SN75C3221PWG4

SN65C3221, SN75C3221 SLLS351F – APRIL 2002 – REVISED JULY 2021 3-V to 5.5-V Single-Channel RS-232 Compatible Line Driver and Receiver 1 Features • • • • • • • Operate with 3-V to 5.5-V VCC supply Operate up to 1 Mbit/s Low standby current : 1 μA typical External capacitors : 4 x 0.1 μF Accepts 5-V logic input with 3.3-V supply RS-232 bus-pin ESD protection exceeds ±15 kV using human-body model (HBM) Auto-powerdown feature automatically disables drivers for power savings 2 Applications • • • • • • • • • Industrial PCs Wired networking Data center and enterprise computing Battery-powered systems PDAs Notebooks Laptops Palmtop PCs Hand-held equipment 3 Description The SN65C3221 and SN75C3221 consist of one line driver, one line receiver, and a dual chargepump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). These devices providethe electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3V to 5.5-V supply. These devices operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/μs to 150 V/μs. Flexible control options for power management are available when the serial port is inactive. The autopowerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the devices do not sense a valid RS-232 signal on the receiver input, the driver output is disabled. If FORCEOFF is set low and EN is high, both the driver and receiver are shut off, and the supply current is reduced to 1 μA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur. Autopowerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high (valid data) if the receiver input voltage is greater than 2.7 V or less than −2.7 V, or has been between −0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if the receiver input voltage is between −0.3 V and 0.3 V for more than 30 μs. Refer to Figure 7-5 for receiver input levels. Device Information PART NUMBER SNx5C3221 (1) PACKAGE(1) BODY SIZE (NOM) SSOP (DB) 16 6.20 mm x 5.30 mm TSSOP (PW) 16 10.3 mm x 7.50 mm For all available packages, see the orderable addendum at the end of the data sheet. Logic Diagram (Positive Logic) An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions(1) .................... 4 6.4 Electrical Characteristics.............................................5 6.5 Electrical Characteristics - Driver................................6 6.6 Switching Characteristics - Driver............................... 6 6.7 Electrical Characteristics - Receiver........................... 6 6.8 Switching Characteristics - Receiver.......................... 7 6.9 Electrical Characteristics - Auto-Powerdown.............. 7 6.10 Switching Characteristics - Auto-Powerdown........... 7 7 Parameter Measurement Information............................ 8 8 Detailed Description...................................................... 11 8.1 Device Functional Modes..........................................11 9 Application and Implementation.................................. 12 9.1 Application Information............................................. 12 10 Device and Documentation Support..........................13 10.1 Receiving Notification of Documentation Updates..13 10.2 Support Resources................................................. 13 10.3 Trademarks............................................................. 13 10.4 Electrostatic Discharge Caution..............................13 10.5 Glossary..................................................................13 11 Mechanical, Packaging, and Orderable Information.................................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (October 2004) to Revision F (July 2021) Page • Changed the Applications list............................................................................................................................. 1 • Deleted the Oderaing Information table..............................................................................................................1 • Added the Device Information table....................................................................................................................1 • Removed the thermal parameters from Absolute Maximum Ratings table and moved them to Thermal Information table................................................................................................................................................. 4 • Added ESD Ratings table. Moved the driver and receiver ESD specifications to this table............................... 4 • Changed the thermal parameters for PW package of SN65C3221 and DB package of SN75C3221. Added additional thermal parameters for both the packages in the Thermal Information table.....................................5 • Added the Detailed Description section............................................................................................................ 