SN65C3221, SN75C3221
SLLS351F – APRIL 2002 – REVISED JULY 2021
3-V to 5.5-V Single-Channel RS-232 Compatible Line Driver and Receiver
1 Features
•
•
•
•
•
•
•
Operate with 3-V to 5.5-V VCC supply
Operate up to 1 Mbit/s
Low standby current : 1 μA typical
External capacitors : 4 x 0.1 μF
Accepts 5-V logic input with 3.3-V supply
RS-232 bus-pin ESD protection exceeds ±15 kV
using human-body model (HBM)
Auto-powerdown feature automatically disables
drivers for power savings
2 Applications
•
•
•
•
•
•
•
•
•
Industrial PCs
Wired networking
Data center and enterprise computing
Battery-powered systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-held equipment
3 Description
The SN65C3221 and SN75C3221 consist of one
line driver, one line receiver, and a dual chargepump circuit with ±15-kV ESD protection pin to
pin (serial-port connection pins, including GND).
These devices providethe electrical interface between
an asynchronous communication controller and the
serial-port connector. The charge pump and four small
external capacitors allow operation from a single 3V to 5.5-V supply. These devices operate at data
signaling rates up to 1 Mbit/s and a driver output slew
rate of 24 V/μs to 150 V/μs.
Flexible control options for power management are
available when the serial port is inactive. The autopowerdown feature functions when FORCEON is
low and FORCEOFF is high. During this mode of
operation, if the devices do not sense a valid RS-232
signal on the receiver input, the driver output is
disabled. If FORCEOFF is set low and EN is high,
both the driver and receiver are shut off, and the
supply current is reduced to 1 μA. Disconnecting
the serial port or turning off the peripheral drivers
causes the auto-powerdown condition to occur. Autopowerdown can be disabled when FORCEON and
FORCEOFF are high. With auto-powerdown enabled,
the device is activated automatically when a valid
signal is applied to the receiver input. The INVALID
output notifies the user if an RS-232 signal is present
at the receiver input. INVALID is high (valid data) if
the receiver input voltage is greater than 2.7 V or less
than −2.7 V, or has been between −0.3 V and 0.3 V
for less than 30 μs. INVALID is low (invalid data) if the
receiver input voltage is between −0.3 V and 0.3 V for
more than 30 μs. Refer to Figure 7-5 for receiver input
levels.
Device Information
PART NUMBER
SNx5C3221
(1)
PACKAGE(1)
BODY SIZE (NOM)
SSOP (DB) 16
6.20 mm x 5.30 mm
TSSOP (PW) 16
10.3 mm x 7.50 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN65C3221, SN75C3221
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SLLS351F – APRIL 2002 – REVISED JULY 2021
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions(1) .................... 4
6.4 Electrical Characteristics.............................................5
6.5 Electrical Characteristics - Driver................................6
6.6 Switching Characteristics - Driver............................... 6
6.7 Electrical Characteristics - Receiver........................... 6
6.8 Switching Characteristics - Receiver.......................... 7
6.9 Electrical Characteristics - Auto-Powerdown.............. 7
6.10 Switching Characteristics - Auto-Powerdown........... 7
7 Parameter Measurement Information............................ 8
8 Detailed Description...................................................... 11
8.1 Device Functional Modes..........................................11
9 Application and Implementation.................................. 12
9.1 Application Information............................................. 12
10 Device and Documentation Support..........................13
10.1 Receiving Notification of Documentation Updates..13
10.2 Support Resources................................................. 13
10.3 Trademarks............................................................. 13
10.4 Electrostatic Discharge Caution..............................13
10.5 Glossary..................................................................13
11 Mechanical, Packaging, and Orderable
Information.................................................................... 13
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (October 2004) to Revision F (July 2021)
Page
• Changed the Applications list............................................................................................................................. 1
• Deleted the Oderaing Information table..............................................................................................................1
• Added the Device Information table....................................................................................................................1
• Removed the thermal parameters from Absolute Maximum Ratings table and moved them to Thermal
Information table................................................................................................................................................. 4
• Added ESD Ratings table. Moved the driver and receiver ESD specifications to this table............................... 4
• Changed the thermal parameters for PW package of SN65C3221 and DB package of SN75C3221. Added
additional thermal parameters for both the packages in the Thermal Information table.....................................5
• Added the Detailed Description section............................................................................................................ 11
2
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5 Pin Configuration and Functions
Figure 5-1. DB or PW Package
Top View
Table 5-1. Pin Functions
PIN
NAME
DESCRIPTION
NO.
