SN74LVC16374DL

www.ti.com SN74LVC16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS FEATURES • • • • • • • Member of the Texas Instruments Widebus™ Family EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages DESCRIPTION This 16-bit edge-triggered D-type flip-flop is designed for 2.7-V to 3.6-V VCC operation. The SN74LVC16374 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. It can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs. SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005 DGG OR DL PACKAGE (TOP VIEW) 1OE 1Q1 1Q2 GND 1Q3 1Q4 VCC 1Q5 1Q6 GND 1Q7 1Q8 2Q1 2Q2 GND 2Q3 2Q4 VCC 2Q5 2Q6 GND 2Q7 2Q8 2OE 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1CLK 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 GND 1D7 1D8 2D1 2D2 GND 2D3 2D4 VCC 2D5 2D6 GND 2D7 2D8 2CLK A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components. OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74LVC16374 is characterized for operation from –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, EPIC are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1993–2005, Texas Instruments Incorporated SN74LVC16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005 FUNCTION TABLE (EACH FLIP-FLOP) INPUTS OE CLK D OUTPUT Q L ↑ H H L ↑ L L L H or L X Q0 H X X Z LOGIC SYMBOL(1) 1OE 1CLK 2OE 2CLK 1D1 1D2 1D3 1D4 1D5 1D6 1D7 1D8 2D1 2D2 2D3 2D4 2D5 2D6 2D7 2D8 1 48 24 25 47 LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1EN C1 1CLK C1 C2 1D 1D1 47 2 1 3 44 5 43 6 41 8 40 9 38 11 37 12 35 33 2D 13 2 14 16 32 17 30 19 29 20 27 22 26 23 2 1Q1 1D 1Q1 1Q2 1Q3 1Q4 To Seven Other Channels 1Q5 1Q6 1Q7 2OE 24 1Q8 2Q1 2CLK 25 2Q2 2Q3 C1 2D1 36 1D 2Q4 2Q5 2Q6 2Q7 2Q8 (1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 48 2EN 46 36 1 To Seven Other Channels 13 2Q1 SN74LVC16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VI Input voltage range (2) –0.5 4.6 V –0.5 VCC + 0.5 range (2) (3) UNIT VO Output voltage IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 or VO > VCC ±50 mA IO Continuous output current VO = 0 to VCC ±50 mA ±100 mA Continuous current through VCC or GND Maximum power dissipation at TA = 55°C (in still air) (4) Tstg (1) (2) (3) (4) DGG package 0.85 DL package Storage temperature range V W 1.2 –65 °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. This value is limited to 4.6 V maximum. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology Data Book, literature number SCBD002B. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage VCC = 2.7 V to 3.6 V VIL Low-level input voltage VCC = 2.7 V to 3.6 V VI Input voltage VO Output voltage MIN MAX 2.7 3.6 2 UNIT V V 0.8 V 0 VCC V 0 VCC V VCC = 2.7 V –12 VCC = 3 V –24 IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate 0 10 ns/V TA Operating free-air temperature –40 85 °C (1) VCC = 2.7 V 12 VCC = 3 V 24 mA mA Unused control inputs must be held high or low to prevent them from floating. 3 SN74LVC16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VCC (1) TEST CONDITIONS IOH = –100 µA VOH MIN to MAX II 3V 2.4 IOH = –24 mA 3V 2 IOL = 100 µA MIN to MAX IOL = 12 mA 2.7 V 0.4 IOL = 24 mA 3V 0.55 V 0.2 ±5 3.6 V VI = 0.8 V Data inputs V µA 75 3V VI = 2 V UNIT VCC – 0.2 2.2 VI = VCC or GND II(hold) TYP (2) MAX 2.7 V IOH = –12 mA VOL MIN µA –75 VI = 0 to 3.6 V 3.6 V ±500 IOZ VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, 3.6 V 40 µA ∆ICC One input at VCC – 0.6 V, Other inputs at VCC or GND 3 V to 3.6 V 500 µA Ci VI = VCC or GND 3.3 V 3.5 pF Co VO = VCC or GND 3.3 V 7 pF (1) (2) IO = 0 For conditions shown as MIN or MAX, use the appropriate values under recommended operating conditions. All typical values are at VCC = 3.3 V, TA = 25°C. Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) VCC = 3.3 V ± 0.3 V VCC = 2.7 V UNIT MIN MAX MIN MAX 100 0 80 fclock Clock frequency 0 tw Pulse duration, CLK high or low 4 4 MHz ns tsu Setup time, data before CLK↑ High or low 2 3 ns th Hold time, data after CLK↑ High or low 1.5 1.5 ns Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd CLK Q ten OE tdis OE PARAMETER VCC = 3.3 V ± 0.3 V UNIT MAX MIN 1.5 7.5 1.5 8.5 ns Q 1.5 7.5 1.5 8.5 ns Q 1.5 7 1.5 8 ns fmax MIN VCC = 2.7 V 100 MAX 80 MHz Operating Characteristics VCC = 3.3 V, TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance per flip-flop TEST CONDITIONS Outputs enabled Outputs disabled CL = 50 pF, f = 10 MHz TYP 22 9 UNIT pF SN74LVC16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION 6V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 6V GND 2.7 V LOAD CIRCUIT FOR OUTPUTS 1.5 V Timing Input 0V tw tsu 2.7 V 1.5 V Input 1.5 V th 2.7 V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V 1.5 V Input 1.5 V 0V tPHL tPLH Output 1.5 V VOL tPHL VOH Output VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS tPLZ 3V 1.5 V tPZH 1.5 V 1.5 V 0V Output Waveform 1 S1 at 6 V (see Note B) tPLH 1.5 V 1.5 V tPZL VOH 1.5 V 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH
0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the ouput is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50
, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN74LVC16374DGGR ACTIVE TSSOP DGG 48 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LVC16374 SN74LVC16374DL ACTIVE SSOP DL 48 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LVC16374 SN74LVC16374DLR ACTIVE SSOP DL 48 1000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LVC16374 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of