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SN74LVC1G06
SCES295X – JUNE 2000 – REVISED AUGUST 2015
SN74LVC1G06 Single Inverter Buffer/Driver With Open-Drain Output
1 Features
3 Description
•
This single inverter buffer and driver is designed for
1.65-V to 5.5-V VCC operation.
1
•
•
•
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoFree™ Package
Supports 5-V VCC Operation
Input and Open-Drain Output Accept
Voltages up to 5.5 V
Maximum tpd of 4.5 ns at 3.3 V at 125°C
Low Power Consumption, 10-µA Maximum ICC
±24-mA Output Drive at 3.3 V for open-drain
devices
Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Can Be Used For Up or Down Translation
Schmitt Trigger Action on All Ports
ESD Protection Exceeds JESD 22
– 2000-V Human Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
NanoFree package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
The output of the SN74LVC1G06 device is opendrain and can be connected to other open-drain
outputs to implement active-low wired-OR or activehigh wired-AND functions. The maximum sink current
is 32 mA.
This device is fully specified for partial-power-down
applications using Ioff.The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
Device Information
PART NUMBER
SN74LVC1G06
PACKAGE
SOT-23 (5)
2.90 mm × 1.60 mm
SC70 (5)
2.00 mm × 1.25 mm
SOT (5)
1.60 mm × 1.20 mm
USON (6)
1.45 mm × 1.00 mm
X2SON (6)
1.00 mm x 1.00 mm
2 Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
AV Receivers
Blu-ray Players and Home Theaters
DVD Recorders and Players
Desktop or Notebook PCs
Digital Radio or Internet Radio Players
Digital Video Cameras (DVC)
Embedded PCs
GPS: Personal Navigation Devices
Mobile Internet Devices
Network Projector Front-Ends
Portable Media Players
Pro Audio Mixers
Smoke Detectors
Solid State Drive (SSD): Enterprise
High-Definition (HDTV)
Tablets: Enterprise
Audio Docks: Portable
DLP Front Projection Systems
DVR and DVS
Digital Picture Frame (DPF)
Digital Still Cameras
BODY SIZE (NOM)
DSBGA (5)
1.40 mm × 0.90 mm
0.90 mm × 0.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
A
1
3
Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC1G06
SCES295X – JUNE 2000 – REVISED AUGUST 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
5
5
6
6
6
7
7
7
7
Absolute Maximum Ratings .....................................
ESD Ratings ............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics, –40°C to 85°C.................
Switching Characteristics, –40°C to 125°C...............
Operating Characteristics..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 8
Detailed Description .............................................. 9
9.1
9.2
9.3
9.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
9
9
9
9
10 Application and Implementation........................ 10
10.1 Application Information.......................................... 10
10.2 Typical Application ............................................... 10
11 Power Supply Recommendations ..................... 11
12 Layout................................................................... 11
12.1 Layout Guidelines ................................................. 11
12.2 Layout Example .................................................... 11
13 Device and Documentation Support ................. 12
13.1
13.2
13.3
13.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
12
12
12
12
14 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision W (December 2013) to Revision X
•
Page
Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information
table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
Changes from Revision V (November 2012) to Revision W
Page
•
Updated document to new TI data sheet format. ................................................................................................................... 1
•
Removed Ordering Information table. .................................................................................................................................... 1
•
Updated Ioff in Features. ......................................................................................................................................................... 1
•
Updated operating temperature range. .................................................................................................................................. 6
2
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5 Device Comparison Table
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74LVC1G06DBV
SOT-23 (5)
2.90 mm × 1.60 mm
SN74LVC1G06DCK
SC70 (5)
2.00 mm × 1.25 mm
SN74LVC1G06DRL
SOT (5)
1.60 mm × 1.20 mm
SN74LVC1G06DRY
USON (6)
1.45 mm × 1.00 mm
SN74LVC1G06DSF
X2SON (6)
1.00 mm x 1.00 mm
SN74LVC1G06YZP
DSBGA (5)
1.40 mm × 0.90 mm
SN74LVC1G06YZV
DSBGA (4)
0.90 mm × 0.90 mm
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6 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
N.C.
1
A
2
GND
3
DRY Package
5-Pin USON
Top View
VCC
5
N.C.
1
6
A
2
5
N.C.
GND
3
4
Y
VCC
Y
4
DSF Package
5-Pin X2SON
Top View
DRL Package
5-Pin SOT
Top View
N.C.
1
A
2
GND
3
N.C.
A
GND
5
VCC
4
Y
1
A
2
GND
3
6
5
3
4
VCC
N.C.
Y
YZP Package
6-Pin DSGBA
Top View
DNU
DCK Package
5-Pin SC70
Top View
N.C.
