SN74LVC1G04DCKR

Sample & Buy Product Folder Technical Documents Support & Community Tools & Software SN74LVC1G04 SCES214AD–APRIL1999–REVISED OCTOBER 2014 SN74LVC1G04 Single Inverter Gate 1 Features • 1 • • • • • • • • 3 Description 2 Available in the Ultra-Small 0.64-mm Package (DPW) with 0.5-mm Pitch Supports 5-V VCC Operation Inputs Accept Voltages up to 5.5 V Allowing Down Translation to VCC Max tpd of 3.3 ns at 3.3-V Low Power Consumption, 10-μA Max ICC ±24-mA Output Drive at 3.3-V Ioff Supports Live-Insertion, Partial-Power-Down Mode, and Back-Drive Protection Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 2 Applications • • • • • • • • • • • • AV Receiver Audio Dock: Portable Blu-ray Player and Home Theater Embedded PC MP3 Player/Recorder (Portable Audio) Personal Digital Assistant (PDA) Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital Solid State Drive (SSD): Client and Enterprise TV: LCD/Digital and High-Definition (HDTV) Tablet: Enterprise Video Analytics: Server Wireless Headset, Keyboard, and Mouse This single inverter gate 1.65-V to 5.5-V VCC operation. is designed for The SN74LVC1G04 device performs the Boolean function Y = A. The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range. The SN74LVC1G04 device is available in a variety of packages, including the ultra-small DPW package with a body size of 0.8 mm × 0.8 mm. Device Information(1) DEVICE NAME SN74LVC1G04 PACKAGE BODY SIZE SOT-23 (5) 2.9mm × 1.6mm SC70 (5) 2.0mm × 1.25mm SON (6) 1.45mm × 1.0mm SON (6) 1.0mm × 1.0mm X2SON (4) 0.8mm × 0.8mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 4 Simplified Schematic A Y 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74LVC1G04 SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. 1 Applications ........................................................... 1 Description ............................................................. 1 Simplified Schematic............................................. 1 Revision History..................................................... 2 Pin Configuration and Functions ......................... 3 Specifications......................................................... 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 Absolute Maximum Ratings ..................................... 4 Handling Ratings....................................................... 4 Recommended Operating Conditions ...................... 5 Thermal Information .................................................. 5 Electrical Characteristics........................................... 6 Switching Characteristics, CL = 15 pF ...................... 6 Switching Characteristics, CL = 30 pF or 50 pF, –40°C to 85°C ............................................................ 6 7.8 Switching Characteristics, CL = 15 pF, –40°C to 125°C ......................................................................... 6 7.9 Switching Characteristics, CL = 30 pF or 50 pF, –40°C to 125°C .......................................................... 7 7.10 Operating Characteristics........................................ 7 7.11 Typical Characteristics ............................................ 7 8 9 Parameter Measurement Information .................. 8 Detailed Description ............................................ 10 9.1 9.2 9.3 9.4 Overview ................................................................. 10 Functional Block Diagram ....................................... 10 Feature Description................................................. 10 Device Functional Modes........................................ 10 10 Application and Implementation........................ 11 10.1 Application Information.......................................... 11 10.2 Typical Application ............................................... 11 11 Power Supply Recommendations ..................... 12 12 Layout................................................................... 12 12.1 Layout Guidelines ................................................. 12 12.2 Layout Example .................................................... 12 13 Device and Documentation Support ................. 13 13.1 Trademarks ........................................................... 13 13.2 Electrostatic Discharge Caution............................ 13 13.3 Glossary ................................................................ 13 14 Mechanical, Packaging, and Orderable Information ........................................................... 13 5 Revision History Changes from Revision AC (March 2014) to Revision AD Page • Updated Features, Description, and Device Information table. ............................................................................................. 1 • Added Pin Functions table. .................................................................................................................................................... 