
VCC
Supply voltage
VIH
High-level input voltage,
control inputs
2 (2)
VCC = 2 V
NOM
MAX
5.5
UNIT
V
1.5
VCC = 2.3 V to 2.7 V
VCC × 0.7
VCC = 3 V to 3.6 V
VCC × 0.7
VCC = 4.5 V to 5.5 V
VCC × 0.7
VCC = 2 V
V
0.5
VCC = 2.3 V to 2.7 V
VCC × 0.3
VCC = 3 V to 3.6 V
VCC × 0.3
VIL
Low-level input voltage,
control inputs
VI
Control input voltage
0
5.5
V
VIO
Input or output voltage
0
VCC
V
Δt/Δv
Input transition rise or fall rate
VCC = 4.5 V to 5.5 V
VCC × 0.3
VCC = 2.3 V to 2.7 V
200
VCC = 3 V to 3.6 V
100
VCC = 4.5 V to 5.5 V
TA
(1)
(2)
4
Operating free-air temperature
V
ns/V
20
–40
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to TI application report
Implications of Slow or Floating CMOS Inputs, SCBA004.
With supply voltages at or near 2 V, the analog switch ON-state resistance becomes very nonlinear. It is recommended that only digital
signals be transmitted at these low supply voltages.
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6.4 Thermal Information
SN74LV4051A
THERMAL METRIC (1)
N (PDIP)
PW (TSSOP)
16 PINS
16 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
54.8
111.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
42.1
45.3
°C/W
RθJB
Junction-to-board thermal resistance
34.8
56.9
°C/W
ψJT
Junction-to-top characterization parameter
26.9
5.4
°C/W
ψJB
Junction-to-board characterization parameter
34.7
56.3
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C
ron
ON-state
switch resistance
IT = 2 mA,
VI = VCC or GND,
VINH = VIL
(see Figure 2)
TA = –40°C to 85°C
TA = 25°C
TA = –40°C to 85°C
TA = 25°C
TA = –40°C to 85°C
TA = 25°C
TA = –40°C to 85°C
ron(p)
Peak ON-state
resistance
IT = 2 mA,
VI = VCC to GND,
VINH = VIL
TA = 25°C
TA = –40°C to 85°C
TA = 25°C
TA = –40°C to 85°C
TA = 25°C
TA = –40°C to 85°C
Δron
Difference in
ON-state resistance
between switches
IT = 2 mA,
VI = VCC to GND,
VINH = VIL
TA = 25°C
TA = –40°C to 85°C
TA = 25°C
TA = –40°C to 85°C
II
TA = 25°C
VCC
2.3 V
3V
4.5 V
2.3 V
3V
4.5 V
2.3 V
3V
4.5 V
MIN
TYP
MAX
38
180
UNIT
225
30
150
190
22
Ω
75
100
113
500
600
54
180
225
31
Ω
100
125
2.1
30
40
1.4
20
30
1.3
Ω
15
20
±0.1
0 to
5.5 V
μA
Control input current
VI = 5.5 V or GND
TA = 25°C
IS(off)
OFF-state switch
leakage current
VI = VCC and
VO = GND, or
VI = GND and
VO = VCC,
VINH = VIH
(see Figure 3)
ON-state switch leakage
current
VI = VCC or GND,
VINH = VIL
(see Figure 4)
TA = 25°C
IS(on)
ICC
Supply current
VI = VCC or GND
TA = –40°C to 85°C
5.5 V
CIC
Control input
capacitance
f = 10 MHz
TA = 25°C
3.3 V
2
pF
CIS
Common terminal
capacitance
TA = 25°C
3.3 V
23.4
pF
COS
Switch terminal
capacitance
TA = 25°C
3.3 V
5.7
pF
CF
Feedthrough
capacitance
TA = 25°C
3.3 V
0.5
pF
TA = –40°C to 85°C
TA = –40°C to 85°C
TA = –40°C to 85°C
±1
±0.1
5.5 V
±1
±0.1
5.5 V
±1
20
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μA
μA
μA
5
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6.6 Operating Characteristics
VCC = 3.3 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
CL = 50 pF,
f = 10 MHz
TYP
UNIT
5.9
pF
6.7 Switching Characteristics: VCC = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
COM or Yn
Yn or COM
CL = 15 pF
(see Figure 5)
TA = 25°C
tPLH
tPHL
Propagation
delay time
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 6)
TA = 25°C
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 6)
TA = 25°C
tPLH
tPHL
Propagation
delay time
COM or Yn
Yn or COM
CL = 50 pF
(see Figure 6)
TA = 25°C
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 6)
TA = 25°C
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 6)
TA = 25°C
MIN
TYP
MAX
1.9
10
TA = –40°C to 85°C
16
6.6
TA = –40°C to 85°C
18
23
7.4
TA = –40°C to 85°C
18
23
3.8
TA = –40°C to 85°C
12
18
7.8
TA = –40°C to 85°C
28
35
11.5
TA = –40°C to 85°C
28
35
UNIT
ns
ns
ns
ns
ns
ns
6.8 Switching Characteristics: VCC = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
COM or Yn
Yn or COM
CL = 15 pF
(see Figure 5)
TA = 25°C
MIN
tPLH
tPHL
