SN74LVC1G74
SCES794G – OCTOBER 2009 – REVISED SEPTEMBER 2021
SN74LVC1G74 Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset
1 Features
3 Description
•
This single positive-edge-triggered D-type flip-flop is
designed for 1.65-V to 5.5-V VCC operation.
•
•
•
•
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoFree™ package
Supports 5-V VCC operation
Inputs accept voltages to 5.5-V
Supports down translation to VCC
Maximum tpd of 5.9-ns at 3.3-V
Low power consumption, 10-µA maximum ICC
±24-mA output drive at 3.3-V
Typical VOLP (output ground bounce)
< 0.8-V at VCC = 3.3-V, TA = 25°C
Typical VOHV (output VOH undershoot)
> 2-V at VCC = 3.3 V, TA = 25°C
Ioff supports live insertion, partial-power-down
mode, and back-drive protection
Latch-up performance exceeds 100 mA per JESD
78, class II
ESD protection exceeds JESD 22
– 2000-V human-body model
– 200-V machine model
– 1000-V charged-device model
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
A low level at the preset ( PRE) or clear ( CLR)
input sets or resets the outputs, regardless of the
levels of the other inputs. When PRE and CLR are
inactive (high), data at the data (D) input meeting the
setup time requirements is transferred to the outputs
on the positive-going edge of the clock pulse. Clock
triggering occurs at a voltage level and is not related
directly to the rise time of the clock pulse. Following
the hold-time interval, data at the D input can be
changed without affecting the levels at the outputs.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables
the outputs, preventing damaging current backflow
through the device when it is powered down.
2 Applications
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•
•
•
•
•
Device Information
Servers
LED displays
Network switch
Telecom infrastructure
Motor drivers
I/O expanders
PART NUMBER
SN74LVC1G74
(1)
PACKAGE (1)
BODY SIZE
SM8 (8)
2.95 mm × 2.80 mm
US8 (8)
2.30 mm × 2.00 mm
X2SON (8)
1.40 mm × 1.00 mm
UQFN (8)
1.50 mm × 1.50 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
PRE
D
Q
CLK
Q
CLR
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC1G74
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................4
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings........................................ 5
6.2 ESD Ratings............................................................... 5
6.3 Recommended Operating Conditions.........................6
6.4 Thermal Information....................................................6
6.5 Electrical Characteristics.............................................7
6.6 Timing Requirements.................................................. 7
6.7 Switching Characteristics............................................7
6.8 Operating Characteristics........................................... 8
6.9 Typical Characteristics................................................ 8
7 Parameter Measurement Information............................ 9
8 Detailed Description......................................................10
8.1 Overview................................................................... 10
8.2 Functional Block Diagram......................................... 10
8.3 Feature Description...................................................10
8.4 Device Functional Modes..........................................10
9 Application and Implementation.................................. 11
9.1 Application Information..............................................11
9.2 Typical Power Button Circuit..................................... 11
10 Power Supply Recommendations..............................12
11 Layout........................................................................... 13
11.1 Layout Guidelines................................................... 13
11.2 Layout Example...................................................... 13
12 Device and Documentation Support..........................14
12.1 Receiving Notification of Documentation Updates..14
12.2 Support Resources................................................. 14
12.3 Trademarks............................................................. 14
12.4 Electrostatic Discharge Caution..............................14
12.5 Glossary..................................................................14
13 Mechanical, Packaging, and Orderable
Information.................................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (April 2020) to Revision G (September 2021)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Updated the Application and Information section............................................................................................. 11
• Updated the Device Power Button Circuit figure Typical Power Button Circuit section.................................... 11
Changes from Revision E (Janurary 2015) to Revision F (April 2020)
Page
• Match RSE pinout with signal names................................................................................................................. 4
Changes from Revision D (January 2013) to Revision E (Janurary 2015)
Page
• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information
table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1
• Deleted Ordering Information table.....................................................................................................................1
• Updated Features .............................................................................................................................................. 1
Changes from Revision C (November 2012) to Revision D (January 2013)
Page
• Deleted Thermal data for DQE Package............................................................................................................ 1
• Added Thermal data for DQE Package.............................................................................................................. 6
Changes from Revision B (March 2012) to Revision C (November 2012)
Page
• Added preview for RES part............................................................................................................................... 1
• Added QFN package ordering information....................................................................................................... 14
Changes from Revision A (November 2011) to Revision B (February 2012)
Page
• Added SN74LVC1G74DCURG4 part number to ORDERING INFORMATION table....................................... 14
Changes from Revision * (October 2009) to Revision A (November 2011)
Page
• Changed Ioff description in Features ..................................................................................................................1
• Changed temperature range for DCT and DCU package from (−40°C to 85°C) to (−40°C to 125°C)............... 6
2
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•
•
SN74LVC1G74
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Changed Timing Requirements table................................................................................................................. 7
Changed Switching Requirements table.............................................................................................................7
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5 Pin Configuration and Functions
DCT PACKAGE
(TOP VIEW)
CLK
1
D
2
DCU PACKAGE
(TOP VIEW)
8
VCC
7
PRE
Q
3
6
CLR
GND
4
5
Q
CLK
D
Q
GND
1
8
2
7
3
6
4
5
VCC
PRE
CLR
Q
See mechanical drawings for dimensions.