I/O
C1+
2
—
Positive terminals of the voltage-doubler charge-pump capacitors
C2+
5
C1–
4
—
Negative terminals of the voltage-doubler charge-pump capacitors
C2–
6
DIN
11
I
Driver input
DOUT
13
O
RS-232 driver output
EN
1
I
Low input enables receiver ROUT output. High input sets ROUT to high impedance.
FORCEOFF
16
I
Automatic power-down control input
FORCEON
12
I
Automatic power-down control input
GND
14
—
Ground
INVALID
10
O
Invalid output pin. Output low when all RIN inputs are unpowered.
RIN
8
I
RS-232 receiver input
ROUT
9
O
Receiver output
VCC
15
—
3-V to 5.5-V supply voltage
V+
3
O
5.5-V supply generated by the charge pump
V–
7
O
–5.5-V supply generated by the charge pump
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage range
range(2)
V+
Positive output supply voltage
V–
Negative output supply voltage range(2)
V+ – V –
Supply voltage
6
V
–0.3
7
V
–7
0.3
V
13
V
Driver (FORCEOFF, FORCEON, EN)
–0.3
6
Receiver
–25
25
–13.2
13.2
–0.3
VCC + 0.3
Input voltage range
VO
Output voltage range
TJ
Operating virtual junction temperature
Tstg
Storage temperature
(2)
MAX
difference(2)
VI
(1)
MIN
–0.3
Driver
Receiver (INVALID)
–65
UNIT
V
V
150
℃
150
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Section 6.3 is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal GND.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-0011
V (ESD)
Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22C1012
RIN and
DOUT
Pins
±15000
All other
pins
±3000
All pins
±1500
UNIT
V
6.3 Recommended Operating Conditions(1)
(see Figure 9-1)
VCC = 3.3 V
Supply voltage
VIH
Driver and control high-level input voltage DIN, FORCEOFF, FORCEON, EN
VIL
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON, EN
VI
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
Operating free-air temperature
(1)
4
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
2
UNIT
V
V
2.4
0.8
V
0
5.5
V
−25
25
V
SN65C3221
−40
85
SN75C3221
0
70
°C
Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
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6.3.1 Thermal Information
SN65C3221
THERMAL
METRIC1
SN75C3221
DB (SSOP)
PW (TSSOP)
DB (SSOP)
PW (TSSOP)
16 PINS
16 PINS
16 PINS
16 PINS
UNIT
R θJA
Junction-to-ambient thermal
resistance
82.0
110.9
105.8
108.0
°C/W
R θJC(top)
Junction-to-case (top) thermal
resistance
45.7
41.7
51.9
41.1
°C/W
R θJB
Junction-to-board thermal
resistance
44.4
57.2
57.6
51.4
°C/W
ψ JT
Junction-to-top characterization
parameter
11.0
4.2
14.1
3.9
°C/W
ψ JB
Junction-to-board
characterization parameter
43.8
56.6
56.8
50.9
°C/W
6.4 Electrical Characteristics
over recommended operating free-air temperature ranges of supply voltage and operating free-air temperature (unless
otherwise noted)(2) (see Figure 9-1)
PARAMETER
II
ICC
(1)
(2)
TEST CONDITIONS
Input leakage current FORCEOFF, FORCEON, EN
Supply current
(TA = 25°C)
MIN
TYP(1)
MAX
±0.01
±1
μA
0.3
1
mA
Auto-powerdown disabled
No load,
FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown enabled
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
1
10
UNIT
μA
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
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6.5 Electrical Characteristics - Driver
over recommended ranges of supply voltage and operating free-air temperature range (unless otherwise noted)(3) (see
Figure 9-1)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
DOUT at RL = 3 kΩ to
GND,
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to
GND,
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI at GND
IOS
Short-circuit output
current(2)
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
ro
Output resistance
VCC, V+, and V− = 0 V,
VO = ±2 V
Ioff
Output leakage current
FORCEOFF = GND
(1)
(2)
(3)
MIN
TYP(1)
MAX
UNIT
DIN = GND
5
5.4
V
DIN = VCC
−5
−5.4
V
±0.01
300
±1
μA
±0.01
±1
μA
±35
±60
±35
±90
mA
10M
Ω
VO = ±12 V,
VCC = 3 V to 3.6 V
±25
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
μA
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
6.6 Switching Characteristics - Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) (see Figure 9-1)
PARAMETER
TEST CONDITIONS
MIN
CL = 1000 pF
Maximum data rate
(see Figure 7-1)
RL = 3 kΩ
MAX
UNIT
250
CL = 250 pF,
VCC = 3 V to 4.5 V
1000
1000
CL = 1000 pF,
VCC = 4.5 V to 5.5 V
tsk(p)
Pulse skew(2)
CL = 150 pF to 2500 pF
RL = 3 kΩ to 7 kΩ,
See Figure 7-2
SR(tr)
Slew rate,
transition region
(see Figure 7-1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
CL = 150 pF to 1000 pF
(1)
(2)
(3)
TYP(1)
kbit/s
100
ns