3 • Added Thermal Information table. ......................................................................................................................................... 5 • Added Detailed Description section. .................................................................................................................................... 10 • Added Application and Implementation section. ................................................................................................................. 11 • Added Power Supply Recommendations section. .............................................................................................................. 12 • Added Layout section. ......................................................................................................................................................... 12 Changes from Revision AB (October 2013) to Revision AC Page • Added Applications. ................................................................................................................................................................ 1 • Added Device Information table. ............................................................................................................................................ 1 • Added DPW Package. ........................................................................................................................................................... 3 • Moved Tstg to Handling Ratings table. .................................................................................................................................... 4 Changes from Revision AA (September 2013) to Revision AB Page • Updated Input Voltage Feature. ............................................................................................................................................. 1 • Corrected typographical error in the Operating Characteristics table. ................................................................................... 7 Changes from Revision Z (November 2012) to Revision AA Page • Removed Ordering Information table. .................................................................................................................................... 1 • Extended maximum temperature operating range from 85°C to 125°C................................................................................. 6 2 Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 6 Pin Configuration and Functions DBV PACKAGE (TOP VIEW) 1 NC 5 DCK PACKAGE (TOP VIEW) NC VCC A A 2 GND 3 NC VCC A 2 3 3 4 NC VCC 5 1 GND 2 GND 4 5 1 DRY PACKAGE (TOP VIEW) DRL PACKAGE (TOP VIEW) Y 4 1 6 VCC A 2 5 NC GND 3 4 Y DSF PACKAGE (TOP VIEW) NC A GND 1 6 2 5 3 4 VCC NC Y Y YZP PACKAGE (TOP VIEW) Y DNU NC – No internal connection DNU – Do not use See mechanical drawings for dimensions. A1 A2 A B1 B2 GND C1 C2 YZV PACKAGE (TOP VIEW) A VCC GND A1 B1 A2 B2 DPW PACKAGE (TOP VIEW) VCC GND NC A Y 1 5 3 2 4 VCC Y Y Pin Functions PIN DBV, DCK, DRL DSF, DRY YZP NC 1 1, 5 A 2 2 GND 3 NAME DESCRIPTION YZV DPW A1, B2 – 1 B1 A1 2 Input 3 C1 B1 3 Ground No connect Y 4 4 C2 B2 4 Output VCC 5 6 A2 A2 5 Power terminal Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 3 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V VO Voltage range applied to any output in the high or low state (2) (3) –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –50 IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND (1) (2) (3) UNIT mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the Recommended Operating Conditions table. 7.2 Handling Ratings PARAMETER Tstg V(ESD) (1) (2) 4 DEFINITION MIN MAX UNIT –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 0 2 Charged device model (CDM), per JEDEC specification JESD22C101, all pins (2) 0 1 Storage temperature range Electrostatic discharge kV JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 7.3 Recommended Oprating Conditions (1) VCC Operating Supply voltage MAX 5.5 Data retention only V 0.65 × VCC VCC = 2.3 V to 2.7 V High-level input voltage UNIT 1.5 VCC = 1.65 V to 1.95 V VIH MIN 1.65 1.7 VCC = 3 V to 3.6 V V 2 VCC = 4.5 V to 5.5 V 0.7 × VCC VCC = 1.65 V to 1.95 V 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VIL Low-level input voltage VI Input voltage 0 5.5 V VO Output voltage 0 VCC V VCC = 4.5 V to 5.5 V 0.3 × VCC VCC = 1.65 V –4 VCC = 2.3 V IOH High-level output current –8 –16 VCC = 3 V Low-level output current Δt/Δv –32 VCC = 1.65 V 4 VCC = 2.3 V 8 16 VCC = 3 V Input transition rise or fall rate (1) mA 24 VCC = 4.5 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 VCC = 3.3 V ± 0.3 V 10 VCC = 5 V ± 0.5 V TA mA –24 VCC = 4.5 V IOL V ns/V 5 Operating free-air temperature –40 125 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 7.4 Thermal Information SN74LVC1G04 THERMAL METRIC (1) DBV DCK DRL DRY YZP DPW 5 PINS 5 PINS 5 PINS 6 PINS 5 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 229 278 243 439 130 340 RθJCtop Junction-to-case (top) thermal resistance 164 93 78 277 54 215 RθJB Junction-to-board thermal resistance 62 65 78 271 51 294 ψJT Junction-to-top characterization parameter 44 2 10 84 1 41 ψJB Junction-to-board characterization parameter 62 64 77 271 50 294 RθJCbot Junction-to-case (bottom) thermal resistance – – – – – 250 (1) UNIT °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 5 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 7.