Figure 5-1. DCT 8-Pin SM8 and DCU 8-Pin VSSOP Package Top View
DQE PACKAGE
(TOP VIEW)
CLK
D
Q
GND
1 8
2 7
3 6
4 5
VCC
PRE
CLR
Q
RSE PACKAGE
(TOP VIEW)
VCC
PRE
CLR
Q
1
8
7
2
3
6
4
5
CLK
D
Q
GND
See mechanical drawings for dimensions
Figure 5-2. DQE 8-Pin X2SON and RSE UQFN 8-Pin Package Top View
Pin Functions
PIN
NAME
4
NO.
TYPE
DESCRIPTION
CLK
1
I
Clock input
CLR
6
I
Clear input − Pull low to set Q output low
D
2
I
Input
GND
4
—
PRE
7
I
Preset input − Pull low to set Q output high
Q
5
O
Output
Q
3
O
Inverted output
VCC
8
—
Supply
Ground
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
MIN
MAX
Supply voltage range
–0.5
6.5
V
range(2)
–0.5
6.5
V
–0.5
6.5
V
–0.5
VCC + 0.5
VI
Input voltage
VO
Voltage range applied to any output in the high-impedance or power-off state(2)
state(2) (3)
UNIT
VO
Voltage range applied to any output in the high or low
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
Storage temperature range
–65
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
6.2 ESD Ratings
PARAMETER
DEFINITION
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
V(ESD)
(1)
(2)
Electrostatic discharge
VALUE
UNIT
2000
V
pins(1)
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins(2)
1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Operating
Supply voltage
Data retention only
1.65
5.5
VCC = 3 V to 3.6 V
VI
Input voltage
VO
Output voltage
V
2
0.7 × VCC
VCC = 1.65 V to 1.95 V
Low-level input voltage
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VCC = 4.5 V to 5.5 V
0.3 × VCC
5.5
V
0
VCC
V
–4
VCC = 2.3 V
High-level output current
–8
–16
VCC = 3 V
Low-level output current
Δt/Δv
Input transition rise or fall rate
–32
VCC = 1.65 V
4
VCC = 2.3 V
8
16
VCC = 3 V
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
–40
DQE Package
85
°C
DCT Package
–40
DCU Package
(1)
ns/V
5
RSE Package
Operating free-air temperature
mA
24
VCC = 5 V ± 0.5 V
TA
mA
–24
VCC = 4.5 V
IOL
V
0
VCC = 1.65 V
IOH
V
1.7
VCC = 4.5 V to 5.5 V
VIL
UNIT
0.65 × VCC
VCC = 2.3 V to 2.7 V
High-level input voltage
MAX
1.5
VCC = 1.65 V to 1.95 V
VIH
MIN
125
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6.4 Thermal Information
SN74LVC1G74
THERMAL
RθJA
(1)
6
METRIC(1)
Junction-to-ambient thermal resistance
DCT
DCU
RSE
DQE
8 PINS
8 PINS
8 PINS
8 PINS
220
227
243
261
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
VOH
1.65 V to 5.5 V
1.65 V
1.2
IOH = –8 mA
2.3 V
1.9
4.5 V
IOL = 100 µA
1.65 V to 5.5 V
0.1
1.65 V
0.45
IOL = 8 mA
2.3 V
0.3
VI = 5.5 V or GND
VI or VO = 5.5 V
ICC
VI = 5.5 V or GND,
IO = 0
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
V
0.55
4.5 V
Ioff
(1)
0.4
3V
IOL = 32 mA
II
3.8
IOL = 4 mA
IOL = 24 mA
Data or
control inputs
2.3
IOH = –32 mA
IOL = 16 mA
UNIT
V
2.4
3V
IOH = –24 mA
MAX
VCC – 0.1
IOH = –4 mA
IOH = –16 mA
VOL
MIN TYP(1)
VCC
0.55
0 to 5.5 V
±5
µA
0
±10
µA
1.65 V to 5.5 V
10
µA
3 V to 5.5 V
500
µA
3.3 V
5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
6.6 Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 7-1)
–40°C to 85°C
PARAMETE
R
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
MIN
fclock
tw
tsu
MAX
VCC = 2.5 V
MIN
80
MAX
–40°C to 125°C
VCC = 3.3 V
MIN
175
MAX
VCC = 5 V
