SN74LVC2G07MDCKTEP

SN74LVC2G07-EP www.ti.com ....................................................................................................................................................................................................... SCES719 – MAY 2008 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS FEATURES 1 • • • • • • (1) • Controlled Baseline – One Assembly Site – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Supports 5-V VCC Operation • • • • • • • Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. • Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V Max tpd of 5.7 ns at 3.3 V Low Power Consumption, 10 µA Max ICC ±24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) 2 V at VCC = 3.3 V, TA = 25°C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) DCK PACKAGE (TOP VIEW) 1A 1 6 1Y GND 2 5 VCC 2A 3 4 2Y See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open drain and can be connected to other open-drain outputs to implement active low wired OR or active high wired AND functions. The maximum sink current is 32 mA. This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION (1) PACKAGE (2) TA –55°C to 125°C (1) (2) SOT (SC-70) – DCK ORDERABLE PART NUMBER Reel of 250 SN74LVC2G07MDCKTEP TOP-SIDE MARKING CHC For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated SN74LVC2G07-EP SCES719 – MAY 2008 ....................................................................................................................................................................................................... www.ti.com FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y H H L L LOGIC DIAGRAM (POSITIVE LOGIC) 1A 2A 1 6 3 4 1Y 2Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V (2) (3) VO Voltage range applied to any output in the high or low state 6.5 V IIK Input clamp current VI < 0 –0.5 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA Continuous current through VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) 2 DCK package –65 ±100 mA 259 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G07-EP SN74LVC2G07-EP www.ti.com ....................................................................................................................................................................................................... SCES719 – MAY 2008 Recommended Operating Conditions VCC Operating Supply voltage Data retention only 1.65 5.5 1.7 VCC = 3 V to 3.6 V 0.7 × VCC 0.35 × VCC VCC = 1.65 V to 1.95 V Low-level input voltage V V 2 VCC = 4.5 V to 5.5 V VIL UNIT 0.65 × VCC VCC = 2.3 V to 2.7 V High-level input voltage MAX 1.5 VCC = 1.65 V to 1.95 V VIH MIN VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 V 0.3 × VCC VCC = 4.5 V to 5.5 V VI Input voltage 0 5.5 V VO Output voltage 0 5.5 V VCC = 1.65 V 4 VCC = 2.3 V IOL Δt/Δv Low-level output current 8 16 VCC = 3 V Input transition rise or fall rate VCC = 4.5 V 24 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 VCC = 3.3 V ± 0.3 V 10 VCC = 5 V ± 0.5 V TA mA 24 ns/V 5 Operating free-air temperature –55 125 °C MAX UNIT Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOL = 100 µA VOL VCC IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 IOL = 16 mA 0.4 3V IOL = 24 mA A inputs TYP 0.1 IOL = 24 mA II MIN 1.65 V to 5.5 V 0.55 4.5 V VI = 5.5 V or GND Ioff VI or VO = 5.5 V ICC VI = 5.5 V or GND, IO = 0 ΔICC One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND V 0.55 0 to 5.5 V ±5 µA 0 ±10 µA 1.65 V to 5.5 V 10 µA 500 µA 3 V to 5.5 V 3.3 V 3.5 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G07-EP pF 3 SN74LVC2G07-EP SCES719 – MAY 2008 ....................................................................................................................................................................................................... www.ti.com Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A Y VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V MIN MAX MIN MAX 1 5.7 0.5 4.9 UNIT ns Operating Characteristics TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS f = 10 MHz Submit Documentation Feedback VCC = 3.3 V VCC = 5 V TYP TYP 4 4 UNIT pF Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G07-EP SN74LVC2G07-EP www.ti.com ....................................................................................................................................................................................................... SCES719 – MAY 2008 PARAMETER MEASUREMENT INFORMATION (OPEN DRAIN) VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tPZL (see Notes E and F) tPLZ (see Notes E and G) tPHZ/tPZH VLOAD VLOAD VLOAD LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH Output VM VOL tPHL VM VM 0V tPLZ Output Waveform 1 S1 at VLOAD (see Note B) tPLH VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VM VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH – V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators have the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. Because this device has open-drain outputs, tPLZ and tPZL are the same as tPD. F. tPZL is measured at VM. G. tPLZ is measured at VOL + V∆. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN74LVC2G07-EP 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) 74LVC2G07MDCKTEPG4 ACTIVE SC70 DCK 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CHC SN74LVC2G07MDCKTEP ACTIVE SC70 DCK 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CHC V62/08616-01XE ACTIVE SC70 DCK 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CHC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of