SN75LBC179D

SN75LBC179, SN65LBC179, SN65LBC179Q SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 Low-Power Differential Line Driver and Receiver Pairs 1 Features • • • • • • • • Designed for high-speed multipoint data transmission over long cables Operates with pulse widths as low as 30 ns Low supply current: 5 mA max Meets or exceeds the standard requirementsof ANSI RS-485 and ISO 8482:1987(E) Common-mode voltage range of − 7 V to 12 V Positive-and negative-output current limiting Driver thermal shutdown protection Pin compatible with the SN75179B 2 Description The SN65LBC179, SN65LBC179Q, and SN75LBC179 differential driver and receiver pairs are monolithic integrated circuits designed for bidirectional data communication over long cables that take on the characteristics of transmission lines. The devices are balanced, or differential, voltage mode devices that meet or exceed the requirements of industry standards ANSIRS-485 and ISO 8482:1987(E). Both devices are designed using TI’s proprietary LinBiCMOS™ with the low power consumption of CMOS and the precision and robustness of bipolar transistors in the same circuit. The SN65LBC179, SN65LBC179Q, and SN75LBC179 combine a differential line driver and differential line receiver and operate from a single 5-V supply. The driver differential outputs and the receiver differential inputs are connected to separate terminals for full-duplex operation and are designed to present minimum loading to the bus when powered off (VCC = 0). These parts feature a wide commonmode voltage range making them suitable for point-topoint or multipoint data bus applications. The devices also provide positive and negative-current limiting and thermal shutdown for protection from line fault conditions. The line driver shuts down at a junction temperature of approximately 172°C. The SN65LBC179, SN65LBC179Q, and SN75LBC179 are available in the 8-pin dual-in-line and small-outline packages. The SN75LBC179 is characterized for operation over the commercial temperature range of 0°C to 70°C. The SN65LBC179 is characterized over the industrial temperature range of −40°C to 85°C. The SN65LBC179Q is characterized over the extended industrial or automotive temperature range of −40°C to 125°C. Package Information PART NUMBER SN75179B (1) A. This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Logic Symbol PACKAGE(1) BODY SIZE (NOM) D (SOIC) 4.9 mm x 3.91 mm P (PDIP) 9.81 mm x 6.35 mm For all available packages, see the orderable addendum at the end of the data sheet. Logic Diagram (Positive Logic) An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 5.2 Recommended Operating Conditions.........................4 5.3 Thermal Information....................................................5 5.4 Dissipation Rating Table............................................. 5 5.5 Electrical Characteristics - Driver................................6 5.6 Switching Characteristics - Driver............................... 6 5.7 Electrical Characteristics - Receiver........................... 7 5.8 Switching Characteristics - Receiver.......................... 7 5.9 Typical Characteristics................................................ 8 6 Parameter Measurement Information.......................... 10 7 Detailed Description......................................................12 7.1 Functional Block Diagram......................................... 12 7.2 Device Functional Modes..........................................12 7.3 Thermal Characteristics of IC Packages...................13 8 Device and Documentation Support............................15 8.1 Device Support......................................................... 15 8.2 Documentation Support............................................ 15 8.3 Receiving Notification of Documentation Updates....15 8.4 Support Resources................................................... 15 8.5 Trademarks............................................................... 15 8.6 Electrostatic Discharge Caution................................15 8.7 Glossary....................................................................15 9 Mechanical, Packaging, and Orderable Information.. 