SN74LVC2G240DCUR

SN74LVC2G240 www.ti.com SCES208I – APRIL 1999 – REVISED NOVEMBER 2013 Dual Buffer Driver With 3-State Outputs Check for Samples: SN74LVC2G240 FEATURES DESCRIPTION • This dual buffer driver is designed for 1.65-V to 5.5-V VCC operation. 1 2 • • • • • • • • • • • Available in the Texas Instruments NanoFree™ Package Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 4.6 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) 2 V at VCC = 3.3 V, TA = 25°C Ioff Supports Live Insertion, Partial-PowerDown Mode, and Back-Drive Protection Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down to the VCC Level Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) DCT PACKAGE (TOP VIEW) The SN74LVC2G240 device is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and busoriented receivers and transmitters. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is organized as two 1-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A input to the Y output. When OE is high, the outputs are in the highimpedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. YZP PACKAGE (BOTTOM VIEW) DCU PACKAGE (TOP VIEW) 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 1OE 1A 2Y GND 1 8 VCC 2 7 3 6 4 5 2OE 1Y 2A GND 2Y 1A 1OE 4 5 3 6 2 7 1 8 2A 1Y 2OE VCC See mechanical drawings for dimensions. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated SN74LVC2G240 SCES208I – APRIL 1999 – REVISED NOVEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Function Table (Each Buffer) INPUTS OUTPUT Y OE A L H L L L H H X Z Logic Diagram (Positive Logic) 1 1OE 1A 6 2 1Y 7 2OE 3 5 2Y 2A Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V –0.5 VCC + 0.5 (2) (3) UNIT VO Voltage range applied to any output in the high or low state IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Tstg (1) (2) (3) (4) 2 Package thermal impedance (4) DCT package 220 DCU package 227 YZP package 102 Storage temperature range –65 150 V °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G240 SN74LVC2G240 www.ti.com SCES208I – APRIL 1999 – REVISED NOVEMBER 2013 Recommended Operating Conditions (1) VCC Supply voltage Operating Data retention only High-level input voltage MAX 5.5 1.5 VCC = 1.65 V to 1.95 V VIH MIN 1.65 VCC = 2.3 V to 2.7 V 1.7 VCC = 3 V to 3.6 V VI Input voltage 0.7 × VCC 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VCC = 4.5 V to 5.5 V VO Output voltage 5.5 High or low state 0 VCC 3-state 0 5.5 VCC = 3 V –32 4 VCC = 2.3 V Δt/Δv Input transition rise or fall rate 8 16 VCC = 3 V VCC = 4.5 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 VCC = 3.3 V ± 0.3 V 10 (1) Operating free-air temperature mA 24 VCC = 5 V ± 0.5 V TA mA –24 VCC = 1.65 V Low-level output current V –8 –16 VCC = 4.5 V IOL V –4 VCC = 2.3 V High-level output current V 0.3 × VCC 0 VCC = 1.65 V IOH V 2 VCC = 1.65 V to 1.95 V Low-level input voltage V 0.65 × VCC VCC = 4.5 V to 5.5 V VIL UNIT ns/V 5 –40 125 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G240 3 SN74LVC2G240 SCES208I – APRIL 1999 – REVISED NOVEMBER 2013 www.ti.com Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS –40°C to 125°C MAX MIN VCC – 0.1 VCC – 0.1 IOH = –4 mA 1.65 V 1.2 1.2 IOH = –8 mA 2.3 V 1.9 1.9 2.4 2.4 2.3 2.3 3.8 3.8 3V TYP (1) MAX 4.5 V IOL = 100 µA 1.65 V to 5.5 V 0.1 0.1 IOL = 4 mA 1.65 V 0.45 0.45 IOL = 8 mA 2.3 V 0.3 0.3 3V IOL = 24 mA UNIT V IOH = –32 mA IOL = 16 mA II TYP (1) 1.65 V to 5.5 V IOH = –24 mA A or OE inputs –40°C to 85°C MIN IOH = –100 µA IOH = –16 mA VOL VCC 0.4 0.4 0.55 0.55 V IOL = 32 mA 4.5 V 0.55 0.75 VI = 5.5 V or GND 0 to 5.5 V ±5 ±5 µA Ioff VI or VO = 5.5 V 0 ±10 ±10 µA IOZ VO = 0 to 5.5 V 3.6 V 10 10 µA ICC VI = 5.5 V or GND, IO = 0 1.65 V to 5.5 V 10 10 µA ΔICC One input at VCC – 0.6 V, Other inputs at VCC or GND 3 V to 5.5 V 500 500 µA Ci VI = VCC or GND 3.3 V 4 pF Co VO = VCC or GND 3.3 V 6 pF (1) 4 All typical values are at VCC = 3.3 V, TA = 25°C. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G240 SN74LVC2G240 www.ti.com SCES208I – APRIL 1999 – REVISED NOVEMBER 2013 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC2G240 –40°C to 85°C PARAMETER FROM (INPUT) TO (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX tpd A Y 2.0 11.3 1.4 5.5 1.1 4.6 1.0 4.0 ns ten OE Y 2.7 11.7 1.9 6.6 1.4 5.4 1.1 5.0 ns tdis OE Y 1.7 12.8 0.8 5.7 1.2 5.5 0.5 4.2 ns VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V UNIT Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC2G240 –40°C to 85°C PARAMETER FROM (INPUT) TO (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX tpd A Y 2.0 13.7 1.4 6.8 1.1 5.8 1.0 5.0 ns ten OE Y 2.7 14.3 1.9 8.0 1.4 6.6 1.1 6.0 ns tdis OE Y 1.7 15.3 0.8 7.5 1.2 6.8 0.5 5.4 ns VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V UNIT Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance per buffer driver TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 15 17 2 3 Outputs enabled Outputs disabled f = 10 MHz 1 1 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G240 UNIT pF 5 SN74LVC2G240 SCES208I – APRIL 1999 – REVISED NOVEMBER 2013 www.ti.com Parameter Measurement Information VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC £2 ns £2 ns £2.5 ns £2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 30 pF 30 pF 50 pF 50 pF 1 kW 500 W 500 W 500 W 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH Output VM VOL tPHL tPLZ VLOAD/2 VM tPZH VM VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH VOH Output VM tPZL tPHL VM VI Output Control VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH – VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G240 SN74LVC2G240 www.ti.com SCES208I – APRIL 1999 – REVISED NOVEMBER 2013 REVISION HISTORY Changes from Revision H (February 2007) to Revision I Page • Updated document to new TI data sheet format. ................................................................................................................. 1 • Removed ordering information. ............................................................................................................................................ 1 • Updated Features. ................................................................................................................................................................ 1 • Added ESD warning. ............................................................................................................................................................ 2 • Updated operating temperature range. ................................................................................................................................. 3 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G240 7 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) 74LVC2G240DCURG4 ACTIVE VSSOP DCU 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 C40R SN74LVC2G240DCTR ACTIVE SM8 DCT 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 C40 (R, Z) SN74LVC2G240DCUR ACTIVE VSSOP DCU 8 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C40J, C40Q, C40R) SN74LVC2G240YZPR ACTIVE DSBGA YZP 8 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 (CK7, CKN) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of