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SN74LVC16T245
SCES636B – AUGUST 2005 – REVISED APRIL 2015
SN74LVC16T245 16-bit Dual-Supply Bus Transceiver
With Configurable Level-Shifting / Voltage Translation and Tri-State Outputs
1 Features
3 Description
•
This 16-bit noninverting bus transceiver uses two
separate configurable power-supply rails. The A port
is designed to track VCCA. VCCA accepts any supply
voltage from 1.65 V to 5.5 V. The B port is designed
to track VCCB. VCCB accepts any supply voltage from
1.65 V to 5.5 V. This allows for universal low-voltage
bidirectional translation between any of the 1.8-V,
2.5-V, 3.3-V, and 5-V voltage nodes.
1
•
•
•
•
•
•
Control Inputs VIH/VIL Levels are Referenced to
VCCA Voltage
VCC Isolation Feature – If Either VCC Input is at
GND, Both Ports are in the High-Impedance State
Overvoltage-Tolerant Inputs and Outputs Allow
Mixed Voltage-Mode Data Communications
Fully Configurable Dual-Rail Design Allows Each
Port to Operate Over the Full 1.65-V to 5.5-V
Power-Supply Range
Ioff Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
2 Applications
•
•
•
•
Personal Electronics
Industrial
Enterprise
Telecom
The SN74LVC16T245 device is designed for
asynchronous communication between two data
buses. The logic levels of the direction-control (DIR)
input and the output-enable (OE) input activate either
the B-port outputs or the A-port outputs or place both
output ports into the high-impedance mode. The
device transmits data from the A bus to the B bus
when the B-port outputs are activated, and from the B
bus to the A bus when the A-port outputs are
activated. The input circuitry on both A and B ports
always is active and must have a logic HIGH or LOW
level applied to prevent excess ICC and ICCZ.
Device Information(1)
PART NUMBER
SN74LVC16T245
PACKAGE
BODY SIZE (NOM)
TSSOP (48)
12.50 mm × 6.10 mm
TVSOP (48)
9.70 mm × 4.40 mm
SSOP (48)
15.88 mm × 7.49 mm
BGA MICROSTAR
7.00 mm × 4.50 mm
JUNIOR (56)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
To Seven Other Channels
24
2OE
36
13
1B1
2B1
To Seven Other Channels
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC16T245
SCES636B – AUGUST 2005 – REVISED APRIL 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
8
1
1
1
2
3
4
6
Absolute Maximum Ratings ...................................... 6
ESD Ratings.............................................................. 6
Recommended Operating Conditions ...................... 7
Thermal Information .................................................. 8
Electrical Characteristics........................................... 8
Switching Characteristics: VCCA = 1.8 V ±0.15 V...... 9
Switching Characteristics: VCCA = 2.5 V ±0.2 V........ 9
Switching Characteristics: VCCA = 3.3 V ±0.3 V...... 10
Switching Characteristics: VCCA = 5 V ±0.5 V......... 10
Operating Characteristics...................................... 10
Typical Characteristics ......................................... 11
Parameter Measurement Information ................ 12
9
Detailed Description ............................................ 13
9.1
9.2
9.3
9.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
13
13
13
13
10 Application and Implementation........................ 15
10.1 Application Information.......................................... 15
10.2 Typical Application ............................................... 16
11 Power Supply Recommendations ..................... 18