15 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (April 2006) to Revision G (October 2022) Page • Changed the data sheet format to the latest data sheet format..........................................................................1 • Added the Thermal Information table................................................................................................................. 5 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 4 Pin Configuration and Functions Figure 4-1. D or P Package (Top View) Table 4-1. Pin Functions PIN NAME NO. TYPE(1) DESCRIPTION 1 VCC P 5 V Voltage Supply 2 R O RS485 Logic Output 3 D I RS485 Logic Input 4 GND G Ground 5 Y O Non-Inverting RS485 Bus Output 6 Z O Inverted RS485 Bus Output 7 B I Inverted RS485 Bus Input 8 A I Non-Inverting RS485 Bus Input (1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power. Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q Submit Document Feedback 3 SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 5 Specifications 5.1 Absolute Maximum Ratings See note (1) VCC Supply voltage range Voltage range at A, B, Y, or Z(2) Voltage range at D or R(2) IO MIN MAX -0.3 7 V -10 15 V -0.3 VCC + 0.5 V Receiver output current UNIT ±10 Continuous total power dissipation(3) mA Internally limited P(AVG) Average power dissipation RL = 54 Ω, input to D is 10 Mbps 50% duty cycle square wave, VCC = 5.25 V, TJ = 130°C 330 mW TSD Thermal shutdown junction temperature 165 °C Total power dissipation (1) (2) (3) See Section 5.4 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. The maximum operating junction temperature is internally limited. Uses the dissipation rating table to operate below this temperature. 5.2 Recommended Operating Conditions VCC Supply voltage VIH High-level input voltage D VIL Low-level input voltage D VID Differential input voltage VO, VI, or VIC Voltage at any bus terminal (separately or common-mode) IOH High-level output current IOL Low-level output current TJ Junction temperature TA Operating free-air temperature A, B, Y, or Z 4 NOM MAX UNIT 5 5.25 V 2 V 0.8 V −6(1) 6 V −7 12 V Y or Z −60 R −8 Y or Z 60 R 8 140 SN65LBC179 −40 85 SN65LBC179Q −40 125 0 70 SN75LBC179 (1) MIN 4.75 mA mA °C °C The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this data sheet for differential input voltage, voltage at any bus terminal (separately or common mode), operating temperature, input threshold voltage, and common-mode output voltage. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 5.3 Thermal Information THERMAL METRIC(1) D (SOIC) P (PDIP) 8 Pins 8 Pins UNIT R θJA Junction-to-ambient thermal resistance 116.7 65.6.4 °C/W R θJC(top) Junction-to-case (top) thermal resistance 63.4 54.6 °C/W R θJB Junction-to-board thermal resistance 56.3 42.1 °C/W ψ JT Junction-to-top characterization parameter 8.8 22.9 °C/W ψ JB Junction-to-board characterization parameter 62.6 41.6 °C/W R θJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W (1) See TI application note literature number SZZA003, Package Thermal Characterization Methodologies, for an explanation of this parameter. 5.4 Dissipation Rating Table (1) (2) PACKAGE THERMAL MODEL D Low K(1) P K(2) High TA < 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING 526 mW 5.0 mW/°C 301 mW 226 mW 882 mW 8.4 mW/°C 504 mW 378 mW 840 mW 8.0 mW/°C 480 mW 360 mW In accordance with the low effective thermal conductivity metric definitions of EIA/JESD 51−3. In accordance with the high effective thermal conductivity metric definitions of EIA/JESD 51−7. Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q Submit Document Feedback 5 SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 5.5 Electrical Characteristics - Driver over recommended operating conditions (unless otherwise noted) PARAMETER VIK TEST CONDITIONS Input clamp voltage Differential output voltage(2) RL = 60 Ω See Figure 6-2 V 5 SN75LBC179 1.5 2.2 5 SN65LBC179, SN65LBC179Q 1.1 2.2 5 SN75LBC179 1.5 2.2 5 Common-mode output voltage Δ|VOC| Change in magnitude of commonmode output voltage(3) RL = 54 Ω See Figure 6-1 IO Output current with power off VCC = 0, VO = − 7 V to 12 V IIH High-level input current IIL Low-level input current IOS Short-circuit output current −7 V ≤ VO ≤ 12 V (3) −1.5 2.2 VOC (1) (2) UNIT 1.1 Change in magnitude of differential output voltage(3) Supply current MAX SN65LBC179, SN65LBC179Q Δ|VOD| ICC TYP(1) II= − 18 mA RL = 54 Ω See Figure 6-1 |VOD| MIN See Figure 6-1 and Figure 6-2 V ±0.2 V 3 V ±0.2 V ±100 μA VI = 2.4 V −100 μA VI = 0.4 V −100 μA ±250 mA 1 No load 2.5 SN65LBC179, SN75LBC179 4.2 5 mA SN65LBC179Q 4.2 7 mA All typical values are at VCC = 5 V and TA = 25°C. The minimum VOD specification of the SN65179 may not fully comply with ANSI RS-485 at operating temperatures below 0°C. System designers should take the possibly lower output signal into account in determining the maximum signal transmission distance. Δ|VOD| and Δ|VOC| are the changes in the steady-state magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. 