SN74LVC2G38
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SCES554D – MARCH 2004 – REVISED DECEMBER 2013
Dual 2-Input NAND Gate With Open-Drain Outputs
Check for Samples: SN74LVC2G38
FEATURES
DESCRIPTION
•
The SN74LVC2G38 is designed for 1.65-V to 5.5-V
VCC operation.
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Available in the Texas Instruments NanoFree™
Package
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 4 ns at 3.3 V
Low Power Consumption, 10-μA Max ICC
±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce) 2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Live insertion, Partial-PowerDown Mode Operation and Back Drive
Protection
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCT PACKAGE
(TOP VIEW)
This device is a dual two-input NAND buffer gate with
open-drain outputs. It performs the Boolean function
Y = A • B or Y = A + B in positive logic.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
YZP PACKAGE
(BOTTOM VIEW)
DCU PACKAGE
(TOP VIEW)
1A
1
8
VCC
1B
2
7
1Y
2Y
3
6
2B
GND
4
5
2A
1A
1B
2Y
GND
1
2
3
8
7
6
4
5
VCC
1Y
2B
2A
GND
2Y
1B
1A
4 5
3 6
2 7
1 8
2A
2B
1Y
VCC
See mechanical drawings for dimensions.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated
SN74LVC2G38
SCES554D – MARCH 2004 – REVISED DECEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Function Table
(Each Gate)
INPUTS
B
OUTPUT
Y
L
L
H
L
H
H
H
L
H
H
H
L
A
Logic Diagram (Positive Logic)
1A
1B
2A
2B
1
7
2
5
3
6
1Y
2Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
Supply voltage range
–0.5
6.5
UNIT
V
(2)
VI
Input voltage range
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high or low state (2)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
(3)
Continuous current through VCC or GND
θJA
Tstg
(1)
(2)
(3)
(4)
2
Package thermal impedance (4)
DCT package
220
DCU package
227
YZP package
102
Storage temperature range
–65
150
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
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SCES554D – MARCH 2004 – REVISED DECEMBER 2013
Recommended Operating Conditions (1)
VCC
Operating
Supply voltage
Data retention only
5.5
UNIT
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
High-level input voltage
MAX
1.5
VCC = 1.65 V to 1.95 V
VIH
MIN
1.65
1.7
VCC = 3 V to 3.6 V
V
2
VCC = 4.5 V to 5.5 V
0.7 × VCC
VCC = 1.65 V to 1.95 V
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VIL
Low-level input voltage
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
V
VCC = 4.5 V to 5.5 V
0.3 × VCC
VCC = 1.65 V
4
VCC = 2.3 V
IOL
Low-level output current
8
16
VCC = 3 V
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
mA
24
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
VCC = 5 V ± 0.5 V
(1)
V
ns/V
5
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOL = 100 μA
VOL
TYP (1)
–40°C to 125°C
MAX
MIN
TYP (1)
MAX
UNIT
1.65 V to 5.5 V
0.1
0.1
1.65 V
0.45
0.45
IOL = 8 mA
2.3 V
0.3
0.3
0.4
0.4
0.55
0.55
0.55
0.55
0 to 5.5 V
±1
±10
μA
0
±10
±10
μA
1.65 V to 5.5 V
10
10
μA
3 V to 5.5 V
500
500
μA
IOL = 16 mA
3V
IOL = 32 mA
A or B inputs
–40°C to 85°C
MIN
IOL = 4 mA
IOL = 24 mA
II
VCC
4.5 V
VI = 5.5 V or GND
V
Ioff
VI or VO = 5.5 V
ICC
VI = 5.5 V or GND, IO = 0
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
3.3 V
4
pF
Co
VO = VCC or GND
3.3 V
4.5
pF
(1)
All typical values are at VCC = 3.3 V, TA = 25°C.
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SN74LVC2G38
SCES554D – MARCH 2004 – REVISED DECEMBER 2013
www.ti.com
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
SN74LVC2G38
–40°C to 85°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.5
8.5
1.5
5.2
1.3
4
0.9
3
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)
SN74LVC2G38
–40°C to 85°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.8
10
1.6
6
1.4
4.5
1
3.9
UNIT
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 2)
SN74LVC2G38
–40°C to 125°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.6
10.8
1.6
6.7
1.4
5.1
1
4.3
UNIT
ns
Operating Characteristics
TA = 25°C
Cpd
4
PARAMETER
TEST CONDITIONS
Power dissipation capacitance
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
6
7
7
9
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UNIT
pF
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links :SN74LVC2G38
SN74LVC2G38
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SCES554D – MARCH 2004 – REVISED DECEMBER 2013
Parameter Measurement Information
(Open Drain)
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tPZL (see Notes E and F)
tPLZ (see Notes E and G)
tPHZ/tPZH
VLOAD
VLOAD
VLOAD
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
15 pF
15 pF
15 pF
15 pF
1 MΩ
1 MΩ
1 MΩ
1 MΩ
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tW
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
VM
VOL
tPHL
VM
VM
0V
tPLZ
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VM
Output
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH – V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators have the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Because this device has open-drain outputs, tPLZ and tPZL are the same as tPD.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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SN74LVC2G38
SCES554D – MARCH 2004 – REVISED DECEMBER 2013
www.ti.com
Parameter Measurement Information
(Open Drain)
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tPZL (see Notes E and F)
tPLZ (see Notes E and G)
tPHZ/tPZH
VLOAD
VLOAD
VLOAD
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tW
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VM
Output
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH – V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators have the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Because this device has open-drain outputs, tPLZ and tPZL are the same as tPD.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
6
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SN74LVC2G38
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SCES554D – MARCH 2004 – REVISED DECEMBER 2013
REVISION HISTORY
Changes from Revision C (Feburary 2007) to Revision D
Page
•
Updated document to new TI data sheet format. ................................................................................................................. 1
•
Added ESD warning. ............................................................................................................................................................ 2
•
Updated operating temperature range. ................................................................................................................................. 3
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
SN74LVC2G38DCTR
ACTIVE
SM8
DCT
8
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
C38
(R, Z)
SN74LVC2G38DCUR
ACTIVE
VSSOP
DCU
8
3000
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
(C38J, C38Q, C38R)
SN74LVC2G38DCUT
ACTIVE
VSSOP
DCU
8
250
RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
(C38J, C38Q, C38R)
SN74LVC2G38YZPR
ACTIVE
DSBGA
YZP
8
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
D7N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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