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 μA VOH 1.65 V to 5.5 V VCC – 0.1 1.2 1.2 IOH = –8 mA 2.3 V 1.9 1.9 2.4 2.4 2.3 2.3 3V 3.8 TYP UNIT MAX V IOH = –32 mA 4.5 V IOL = 100 μA 1.65 V to 5.5 V 0.1 0.1 IOL = 4 mA 1.65 V 0.45 0.45 IOL = 8 mA 2.3 V 0.3 0.3 3.8 0.4 0.4 0.55 0.55 0.55 0.55 3V IOL = 24 mA IOL = 32 mA 4.5 V VI = 5.5 V or GND Ioff VI or VO = 5.5 V ICC VI = 5.5 V or GND ΔICC One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND (1) MIN VCC – 0.1 IOL = 16 mA A input MAX 1.65 V IOH = –24 mA II TYP (1) MIN IOH = –4 mA IOH = –16 mA VOL RECOMMENDED –40°C to 125°C –40°C to 85°C VCC IO = 0 V 0 to 5.5 V ±5 ±5 μA 0 ±10 ±10 μA 1.65 V to 5.5 V 10 10 μA 3 V to 5.5 V 500 500 μA 3.3 V 3.5 3.50 pF VCC = 5 V ± 0.5 V UNIT All typical values are at VCC = 3.3 V, TA = 25°C. 7.6 Switching Characteristics, CL = 15 pF over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3) –40°C to 85°C PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN MAX MIN MAX 2 6.4 1 4.2 0.7 3.3 0.7 3.1 ns 7.7 Switching Characteristics, CL = 30 pF or 50 pF, –40°C to 85°C over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 4) –40°C to 85°C PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 3 7.5 1.4 5.2 1 4.2 1 3.7 ns 7.8 Switching Characteristics, CL = 15 pF, –40°C to 125°C over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3) –40°C to 125°C 6 PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 2 6.4 1 4.2 0.7 3.3 0.7 3.1 ns Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 7.9 Switching Characteristics, CL = 30 pF or 50 pF, –40°C to 125°C over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 4) –40°C to 125°C PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 3 7.5 1.4 5.2 1 4.2 1 3.7 ns 7.10 Operating Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5.0 V TYP TYP TYP TYP 16 18 18 20 f = 10 MHz UNIT pF 7.11 Typical Characteristics 6 8 TPD TPD 7 5 6 TPD - ns TPD - ns 4 3 2 5 4 3 2 1 0 -100 1 -50 0 50 Temperature - °C 100 150 0 0 1 D001 Figure 1. TPD Across Temperature at 3.3-V VCC Copyright © 1999–2014, Texas Instruments Incorporated 2 3 Vcc - V 4 5 D002 Figure 2. TPD Across VCC at 25°C Submit Documentation Feedback Product Folder Links: SN74LVC1G04 6 7 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 8 Parameter Measurement Information VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 15 pF 15 pF 15 pF 15 pF 1 MΩ 1 MΩ 1 MΩ 1 MΩ 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH tPHL VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL VOH Output VI Output Control VM VOL Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + V∆ VOL tPHZ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms 8 Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 Parameter Measurement Information (continued) VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V tPLZ Output Waveform 1 S1 at VLOAD (see Note B) tPLH VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOL tPHZ Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + V∆ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 4. Load Circuit and Voltage Waveforms Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 9 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 9 Detailed Description 9.1 Overview The SN74LVC1G04 device contains inverter gate and performs the Boolean function Y = A. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The DPW package technology is a major breakthrough in IC packaging. Its tiny 0.64 mm square footprint saves significant board space over other package options while still retaining the traditional manufacturing friendly lead pitch of 0.5 mm. 9.2 Functional Block Diagram A Y 9.3 Feature Description • • • • Wide operating voltage range. – Operates from 1.65 V to 5.5 V. Allows down voltage translation. Inputs accept voltages to 5.5 V. Ioff feature allows voltages on the inputs and outputs, when VCC is 0 V. 9.4 Device Functional Modes Function Table INPUT A 10 OUTPUT Y H L L H Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 10 Application and Implementation 10.1 Application Information The SN74LVC1G04 is a high drive CMOS device that can be used for implementing inversion logic with a high output drive, such as an LED application. It can produce 24 mA of drive current at 3.3 V making it Ideal for driving multiple outputs and good for high speed applications up to 100 Mhz. The inputs are 5.5 V tolerant allowing it to translate down to VCC. 10.2 Typical Application Inverter Logic Function Basic LED Driver VCC VCC uC or Logic uC or Logic uC or Logic LVC1G04 LVC1G04 10.2.1 Design Requirements This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus contention because it can drive currents that would exceed maximum limits. The high drive will also create fast edges into light loads so routing and load conditions should be considered to prevent ringing. 