11 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 5 Pin Configuration and Functions Figure 5-1. DB or PW Package Top View Table 5-1. Pin Functions PIN NAME DESCRIPTION NO. I/O C1+ 2 — Positive terminals of the voltage-doubler charge-pump capacitors C2+ 5 C1– 4 — Negative terminals of the voltage-doubler charge-pump capacitors C2– 6 DIN 11 I Driver input DOUT 13 O RS-232 driver output EN 1 I Low input enables receiver ROUT output. High input sets ROUT to high impedance. FORCEOFF 16 I Automatic power-down control input FORCEON 12 I Automatic power-down control input GND 14 — Ground INVALID 10 O Invalid output pin. Output low when all RIN inputs are unpowered. RIN 8 I RS-232 receiver input ROUT 9 O Receiver output VCC 15 — 3-V to 5.5-V supply voltage V+ 3 O 5.5-V supply generated by the charge pump V– 7 O –5.5-V supply generated by the charge pump Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 3 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage range range(2) V+ Positive output supply voltage V– Negative output supply voltage range(2) V+ – V – Supply voltage 6 V –0.3 7 V –7 0.3 V 13 V Driver (FORCEOFF, FORCEON, EN) –0.3 6 Receiver –25 25 –13.2 13.2 –0.3 VCC + 0.3 Input voltage range VO Output voltage range TJ Operating virtual junction temperature Tstg Storage temperature (2) MAX difference(2) VI (1) MIN –0.3 Driver Receiver (INVALID) –65 UNIT V V 150 ℃ 150 °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Section 6.3 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal GND. 6.2 ESD Ratings VALUE Human-body model (HBM), per ANSI/ESDA/JEDEC JS-0011 V (ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22C1012 RIN and DOUT Pins ±15000 All other pins ±3000 All pins ±1500 UNIT V 6.3 Recommended Operating Conditions(1) (see Figure 9-1) VCC = 3.3 V Supply voltage VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON, EN VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON, EN VI Driver and control input voltage DIN, FORCEOFF, FORCEON VI Receiver input voltage TA Operating free-air temperature (1) 4 VCC = 5 V VCC = 3.3 V VCC = 5 V MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 2 UNIT V V 2.4 0.8 V 0 5.5 V −25 25 V SN65C3221 −40 85 SN75C3221 0 70 °C Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 6.3.1 Thermal Information SN65C3221 THERMAL METRIC1 SN75C3221 DB (SSOP) PW (TSSOP) DB (SSOP) PW (TSSOP) 16 PINS 16 PINS 16 PINS 16 PINS UNIT R θJA Junction-to-ambient thermal resistance 82.0 110.9 105.8 108.0 °C/W R θJC(top) Junction-to-case (top) thermal resistance 45.7 41.7 51.9 41.1 °C/W R θJB Junction-to-board thermal resistance 44.4 57.2 57.6 51.4 °C/W ψ JT Junction-to-top characterization parameter 11.0 4.2 14.1 3.9 °C/W ψ JB Junction-to-board characterization parameter 43.8 56.6 56.8 50.9 °C/W 6.4 Electrical Characteristics over recommended operating free-air temperature ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Figure 9-1) PARAMETER II ICC (1) (2) TEST CONDITIONS Input leakage current FORCEOFF, FORCEON, EN Supply current (TA = 25°C) MIN TYP(1) MAX ±0.01 ±1 μA 0.3 1 mA Auto-powerdown disabled No load, FORCEOFF and FORCEON at VCC Powered off No load, FORCEOFF at GND 1 10 Auto-powerdown enabled No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded 1 10 UNIT μA All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 5 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 6.5 Electrical Characteristics - Driver over recommended ranges of supply voltage and operating free-air temperature range (unless otherwise noted)(3) (see Figure 9-1) PARAMETER TEST CONDITIONS VOH High-level output voltage DOUT at RL = 3 kΩ to GND, VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS Short-circuit output current(2) VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V ro Output resistance VCC, V+, and V− = 0 V, VO = ±2 V Ioff Output leakage current FORCEOFF = GND (1) (2) (3) MIN TYP(1) MAX UNIT DIN = GND 5 5.4 V DIN = VCC −5 −5.4 V ±0.01 300 ±1 μA ±0.01 ±1 μA ±35 ±60 ±35 ±90 mA 10M Ω VO = ±12 V, VCC = 3 V to 3.6 V ±25 VO = ±10 V, VCC = 4.5 V to 5.5 V ±25 μA All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. 6.6 Switching Characteristics - Driver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) (see Figure 9-1) PARAMETER TEST CONDITIONS MIN CL = 1000 pF Maximum data rate (see Figure 7-1) RL = 3 kΩ MAX UNIT 250 CL = 250 pF, VCC = 3 V to 4.5 V 1000 1000 CL = 1000 pF, VCC = 4.5 V to 5.5 V tsk(p) Pulse skew(2) CL = 150 pF to 2500 pF RL = 3 kΩ to 7 kΩ, See Figure 7-2 SR(tr) Slew rate, transition region (see Figure 7-1) VCC = 3.3 V, RL = 3 kΩ to 7 kΩ CL = 150 pF to 1000 pF (1) (2) (3) TYP(1) kbit/s 100 ns 18 150 V/μs All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. 