MIN
175
MAX
VCC = 3.3 V
MIN
MAX
200
VCC = 5 V
MIN
175
MAX
200 MHz
CLK
6.2
2.7
2.7
2
2.7
2
PRE or CLR low
6.2
2.7
2.7
2
2.7
2
Data
2.9
1.7
1.3
1.1
1.3
1.1
PRE or CLR inactive
1.9
1.4
1.2
1
1.2
1.2
0
0.3
1.2
0.5
1.2
0.5
th
UNIT
ns
ns
ns
6.7 Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 7-1)
–40°C to 85°C
PARAMETE
R
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
MIN
fmax
CLK
tpd
MAX
80
PRE or CLR
low
VCC = 2.5 V
MIN
MAX
175
–40°C to 125°C
VCC = 3.3 V
MIN
MAX
175
VCC = 5 V
MIN
MAX
200
VCC = 3.3 V
MIN
MAX
175
VCC = 5 V
MIN
MAX
200
MHz
Q
4.8
13.4
2.2
7.1
2.2
5.9
1.4
4.1
2.2
7.9
1.4
6.1
Q
6
14.4
3
7.7
2.6
6.2
1.6
4.4
2.6
8.2
1.6
6.4
4.4
12.9
2.3
7
1.7
5.9
1.6
4.1
1.7
7.9
1.6
6.1
Q or Q
UNIT
ns
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6.8 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
35
35
37
40
f = 10 MHz
UNIT
pF
6.9 Typical Characteristics
14
10
12
VCC = 3 V,
TA = 25°C
tpd – Propagation Delay Time – ns
tpd – Propagation Delay Time – ns
VCC = 3 V,
TA = 25°C
One Output Switching
10
8
6
4
2
One Output Switching
8
6
4
2
0
50
100
150
200
250
300
0
CL – Load Capacitance – pF
Figure 6-1. Propagation Delay (Low to High
Transition)
vs Load Capacitance
8
50
100
150
200
250
300
CL – Load Capacitance – pF
Figure 6-2. Propagation Delay (High to Low
Transition)
vs Load Capacitance
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7 Parameter Measurement Information
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
CL
(see Note A)
S1
Open
VLOAD
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
RL
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
£2 ns
£2 ns
£2.5 ns
£2.5 ns
VM
VLOAD
CL
RL
VD
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kW
500 W
500 W
500 W
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tW
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
Output
VM
VOL
tPHL
tPLZ
VLOAD/2
VM
tPZH
VM
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VOH
Output
VM
tPZL
tPHL
VM
VI
Output
Control
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + VD
VOL
tPHZ
VM
VOH – VD
VOH
»0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 7-1. Load Circuit and Voltage Waveforms
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8 Detailed Description
8.1 Overview
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
8.2 Functional Block Diagram
PRE
7
1
CLK
C
C
C
5
Q
TG
C
C
C
C
D
2
TG
TG
TG
3
C
CLR
Q
C
C
6
8.3 Feature Description
•
•
•
Allow down voltage translation
– 5-V to 3.3-V
– 5.0-V to 1.8-V
– 3.3-V to 1.8-V
Inputs accept voltage levels up to 5.5-V
Ioff Feature
– Can prevent backflow current that can damage device when powered down
8.4 Device Functional Modes
Table 8-1. Function Table
INPUTS
(1)
10
OUTPUTS
PRE
CLR
CLK
D
Q
Q
L
H
X
X
H
L
H
L
X
X
L
H
L
L
X
X
H(1)
H(1)
H
H
↑
H
H
L
H
H
↑
L
L
H
H
H
L
X
Q0
Q0
This configuration is nonstable; that is, it does not persist when PRE or CLR returns to its inactive (high) level.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of
the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs
at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval,
data at the D input can be changed without affecting the levels at the outputs.
