0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
SN75LBC777DWG4

SN75LBC777DWG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC20

  • 描述:

    IC TRANSCEIVER FULL 3/2 20SOIC

  • 数据手册
  • 价格&库存
SN75LBC777DWG4 数据手册
Obsolete Device          SLLS227 − SEPTEMBER 1996 D Single-Chip Interface Solution for the 9-Pin D D D D D D D DW PACKAGE (TOP VIEW) GeoPort Peripheral Data CircuitTerminating Equipment (DCE) for the Intelligent Network Port Designed to Operate up to 4-Mbits/s Full Duplex Single 5-V Supply Operation 10-kV ESD Protection on Bus Terminals Backward Compatible with AppleTalk and LocalTalk LANs Combines Multiple Components into a Single Chip Solution Complements the SN75LBC776 9-Terminal GeoPort Host Data Terminal Equipment (DTE) Interface Device LinBiCMOS Process Technology 1 2 3 4 5 6 7 8 9 10 DA1 VEE C− C+ SHDN DZ2 DY2 GND DEN DA2 20 19 18 17 16 15 14 13 12 11 GND VCC DY1 DY3 DA3 RB2 RY2 RB1 RA1 RY1 logic diagram (positive logic) description The SN75LBC777 is a low-power LinBiCMOS device that incorporate the drivers and receivers for a 9-pin GeoPort peripheral interface. GeoPort combines hybrid EIA/TIA-422-B and EIA/ TIA-423-B drivers and receivers to transmit data up to four-Mbit/s full duplex. GeoPort is a serial communications standard that is intended to replace the RS-232, AppleTalk, and printer ports all in one connector in addition to providing real-time data transfer capability. The SN75LBC777 provides point-to-point connections between GeoPort-compatible devices with data transmission rates up to 4-Mbit/s full duplex over a 4-foot cable. Applications include connection to telephone, integrated services digital network (ISDN), digital sound and imaging, fax-data modems, and other traditional serial and parallel connections. The GeoPort is backwardly compatible to both LocalTalk and AppleTalk LANs. DA2 DEN RY1 DA1 DA3 RY2 SHDN While the SN75LBC777 is powered off (VCC = 0) the outputs are in a high-impedance state. When the shutdown (SHDN) terminal is high, the charge pump is powered down and the outputs are in a high-impedance state. When high, the driver enable (DEN) terminal puts the outputs of the differential driver into a high-impedance state. VCC GND 7 10 6 9 11 DZ2 12 RA1 13 RB1 1 18 16 17 14 DY2 15 DY1 DY3 RB2 5 19 8 Charge Pump 2 VEE Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. GeoPort, LocalTalk, and AppleTalk are trademarks of Apple Computer, Incorporated. LinBiCMOS is a trademark of Texas Instruments Incorporated. Copyright  1996, Texas Instruments Incorporated     ! " #$! "  $%#! &!' &$#!" # ! "##!"  !( !"  )" "!$!" "!&& *!+' &$#! #"", &" ! #""+ #$& !"!,   !"' • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 1 Obsolete Device          SLLS227 − SEPTEMBER 1996 description (continued) A switched-capacitor voltage converter generates the negative voltage required from a single 5-V supply using two 0.33-µF capacitors. One capacitor is between the C+ and C− terminals and the other is between VEE and ground. The SN75LBC777 is characterized for operation over the 0°C to 70°C temperature range. DRIVER FUNCTION TABLE INPUTS ENABLE OUTPUTS DA1 DA2 DA3 SHDN DEN DY1 DY2 DZ2 DY3 H X H L X L X X H L X L L X H X X L X H X L L X H L X X L X L L X L H X OPEN OPEN OPEN L L L H L H X X X H X Z Z Z Z X X X X H X Z Z X X X X OPEN OPEN Z Z Z Z H = high level, L= low level, X = irrelevant, ? = indeterminate, Z = high impedance (off) RECEIVER FUNCTION TABLE INPUTS ENABLE OUTPUTS RA1 RB1 RB2 SHDN RY1 H L H L H L L H L L L H OPEN SHORT† L H H L ? ? Z OPEN SHORT† X X X H Z X X X OPEN Z RY2 Z † −0.2 V < VID < 0.2 V H = high level, L= low level, X = irrelevant, ? = indeterminate, Z = high impedance (off) 2 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • Obsolete