5.6 Switching Characteristics - Driver VCC = 5 V, TA = 25°C PARAMETER 6 TEST CONDITIONS td(OD) Differential-output delay time tt(OD) Differential transition time Submit Document Feedback RL = 54 Ω See Figure 6-3 MIN MAX 7 18 UNIT ns 5 20 ns Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 5.7 Electrical Characteristics - Receiver over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX VIT+ Positive-going input threshold voltage IO = − 8 mA VIT− Negative-going input threshold voltage IO = 8 mA Vhys Hysteresis voltage (VIT+ − VIT−) VOH High-level output voltage VID = 200 mV, IOH = − 8 mA VOL Low-level output voltage VID = − 200 mV, IOL = 8 mA 0.3 0.5 VI = 12 V, Other inputs at 0 V, SN65LBC179, SN75LBC179 0.7 1 mA VCC = 5 V SN65LBC179Q 0.7 1.2 mA VI = 12 V, Other inputs at 0 V, SN65LBC179, SN75LBC179 0.8 1 mA VCC = 0 V SN65LBC179Q 0.8 1.2 mA VI = − 7 V, Other inputs at 0 V, SN65LBC179, SN75LBC179 −0.5 −0.8 mA VCC = 5 V SN65LBC179Q −0.5 −1.0 mA VI = − 7 V, Other inputs at 0 V, SN65LBC179, SN75LBC179 −0.5 −0.8 mA VCC = 0 V SN65LBC179Q −0.5 −1.0 mA MAX UNIT II Bus input current 0.2 UNIT −0.2 3.5 V V 45 mV 4.5 V V 5.8 Switching Characteristics - Receiver VCC = 5 V, TA = 25°C PARAMETER tPHL TEST CONDITIONS Propagation delay time, high- to low-level output tPLH Propagation delay time, low- to high-level output tsk(p) Pulse skew (|tPHL − tPLH| ) tt Transition time MIN TYP 15 30 ns 15 30 ns 3 6 ns 3 5 ns VID = −1.5 V to 1.5 V, See Figure 6-4 See Figure 6-4 Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q Submit Document Feedback 7 SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 5.9 Typical Characteristics 8 Figure 5-1. Driver High-Level Output Voltage vs High-Level Output Current Figure 5-2. Driver Low-Level Output Voltage vs Low-Level Output Current Figure 5-3. Driver Differential Output Voltage vs Output Current Figure 5-4. Driver Differential Output Voltage vs Free-Air Temperature Figure 5-5. Driver Differential Delay Time vs Free-Air Temperature Figure 5-6. Receiver High-Level Output Voltage vs High-Level Output Current Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 5.9 Typical Characteristics (continued) Figure 5-7. Receiver Low-Level Output Voltage vs Low-Level Output Current Figure 5-8. Receiver Output Voltage vs Differential Input Voltage Figure 5-9. Average Supply Current vs Frequency Figure 5-10. Receiver Input Current vs Input Voltage (Complementary Input at 0 V) Figure 5-11. Receiver Propagation Delay Time vs Free-Air Temperature Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q Submit Document Feedback 9 SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 6 Parameter Measurement Information Figure 6-1. Differential and Common-Mode Output Voltage Test Circuit Figure 6-2. Differential Output Voltage Test Circuit A. B. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, tr ≤ 6 ns, tf≤ 6 ns, ZO = 50 Ω. CL includes probe and jig capacitance. Figure 6-3. Driver Test Circuits and Differential Output Delay and Transition Time Voltage Waveforms 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com A. B. SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, tr ≤ 6 ns, tf≤ 6 ns, ZO = 50 Ω. CL includes probe and jig capacitance. Figure 6-4. Receiver Test Circuit and Propagation Delay and Transition Time Voltage Waveforms Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q Submit Document Feedback 11 SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 7 Detailed Description 7.1 Functional Block Diagram Figure 7-1. Schematics of Inputs and Outputs 7.2 Device Functional Modes Function Tables (1) 12 Table 7-1. Driver(1) OUTPUTS INPUT D Y H H L L L H Z H = high level, L = low level, ? = indeterminate Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 Table 7-2. Receiver(1) (1) DIFFERENTIAL INPUTS A−B OUTPUT R VID ≥ 0.2 V H −0.2 V < VID < 0.2 V ? VID ≤ − 0.2 V L Open circuit H H = high level, L = low level, ? = indeterminate 7.3 Thermal Characteristics of IC Packages θJA (Junction-to-Ambient Thermal Resistance) is defined as the difference in junction temperature to ambient temperature divided by the operating power. θJA is not a constant and is a strong function of: • • • the PCB design (50% variation altitude (20% variation) device power (5% variation θJA can be used to compare the thermal performance of packages if the specific test conditions are defined and used. Standardized testing includes specification of PCB construction, test chamber volume, sensor locations, and the thermal characteristics of holding fixtures. θJA is often misused when it is used to calculate junction temperatures for other installations. TI uses two test PCBs as defined by JEDEC specifications. The low-k board gives average in-use condition thermal performance and consists of a single trace layer 25 mm long and 2-oz thick copper. The high-k board gives best case in−use condition and consists of two 1-oz buried power planes with a single trace layer 25 mm long with 2-oz thick copper. A 4% to 50% difference in θJA can be measured between these two test cards. θJC (Junction-to-Case Thermal Resistance) is defined as difference in junction temperature to case divided by the operating power. It is measured by putting the mounted package up against a copper block cold plate to force heat to flow from die, through the mold compound into the copper block. θJC is a useful thermal characteristic when a heatsink is applied to package. It is not a useful characteristic to predict junction temperature as it provides pessimistic numbers if the case temperature is measured in a non-standard system and junction temperatures are backed out. It can be used with θjb in 1-dimensional thermal simulation of a package system. θJB (Junction-to-Board Thermal Resistance) is defined to be the difference in the junction temperature and the PCB temperature at the center of the package (closest to the die) when the PCB is clamped in a cold−plate structure. θjb is only defined for the high-k test card. θJB provide an overall thermal resistance between the die and the PCB. It includes a bit of the PCB thermal resistance (especially for BGAs with thermal balls) and can be used for simple 1-dimensional network analysis of package system (see Figure 7-2). Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q Submit Document Feedback 13 SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 Figure 7-2. Thermal Resistance 14 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q SN75LBC179, SN65LBC179, SN65LBC179Q www.ti.com SLLS173G – JANUARY 1994 – REVISED OCTOBER 2022 8 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 8.1 Device Support 8.2 Documentation Support 8.2.1 Related Documentation 8.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 8.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 8.5 Trademarks LinBiCMOS™ is a trademark of LinBiCMOS. TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 8.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 9 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN75LBC179 SN65LBC179 SN65LBC179Q Submit Document Feedback 15 PACKAGE OPTION ADDENDUM www.ti.com 18-Nov-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN65LBC179D LIFEBUY SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 6LB179 SN65LBC179DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 6LB179 Samples SN65LBC179DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 6LB179 Samples SN65LBC179P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 65LBC179 Samples SN65LBC179QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LB179Q Samples SN65LBC179QDG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LB179Q Samples SN65LBC179QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LB179Q Samples SN65LBC179QDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LB179Q Samples SN75LBC179D LIFEBUY SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7LB179 SN75LBC179DR LIFEBUY SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7LB179 SN75LBC179DRG4 LIFEBUY SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7LB179 SN75LBC179P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 75LBC179 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of