12 Layout................................................................... 18
12.1 Layout Guidelines ................................................. 18
12.2 Layout Example .................................................... 19
13 Device and Documentation Support ................. 20
13.1
13.2
13.3
13.4
Documentation Support ........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
20
20
20
20
14 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
Changes from Revision A (October 2005) to Revision B
•
2
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
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5 Description (continued)
The SN74LVC16T245 control pins (1DIR, 2DIR, 1OE, and 2OE) are supplied by VCCA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
The VCC isolation feature ensures that if either VCC input is at GND, then both ports are in the high-impedance
state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a
pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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SCES636B – AUGUST 2005 – REVISED APRIL 2015
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6 Pin Configuration and Functions
DGG and DGV Packages
48-Pin TSSOP and TVSOP
(Top View)
1DIR
1B1
1B2
GND
1B3
1B4
VCCB
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCCB
2B5
2B6
GND
2B7
2B8
2DIR
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
GQL and ZQL Packages
56-Pin BGA
(Top View)
1
1OE
1A1
1A2
GND
1A3
1A4
VCCA
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCCA
2A5
2A6
GND
2A7
2A8
2OE
2
3
4
5
6
A
B
C
D
E
F
G
H
J
K
Pin Functions
PIN
NAME
I/O
DESCRIPTION
DGG / DGV
GQL / ZQL
1A1
47
B5
I/O
Input/Output. Referenced to VCCA
1A2
46
B6
I/O
Input/Output. Referenced to VCCA
1A3
44
C5
I/O
Input/Output. Referenced to VCCA
1A4
43
C6
I/O
Input/Output. Referenced to VCCA
1A5
41
D5
I/O
Input/Output. Referenced to VCCA
1A6
40
D6
I/O
Input/Output. Referenced to VCCA
1A7
38
E5
I/O
Input/Output. Referenced to VCCA
1A8
37
E6
I/O
Input/Output. Referenced to VCCA
1B1
2
B2
I/O
Input/Output. Referenced to VCCB
1B2
3
B1
I/O
Input/Output. Referenced to VCCB
1B3
5
C2
I/O
Input/Output. Referenced to VCCB
1B4
6
C1
I/O
Input/Output. Referenced to VCCB
1B5
8
D2
I/O
Input/Output. Referenced to VCCB
1B6
9
D1
I/O
Input/Output. Referenced to VCCB
1B7
11
E2
I/O
Input/Output. Referenced to VCCB
1B8
12
E1
I/O
Input/Output. Referenced to VCCB
1DIR
1
A1
I
4
Direction-control signal
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Pin Functions (continued)
PIN
NAME
I/O
DESCRIPTION
DGG / DGV
GQL / ZQL
1OE
48
A6
I
2A1
36
F6
I/O
Input/Output. Referenced to VCCA
2A2
35
F5
I/O
Input/Output. Referenced to VCCA
2A3
33
G6
I/O
Input/Output. Referenced to VCCA
2A4
32
G5
I/O
Input/Output. Referenced to VCCA
2A5
30
H6
I/O
Input/Output. Referenced to VCCA
2A6
29
H5
I/O
Input/Output. Referenced to VCCA
2A7
27
J6
I/O
Input/Output. Referenced to VCCA
2A8
26
J5
I/O
Input/Output. Referenced to VCCA
2B1
13
F1
I/O
Input/Output. Referenced to VCCB
2B2
14
F2
I/O
Input/Output. Referenced to VCCB
2B3
16
G1
I/O
Input/Output. Referenced to VCCB
2B4
17
G2
I/O
Input/Output. Referenced to VCCB
2B5
19
H1
I/O
Input/Output. Referenced to VCCB
2B6
20
H2
I/O
Input/Output. Referenced to VCCB
2B7
22
J1
I/O
Input/Output. Referenced to VCCB
2B8
23
J2
I/O
Input/Output. Referenced to VCCB
2DIR
24
K1
I
Direction-control signal
2OE
25
K6
I