Device          SLLS227 − SEPTEMBER 1996 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Positive supply voltage range, VCC, (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 to 7 V Negative supply voltage range, VEE, (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −7 to 0.5 V Receiver input voltage range (RA1, RB1, RB2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V to 15 V Receiver differential input voltage range, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −12 V to 12 V Receiver output voltage range (RY1, RY2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V Driver output voltage range (Power Off)(DY1, DY2, DZ2, DY3) . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V to 15 V Driver output voltage range (Power On)(DY1, DY2, DZ2, DY3) . . . . . . . . . . . . . . . . . . . . . . . . . . . −11 V to 11 V Driver input voltage range (DA, SHDN, DEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC +0.4 V Electrostatic discharge (see Note 2) Bus Pins (Class 3 A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 kV Bus Pins (Class 3 B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 V All Pins (Class 3, A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV All Pins (Class 3 B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 V Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages values are with respect to the network ground terminal unless otherwise noted. 2. This rating is measured using MIL-STD-883C Method, 3015.7. DISSIPATION RATING TABLE PACKAGE DW TA ≤ 25°C POWER RATING DERATE FACTOR ABOVE TA = 25°C 1125 mW 9.0°C • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • TA = 70°C POWER RATING 720 mW 3 Obsolete Device          SLLS227 − SEPTEMBER 1996 recommended operating conditions Supply voltage, VCC High-level input voltage, VIH (DA, SHDN, DEN) Low-level input voltage, VIL (DA, SHDN, DEN) MIN NOM MAX UNIT 4.75 5 5.25 V 5.25 V 0.8 V 2 Receiver common-mode input voltage, VIC −7 7 V Receiver differential input voltage, VID −12 12 V Voltage converter filter capacitance 0.33 Voltage converter filter capacitor equivalent series resistance (ESR) µF 0 Operating free-air temperature, TA 0.2 Ω 70 °C driver electrical characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS High-level output voltage Single ended, See Figure 1 VOL Low-level output voltage |VOD| Magnitude of differential output voltage |VDY − VDZ| ∆|VOD| Change in differential voltage magnitude VOC Common-mode output voltage |∆VOC(SS)| Magnitude of change, common-mode steadystate output voltage |∆VOC(PP)| Magnitude of change, common-mode peak-to-peak output voltage ICC Supply current IOZ High-impedance output current IOS Short-circuit output current MIN TYP RL= 12 kΩ 3.6 4.5 RL= 120 Ω 2 3.6 UNIT V V RL= 12 kΩ −4.5 −3.6 V RL = 120 Ω −2.7 −1.8 V RL = 120 Ω, See Figure 2 4 V 250 −1 3 200 See Figure 3 700 SHDN = DEN = 0 V, No Load SHDN = DEN = 5 V, No Load VCC = 0 or 5 V, VCC = 5.25 V, See Note 3 −10 ≤ VO ≤ 10 V −5 V ≤ VO ≤ 5 V, NOTE 3: Not more than one output should be shorted at one time. 4 MAX • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 7 ±170 mV V mV mV 15 mA 100 µA ±100 µA ±450 mA Obsolete Device          SLLS227 − SEPTEMBER 1996 driver switching characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPHL tPLH Propagation delay time, high-to-low level output tPZL tPZH Driver output enable time to low-level output SHDN Driver output enable time to high-level output SHDN tPLZ tPHZ Driver output disable time from low-level output SHDN Driver output disable time from high-level output SHDN tr tf Rise time Fall time tPHL tPLH Propagation delay time, high-to-low level output MIN Propagation delay time, low-to-high level output Driver output enable time to low-level