1
2
5
VCC
4
Y
A1
A2
A
B1
B2
GND
C1
C2
VCC
Y
DNU – Do not use
YZV Package
4-Pin DSBGA
Top View
A
A1
A2
VCC
GND
B1
B2
Y
Pin Functions (1) (2)
PIN
DBV,
DCK,
DRL
DRY,
DSF
YZP
YZV
NC
1
1, 5
A1, B2
–
A
2
2
B1
A1
I
GND
3
3
C1
B1
—
Ground
Y
4
4
C2
B2
O
Output
VCC
5
6
A2
A2
—
Power pin
NAME
(1)
(2)
4
I/O
—
DESCRIPTION
Not connected
Input
N.C. – No internal connection
See mechanical drawings for dimensions
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
UNIT
Supply voltage
–0.5
6.5
V
(2)
VI
Input voltage
–0.5
6.5
V
VO
Voltage applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
VO
Voltage applied to any output in the high or low state (2) (3)
–0.5
6.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Tj
Continuous current through VCC or GND
Junction temperature
–65
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
UNIT
+2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
+1000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Operating
Supply voltage
Data retention only
1.65
5.5
VCC = 3 V to 3.6 V
V
2
0.7 × VCC
VCC = 1.65 V to 1.95 V
Low-level input voltage
V
1.7
VCC = 4.5 V to 5.5 V
VIL
UNIT
0.65 × VCC
VCC = 2.3 V to 2.7 V
High-level input voltage
MAX
1.5
VCC = 1.65 V to 1.95 V
VIH
MIN
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VCC = 4.5 V to 5.5 V
V
0.3 × VCC
VI
Input voltage
0
5.5
V
VO
Output voltage
0
5.5
V
IOL
Low-level output current
Δt/Δv
VCC = 1.65 V
4
VCC = 2.3 V
8
16
VCC = 3 V
Input transition rise or fall rate
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
VCC = 5 V ± 0.5 V
TA
ns/V
5
Operating free-air temperature
(1)
mA
24
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
7.4 Thermal Information
SN74LVC1G06
THERMAL METRIC
RθJA
(1)
(1)
Junction-to-ambient thermal resistance
DBV
(SOT-23)
DCK
(SC70)
DRL
(SOT)
DRY
(USON)
YZP
(DSBGA)
DSF
(X2SON)
YZV
(DSBGA)
5 PINS
5 PINS
5 PINS
6 PINS
5 PINS
6 PINS
4 PINS
206
252
142
234
132
300
123
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOL = 100 μA
VOL
1.65 V
0.45
IOL = 8 mA
2.3 V
0.3
3V
4.5 V
VI = 5.5 V or GND
Ioff
VI or VO = 5.5 V
ICC
VI = 5.5 V or GND, IO = 0
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
6
MAX
IOL = 4 mA
IOL = 32 mA
(1)
TYP (1)
0.1
IOL = 24 mA
A input
MIN
1.65 V to 5.5 V
IOL = 16 mA
II
VCC
0.4
UNIT
V
0.55
0.55
0 to 5.5 V
±1
μA
0
±10
μA
1.65 V to 5.5 V
10
μA
3 V to 5.5 V
500
μA
All typical values are at VCC = 3.3 V, TA = 25°C.
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Electrical Characteristics (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP (1)
MAX
UNIT
Ci
VI = VCC or GND
3.3 V
4
pF
Co
VO = VCC or GND
3.3 V
5
pF
7.6 Switching Characteristics, –40°C to 85°C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tpd
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.2
6.5
1.1
4
1.2
4
1
3
ns
7.7 Switching Characteristics, –40°C to 125°C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tpd
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.2
7
1.1
4.5
1.2
4.5
1
3.5
ns
7.8 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
VCC = 1.8 V
f = 10 MHz
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
3
3
4
6
UNIT
pF
7.9 Typical Characteristics
2.5
6
TPD
TPD
5
2
TPD - ns
TPD - ns
4
1.5
1
3
2
0.5
0
-100
1
0
-50
0
50
Temperature - °C
100
150
0
1
D001
Figure 1. TPD Across Temperature at 3.3-V VCC
2
3
Vcc - V
4
5
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D002
Figure 2. TPD Across VCC at 25°C
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8 Parameter Measurement Information
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
RL
CL
(see Note A)
S1
tPZL (see Notes E and F)
VLOAD
tPLZ (see Notes E and G)
VLOAD
tPHZ/tPZH
VLOAD
LOAD CIRCUIT
INPUT
VCC
VI
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VM
tr/tf
≤ 2 ns
≤ 2 ns
≤ 2.5 ns
≤ 2.5 ns
VCC
VCC
3V
VCC
VLOAD
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
CL
RL
V∆
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
th
VI
VM
Input
VM
VM
VM
Data Input
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VI
VM
Input
VM
0V
Output
VM
VOL
tPHL
VM
tPLZ
VLOAD/2
VM
tPZH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VOH
Output
VM
tPZL
VOH
VM
VI
Output
Control
tPHL
tPLH
VI
Output
Waveform 2
S1 at VLOAD
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VLOAD/2 − V∆
VLOAD/2
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms (Open Drain)
8
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9 Detailed Description
9.1 Overview
The SN74LVC1G06 device contains one open-drain inverter with a maximum sink current of 32 mA. This device
is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing
damaging current backflow through the device when it is powered down.