Tri-State output-mode enables. Pull OE high to place all outputs in Tri-State
mode. Referenced to VCCA
4
10
GND
B3
B4
D3
15
D4
21
G3
28
G4
34
J3
45
Tri-State output-mode enables. Pull OE high to place all outputs in Tri-State
mode. Referenced to VCCA
—
Ground
J4
A2
A3
A4
NC (1)
—
A5
K2
—
K3
K4
K5
VCCA
VCCB
(1)
31
C4
42
H4
7
C3
18
H3
—
A-port supply. 1.65 V ≤ VCCA≤ 5.5 V
—
B-port supply. 1.65 V ≤ VCCB≤ 5.5 V
NC – No internal connection
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
–0.5
6.5
V
I/O ports (A port)
–0.5
6.5
I/O ports (B port)
–0.5
6.5
Control inputs
–0.5
6.5
A port
–0.5
6.5
B port
–0.5
6.5
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
VCCA
VCCB
Supply voltage
VI
Input voltage (2)
VO
Voltage applied to any output
in the high-impedance or power-off state (2)
VO
Voltage applied to any output in the high or low state (2)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through each VCCA, VCCB, and GND
±100
mA
(3)
V
V
V
TJ
Junction temperature
-40
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input (VI ) and output (VO) negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The output positive-voltage rating may be exceeded up to 6.5 V maximum if the output current rating is observed.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
6
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
Machine model (A115-A)
±200
UNIT
V
JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
See
(1) (2) (3) (4)
VCCI
VCCA
VCCB
VCCO
Supply voltage
1.65 V to 1.95 V
High-level
input voltage
VIH
MAX
1.65
5.5
1.65
5.5
1.7
3 V to 3.6 V
4.5 V to 5.5 V
Low-level
input voltage
Data inputs (5)
VCCI × 0.7
VCCI × 0.35
2.3 V to 2.7 V
0.7
3 V to 3.6 V
0.8
4.5 V to 5.5 V
VIH
Control inputs
(referenced to VCCA) (6)
VCCA × 0.65
2.3 V to 2.7 V
1.7
3 V to 3.6 V
V
2
4.5 V to 5.5 V
VCCA × 0.7
1.65 V to 1.95 V
VCCA × 0.35
2.3 V to 2.7 V
0.7
3 V to 3.6 V
0.8
VIL
Low-level
input voltage
Control inputs
(referenced to VCCA) (6)
VI
Input voltage
Control inputs
0
5.5
Input/output
voltage
Active state
0
VCCO
Tri-State
0
5.5
4.5 V to 5.5 V
VI/O
High-level output current
IOL
Low-level output current
Δt/Δv
Input transition
rise or fall rate
TA
Operating free-air temperature
Data inputs
(4)
(5)
(6)
V
V
–4
2.3 V to 2.7 V
–8
3 V to 3.6 V
–24
4.5 V to 5.5 V
–32
1.65 V to 1.95 V
4
2.3 V to 2.7 V
8
3 V to 3.6 V
24
4.5 V to 5.5 V
32
1.65 V to 1.95 V
20
2.3 V to 2.7 V
20
3 V to 3.6 V
10
4.5 V to 5.5 V
(1)
(2)
(3)
V
VCCA × 0.3
1.65 V to 1.95 V
IOH
V
VCCI × 0.3
1.65 V to 1.95 V
High-level
input voltage
V
V
2
1.65 V to 1.95 V
VIL
UNIT
VCCI × 0.65
2.3 V to 2.7 V
Data inputs (5)
MIN
mA
mA
ns/V
5
–40
85
°C
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
All unused or driven (floating) data inputs (I/Os) of the device must be held at logic HIGH or LOW (preferably VCCI or GND) to ensure
proper device operation and minimize power. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature
number SCBA004.
All unused data inputs of the device must be held at VCCA or GND to ensure proper device operation.
For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V.
For VCCA values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V.
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7.4 Thermal Information
SN74LVC16T245
THERMAL METRIC
RθJA
(1)
DGG (TSSOP)
DGV
(TVSOP)
GQL / ZQL
(BGA)
48 PINS
48 PINS
48 PINS
56 PINS
UNIT
92.9
60
82.5
64.6
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
29.5
13.9
34.2
16.6
°C/W