Propagation
delay time
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 6)
TA = 25°C
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 6)
TA = 25°C
tPLH
tPHL
Propagation
delay time
COM or Yn
Yn or COM
CL = 50 pF
(see Figure 5)
TA = 25°C
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 6)
TA = 25°C
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 6)
TA = 25°C
6
TYP
1.2
TA = –40°C to 85°C
4.7
12
15
5.7
TA = –40°C to 85°C
12
15
2.5
TA = –40°C to 85°C
9
12
5.5
TA = –40°C to 85°C
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6
10
TA = –40°C to 85°C
TA = –40°C to 85°C
MAX
20
25
8.8
20
25
UNIT
ns
ns
ns
ns
ns
ns
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6.9 Switching Characteristics: VCC = 5 V ± 0.5 V
over recommended operating free-air temperature range (unless otherwise noted)
FROM
(INPUT)
TO
(OUTPUT)
COM or Yn
Yn or COM
CL = 15 pF
(see Figure 5)
TA = 25°C
PARAMETER
TEST
CONDITIONS
tPLH
tPHL
Propagation
delay time
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 6)
TA = 25°C
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 15 pF
(see Figure 6)
TA = 25°C
tPLH
tPHL
Propagation
delay time
COM or Yn
Yn or COM
CL = 50 pF
(see Figure 5)
TA = 25°C
tPZH
tPZL
Enable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 6)
TA = 25°C
tPHZ
tPLZ
Disable
delay time
INH
COM or Yn
CL = 50 pF
(see Figure 6)
TA = 25°C
MIN
TYP
MAX
0.6
4
TA = –40°C to 85°C
7
3.5
TA = –40°C to 85°C
8
10
4.4
TA = –40°C to 85°C
8
10
1.5
TA = –40°C to 85°C
6
8
4
TA = –40°C to 85°C
14
18
6.2
TA = –40°C to 85°C
14
18
UNIT
ns
ns
ns
ns
ns
ns
6.10 Analog Switch Characteristics
over recommended operating free-air temperature range (unless otherwise noted), TA = 25°C
PARAMETER
Frequency response
(switch on)
Crosstalk
(control input to signal output)
Feedthrough attenuation
(switch off)
Sine-wave distortion
(1)
(2)
FROM
(INPUT)
TO
(OUTPUT)
COM or Yn
Yn or COM
INH
COM or Yn
COM or Yn
COM or Yn
Yn or COM
Yn or COM
TEST
CONDITIONS
VCC
MIN
TYP
CL = 50 pF,
RL = 600 Ω,
fin = 1 MHz (sine wave)
(see (1) and Figure 7)
2.3 V
20
3V
25
4.5 V
35
CL = 50 pF,
RL = 600 Ω,
fin = 1 MHz (square wave)
(see Figure 8)
2.3 V
20
3V
35
4.5 V
60
CL = 50 pF,
RL = 600 Ω,
fin = 1 MHz
(see (2) and Figure 9)
2.3 V
–45
3V
–45
4.5 V
–45
CL = 50 pF,
VI = 2 Vp-p
RL = 10 kΩ,
VI = 2.5 Vp-p
fin = 1 kHz
(sine wave)
V = 4 Vp-p
(see Figure 10) I
2.3 V
0.1%
3V
0.1%
4.5 V
0.1%
MAX
UNIT
MHz
mV
dB
Adjust fin voltage to obtain 0-dBm output. Increase fin frequency until dB meter reads –3 dB.
Adjust fin voltage to obtain 0-dBm input.
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6.11 Typical Characteristics
200
TA =25o C
160
Ron
120
MAX
(Ohm)
80
40
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Vcc(V)
Figure 1. Plot at 25°C for VCC vs Max RON
8
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7 Parameter Measurement Information
VCC
VINH = VIL
VCC
VI = VCC or GND
VO
(ON)
GND
r on =
VI – VO
2 ˣ 10 –3
Ω
2 mA
V
VI − VO
Figure 2. On-State Resistance Test Circuit
VCC
VINH = VIH
VCC
A
VI
(OFF)
VO
GND
Condition 1: VI = 0, VO = VCC
Condition 2: VI = VCC, VO = 0
Figure 3. Off-State Switch Leakage-Current Test Circuit
VCC
VINH = VIL
VCC
VI
A
(ON)
Open
GND
VI = VCC or GND
Figure 4. On-State Switch Leakage-Current Test Circuit
VCC
VINH = VIL
VCC
(ON)
Input
50 Ω
GND
Output
CL
Figure 5. Propagation Delay Time, Signal Input to Signal Output
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Parameter Measurement Information (continued)
VCC
50 Ω
VINH
VCC
VI
S1
VO
TEST
S1
S2
tPLZ/tPZL
tPHZ/tPZH
GND
VCC
VCC
GND
1 kΩ
S2
CL
GND
TEST CIRCUIT
VCC
VCC
VINH
50%
50%
0V
0V
tPZH
tPZL
VOH
≈VCC
VO
50%
50%
VOL
≈0 V
(tPZL, tPZH)
VCC
VCC
VINH
50%
50%
0V
0V
tPHZ
tPLZ
≈VCC
VOH
VO
VOL + 0.3 V
VOL
VOH – 0.3 V
≈0 V
(tPLZ, tPHZ)
VOLTAGE WAVEFORMS
Figure 6. Switching Time (tPZL, tPLZ, tPZH, tPHZ), Control to Signal Output
VCC
VINH = GND
0.1 µF
(1)
fin
VI
VCC
VO
(ON)
GND
50 Ω
RL
CL
VCC
(1)
fin is a sine wave.