9.2 Functional Block Diagram
A
1
3
Y
9.3 Feature Description
The wide operating voltage range of 1.65 V to 5.5 V allows the SN74LVC1G06 to be used in systems with many
different voltage rails. In addition, the voltage tolerance on the output allows the device to be used for inverting
up-translation or down-translation. The IOFF feature safely allows voltage on the inputs and outputs when no VCC
is present.
9.4 Device Functional Modes
Table 1 lists the functional modes of the SN74LVC1G06.
Table 1. Function Table
INPUT
A
OUTPUT
Y
L
Hi-Z
H
L
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The SN74LVC1G06 is a high-drive CMOS device that can be used to implement a high output drive buffer, such
as an LED application. It can sink 32 mA of current at 4.5 V making it ideal for high-drive applications. It is good
for high-speed applications up to 100 MHz. The inputs are 5.5-V tolerant allowing it to translate up or down to
VCC. Below shows a simple LED driver application for a single channel of the device.
10.2 Typical Application
VPU
VCC
From
MCU
Figure 4. Typical Application Diagram
10.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Take care to avoid bus contention because it
can drive currents that would exceed maximum limits. The high drive will also create fast edges into light loads
so routing and load conditions should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions
– Rise time and fall time specs. See (Δt/ΔV) in the Recommended Operating Conditions table.
– Specified high and low levels. See (VIH and VIL) in the Recommended Operating Conditions table.
– Inputs are overvoltage tolerant allowing them to go as high as (VI max) in the Recommended Operating
Conditions table at any valid VCC.
2. Recommend Output Conditions
– Load currents should not exceed (IO max) per output and should not exceed (Continuous current through
VCC or GND) total current for the part. These limits are located in the Absolute Maximum Ratings table.
– Outputs should not be pulled above 5.5 V.
10
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Typical Application (continued)
10.2.3 Application Curve
1600
Icc
Icc
Icc
Icc
1400
1200
1.8V
2.5V
3.3V
5V
Icc - µA
1000
800
600
400
200
0
0
20
40
Frequency - MHz
60
80
D001
Figure 5. ICC vs Frequency
11 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions table.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, a 0.1-μF capacitor is recommended and if there are multiple VCC pins then a 0.01-μF or 0.022-μF
capacitor is recommended for each power pin. It is ok to parallel multiple bypass caps to reject different
frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be
installed as close to the power pin as possible for best results.
12 Layout
12.1 Layout Guidelines
When using multiple bit logic devices inputs must not ever float. In many cases, functions or parts of functions of
digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3
of the 4 buffer gates are used. Such input pins must not be left unconnected because the undefined voltages at
the outside connections result in undefined operational states. Specified below are the rules that must be
observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low
bias to prevent them from floating. The logic level that should be applied to any particular unused input depends
on the function of the device. Generally they will be tied to GND or VCC whichever make more sense or is more
convenient.
12.2 Layout Example
VCC
Unused Input
Input
Output
Unused Input
Output
Input
Figure 6. Layout Diagram
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13 Device and Documentation Support
13.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.2 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
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Product Folder Links: SN74LVC1G06
PACKAGE OPTION ADDENDUM
www.ti.com
31-Jan-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74LVC1G06DBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(C065 ~ C06F ~
C06R ~ C06T)
(C06H ~ C06P ~
C06S)
SN74LVC1G06DBVRE4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C06F
SN74LVC1G06DBVRG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C06F