RθJB
Junction-to-board thermal resistance
35.5
27.1
45.1
30.8
°C/W
ψJT
Junction-to-top characterization parameter
8.1
0.5
2.7
0.9
°C/W
ψJB
Junction-to-board characterization parameter
34.9
26.8
44.6
64.6
°C/W
(1)
Junction-to-ambient thermal resistance
DL (SSOP)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (1)
PARAMETER
VOH
VOL
TEST CONDITIONS
TA = –40°C to 85°C
MAX
MIN
MAX
1.65 V to 4.5 V
1.65 V to 4.5 V
VI = VIH
1.65 V
1.65 V
1.2
IOH = –8 mA,
VI = VIH
2.3 V
2.3 V
1.9
IOH = –24 mA,
VI = VIH
3V
3V
2.4
IOH = –32 mA,
VI = VIH
4.5 V
4.5 V
3.8
IOL = 100 μA,
VI = VIL
1.65 V to 4.5 V
1.65 V to 4.5 V
0.1
IOL = 4 mA,
VI = VIL
1.65 V
1.65 V
0.45
IOL = 8 mA,
VI = VIL
2.3 V
2.3 V
0.3
IOL = 24 mA,
VI = VIL
3V
3V
0.55
IOL = 32 mA,
VI = VIL
4.5 V
4.5 V
0.55
1.65 V to 5.5 V
1.65 V to 5.5 V
±1
±2
Ioff
A or B
port
VI or VO = 0 to 5.5 V
IOZ
A or B
port
VO = VCCO or GND,
OE = VIH
VI = VCCI or GND,
IO = 0
ICCB
VI = VCCI or GND,
IO = 0
ICCA + ICCB
VI = VCCI or GND,
IO = 0
A port
One A port at VCCA – 0.6 V,
DIR at VCCA, B port = open
DIR
DIR at VCCA – 0.6 V,
B port = open,
A port at VCCA or GND
ΔICCB
B port
One B port at VCCB – 0.6 V,
DIR at GND, A port = open
Ci
Control
inputs
VI = VCCA or GND
8
TYP
VI = VIH
VI = VCCA or GND
(1)
(2)
TA = 25°C
MIN
IOH = –4 mA,
Control
inputs
ΔICCA
VCCB
IOH = –100 μA,
II
ICCA
VCCA
(2)
UNIT
VCCO – 0.1
V
0V
0 to 5.5 V
±1
±2
0 to 5.5 V
0V
±1
±2
1.65 V to 5.5 V
1.65 V to 5.5 V
±1
±2
1.65 V to 5.5 V
1.65 V to 5.5 V
20
5V
0V
20
0V
5V
–2
1.65 V to 5.5 V
1.65 V to 5.5 V
20
5V
0V
–2
0V
5V
20
1.65 V to 5.5 V
1.65 V to 5.5 V
30
V
μA
μA
μA
μA
μA
μA
50
3 V to 5.5 V
μA
3 V to 5.5 V
50
3 V to 5.5 V
3 V to 5.5 V
3.3 V
3.3 V
4
50
μA
5
pF
VCCO is the VCC associated with the output port.
VCCI is the VCC associated with the input port.
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Electrical Characteristics (continued)
over recommended operating free-air temperature range (unless otherwise noted)(1) (2)
PARAMETER
A or B
port
Cio
TEST CONDITIONS
VO = VCCA/B or GND
VCCA
VCCB
3.3 V
3.3 V
TA = 25°C
MIN
TYP
TA = –40°C to 85°C
MAX
MIN
MAX
8.5
UNIT
10
pF
7.6 Switching Characteristics: VCCA = 1.8 V ±0.15 V
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPHZ
tPLZ
tPHZ
tPLZ
tPZH
tPZL
tPZH
tPZL
FROM
(INPUT)
TO
(OUTPUT)
A
VCCB = 1.8 V
±0.15 V
VCCB = 2.5 V
±0.2 V
VCCB = 3.3 V
±0.3 V
VCCB = 5 V
±0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.7
21.9
1.3
9.2
1
7.4
0.8
7.1
ns
B
A
0.9
23.8
0.8
23.6
0.7
23.4
0.7
23.4
ns
OE
A
1.6
29.6
1.5
29.4
1.5
29.3
1.4
29.2
ns
OE
B
2.4
32.2
1.9
13.1
1.7
12
1.3
10.3
ns
OE
A
0.4
24
0.4
23.8
0.4
23.7
0.4
23.7
ns
OE
B
1.8
32
1.6
16
1.2
12.6
0.9
10.8
ns
7.7 Switching Characteristics: VCCA = 2.5 V ±0.2 V
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPHZ
tPLZ
tPHZ
tPLZ
tPZH
tPZL
tPZH
tPZL
FROM
(INPUT)
TO
(OUTPUT)
A
VCCB = 1.8 V
±0.15 V
VCCB = 2.5 V
±0.2 V
VCCB = 3.3 V
±0.3 V
VCCB = 5 V
0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.6
21.4
1.2
9
0.8
6.2
0.6
4.8
ns
B
A
1.2
9.3
1
9.1
1
8.9
0.9
8.8
ns
OE
A
1.4
9
1.4
9
1.4
9
1.4
9
ns
OE
B
2.3
29.6
1.8
11
1.7
9.3
0.9
6.9
ns
OE
A
1
10.9
1
10.9
1
10.9
1
10.9
ns
OE
B
1.7
28.2
1.6
12.9
1.2
9.4
1
6.9
ns
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7.8 Switching Characteristics: VCCA = 3.3 V ±0.3 V
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPHZ
tPLZ
tPHZ
tPLZ
tPZH
tPZL
tPZH
tPZL
FROM
(INPUT)
TO
(OUTPUT)
A
VCCB = 1.8 V
±0.15 V
VCCB = 2.5 V
±0.2 V
VCCB = 3.3 V
±0.3 V
