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SN74LVC1G126
SCES224R – APRIL 1999 – REVISED JANUARY 2015
SN74LVC1G126 Single Bus Buffer Gate With 3-State Output
1 Features
2 Applications
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Available in the Texas Instruments
NanoFree™ Package
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Provides Down Translation to VCC
Max tpd of 3.7 ns at 3.3 V
Low Power Consumption, 10-μA Max ICC
±24-mA Output Drive at 3.3 V
Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back Drive Protection
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model
– 200-V Machine Model
– 1000-V Charged-Device Model
•
•
Cable Modem Termination Systems
High-Speed Data Acquisition and Generation
Military: Radars and Sonars
Motor Controls: High-Voltage
Power Line Communication Modems
SSDs: Internal or External
Video Broadcasting and Infrastructure: Scalable
Platforms
Video Broadcasting: IP-Based Multi-Format
Transcoders
Video Communication Systems
3 Description
This single buffer is designed for 1.65-V to 3.6-V VCC
operation. The LVC1G126 device is a single line
driver with 3-state output. The output is disabled
when the output-enable input is low.
Device Information(1)
PART NUMBER
SN74LVC1G126
PACKAGE (PIN)
BODY SIZE
SOT-23 (5)
2.90 mm × 1.60 mm
SC70 (5)
2.00 mm × 1.25 mm
SOT (5)
1.60 mm × 1.20 mm
SON (6)
1.00 mm × 1.00 mm
XBGA (5)
1.40 mm × 0.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
1
OE
2
A
4
Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC1G126
SCES224R – APRIL 1999 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
4
4
5
5
6
6
6
7
7
7
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics, CL = 15 pF ......................
Switching Characteristics, –40°C to 85°C.................
Switching Characteristics, –40°C to 125°C...............
Operating Characteristics ........................................
Typical Characteristics ............................................
Parameter Measurement Information .................. 8
9
Detailed Description ............................................ 10
9.1
9.2
9.3
9.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
10
10
10
10
10 Application and Implementation........................ 11
10.1 Application Information.......................................... 11
10.2 Typical Application ............................................... 11
11 Power Supply Recommendations ..................... 12
12 Layout................................................................... 12
12.1 Layout Guidelines ................................................. 12
12.2 Layout Example .................................................... 12
13 Device and Documentation Support ................. 13
13.1 Trademarks ........................................................... 13
13.2 Electrostatic Discharge Caution ............................ 13
13.3 Glossary ................................................................ 13
14 Mechanical, Packaging, and Orderable
Information ........................................................... 13
5 Revision History
Changes from Revision Q (December 2013) to Revision R
•
Page
Added Applications, Device Information table, Handling Ratings table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ..... 1
Changes from Revision P (November 2012) to Revision Q
Page
•
Updated document to new TI data sheet format. ................................................................................................................... 1
•
Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. ......................................... 5
•
Added ESD warning. ............................................................................................................................................................ 13
Changes from Revision O (March 2011) to Revision P
•
Removed Ordering Information table. .................................................................................................................................... 1
Changes from Revision N (February 2007) to Revision O
•
2
Page
Page
Added DSF package option to the data sheet. ...................................................................................................................... 3
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SCES224R – APRIL 1999 – REVISED JANUARY 2015
6 Pin Configuration and Functions
DBV PACKAGE
(TOP VIEW)
OE
1
A
2
GND
3
VCC
5
OE
1
A
2
GND
3
1
A
2
GND
3
6
5
4
VCC
5
OE
1
A
2
GND
3
5
VCC
4
Y
Y
4
Y
4
DRY PACKAGE
(TOP VIEW)
OE
DRL PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DSF PACKAGE
(TOP VIEW)
OE
A
GND
VCC
N.C.
1
6
2
5
3
4
VCC
N.C.
Y
Y
YZP PACKAGE
(BOTTOM VIEW)
GND
C1
3 4 C2
A
B1
2
OE
A1
1 5 A2
Y
VCC
See mechanical drawings for dimensions.