SN74LVC1G06DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(C065 ~ C06F ~
C06R)
(C06H ~ C06P ~
C06S)
SN74LVC1G06DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
C06F
SN74LVC1G06DCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CT5 ~ CTF ~ CTK ~
CTR ~ CTT)
(CTH ~ CTS)
SN74LVC1G06DCKRE4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CT5 ~ CTF ~ CTK ~
CTR ~ CTT)
(CTH ~ CTS)
SN74LVC1G06DCKRG4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CT5 ~ CTF ~ CTK ~
CTR ~ CTT)
(CTH ~ CTS)
SN74LVC1G06DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CT5 ~ CTF ~ CTK ~
CTR)
(CTH ~ CTS)
SN74LVC1G06DCKTE4
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CT5 ~ CTF ~ CTK ~
CTR)
(CTH ~ CTS)
SN74LVC1G06DCKTG4
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CT5 ~ CTF ~ CTK ~
CTR)
(CTH ~ CTS)
SN74LVC1G06DRLR
ACTIVE
SOT
DRL
5
4000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CT7 ~ CTR)
SN74LVC1G06DRY2
PREVIEW
SON
DRY
6
TBD
Call TI
Call TI
-40 to 125
CT
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
31-Jan-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
SN74LVC1G06DRYR
ACTIVE
SON
DRY
6
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CT
(4/5)
SN74LVC1G06DSF2
PREVIEW
SON
DSF
6
TBD
Call TI
Call TI
-40 to 125
CT
SN74LVC1G06DSFR
ACTIVE
SON
DSF
6
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
CT
SN74LVC1G06YZPR
ACTIVE
DSBGA
YZP
5
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
(CT7 ~ CTN)
SN74LVC1G06YZVR
ACTIVE
DSBGA
YZV
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
CT
(7 ~ N)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-Jan-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC1G06 :
• Enhanced Product: SN74LVC1G06-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Jan-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
SN74LVC1G06DBVR
SOT-23
DBV
5
3000
180.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
SN74LVC1G06DBVR
SOT-23
DBV
5
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
SN74LVC1G06DBVRG4
SOT-23
DBV
5
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
SN74LVC1G06DBVT
SOT-23
DBV
5
250
180.0
8.4
3.23
3.17
1.37
4.0
8.0
Q3
SN74LVC1G06DBVTG4
SOT-23
DBV
5
250
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
SN74LVC1G06DCKR
SC70
DCK
5
3000
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
SN74LVC1G06DCKT
SC70
DCK
5
250
180.0
9.2
2.3
2.55
1.2
4.0
8.0
Q3
SN74LVC1G06DCKT
SC70
DCK
5
250
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
SN74LVC1G06DRLR
SOT
DRL
5
4000
180.0
8.4
1.98
1.78
0.69
4.0
8.0
Q3
SN74LVC1G06DRLR
SOT
DRL
5
4000
180.0
9.5
1.78
1.78
0.69
4.0
8.0
Q3
SN74LVC1G06DRYR
SON
DRY
6
5000
180.0
9.5
1.15
1.6
0.75
4.0
8.0
Q1
SN74LVC1G06DSFR
SON
DSF
6
5000
180.0
9.5
1.16
1.16
0.5
4.0
8.0
Q2
SN74LVC1G06YZPR
DSBGA
YZP
5
3000
178.0
9.2
1.02
1.52
0.63
4.0
8.0
Q1
SN74LVC1G06YZVR
DSBGA
YZV
4
3000
178.0
9.2
1.0
1.0
0.63
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Jan-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVC1G06DBVR
SOT-23
DBV
5
3000
202.0
201.0
28.0
SN74LVC1G06DBVR
SOT-23
DBV
5
3000
180.0
180.0
18.0
SN74LVC1G06DBVRG4
SOT-23
DBV
5
3000
180.0
180.0
18.0
SN74LVC1G06DBVT
SOT-23
DBV
5
250
202.0
201.0
28.0
SN74LVC1G06DBVTG4
SOT-23
DBV
5
250
180.0
180.0
18.0
SN74LVC1G06DCKR
SC70
DCK
5
3000
180.0
180.0
18.0
SN74LVC1G06DCKT
SC70
DCK
5
250
205.0
200.0
33.0
SN74LVC1G06DCKT
SC70
DCK
5
250
180.0
180.0
18.0
SN74LVC1G06DRLR
SOT
DRL
5
4000
202.0
201.0
28.0
SN74LVC1G06DRLR
SOT
DRL
5
4000
184.0
184.0
19.0
SN74LVC1G06DRYR
SON
DRY
6
5000
184.0
184.0
19.0
SN74LVC1G06DSFR
SON
DSF
6
5000
184.0
184.0
19.0
SN74LVC1G06YZPR
DSBGA
YZP
5
3000
220.0
220.0
35.0
SN74LVC1G06YZVR
DSBGA
YZV
4
3000
220.0
220.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
PLASTIC SMALL OUTLINE NO-LEAD
DSF (S-PX2SON-N6)
1.05
0.95
A
B
PIN 1 INDEX AREA
1.05
0.95
0.4 MAX
C
SEATING PLANE
0.05
C
(0.11) TYP
SYMM
0.05
0.00
3
2X
0.7
4
SYMM
4X
0.35
6
1
(0.1)
PIN 1 ID
6X
6X
0.45
0.35
0.22
0.12
0.07
0.05
C A
C
B
4208186/F 10/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MO-287, variation X2AAF.
www.ti.com
D: Max = 1.418 mm, Min =1.358 mm
E: Max = 0.918 mm, Min =0.858 mm
D: Max = 0.918 mm, Min =0.858 mm
E: Max = 0.918 mm, Min =0.858 mm
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