VCCB = 5 V
±0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN MAX
B
1.5
21.2
1.1
8.8
0.8
6.1
0.5
4.4
ns
B
A
0.9
7.2
0.8
6.2
0.7
6.1
0.6
6
ns
OE
A
1.6
8.2
1.6
8.2
1.6
6.2
1.6
8.2
ns
OE
B
2.1
29
1.7
10.3
1.5
8.6
0.8
6.3
ns
OE
A
0.8
7.8
0.8
7.8
0.8
7.8
0.8
7.8
ns
OE
B
1.6
27.7
1.4
12.4
1.1
8.5
0.9
8.4
ns
7.9 Switching Characteristics: VCCA = 5 V ±0.5 V
over recommended operating free-air temperature range, VCCA = 5 V ± 0.5 V (unless otherwise noted) (see Figure 3)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPHZ
tPLZ
tPHZ
tPLZ
tPZH
tPZL
tPZH
tPZL
VCC = 1.8 V
±0.15 V
FROM
(INPUT)
TO
(OUTPUT)
A
B
1.6
B
A
OE
MIN MAX
VCC = 2.5 V
±0.2 V
VCC = 3.3 V
±0.3 V
VCC = 5 V
±0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
21.4
1
8.8
0.7
6
0.4
4.2
ns
0.7
6.8
0.4
4.8
0.3
4.5
0.3
4.3
ns
A
0.3
5.4
0.3
5.4
0.3
5.4
0.3
6.4
ns
OE
B
2
28.7
1.6
9.7
1.4
8
0.7
5.7
ns
OE
A
0.7
5.5
0.7
5.5
0.7
5.5
0.7
5.5
ns
OE
B
1.6
27.6
1.3
11.4
1
8.1
0.9
6
ns
7.10 Operating Characteristics
TA = 25°C
PARAMETER
CpdA
CpdB
(1)
10
(1)
A-port input, B-port output
B-port input, A-port output
(1)
TEST
CONDITIONS
A-port input, B-port output
B-port input, A-port output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
VCCA =
VCCB = 1.8 V
VCCA =
VCCB = 2.5 V
VCCA =
VCCB = 3.3 V
VCCA =
VCCB = 5 V
UNIT
TYP
TYP
TYP
TYP
2
2
2
3
18
19
19
22
18
19
20
22
2
2
2
2
pF
Power dissipation capacitance per transceiver. Refer to the TI application report, CMOS Power Consumption and Cpd Calculation,
SCAA035
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1.4
5.6
1.2
5.4
1.0
5.2
VOH Voltage (V)
VOL Voltage (V)
7.11 Typical Characteristics
0.8
0.6
0.4
4.8
4.6
o
-40 C
o
25 C
0.2
5.0
o
-40 C
o
25 C
4.4
o
o
85 C
85 C
4.2
0
0
20
40
60
80
100
0
-20
-40
-60
-80
IOL Current (mA)
IOH Current (mA)
Figure 1. VOL Voltage vs IOL Current
Figure 2. VOH Voltage vs IOH Current
-100
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8 Parameter Measurement Information
2 Ψ VCCO
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 Ψ VCCO
GND
RL
tw
LOAD CIRCUIT
VCCI
VCCI/2
Input
VCCO
CL
RL
VTP
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
15 pF
15 pF
15 pF
15 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
0.15 V
0.15 V
0.3 V
0.3 V
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
VCCA/2
0V
tPLZ
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VOH
VCCO/2
VOL
VCCO/2
VCCO
Output
Waveform 1
S1 at 2 Ψ VCCO
(see Note B)
VCCO/2
VOL + VTP
VOL
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCCO/2
VOH − VTP
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 W, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLH and tPHL are the same as tpd.
F. VCCI is the VCC associated with the input port.
G. VCCO is the VCC associated with the output port.
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms
12
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9 Detailed Description
9.1 Overview
The SN74LVC16T245 is a 16-bit, dual-supply noninverting bidirectional voltage level translation. Pins A and
control pins (DIR and OE) are supported by VCCA and pins B are supported by VCCB. The A port is able to accept
I/O voltages ranging from 1.65 V to 5.5 V, while the B port can accept I/O voltages from 1.65 V to 5.5 V. A high
on DIR allows data transmission from A to B and a low on DIR allows data transmission from B to A when OE is
set to low. When OE is set to high, both A and B are in the high-impedance state.
