SN78MCDCYR

PCN Number: Title: 20161104001 PCN Date: Nov 07 2016 Qualification of additional Assembly & Test sites for select devices in the SOT Package Customer PCN Manager Dept: Quality Services Contact: Proposed 1st Ship Provided upon Feb 07 2017 Estimated Sample Availability: Date: Request Change Type: Assembly Site Assembly Process Assembly Materials Design Electrical Specification Mechanical Specification Test Site Packing/Shipping/Labeling Test Process Wafer Bump Site Wafer Bump Material Wafer Bump Process Wafer Fab Site Wafer Fab Materials Wafer Fab Process Part number change PCN Details Description of Change: Texas Instruments is pleased to announce the qualification of JCET Chuzhou and GTBF as alternate Assembly and Test sites for the devices listed in the Product Affected section below. Construction differences are as follows: What Mount Compound Mold Compound NFME SID# A-06 SID#R-17 JCETCZ S#011204001902 S#013101006201 GTBF S#011204001902 SID#EN0000052 Test coverage, insertions, conditions will remain consistent with current testing and verified with test MQ. Reason for Change: Continuity of Supply Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): None Anticipated impact on Material Declaration No Impact to the Material Declaration Material Declarations or Product Content reports are driven from production data and will be available following the production release. Upon production release the revised reports can be obtained from the TI ECO website. Changes to product identification resulting from this PCN: Assembly Site Assembly Site Origin (22L) Assembly Country Code (21L) NFME NFM CHN JCETCZ GP6 CHN GTBF GTF CHN Texas Instruments Incorporated Assembly City Economic Development Zone Chuzhou Anhui Sci. Park Phasell Shatin PCN#20161104001 Sample product shipping label (not actual product label) Topside Device marking (if included): Assembly site code for NFM= E Assembly site code for GP6 = F Assembly site code for GTF= T Product Affected Group 1 Devices: Current AT - NFME; New AT - GTBF & JCETCZ: TLV1117-15CDCYR TLV1117-25CDCYRG3 TLV1117-33IDCYR TLV1117-50IDCYR TLV1117-15CDCYRG3 TLV1117-25IDCYR TLV1117-33IDCYRG3 TLV1117-50IDCYRG3 TLV1117-15IDCYR TLV1117-33CDCYR TLV1117-50CDCYR UA78M08CDCYR TLV1117-25CDCYR TLV1117-33CDCYRG3 TLV1117-50CDCYRG3 Group 2 Devices: Current AT - NFME & JCETCZ; New AT – GTBF: LM317DCYR TLV1117-18CDCYRG3 TLV1117CDCYRG3 UA78M05CDCYRG3 LM317DCYRG3 TLV1117-18IDCYR TLV1117IDCYR UA78M05IDCYR LM317MDCYR TLV1117-18IDCYRG3 TLV1117IDCYRE3 UA78M05IDCYRG3 LM317MDCYRG3 TLV1117CDCYR TLV1117IDCYRG3 UA78M33CDCYR SN78MCDCYR TLV1117CDCYRE3 UA78M05CDCYR UA78M33CDCYRG3 TLV1117-18CDCYR Texas Instruments Incorporated PCN#20161104001 Texas Instruments Incorporated PCN#20161104001 For questions regarding this notice, e-mails can be sent to the regional contacts shown below or your local Field Sales Representative. Location USA Europe Asia Pacific Japan Texas Instruments Incorporated E-Mail PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com PCN#20161104001