The 330 Ω resistor and 22 pF capacitor shown in Figure 9-1 produce enough delay to meet the hold time
requirement of the D input. To calculate the delay for a particular RC combination, use Equation 1. The delay
with this RC combination is 5.03 ns
tdelay = −RC ln(0.5) ≈ 0.693 RC
(1)
To ensure proper operation, check that the transition time of the RC circuit meets the transition time
requirements of the device inputs listed in the Recommended Operating Conditions table. Transition time for
an RC can be approximated with Equation 2.
tt≈ 2.2 RC
(2)
9.2 Typical Power Button Circuit
VCC
VCC
0.1 F
VCC
0.1 F
10 k
1A
1 F
1Y
VCC
330
22 pF
20 k
VCC
D
PRE
Q
CLR
GND
2A
1 F
CLK
Q
MCU
2Y
SN74LVC2G17
Figure 9-1. Device Power Button Circuit
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9.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. Outputs can be combined to
produce higher drive but the high drive will also create faster edges into light loads so routing and load
conditions should be considered to prevent ringing.
9.2.2 Detailed Design Procedure
1. Recommended Input Conditions:
• For rise time and fall time specifications, see (Δt/ΔV) in the Recommended Operating Conditions table.
• For specified high and low levels, see (VIH and VIL) in the Recommended Operating Conditions table.
• Inputs are overvoltage tolerant allowing them to go as high as 5.5-V at any valid VCC.
2. Recommend Output Conditions:
• Load currents should not exceed 50-mA per output and 100-mA total for the part.
• Series resistors on the output may be used if the user desires to slow the output edge signal or limit the
output current.
9.2.3 Application Curves
60
40
100
TA = 25°C, VCC = 3 V,
VIH = 3 V, VIL = 0 V,
All Outputs Switching
80
TA = 25°C, VCC = 3 V,
VIH = 3 V, VIL = 0 V,
All Outputs Switching
60
0
I OL – mA
I OH – mA
20
–20
40
–40
20
–60
0
–80
–100
–1
–0.5 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
–20
–0.2
0.0
VOH – V
Figure 9-2. Output Current Drive
vs HIGH-level Output Voltage
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VOL – V
Figure 9-3. Output Current Drive
vs LOW-level Output Voltage
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommonded Operating Conditions table. Each VCC terminal should have a good bypass capacitor to prevent
power disturbance. For devices with a single supply, a 0.1-μF capacitor is recommended and if there are multiple
VCC terminals then .01-μF or .022-μF capacitors are recommended for each power terminal. It is acceptable
to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are
commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible
for best results.
12
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SN74LVC1G74
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SCES794G – OCTOBER 2009 – REVISED SEPTEMBER 2021
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of
digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used,
or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the
undefined voltages at the outside connections result in undefined operational states.
Specified in Figure 11-1 are rules that must be observed under all circumstances. All unused inputs of digital
logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should
be applied to any particular unused input depends on the function of the device. Generally they will be tied to
GND or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the
part is a transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part
when asserted. This will not disable the input section of the I/Os so they also cannot float when disabled.
11.2 Layout Example
Vcc
Unused Input
Input
Output
Unused Input
Output
Input
Figure 11-1. Layout Diagram
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13
SN74LVC1G74
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SCES794G – OCTOBER 2009 – REVISED SEPTEMBER 2021
12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
NanoFree™ is a trademark of Texas Instruments.
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
14
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74LVC1G74DCTR
ACTIVE
SM8
DCT
8
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
N74
Z
SN74LVC1G74DCUR
ACTIVE
VSSOP
DCU
8
3000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
(N74J, N74Q, N74R)
SN74LVC1G74DCURG4
ACTIVE
VSSOP
DCU
8
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
N74R
SN74LVC1G74DCUT
ACTIVE
VSSOP
DCU
8
250
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
(N74J, N74Q, N74R)
SN74LVC1G74DQER
ACTIVE
X2SON
DQE
8
5000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
DP
SN74LVC1G74RSE2
ACTIVE
UQFN
RSE
8
5000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
DP
SN74LVC1G74RSER
ACTIVE
UQFN
RSE
8
5000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
DP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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