SN75179B
SLLS003F – OCTOBER 1985 – REVISED OCTOBER 2022
SN75179B Differential Driver and Receiver Pair
1 Features
2 Description
•
The SN75179B is a differential driver and
receiver pair designed for balanced transmission-line
applications and meets TIA/EIA-422-B, TIA/EIA-485A, and ITU Recommendation V.11. The device is
designed to improve the performance of full-duplex
data communications over long bus lines.
•
•
•
•
•
•
•
•
•
Meets or exceeds the requirements of
TIA/EIA-422-B, TIA/EIA-485-A, and ITU
Recommendation V.11
Bus voltage range: –7 V to 12 V
Positive- and negative-current limiting
Driver output capability: 60 mA Max
Driver thermal-shutdown protection
Receiver input impedance: 12 kΩ Min
Receiver input sensitivity: ±200 mV
Receiver input hysteresis: 50 mV Typ
Operates from single 5-V supply
Low power requirements
The SN75179B driver output provides limiting for
both positive and negative currents. The receiver
features high input impedance, input hysteresis for
increased noise immunity, and input sensitivity of
±200 mV over a common-mode input voltage range
of –7 V to 12 V. The driver provides thermal
shutdown for protection from line fault conditions.
Thermal shutdown is designed to occur at a junction
temperature of approximately 150°C. The SN75179B
is designed to drive current loads of up to 60 mA
maximum.
The SN75179B is characterized for operation from
0°C to 70°C.
Package Information
PART NUMBER
SN75179B
(1)
A.
This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
Logic Symbol
PACKAGE(1)
BODY SIZE (NOM)
D (SOIC)
4.9 mm x 3.91 mm
P (PDIP)
9.81 mm x 9.43 mm
PS (SOP)
6.2 mm x 5.3 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN75179B
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SLLS003F – OCTOBER 1985 – REVISED OCTOBER 2022
Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 Recommended Operating Conditions.........................4
5.3 Thermal Information....................................................4
5.4 Electrical Characteristics: Driver................................. 5
5.5 Switching Characteristics............................................5
5.6 Symbol Equivalent...................................................... 5
5.7 Electrical Characteristics: Receiver............................ 6
5.8 Switching Characteristics ...........................................6
5.9 Typical Characteristics................................................ 7
6 Parameter Measurement Information............................ 9
7 Detailed Description......................................................10
7.1 Functional Block Diagram......................................... 10
7.2 Device Functional Modes..........................................11
8 Device and Documentation Support............................12
8.1 Documentation Support............................................ 12
8.2 Receiving Notification of Documentation Updates....12
8.3 Support Resources................................................... 12
8.4 Trademarks............................................................... 12
8.5 Electrostatic Discharge Caution................................12
8.6 Glossary....................................................................12
9 Mechanical, Packaging, and Orderable Information.. 12
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (June 2008) to Revision F (October 2022)
Page
• Changed the data sheet format to the latest data sheet format..........................................................................1
• Changed the Thermal Information table............................................................................................................. 4
2
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4 Pin Configuration and Functions
Figure 4-1. D, PS, or P Package
Top View
Table 4-1. Pin Functions
PIN
NAME
NO.
TYPE(1)
DESCRIPTION
1
VCC
P
5V Voltage Supply
2
R
O
RS485 Logic Output
3
D
I
RS485 Logic Input
4
GND
G
Ground
5
Y
O
Non-Inverting RS485 Bus Output
6
Z
O
Inverted RS485 Bus Output
7
B
I
Inverted RS485 Bus Input
8
A
I
Non-Inverting RS485 Bus Input
(1)
I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
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5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
Supply voltage(2)
VCC
Voltage range at any bus terminal
VID
Differential input voltage (3)
Tstg
Storage temperature
(1)
(2)
(3)
–10
–65
MAX
UNIT
7
V
15
V
±25
V
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
All voltage values are with respect to network ground terminal.
Differential input voltage is measured at the noninverting input with respect to the corresponding inverting input.