Pin Functions
PIN
SN74LVC1G126
NAME
TYPE
DESCRIPTION
DBV, DCK,
DRL, YZP
DRY, DSF
A
2
2
I
GND
3
3
—
Ground Pin
NC
—
5
—
Do not connect
OE
1
1
I
OE Enable/Input
VCC
5
6
—
Power Pin
Y
4
4
O
Y Output
A Input
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
Supply voltage range
–0.5
6.5
UNIT
V
(2)
VI
Input voltage range
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high or low state (2) (3)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
Storage temperature range
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
7.2 ESD Ratings
PARAMETER
V(ESD)
(1)
(2)
4
Electrostatic
discharge
DEFINITION
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Operating
Supply voltage
MAX
1.65
5.5
Data retention only
1.7
VCC = 3 V to 3.6 V
0.7 × VCC
VCC = 1.65 V to 1.95 V
Low-level input voltage
V
2
VCC = 4.5 V to 5.5 V
VIL
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
High-level input voltage
UNIT
1.5
VCC = 1.65 V to 1.95 V
VIH
MIN
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VCC = 4.5 V to 5.5 V
V
0.3 × VCC
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
VCC = 1.65 V
–4
VCC = 2.3 V
–8
–16
VCC = 3 V
VCC = 4.5 V
–32
VCC = 1.65 V
4
VCC = 2.3 V
IOL
Low-level output current
8
16
VCC = 3 V
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
mA
24
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
VCC = 5 V ± 0.5 V
(1)
mA
–24
ns/V
5
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7.4 Thermal Information
SN74LVC1G126
THERMAL METRIC
RθJA
(1)
(1)
Junction-to-ambient thermal resistance
DBV
DCK
DRL
DRY
YZP
5 PINS
5 PINS
5 PINS
6 PINS
5 PINS
206
252
142
234
132
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 μA
VOH
MAX
VCC – 0.1
VCC –
0.1
1.65 V
1.2
1.2
2.3 V
1.9
1.9
2.4
2.4
2.3
2.3
3V
TYP (1)
MIN
IOH = –8 mA
UNIT
V
4.5 V
IOL = 100 μA
1.65 V to 5.5 V
0.1
0.1
IOL = 4 mA
1.65 V
0.45
0.45
IOL = 8 mA
2.3 V
0.3
0.3
0.4
0.4
0.55
0.55
0.55
0.55
0 to 5.5 V
±5
±5
μA
IOL = 16 mA
3.8
MAX
IOH = –32 mA
3.8
3V
IOL = 24 mA
IOL = 32 mA
II
–40°C to 125°C
TYP (1)
IOH = –4 mA
IOH = –24 mA
A or OE
inputs
MIN
1.65 V to 5.5 V
IOH = –16 mA
VOL
–40°C to 85°C
VCC
4.5 V
VI = 5.5 V or GND
V
Ioff
VI or VO = 5.5 V
0
±10
±10
μA
IOZ
VO = 0 to 5.5 V
3.6 V
10
10
μA
ICC
VI = 5.5 V or GND
1.65 V to 5.5 V
10
10
μA
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
3 V to 5.5 V
500
500
μA
Ci
VI = VCC or GND
(1)
IO = 0
3.3 V
4
4
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
7.6 Switching Characteristics, CL = 15 pF
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3)
–40°C to 85°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1.7
6.9
0.6
4.6
0.6
3.7
0.5
3.4
ns
7.7 Switching Characteristics, –40°C to 85°C
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 4)
–40°C to 85°C
6
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
tpd
A
Y
2.6
8
1.1
5.5
1
4.5
1
4
ns
ten
OE
Y
2.8
9.4
1.3
6.6
1.2
5.3
1
5
ns
tdis
OE
Y
1.6
9.8
1
5.5
1
5.5
1
4.2
ns
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VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
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7.8 Switching Characteristics, –40°C to 125°C
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 4)
–40°C to 125°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
tpd
A
Y
2.6
9
1.1
5.7
1
4.7
1
4.2
ns
ten
OE
Y
2.8
9.6
1.3
6.8
1.2
5.5
1
5.2
ns
tdis
OE
Y
1.6
10
1
5.7
1
5.7
1
4.4
ns
7.9
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
Operating Characteristics
TA = 25°C
TEST
CONDITIONS
PARAMETER
Cpd
Outputs enabled
Power dissipation
capacitance
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
19
19
19
21
2
2
3
4
f = 10 MHz
Outputs disabled
UNIT
pF
7.10 Typical Characteristics
10
14
12
VCC = 3 V,
TA = 25°C
tpd – Propagation Delay Time – ns
tpd – Propagation Delay Time – ns
VCC = 3 V,
TA = 25°C
One Output Switching
10
8
6
4
One Output Switching
8
6
4
2
2
0
50
100
150
200
250
300
CL – Load Capacitance – pF
Figure 1. Propagation Delay (Low to High Transition)
vs Load Capacitance
0
50
100
150
200
250
300
CL – Load Capacitance – pF
Figure 2. Propagation Delay (High to Low Transition)
vs Load Capacitance
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8 Parameter Measurement Information
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
15 pF
15 pF
15 pF
15 pF
1 MΩ
1 MΩ
1 MΩ
1 MΩ
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VI
VM
Input
VM
0V
VOH
VM
Output
VM
VOL
VM
0V
VLOAD/2
VM
tPZH
VOH
Output
VM
tPLZ
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPHL
VM
tPZL
tPHL
tPLH
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + V∆
VOL
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. t PZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms
8
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Parameter Measurement Information (continued)
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
VOH
VM
Output
VM
VOL
VM
0V
VLOAD/2
VM
tPZH
VOH
Output
VM
tPLZ
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPHL
VM
tPZL
tPHL
tPLH
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + V∆
VOL
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. t PZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 4. Load Circuit and Voltage Waveforms
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9 Detailed Description
9.1 Overview
The SN74LVC1G126 device contains a dual buffer gate with output enable control and performs the Boolean
function Y = A.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
9.2 Functional Block Diagram
1
OE
2
4
A
Y
9.3 Feature Description
•
•
•
•
1.65 V to 5.5 V operating voltage range
Allows down voltage translation
– 5 V to 3.3 V
– 5 V or 3.3 V to 1.8 V
Inputs accept voltages to 5.5 V
– 5.5-V tolerance on input pin when VCC = 0 V
Ioff feature
– Allows voltage on the inputs and outputs when VCC is 0 V
– Able to reduce leakage when VCC is 0 V
9.4 Device Functional Modes
Table 1. Function Table
INPUTS
10
OE
A
OUTPUT
Y
H
H
H
H
L
L
L
X
Z
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The SN74LVC1G126 device is a high-drive CMOS device that can be used as an output enabled buffer with a
high output drive, such as an LED application. It can produce 24 mA of drive current at 3.3 V, making it ideal for
driving multiple outputs and good for high speed applications up to 100 MHz. The inputs are 5.5-V tolerant
allowing it to translate down to VCC.
