SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
D
D
D
D
D
D
D
D
D
D
DGG OR DL PACKAGE
(TOP VIEW)
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low-Static Power
Dissipation
Member of the Texas Instruments
Widebus Family
Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
3.3-V VCC)
Supports Unregulated Battery Operation
Down to 2.7 V
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Supports Live Insertion
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes
PCB Layout
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages Using 25-mil
Center-to-Center Spacings
NC
NC
Y1
GND
Y2
Y3
VCC
Y4
Y5
Y6
GND
Y7
Y8
Y9
Y10
Y11
Y12
GND
Y13
Y14
Y15
VCC
Y16
Y17
GND
Y18
OE
LE
description
The SN74LVT16835 is an 18-bit universal bus
driver designed for low-voltage (3.3-V) VCC
operation, but with the capability to provide a TTL
interface to a 5-V system environment.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
GND
NC
A1
GND
A2
A3
VCC
A4
A5
A6
GND
A7
A8
A9
A10
A11
A12
GND
A13
A14
A15
VCC
A16
A17
GND
A18
CLK
GND
NC – No internal connection
Data flow from A to Y is controlled by the
output-enable (OE) input. This device operates in
the transparent mode when the latch-enable (LE)
input is high. The A data is latched if the clock (CLK) input is held at a high or low logic level. If LE is low, the
A-bus data is stored in the latch/flip-flop on the low-to-high transition of the clock. When OE is high, the outputs
are in the high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74LVT16835 is available in TI’s shrink small-outline (DL) and thin shrink small-outline (DGG) packages,
which provide twice the input/output (I/O) pins and functionality of standard small-outline packages in the same
printed circuit board area.
The SN74LVT16835 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments Incorporated.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
FUNCTION TABLE
INPUTS
OE
LE
CLK
A
OUTPUT
Y
H
X
X
X
Z
L
H
X
L
L
L
H
X
H
H
L
L
↑
L
L
L
L
↑
H
L
L
H
X
H
Y0†
X
Y0‡
† Output level before the indicated steady-state
input conditions were established, provided
that CLK was high before LE went low
‡ Output level before the indicated steady-state
input conditions were established
L
L
L
logic symbol§
27
OE
CLK
LE
EN1
30
28
2C3
C3
G2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
Y11
Y12
Y13
Y14
Y15
Y16
Y17
Y18
3
1
1
3D
52
6
51
8
49
9
48
10
47
12
45
13
44
14
43
15
42
16
41
17
40
19
38
20
37
21
36
23
34
24
33
26
31
§ This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
54
5
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
logic diagram (positive logic)
OE
CLK
LE
A1
27
30
28
54
1D
C1
3
Y1
CLK
To 17 Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the high state or power-off state, VO (see Note 1) . . . . –0.5 V to 7 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . 1 W
DL package . . . . . . . . . . . . . . . . . . . 1.4 W
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data
Book.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
recommended operating conditions (see Note 4)
MIN
MAX
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
5.5
V
IOH
IOL
High-level output current
–32
mA
Low-level output current
64
mA
∆t/∆v
Input transition rise or fall rate
10
ns/V
85
°C
High-level input voltage
2
V
0.8
Outputs enabled
TA
Operating free-air temperature
NOTE 4: Unused control inputs must be held high or low to prevent them from floating.
–40
V
V
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
II(hold)
I(h ld)
VCC = 2
2.7
7V
IOL = 100 µA
IOL = 24 mA
0.2
IOL = 16 mA
IOL = 32 mA
0.4
IOL = 64 mA
VI = 5.5 V
0.55
VCC = 0 or 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V
VCC = 3 V
IOZH
IOZL
VCC = 3.6 V,
VCC = 3.6 V,
ICC
VCC = 3.6
3 6 V,
V
VI = VCC or GND
VCC–0.2
2.4
V
2
0.5
10
VI = VCC or GND
VI = VCC
±1
VI = 5.5 V
20
VI = 0
–5
1
±100
VI or VO = 0 to 4.5 V
VI = 0.8 V
75
VI = 2 V
VO = 3 V
Ci
VO = 0.5 V
Data pins
4.5
• DALLAS, TEXAS 75265
µA
0.2
3.5
POST OFFICE BOX 655303
µA
mA
0.12
Co
VO = 3 V or 0
11
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
4
1
–1
5
Outputs disabled
VI = 3 V or 0
µA
0.12
Outputs low
VCC = 3 V to 3.6 V,
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Control inputs
µA
µ
µA
–75
IO = 0,
0
V
0.5
Outputs high
∆ICC‡
V
IOH = –8 mA
IOH = –32 mA
VCC = 0,
A inputs
UNIT
–1.2
VCC = 2.7 V,
VCC = 3 V
II
Ioff
MAX
II = –18 mA
IOH = –100 µA
VCC = 3 V
A inputs
TYP†
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V,
VOL
Control inputs
MIN
mA
pF
pF
SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
VCC = 3.3 V
± 0.3 V
fclock
Clock frequency
tw
Pulse duration
tsu
th
Setup time
Hold time
VCC = 2.7 V
MIN
MAX
MIN
MAX
0
150
0
125
LE high
3.3
3.3
CLK high or low
3.3
3.3
Data before CLK↑
1.6
2.1
Data before LE↓, CLK high
2.6
1.9
Data before LE↓, CLK low
2
1.3
Data after CLK↑
2
2.1
0.9
1.2
Data after LE↓
UNIT
MHz
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPHZ
FROM
(INPUT)
TO
(OUTPUT)
VCC = 3.3 V ± 0.3 V
MIN TYP†
MAX
150
A
Y
LE
Y
CLK
Y
OE
Y
OE
Y
tPLZ
† All typical values are at VCC = 3.3 V, TA = 25°C.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VCC = 2.7 V
MIN
MAX
150
UNIT
MHz
1.7
3
5.4
6.8
1.6
3.2
5.9
7.7
2.3
4
7
8.5
2.7
4.3
7.9
9.7
2.5
4.1
7.9
9.2
3.5
5.4
8.9
10.4
1.2
3
5
5.9
1.5
3
5.8
6.9
2.7
4.6
7.4
8.3
2.8
4.7
6.7
7.2
ns
ns
ns
ns
ns
5
SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
1.5 V
Timing Input
0V
tw
tsu
2.7 V
1.5 V
Input
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
1.5 V
Input
1.5 V
0V
tPLH
1.5 V
Output
1.5 V
VOL
VOH
Output
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPLZ
Output
Waveform 1
S1 at 6 V
(see Note B)
tPLH
tPHL
1.5 V
tPZL
tPHL
VOH
2.7 V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
3V
1.5 V
VOL + 0.3 V
VOL
tPZH
tPHZ
1.5 V
VOH – 0.3 V
VOH
[0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
7-Sep-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74LVT16835DGGRE4
NRND
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVT16835DGGRG4
NRND
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT16835DGGR
NRND
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT16835DL
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
SN74LVT16835DLR
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LVT16835DGGR
Package Package Pins
Type Drawing
TSSOP
DGG
56
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.6
1.8
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVT16835DGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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