6.7 Electrical Characteristics - Receiver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Figure 9-1) TEST CONDITIONS PARAMETER VOH High-level output voltage IOH = −1 mA VOL Low-level output voltage IOL = 1.6 mA 6 TYP(1) VCC − 0.6 V VCC − 0.1 V MAX 0.4 1.6 2.4 VCC = 5 V 1.9 2.4 Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+− VIT–) Ioff Output leakage current FORCEOFF = 0 V ri Input resistance VI = ±3 V to ±25 V VCC = 3.3 V 0.6 1.1 VCC = 5 V 0.8 1.4 V V V 0.5 3 UNIT V VCC = 3.3 V VIT+ (1) (2) MIN V ±0.05 ±10 μA 5 7 kΩ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 6.8 Switching Characteristics - Receiver over recommended ranges of supply voltage and operating free-air temperature range (unless otherwise noted)(3) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT tPLH Propagation delay time, low- to CL = 150 pF, high-level output See Figure 7-3 150 ns tPHL Propagation delay time, high- to CL = 150 pF, low-level output See Figure 7-3 150 ns ten Output enable time CL = 150 pF, RL = 3 kΩ, See Figure 7-4 200 ns tdis Output disable time CL = 150 pF, RL = 3 kΩ, See Figure 7-4 200 ns tsk(p) Pulse skew(2) See Figure 7-3 50 ns (1) (2) (3) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. Test conditions are C1−C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2−C4 = 0.33 μF at VCC = 5 V ± 0.5 V. 6.9 Electrical Characteristics - Auto-Powerdown over recommended ranges of supply voltage and operating free-air temperature range (unless otherwise noted) (see Figure 7-5) PARAMETER TEST CONDITIONS MIN VT+(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC VT−(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC −2.7 VT(invalid) Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC −0.3 VOH INVALID high-level output voltage IOH = −1 mA, FORCEON = GND, FORCEOFF = VCC VOL INVALID low-level output voltage IOL= 1.6 mA, FORCEON = GND, FORCEOFF = VCC MAX 2.7 UNIT V V 0.3 VCC−0.6 V V 0.4 V 6.10 Switching Characteristics - Auto-Powerdown over operating free-air temperature range (unless otherwise noted) (see Figure 7-5) PARAMETER MIN TYP(1) MAX UNIT tvalid Propagation delay time, low- to high-level output 1 µs tinvalid Propagation delay time, high- to low-level output 30 µs ten Supply enable time 100 µs (1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 7 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 7 Parameter Measurement Information Figure 7-1. Driver Slew Rate Figure 7-2. Driver Pulse Skew Figure 7-3. Receiver Propagation Delay Times 8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 Figure 7-4. Receiver Enable and Disable Times Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 9 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 Figure 7-5. INVALID Propagation Delay Times and Driver Enabling Time 10 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 8 Detailed Description 8.1 Device Functional Modes Table 8-1. Each Driver(1) INPUTS (1) OUTPUT DOUT DRIVER STATUS X Z Powered off Normal operation with autopowerdown disabled DIN FORCEON FORCEOFF VALID RIN RS-232 LEVEL X X L L H H X H H H H X L L L H Yes H H L H Yes L L L H No Z H L H No Z Normal operation with autopowerdown enabled Powered off by autopowerdown feature H = high level, L = low level, X = irrelevant, Z = high impedance Table 8-2. Each Receiver(1) INPUTS (1) OUTPUT ROUT RIN EN VALID RIN RS-232 LEVEL L L X H L X L X H X Z Open L No H H H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = disconnected input or connected driver off. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 11 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Information † C3 can be connected to VCC or GND Resistor values shown are nominal. Figure 9-1. Typical Operating Circuit and Capacitor Values Table 9-1. VCC vs Capacitator Values 12 VCC C1 C2, C3, and C4 3.3 V ± 0.3 V 0.1 μF 0.1 μF 5 V ± 0.5 V 0.047 μF 0.33 μF 3 V to 5.5 V 0.1 μF 0.47 μF Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 SN65C3221, SN75C3221 www.ti.com SLLS351F – APRIL 2002 – REVISED JULY 2021 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN65C3221 SN75C3221 13 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN65C3221DB ACTIVE SSOP DB 16 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CB3221 Samples SN65C3221DBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CB3221 Samples SN65C3221PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CB3221 Samples SN75C3221DBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 CA3221 Samples SN75C3221DW PREVIEW SOIC DW 16 40 TBD Call TI Call TI 0 to 70 SN75C3221PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 CA3221 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of