10.2 Typical Application
1.65 V to 5 V
SN74LVC1G126
0.1 PF
OE
Input signal 1
from system
VCC
A
GND
Y
Output 1 to long
PCB trace or
high-Z logic input
Figure 5. Application Schematic
10.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. Outputs can be combined to
produce higher drive but the high drive will also create faster edges into light loads, so routing and load
conditions should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions:
– For rise time and fall time specifications, see Δt/ΔV in the Recommended Operating Conditions table.
– For specified high and low levels, see VIH and VIL in the Recommended Operating Conditions table.
– Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC.
2. Recommend Output Conditions:
– Load currents should not exceed 50 mA per output and 100 mA total for the part.
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11
SN74LVC1G126
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www.ti.com
Typical Application (continued)
10.2.3 Application Curves
10
VCC
VCC
VCC
VCC
9
8
1.8 V
2.5 V
3.3 V
5V
ICC (mA)
7
6
5
4
3
2
1
0
0
20
40
Frequency (MHz)
60
80
D003
Figure 6. ICC vs Frequency
11 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply voltage rating located in the
Recommended Operating Conditions table.
Each VCC terminal should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, a 0.1-μF capacitor is recommended. If there are multiple VCC terminals, then 0.01-μF or 0.022-μF
capacitors are recommended for each power terminal. It is ok to parallel multiple bypass capacitors to reject
different frequencies of noise. Multiple bypass capacitors may be paralleled to reject different frequencies of
noise. The bypass capacitor should be installed as close to the power terminal as possible for the best results.
12 Layout
12.1 Layout Guidelines
When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of
digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used,
or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the
undefined voltages at the outside connections result in undefined operational states.
Specified in Figure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic
devices must be connected to a high or low bias to prevent them from floating. The logic level that should be
applied to any particular unused input depends on the function of the device. Generally they will be tied to GND
or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a
transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when
asserted. This will not disable the input section of the I/Os so they also cannot float when disabled.
12.2 Layout Example
Vcc
Unused Input
Input
Output
Unused Input
Output
Input
Figure 7. Layout Diagram
12
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SN74LVC1G126
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SCES224R – APRIL 1999 – REVISED JANUARY 2015
13 Device and Documentation Support
13.1 Trademarks
NanoFree is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
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13
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
74LVC1G126DBVRE4
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
C26F
Samples
74LVC1G126DBVRG4
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
C26F
Samples
74LVC1G126DBVTE4
ACTIVE
SOT-23
DBV
5
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
C26F
Samples
74LVC1G126DBVTG4
ACTIVE
SOT-23
DBV
5
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
C26F
Samples
74LVC1G126DCKRE4
ACTIVE
SC70
DCK
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CN5
Samples
74LVC1G126DCKRG4
ACTIVE
SC70
DCK
5
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CN5
Samples
74LVC1G126DCKTG4
ACTIVE
SC70
DCK
5
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CN5
Samples
SN74LVC1G126DBVR
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
(C265, C26F, C26J,
C26K, C26R, C
26T)
SN74LVC1G126DBVT
ACTIVE
SOT-23
DBV
5
250
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
(C265, C26F, C26J,
C26K, C26R)
Samples
SN74LVC1G126DCKR
ACTIVE
SC70
DCK
5
3000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
(CN5, CNF, CNJ, CN
K, CNR, CNT)
Samples
SN74LVC1G126DCKT
ACTIVE
SC70
DCK
5
250
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
(CN5, CNF, CNJ, CN
K, CNR)
Samples
SN74LVC1G126DRLR
ACTIVE
SOT-5X3
DRL
5
4000
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
(CN7, CNR)
Samples
SN74LVC1G126DRYR
ACTIVE
SON
DRY
6
5000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CN
Samples
SN74LVC1G126DSFR
ACTIVE
SON
DSF
6
5000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
CN
Samples
SN74LVC1G126YZPR
ACTIVE
DSBGA
YZP
5
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
(CN7, CNN)
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of