Figure 7. Frequency Response (Switch On)
10
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Parameter Measurement Information (continued)
VCC
VINH
50 Ω
VCC
VO
GND
RL
600 Ω
VCC/2
CL
VCC/2
Figure 8. Crosstalk (Control Input, Switch Output)
VCC
VINH = VCC
0.1 µF
50 Ω
VCC
VI
fin
VO
(OFF)
GND
600 Ω
RL
CL
VCC/2
VCC/2
Figure 9. Feedthrough Attenuation (Switch Off)
VCC
VINH = GND
10 µF
fin
10 µF
VCC
VO
(ON)
GND
600 Ω
RL
CL
VCC/2
Figure 10. Sine-Wave Distortion
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8 Detailed Description
8.1 Overview
The SN74LV4051A device is an 8-channel analog multiplexer. A multiplexer is used when several signals must
share the same device or resource. This device allows for the selection of one of these signals at a time for
analysis or propagation.
8.2 Functional Block Diagram
8.3 Feature Description
The SN74LV4051A device contains one 8-channel multiplexer for use in a variety of applications and can also be
configured as demultiplexer by using the COM pin as an input and the Yn pins as outputs. This device is
qualified to operate in the temperature range –40°C to +85°C (maximum depends on package type).
8.4 Device Functional Modes
Table 1. Function Table
INPUTS
12
A
ON
CHANNEL
L
L
Y0
L
H
Y1
L
H
L
Y2
L
L
H
H
Y3
L
H
L
L
Y4
L
H
L
H
Y5
L
H
H
L
Y6
L
H
H
H
Y7
H
X
X
X
None
INH
C
B
L
L
L
L
L
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
A multiplexer is used in applications where multiple signals share a resource. In Figure 11, several different
sensors are connected to the analog-to-digital converter (ADC) of a microcontroller unit (MCU).
9.2 Typical Application
Figure 11. Example of Multiplexer Use With Analog Sensors and the ADC of an MCU
9.2.1 Design Requirements
Designing with the SN74LV4051A device requires a stable input voltage between 2 V (see Recommended
Operating Conditions for details) and 5.5 V. Another important design consideration are the characteristics of the
signal being multiplexed—ensure no important information is lost due to timing or incompatibility with this device.
9.2.2 Detailed Design Procedure
Normally, processing eight different analog signals requires eight separate ADCs, but Figure 11 shows how to
achieve this using only one ADC and four GPIOs (general-purpose input/outputs).
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Typical Application (continued)
9.2.3 Application Curve
500
TA =25o C
400
Ron
300
Peak
MAX
(Ohm)
200
100
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Vcc(V)
Figure 12. Plot at 25°C for VCC vs Max RON(peak)
14
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10 Power Supply Recommendations
Most systems have a common 3.3-V or 5-V rail that can supply the VCC pin of this device. If this rail is not
available, a switched-mode power supply (SMPS) or a low dropout regulator (LDO) can supply this device from a
higher-voltage rail.
11 Layout
11.1 Layout Guidelines
TI recommends keeping the signal lines as short and as straight as possible (see Figure 13). Incorporation of
microstrip or stripline techniques are also recommended when signal lines are more than 1" long. These traces
must be designed with a characteristic impedance of either 50-Ω or 75-Ω as required by the application. Do not
place this device too close to high-voltage switching components because they may cause interference.
11.2 Layout Example
Figure 13. Layout Schematic
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
Implications of Slow or Floating CMOS Inputs, SCBA004
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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PACKAGE OPTION ADDENDUM
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13-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74LV4051AD
ACTIVE
SOIC
D
16
40
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV4051A
SN74LV4051ADBR
ACTIVE
SSOP
DB
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051ADGVR
ACTIVE
TVSOP
DGV
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051ADGVRG4
ACTIVE
TVSOP
DGV
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051ADR
ACTIVE
SOIC
D
16
2500
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
LV4051A
SN74LV4051AN
ACTIVE
PDIP
N
16
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74LV4051AN
SN74LV4051ANSR
ACTIVE
SO
NS
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
74LV4051A
SN74LV4051APW
ACTIVE
TSSOP
PW
16
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051APWG4
ACTIVE
TSSOP
PW
16
90
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051APWR
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051APWRE4
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051APWRG4
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051APWT
ACTIVE
TSSOP
PW
16
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW051A
SN74LV4051ARGYR
ACTIVE
VQFN
RGY
16
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
LW051A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of