18
150
V/μs
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
6.7 Electrical Characteristics - Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Figure 9-1)
TEST
CONDITIONS
PARAMETER
VOH
High-level output voltage
IOH = −1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
6
TYP(1)
VCC − 0.6 V
VCC − 0.1 V
MAX
0.4
1.6
2.4
VCC = 5 V
1.9
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+− VIT–)
Ioff
Output leakage current
FORCEOFF = 0 V
ri
Input resistance
VI = ±3 V to ±25 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
V
V
V
0.5
3
UNIT
V
VCC = 3.3 V
VIT+
(1)
(2)
MIN
V
±0.05
±10
μA
5
7
kΩ
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
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6.8 Switching Characteristics - Receiver
over recommended ranges of supply voltage and operating free-air temperature range (unless otherwise noted)(3)
PARAMETER
TEST CONDITIONS
MIN
TYP(1)
MAX UNIT
tPLH
Propagation delay time, low- to
CL = 150 pF,
high-level output
See Figure 7-3
150
ns
tPHL
Propagation delay time, high- to
CL = 150 pF,
low-level output
See Figure 7-3
150
ns
ten
Output enable time
CL = 150 pF,
RL = 3 kΩ,
See Figure 7-4
200
ns
tdis
Output disable time
CL = 150 pF,
RL = 3 kΩ,
See Figure 7-4
200
ns
tsk(p)
Pulse skew(2)
See Figure 7-3
50
ns
(1)
(2)
(3)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
6.9 Electrical Characteristics - Auto-Powerdown
over recommended ranges of supply voltage and operating free-air temperature range (unless otherwise noted) (see Figure
7-5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND, FORCEOFF = VCC
VT−(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND, FORCEOFF = VCC
−2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND, FORCEOFF = VCC
−0.3
VOH
INVALID high-level output voltage
IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL= 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
2.7
UNIT
V
V
0.3
VCC−0.6
V
V
0.4
V
6.10 Switching Characteristics - Auto-Powerdown
over operating free-air temperature range (unless otherwise noted) (see Figure 7-5)
PARAMETER
MIN
TYP(1)
MAX
UNIT
tvalid
Propagation delay time, low- to high-level output
1
µs
tinvalid
Propagation delay time, high- to low-level output
30
µs
ten
Supply enable time
100
µs
(1)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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7 Parameter Measurement Information
Figure 7-1. Driver Slew Rate
Figure 7-2. Driver Pulse Skew
Figure 7-3. Receiver Propagation Delay Times
8
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Figure 7-4. Receiver Enable and Disable Times
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Figure 7-5. INVALID Propagation Delay Times and Driver Enabling Time
10
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8 Detailed Description
8.1 Device Functional Modes
Table 8-1. Each Driver(1)
INPUTS
(1)
OUTPUT
DOUT
DRIVER STATUS
X
Z
Powered off
Normal operation with autopowerdown disabled
DIN
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
X
X
L
L
H
H
X
H
H
H
H
X
L
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with autopowerdown enabled
Powered off by autopowerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
Table 8-2. Each Receiver(1)
INPUTS
(1)
OUTPUT
ROUT
RIN
EN
VALID RIN
RS-232 LEVEL
L
L
X
H
L
X
L
X
H
X
Z
Open
L
No
H
H
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = disconnected input or connected driver off.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
† C3 can be connected to VCC or GND
Resistor values shown are nominal.
Figure 9-1. Typical Operating Circuit and Capacitor Values
Table 9-1. VCC vs Capacitator Values
12
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
0.1 μF
0.1 μF
5 V ± 0.5 V
0.047 μF
0.33 μF
3 V to 5.5 V
0.1 μF
0.47 μF
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10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
10.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
SN65C3221DB
ACTIVE
SSOP
DB
16
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3221
Samples
SN65C3221DBR
ACTIVE
SSOP
DB
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3221
Samples
SN65C3221PWR
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
CB3221
Samples
SN75C3221DBR
ACTIVE
SSOP
DB
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
CA3221
Samples
SN75C3221DW
PREVIEW
SOIC
DW
16
40
TBD
Call TI
Call TI
0 to 70
SN75C3221PWR
ACTIVE
TSSOP
PW
16
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
CA3221
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of