output tPZH Driver output enable time to high-level output UNIT ns 75 ns 100 µs 25 100 µs 30 100 ns 30 100 ns 10 25 75 ns 10 25 75 ns 40 75 ns Single-ended, RL = 120 Ω, See Figure 4 40 75 ns SHDN 25 100 µs DEN 35 100 ns 25 100 µs 35 150 ns 30 100 ns DEN 30 100 ns SHDN 35 100 ns DEN 35 100 ns Differential, RL = 120 Ω, See Figure 5 DEN SHDN Driver output disable time from low-level output 75 25 SHDN tPLZ MAX 40 40 Propagation delay time, low-to-high level output tPZL TYP tPHZ Driver output disable time from high-level output tr tf Rise time 10 25 75 ns Fall time 10 25 75 ns tSK(P) Pulse skew, |tPLH − tPHL| 22 ns receiver electrical characteristics over free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIT+ VIT− Positive-going input threshold voltage Vhys VOH Differential input voltage hysteresis (VIT+ − VIT−) VOL Low-level output voltage IOS Short-circuit output current RI Input resistance Negative-going input threshold voltage High-level output voltage (see Note 4) MIN TYP MAX UNIT 200 mV −200 mV 50 IOH = 2 mA, IOL = −2 mA, VO = 0 VO = 5.25 V VCC = 0 or 5.25 V, VIC = 0 VIC = 0 2 4.9 0.2 −85 6 V 0.8 −45 45 −12 V ≤ VI ≤ 12 V mV 30 V mA 85 mA kΩ NOTE 4: If the inputs are left unconnected, RA1 interprets this as a high-level input and RB1 and RB2 interpret this as a low-level input so that all outputs are at the high level. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 5 Obsolete Device          SLLS227 − SEPTEMBER 1996 receiver switching characteristics over free-air temperature range (unless otherwise noted) TYP MAX tPHL tPLH Propagation delay time, high-to-low level output PARAMETER 30 75 ns Propagation delay time, low-to-high level output 30 75 ns tr tf Rise time 15 30 ns 15 30 ns tsk(p) tPZL Pulse skew |tPLH-tPHL| 20 ns Receiver output enable time to low-level output 35 100 ns tPZH tPLZ Receiver output enable time to high-level output 35 100 ns 21 100 ns tPHZ Receiver output disable time from high-level output 21 100 ns tPZL tPZH Receiver output enable time to low-level output 12 25 µs 12 25 µs tPLZ tPHZ Receiver output disable time from low-level output 25 100 ns 125 400 ns 6 TEST CONDITIONS RL = 2 kΩ, kΩ See Figure 6 CL = 15 pF, Fall time Differential, See Figure 7 Receiver output disable time from low-level output Receiver output enable time to high-level output Single-ended, See Figure 7 CL = 50 pF, CL = 50 pF, Receiver output disable time from high-level output • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • MIN UNIT Obsolete Device          SLLS227 − SEPTEMBER 1996 PARAMETER MEASUREMENT INFORMATION CL IO CL II IO DY1 II DA1 VO CL DA2 RL VI RL DY2 VO VI IO DZ2 SHDN RL VO DEN or SHDN TEST CIRCUIT NOTES: A. CL = 50 pF B. Driver 3 is a noninverting version of driver 1. Figure 1. Single-Ended Driver DC Parameter Test Circuits 60 Ω DY2 II IO VOD DA2 VI 60 Ω DZ2 50 pF DEN or SHDN TEST CIRCUIT Figure 2. Differential Driver DC Parameter Test Circuit 60 Ω DY2 VOD DA2 VI 60 Ω DZ2 VOC 15 pF DEN or SHDN TEST CIRCUIT (see Note A) 3V VI 1.5 V 1.5 V 0V VOC 0V V VOC(PP) OC(SS) VOLTAGE WAVEFORM NOTE A. Measured 3dB Bandwidth = 300 MHz Figure 3. Differential Driver Common-Mode Output Voltage Test Circuit and Waveform • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 7 Obsolete Device          SLLS227 − SEPTEMBER 1996 PARAMETER MEASUREMENT INFORMATION CL IO CL II DY1 DA1 RL DY2 VO CL DA2 RL VO VI SHDN IO DZ2 RL VO SHDN or DEN TEST CIRCUIT (see Note A) 3V SHDN or DEN 1.5 V 1.5 V 1.5 V 1.5 V 0V 3V 1.5 V DA 1.5 V 0V tPLH tPHL tPLZ tPZL 90% DY1, DZ2 10% tPHZ 90% 90% 50% 10% 10% 90% 0V 50% 10% VOL tPZH tf tPLZ tr tPHL tPHZ tPLH VOH tPZH DY2 90% 90% tPZL 90% 50% 10% 10% VOH 90% 50% 10% 0V 10% tf tr VOLTAGE WAVEFORM (see Note B) NOTES: A. CL = 50 pF, RL = 120 Ω B. The input waveform