This device is fully specified for partial-power-down applications using off output current (Ioff).
The VCC isolation feature ensures that if either VCC input is at GND, both ports are put in a high-impedance state.
9.2 Functional Block Diagram
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
24
2OE
36
13
1B1
2B1
To Seven Other Channels
To Seven Other Channels
9.3 Feature Description
9.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65-V to 5.5-V
Power-Supply Range
Both VCCA and VCCB can be supplied at any voltage from 1.65 V to 5.5 V making the device suitable for
translating between any of the low voltage nodes (1.8-V, 2.5-V, and 3.3-V).
9.3.2 Support High-Speed Translation
SN74LVC16T245 can support high data rate application. Data rates can be calculated form the maximum
propagation delay. This is also dependant on the output load. For example, for a 3.3-V to 5-V conversion, the
maximum frequency is 200 MHz.
9.3.3 Partial-Power-Down Mode Operation
This device is fully specified for partial-power-down applications using off output current (Ioff). Ioff will prevent
backflow current by disabling I/O output circuits when device is in partial power-down mode.
9.3.4 VCC Isolation
The VCC isolation feature ensures that if either VCCA or VCCB are at GND, both ports will be in a high-impedance
state (IOZ shown in Electrical Characteristics). This prevents false logic levels from being presented to either bus.
9.4 Device Functional Modes
The functional modes for the SN74LVC16T245 device are shown in Table 1.
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Table 1. Function Table (1)
(Each Transceiver)
CONTROL INPUTS
OE
(1)
14
OUTPUT CIRCUITS
B PORT
OPERATION
DIR
A PORT
L
L
Enabled
Hi-Z
B data to A bus
L
H
Hi-Z
Enabled
A data to B bus
H
X
Hi-Z
Hi-Z
Isolation
Input circuits of the data I/Os always are active.
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The SN74LVC16T245 device can be used in level-shifting applications for interfacing devices and addressing
mixed voltage incompatibility. The SN74LVC16T245 device is ideal for data transmission where direction is
different for each channel.
10.1.1 Enable Times
Calculate the enable times for the SN74LV16T245 using the following formulas:
tPZH (DIR to A) = tPLZ (DIR to B) + tPLH (B to A)
tPZL (DIR to A) = tPHZ (DIR to B) + tPHL (B to A)
tPZH (DIR to B) =tPLZ (DIR to A) + tPLH (A to B)
tPZL (DIR to B) = tPHZ(DIR to A) + tPHL (A to B)
(1)
(2)
(3)
(4)
In a bidirectional application, these enable times provide the maximum delay from the time the DIR bit is
switched until an output is expected. For example, if the SN74LVC16T245 initially is transmitting from A to B,
then the DIR bit is switched; the B port of the device must be disabled before presenting it with an input. After the
B port has been disabled, an input signal applied to it appears on the corresponding A port after the specified
propagation delay.
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10.2 Typical Application
1.8 V
3.3 V
0.1 µF
0.1 µF
VCCA
1 µF
VCCB
1DIR/2DIR
1OE/2OE
1.8-V
Controller
3.3-V
System
SN74LVC16T245
Data
1A1/2A1
1B1/2B1
1A2/2A2
1B2/2B2
1A3/2A3
1B3/2B3
1A4/2A4
1B4/2B4
1A5/2A5
1B5/2B5
1A6/2A6
1B6/2B6
1A7/2A7
1B7/2B7
1A8/2A8
1B8/2B8
GND
Data
GND
GND
Figure 4. Typical Application Schematic
10.2.1 Design Requirements
This device uses drivers which are enabled depending on the state of the DIR pin. The designer must know the
intended flow of data and take care not to violate any of the high or low logic levels. It is important that unused
data inputs not be floating, as this can cause excessive internal leakage on the input CMOS structure. Make sure
to tie any unused input and output ports directly to ground. For this design example, use the parameters listed in
Table 2.
Table 2. Design Parameters
16
DESIGN PARAMETERS
EXAMPLE VALUE
Input voltage range
1.65 V to 5.5 V
Output voltage
1.65 V to 5.5 V
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10.2.2 Detailed Design Procedure
To begin the design process, determine the following:
• Input voltage range
– Use the supply voltage of the device that is driving the SN74LVC16T245 device to determine the input
voltage range. For a valid logic high the value must exceed the VIH of the input port. For a valid logic low
the value must be less than the VIL of the input port.