5.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage
VIH
High-level input voltage
Driver
VIL
Low-level input voltage
Driver
VIC
Common-mode input voltage
VID
Differential input voltage,
IOH
High level output current
IOL
Low level output current
TA
Operating free-air temperature
(1)
MIN
NOM
MAX
UNIT
4.75
5
5.25
V
2
V
–7(1)
0.8
V
12
V
±12
V
Driver
–602
mA
Receiver
–400
µA
60
mA
8
mA
70
°C
Driver
Receiver
0
The algebraic convention, where the less positive (more negative) limit is designated minimum, is used in this data sheet for
common-mode input voltage and threshold voltage.
5.3 Thermal Information
THERMAL METRIC(1)
PDIP (P)
SOP (PS)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
116.7
109.5
84.3
RθJC(top)
Junction-to-case (top) thermal resistance
56.3
53.9
65.4
RθJB
Junction-to-board thermal resistance
63.4
65.7
62.1
ψJT
Junction-to-top characterization parameter
8.8
11.6
31.3
ψJB
Junction-to-board characterization parameter
62.6
64.5
60.4
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
(1)
4
SOIC (D)
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
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5.4 Electrical Characteristics: Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Input clamp voltage
II = –18 mA
VO
Output voltage
IO = 0
|VOD1|
Differential output voltage
IO = 0
|VOD2|
|VOD3|
Differential output voltage
Differential output voltage
MIN
RL = 100 Ω
See Figure 6-1
RL = 54 Ω
See Figure 6-1
See
TYP(1)
–1.5
V
0
6
V
1.5
6
V
V
2(2)
1.5
2.5
Δ|VOC|
Change in magnitude of common-mode output
voltage(3)
IO
Output current
VCC = 0
IIH
High-level input current
IIL
Low-level input current
IOS
Short circuit output current
ICC
Supply current (total package)
RL = 54 Ω or 100 Ω,
(4)
V
5
V
±0.2
V
3
See Figure 6-1
–1
V
±0.2
V
±100
µA
VIH = 2.4 V
20
µA
VIL = 0.4 V
–200
µA
VO = –7 V
–250
VO = VCC
250
VO = -7 V to 12 V
VO = 12 V
(1)
(2)
(3)
5
1.5
Δ|VOD| Change in magnitude of differential output voltage
Common mode output voltage
UNIT
1/2 VOD1
(4)
VOC
MAX
mA
250
No load
57
70
mA
All typical values are at VCC = 5 V and TA = 25°C.
The minimum VOD2 with 100-Ω load is either 1/2 VOD2 or 2 V, whichever is greater
Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level
to a low level.
See TIA/EIA-485-A, Figure 3.5, Test Termination Measurement 2.
5.5 Switching Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
td(OD)
Differential output delay time
RL = 54 Ω ,
See Figure 6-3
15
22
ns
tt(OD)
Differential output transition time
RL = 54 Ω ,
See Figure 6-3
20
30
ns
5.6 Symbol Equivalent
DATA-SHEET PARAMETER
VO
TIA/EIA-422-B
TIA/EIA-485-A
Voa, Vob
Voa, Vob
| VOD1 |
Vo
Vo
| VOD2 |
Vt(RL = 100 Ω)
Vt(RL = 54 Ω)
| VOD3 |
D | VOD |
VOC
D | VOC |
Vt (Test Termination Measurement 2)
|| Vt|– |Vtt |
|| Vt|– |V t| |
| Vos |
| Vos |
| Vos – Vos |
| Vos – V os |
IOS
|Isa|, | Isb|
IO
|Ixa|, | Ixb|
Iia, Iib
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5.7 Electrical Characteristics: Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
MIN TYP(1)
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VO = 2.7 V
IO = –0.4 mA
VIT-
Negative-going input threshold voltage
VO = 0.5 V
IO = 8 mA
Vhys|
Hysteresis voltage (VIT+ – VIT– )
VOH
High-level output voltage
VID = 200 mV
IOH = -400 µA
See Figure 6-2
VOL
Low-level output voltage
VID = -200 mV
IOL = 8 mA
See Figure 6-2
II
Line input current
rI
Input resistance
IOS
Short-circuit output current
IOS
Supply current (total package)
(1)
(2)
(3)
MAX UNIT
0.2
–0.2(2)
V
50
Other input at 0 V See (3)
mV
2.7
V
0.45
VI = 12 V
VI = –7 V
V
1
mA
–0.8
mA
12
kΩ
–15
No load
V
57
–85
mA
70
mA
All typical values are at VCC = 5 V and TA = 25°C.