tr, tf ≤ 10 ns. C. Driver 3 is a noninverting version of driver 1. Figure 4. Single-Ended Driver Propagation and Transition Times Test Circuits and Waveform 8 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • VOL Obsolete Device          SLLS227 − SEPTEMBER 1996 PARAMETER MEASUREMENT INFORMATION RL = 60 Ω DY2 VOD DA2 VI RL = 60 Ω DZ2 50 pF SHDN or DEN TEST CIRCUIT 3V SHDN or DEN 1.5 V 1.5 V 1.5 V 1.5 V 0V 3V 1.5 V DA 1.5 V 0V tPHL tPLH tPHZ tPZH 90% 90% VOD(H) 90% 10% 50% 90% VOD tPLZ 50% 10% 0V 10% 10% tPZL VOD(L) tf tr VOLTAGE WAVEFORM NOTE A: For the input waveform tr, tf < = 10 ns Figure 5. Differential Driver Propagation and Transition Times Test Circuit and Waveforms VCC II Input VI 2.5 V VI 2 kΩ RA + RB _ RY 0V −2.5 V IO tPLH Output VO 15 pF 0V VO SHDN tPHL 90% 10% tr TEST CIRCUIT 90% VOH 1.5 V 10% V OL tf VOLTAGE WAVEFORM NOTE A: For the input waveform tr, tf < = 10 ns Figure 6. Receiver Propagation and Transition Times Test Circuit and Waveform • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 9 Obsolete Device          SLLS227 − SEPTEMBER 1996 PARAMETER MEASUREMENT INFORMATION VCC −2.5 V or 2.5 V RA + RB _ RY RL = 500 Ω S1 CL = 50 pF SHDN TEST CIRCUIT 3V SHDN 1.5 V 1.5 V 0V tPLZ tPZL VCC S1 at VCC 90% 10% VO VOL tPHZ tPZH VOH 90% S1 at GND 10% 0V VOLTAGE WAVEFORM NOTE A: For the input waveform tr, tf < = 10 ns Figure 7. Receiver Enable and Disable Test Circuit and Waveforms 10 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • Obsolete Device          SLLS227 − SEPTEMBER 1996 APPLICATION INFORMATION GeoPort Host SN75LBC776 9-Terminal DTE 13 RxD− 6 12 RxD + 7 7 6 TxD + 12 13 18 15 RESET/ATT SCLK TxD − GND 15 18 19 17 Power 16 TxHS/Wake-Up VCC 0.33 µF Standard 19 Peripheral SN75LBC777 9-Terminal DCE 4 + 3 GeoPort Peripheral Device SN75LBC777 9-Terminal DCE RESET/ATT 10 RxD 11 TxD 5 SHDN 14 1 SCLK 16 TxHS/WAKE-UP 9 DEN 6 RxD − 7 RxD + GeoPort Control Logic DTR RTXC CTS RTS 17 TxHS/WAKE-UP 12 TxD + 13 TxD − 6 3 −5 V 0.33 µF VEE 2 + 8 20 GND 15 RESET/ATT 18 SCLK 7 VCC 8 4 9 1 2 5 Power NOTE A: A potential charge pump capacitor is the AVX 0805YC334MATXA or an equivalent. Figure 8. GeoPort 9-terminal DCE Connection Application • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 11 Obsolete Device          SLLS227 − SEPTEMBER 1996 generator characteristics 232/V.28 PARAMETER TEST CONDITIONS MIN Output voltage magnitude 3 kΩ ≤ RL ≤ 7 kΩ RL = 450 Ω MAX 25 4 6 5 Short-circuit output current Power-off source resistance VO = 0 VCC = 0, |VO| < 2 V IO(OFF) SR Power-off output current VCC = 0, |VO| < 6 V 30 0.04 10% to 90% V V V 60 mA Ω 300 ±100 NA VO(RING) Output voltage ringing † ui is the unit interval and is the inverse of the signaling rate (a.k.a. bit time). 13.2 150 NA UNIT NA NA ±3 V to ±3 V MAX 3.7 100 Output voltage slew rate Output transition time NA MIN 3.6 300 ±3.3 V to ±3.3 V tt 15 NA IOS RO(OFF) 562 MIN Open circuit |VO| 423/V.10 MAX µA NA NA 4 30 V/µs NA 0.22 2.1 µs ui† ui† NA NA NA 0.3 NA 10% NA 5% receiver characteristics 232/V.28 PARAMETER |VI| VIT RI 12 TEST CONDITIONS MIN Input voltage Input voltage threshold Input resistance 423/V.10 MAX MIN 25 |VI| < 15 V −3 3 NA |VI| < 10 V 3 V < |VI| < 15 V 3 |VI| < 10 V NA • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • MAX MIN 10 NA −0.2 7 562 NA 4 −3 0.2 MAX 25 V 3 V 7 kΩ NA 3 NA UNIT V kΩ PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2013 PACKAGING INFORMATION Orderable Device Status (1) SN75LBC777DWG4 OBSOLETE Package Type Package Pins Package Drawing Qty SOIC DW 20 Eco Plan Lead/Ball Finish (2) TBD MSL Peak Temp Op Temp (°C) Device Marking (3) Call TI Call TI (4/5) SN75LBC777 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
SN75LBC777DWG4 价格&库存

很抱歉,暂时无法提供与“SN75LBC777DWG4”相匹配的价格&库存,您可以联系我们找货

免费人工找货