• Output voltage range
– Use the supply voltage of the device that the SN74LVC16T245 device is driving to determine the output
voltage range.
10.2.3 Application Curve
Voltage (V)
Output (5 V)
Input (1.8 V)
Time (200 ns/div)
Figure 5. Translation Up (1.8 V to 5 V) at 2.5 MHz
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11 Power Supply Recommendations
The SN74LVC16T245 device uses two separate configurable power-supply rails, VCCA and VCCB. VCCA accepts
any supply voltage from 1.65 V to 5.5 V and VCCB accepts any supply voltage from 1.65 V to 5.5 V. The A port
and B port are designed to track VCCA and VCCB, respectively, allowing for low-voltage bidirectional translation
between any of the 1.8-V, 2.5-V and 3.3-V voltage nodes.
The output-enable OE input circuit is supplied by VCCA and when the OE input is high, all outputs are placed in
the high-impedance state. To ensure the high-impedance state of the outputs during power up or power down,
the OE input pin must be tied to VCCA through a pullup resistor and must not be enabled until VCCA and VCCB are
fully ramped and stable. The minimum value of the pullup resistor to VCCA is determined by the current-sinking
capability of the driver.
12 Layout
12.1 Layout Guidelines
To
•
•
•
18
ensure reliability of the device, following common printed-circuit-board layout guidelines is recommended.
Bypass capacitors should be used on power supplies.
Short trace lengths should be used to avoid excessive loading.
Placing pads on the signal paths for loading capacitors or pullup resistors to help adjust rise and fall times of
signals depending on the system requirements.
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12.2 Layout Example
LEGEND
VIA to Power Plane
Polygonal Copper Pour
VIA to GND Plane (Inner Layer)
Keep OE high until VCCA and
VCCB are powered up
VCCA
1DIR
1OE
48
To
System
2
1B1
1A1
47
From
Controller
To
System
3
1B2
1A2
46
From
Controller
4
GND
GND
45
To
System
5
1B3
1A3
44
From
Controller
To
System
6
1B4
1A4
43
From
Controller
VCCA
42
7
VCCB
8
1B5
1A5
41
From
Controller
To
System
9
1B6
1A6
40
From
Controller
10
GND
GND
39
11
1B7
1A7
38
From
Controller
12
1B8
1A8
37
From
Controller
To
System
13
2B1
2A1
36
From
Controller
To
System
14
2B2
2A2
35
15
GND
GND
34
To
System
16
2B3
2A3
33
From
Controller
To
System
17
2B4
2A4
32
From
Controller
18
VCCB
To
System
SN74AVCH16T245
VCCA
VCCA
Bypass Capacitor
To
System
To
System
VCCB
VCCA
VCCB
1
From
Controller
VCCA
31
Bypass Capacitor
From
Controller
From
Controller
19
2B5
2A5
To
System
20
2B6
2A6
29
21
GND
GND
28
To
System
22
2B7
2A7
27
From
Controller
To
System
23
2B8
2A8
26
From
Controller
24
2DIR
2OE
25
VCCA
To
System
VCCA
31
Keep OE high until VCCA and
VCCB are powered up
Figure 6. SN74LVC16T245 Layout Example
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13 Device and Documentation Support
13.1 Documentation Support
13.1.1 Related Documentation
For related documentation see the following:
• CMOS Power Consumption and Cpd Calculation, SCAA035
• Implications of Slow or Floating CMOS Inputs, SCBA004
13.2 Trademarks
All trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
20
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PACKAGE OPTION ADDENDUM
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14-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
74LVC16T245DGGRE4
ACTIVE
TSSOP
DGG
48
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVC16T245
74LVC16T245DGGRG4
ACTIVE
TSSOP
DGG
48
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVC16T245
74LVC16T245DGVRG4
ACTIVE
TVSOP
DGV
48
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LDT245
SN74LVC16T245DGGR
ACTIVE
TSSOP
DGG
48
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVC16T245
SN74LVC16T245DGVR
ACTIVE
TVSOP
DGV
48
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LDT245
SN74LVC16T245DL
ACTIVE
SSOP
DL
48
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVC16T245
SN74LVC16T245DLR
ACTIVE
SSOP
DL
48
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVC16T245
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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