The algebraic convention, where the less positive (more negative) limit is designated minimum, is used in this data sheet for
common-mode input voltage and threshold voltage levels only.
See TIA/EIA-422-B for exact conditions.
5.8 Switching Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
6
TEST CONDITIONS
tPLH
Propagation delay time, low- to high-level output
VID = –1.5 V to 1.5 V
tPHL
Propagation delay time, high- to low-level output
CL = 15 pF
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MIN
See Figure 6-4
TYP
MAX UNIT
19
35
ns
30
40
ns
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5.9 Typical Characteristics
Figure 5-1. Driver High-Level Output Voltage vs High-Level
Output Current
Figure 5-2. Driver Low-Level Output Voltage vs Low-Level
Output Current
Figure 5-3. Driver Differential Output Voltage vs Output Current
Figure 5-4. Receiver Output Voltage vs Differential Input Voltage
Figure 5-5. High-Level Output Voltage vs High-Level Output
Current
Figure 5-6. High-Level Output Voltage vs Free-Air Temperature
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5.9 Typical Characteristics (continued)
Figure 5-7. Receiver Low-Level Output Voltage vs Low-Level
Output Current
8
Figure 5-8. Receiver Low-Level Output Voltage vs Free-Air
Temperature
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6 Parameter Measurement Information
Figure 6-1. Driver VDD and VOC
Figure 6-2. Receiver VOH and VOL
A.
B.
The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, tr ≤ 6 ns, tf ≤ 6 ns, ZO =
50 Ω.
CL includes probe and jig capacitance.
Figure 6-3. Driver Test Circuit and Voltage Waveforms
A.
B.
The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, tr ≤ 6 ns, tf ≤ 6 ns, ZO =
50 Ω.
CL includes probe and jig capacitance.
Figure 6-4. Receiver Test Circuit and Voltage Waveforms
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7 Detailed Description
7.1 Functional Block Diagram
A.
Driver input: R(eq) = 3 kΩ NOMR(eq) = equivalent resistor
Figure 7-1. Equivalent of Driver Input
Figure 7-2. Typical of All Driver Outputs
Figure 7-3. Equivalent of Each Receiver Input
Figure 7-4. Typical of All Receiver Outputs
10
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7.2 Device Functional Modes
Table 7-1. Driver(1)
(1)
OUTPUTS
INPUT
D
Y
Z
H
H
L
L
L
H
H = high level, L = low level, ? = indeterminate
Table 7-2. Receiver(1)
(1)
DIFFERENTIAL INPUTS
A–B
OUTPUT
R
VID ≥ 0.2 V
H
–0.2 V < VID < 0.2 V
?
VID ≤ –0.2 V
L
Open
?
H = high level, L = low level, ? = indeterminate
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8 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
8.1 Documentation Support
8.1.1 Related Documentation
8.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
8.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
8.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
8.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
8.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12
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PACKAGE OPTION ADDENDUM
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18-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN75179BD
LIFEBUY
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
75179B
SN75179BDE4
LIFEBUY
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
75179B
SN75179BDR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
75179B
Samples
SN75179BDRG4
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
75179B
Samples
SN75179BP
ACTIVE
PDIP
P
8
50
RoHS & Green
NIPDAU
N / A for Pkg Type
0 to 70
SN75179BP
Samples
SN75179BPE4
ACTIVE
PDIP
P
8
50
RoHS & Green
NIPDAU
N / A for Pkg Type
0 to 70
SN75179BP
Samples
SN75179BPSR
ACTIVE
SO
PS
8
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
A179B
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of