10.2.2 Detailed Design Procedure 1. Recommended Input Conditions – Rise time and fall time specs: See (Δt/ΔV) in the Recommended Operating Conditions table. – Specified high and low levels: See (VIH and VIL) in the Recommended Operating Conditions table. – Inputs are overvoltage tolerant allowing them to go as high as (VI max) in the Recommended Operating Conditions table at any valid VCC. 2. Recommend Output Conditions – Load currents should not exceed (IO max) per output and should not exceed total current (continuous current through VCC or GND) for the part. These limits are located in the Absolute Maximum Ratings table. – Outputs should not be pulled above VCC. Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 11 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 Typical Application (continued) 10.2.3 Application Curves 7 Icc Icc Icc Icc 6 Icc - mA 5 1.8V 2.5V 3.3V 5V 4 3 2 1 0 0 20 40 Frequency - MHz 60 80 D003 Figure 5. ICC vs Frequency 11 Power Supply Recommendations The power supply can be any voltage between the min and max supply voltage rating located in the Recommended Operating Conditions table. Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, a 0.1-μF capacitor is recommended. if there are multiple VCC pins, then a 0.01-μF or 0.022-μF capacitor is recommended for each power pin. It is ok to parallel multiple bypass capacitors to reject different frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results. 12 Layout 12.1 Layout Guidelines When using multiple bit logic devices, inputs should never float. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. The rules that must be observed under all circumstances are specified in the next paragraph. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or VCC; whichever makes more sense or is more convenient. 12.2 Layout Example VCC Unused Input Input Output Unused Input Output Input 12 Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 SN74LVC1G04 www.ti.com SCES214AD – APRIL 1999 – REVISED OCTOBER 2014 13 Device and Documentation Support 13.1 Trademarks All trademarks are the property of their respective owners. 13.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SN74LVC1G04 13 PACKAGE OPTION ADDENDUM www.ti.com 4-Apr-2019 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN74LVC1G04DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C045, C04F, C04J, C04K, C04R) (C04H, C04P) SN74LVC1G04DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C04 C04P SN74LVC1G04DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C045, C04F, C04J, C04K, C04R) (C04H, C04P, C04S) SN74LVC1G04DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C04 C04P SN74LVC1G04DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C04 C04P SN74LVC1G04DCK3 ACTIVE SC70 DCK 5 3000 Pb-Free (RoHS) CU SNBI Level-1-260C-UNLIM -40 to 125 (CCF, CCZ) SN74LVC1G04DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CC5, CCF, CCK, CC R) (CCH, CCP, CCS) SN74LVC1G04DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CC5, CCF, CCK, CC R) (CCH, CCP, CCS) SN74LVC1G04DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CC5, CCF, CCK, CC R) (CCH, CCP, CCS) SN74LVC1G04DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CC5, CCF, CCK, CC R) (CCH, CCP) SN74LVC1G04DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CC5, CCF, CCK, CC R) (CCH, CCP) SN74LVC1G04DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CC5, CCF, CCK, CC R) (CCH, CCP) SN74LVC1G04DPWR ACTIVE X2SON DPW 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 K4 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 4-Apr-2019 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN74LVC1G04DRLR ACTIVE SOT-5X3 DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 (CC7, CCR) SN74LVC1G04DRY2 ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CC SN74LVC1G04DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CC SN74LVC1G04DRYRG4 ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CC SN74LVC1G04DSF2 ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 CC SN74LVC1G04DSFR ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 CC SN74LVC1G04YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 (CC7, CCN) SN74LVC1G04YZVR ACTIVE DSBGA YZV 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 CC 7 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of