SN54ACT374, SN74ACT374
SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
SNx4ACT374 Octal D-Type Edge-Triggered Flip-Flops with 3-State Outputs
1 Features
2 Description
•
•
•
•
These 8-bit flip-flops feature 3-state outputs designed
specifically for driving highly capacitive or relatively
low-impedance loads. The devices are particularly
suitable for implementing buffer registers, I/O ports,
bidirectional bus drivers, and working registers.
Operation of 4.5-V to 5.5-V VCC
Inputs accept voltages to 5.5 V
Max tpd of 10 ns at 5 V
Inputs are TTL-voltage compatible
Device Information
PART NUMBER
SNx4ACT374
PACKAGE1
BODY SIZE2
DB (SSOP, 20)
7.20 mm × 5.30 mm
DW (SOIC, 20)
12.80 mm × 7.50 mm
N (PDIP, 20)
24.33 mm × 6.35 mm
NS (SO, 20)
12.60 mm × 5.30 mm
PW (TSSOP, 20)
6.50 mm × 4.40 mm
1. For all available packages, see the orderable
addendum at the end of the data sheet.
2. The package size (length × width) is a nominal
value and includes pins, where applicable.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54ACT374, SN74ACT374
www.ti.com
SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 Recommended Operating Conditions.........................4
5.3 Thermal Information....................................................5
5.4 Electrical Characteristics.............................................5
5.5 Timing Requirements.................................................. 6
5.6 Switching Characteristics............................................6
5.7 Operating Characteristics........................................... 6
6 Parameter Measurement Information............................ 7
7 Detailed Description........................................................8
7.1 Overview..................................................................... 8
7.2 Functional Block Diagram........................................... 8
7.3 Device Functional Modes............................................8
8 Device and Documentation Support..............................9
8.1 Documentation Support (Analog)................................9
8.2 Receiving Notification of Documentation Updates......9
8.3 Support Resources..................................................... 9
8.4 Trademarks................................................................. 9
8.5 Electrostatic Discharge Caution..................................9
8.6 Glossary......................................................................9
9 Mechanical, Packaging, and Orderable Information.... 9
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (November 2002) to Revision G (August 2023)
Page
• Added Device Information table, Pin Functions table, Thermal Information table, Device Functional Modes,
Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section 1
2
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SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
4 Pin Configuration and Functions
Figure 4-1. SN54ACT374 J or W Package;
SN74ACT374 DB, DW, N, NS, or PW Package; (Top
View)
Figure 4-2. SN54ACT374 FK Package (Top View)
Table 4-1. Pin Functions
PIN
NAME
TYPE
NO.
DESCRIPTION
OE
1
I
Enable pin
1Q
2
O
Output 1
1D
3
I
Input 1
2D
4
I
Input 2
2Q
5
O
Output 2
3Q
6
O
Output 3
3D
7
I
Input 3
4D
8
I
Input 4
4Q
9
O
Output 4
GND
10
–
Ground pin
CLK
11
I
Clock pin
5Q
12
O
Output 5
5D
13
I
Input 5
6D
14
I
Input 6
6Q
15
O
Output 6
7Q
16
O
Output 7
7D
17
I
Input 7
8D
18
I
Input 8
8Q
19
O
Output 8
VCC
20
–
Power pin
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SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)1
VCC
VI
1
VO
1
MIN
MAX
Supply voltage range
−0.5
7
UNIT
V
Input voltage range
−0.5
VCC + 0.5
V
Output voltage range
−0.5
VCC + 0.5
V
IIK
Input clamp current
(VI < 0 or VI > VCC)
±20
mA
IOK
Output clamp current
(VO < 0 or VO > VCC)
±20
mA
IO
Continuous output current
(VO = 0 to VCC)
Continuous current through VCC or GND
Tstg
(1)
(2)
Storage temperature range
−65
±50
mA
±200
mA
150
°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 Recommended Operating Conditions
over recommended operating free-air temperature range (unless otherwise noted)1
SN54ACT374
MAX
MIN
MAX
4.5
5.5
4.5
5.5
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
V
VI
Input voltage
0
VCC
0
VCC
V
VO
Output voltage
0
VCC
0
VCC
V
IOH
High-level output current
−24
−24
mA
IOL
Low-level output current
24
24
mA
Δt/Δv
Input transition rise or fall rate
8
8
ns/V
TA
Operating free-air temperature
85
°C
(1)
4
SN74ACT374
MIN
2
2
0.8
−55
125
−40
V
V
All unused inputs of the device must be held at VCC or GND for proper device operation. Refer to the TI application report, Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
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SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
5.3 Thermal Information
SN74ACT374
THERMAL METRIC(1)
RθJA
(1)
DB (SSOP) DW (SOIC)
Junction-to-ambient thermal resistance
N
NS (SO)
PW
(TSSOP)
20 PINS
20 PINS
20 PINS
20 PINS
20 PINS
70
58
69
60
83
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
5.4 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −50μA
IOH = −24 mA
VOH
SN54ACT374
4.5 V
4.4
4.49
4.4
4.4
5.5 V
5.4
5.49
5.4
5.4
4.5 V
3.86
3.7
3.76
5.5 V
4.86
4.7
4.76
5.5 V
IOH = −75 mA
(1)
5.5 V
MAX
MIN
MAX
SN74ACT374
TYP
(1)
IOL = 24 mA
TA = 25°C
MIN
IOH = −50 mA
IOL = 50μA
VOL
VCC
MIN
MAX
UNIT
V
3.85
3.85
4.5 V
0.1
0.1
0.1
5.5 V
0.1
0.1
0.1
4.5 V
0.36
0.44
0.44
5.5 V
0.36
0.5
0.44
V
(1)
5.5 V
IOL = 75 mA
(1)
5.5 V
IOZ
VO = VCC or GND
5.5 V
±0.25
±5
±2.5
μA
II
VI = VCC or GND
5.5 V
±0.1
±1
±1
μA
ICC
VI = VCC or GND,
5.5 V
4
80
40
μA
ΔICC (2)
One input at 3.4 V, Other inputs at
GND or VCC
1.6
1.5
mA
Ci
VI = VCC or GND
IOL = 50 mA
(1)
(2)
IO = 0
1.65
1.65
5.5 V
0.6
5V
4.5
pF
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
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SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
5.5 Timing Requirements
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Load Circuit and
Voltage Waveforms)
TA = 25°C
MIN
fclock
Clock frequency
tw
Pulse duration, CLK high or low
tsu
Setup time, data before CLK↑
th
Hold time, data after CLK↑
SN54ACT374
MAX
MIN
SN74ACT374
MAX
100
MIN
MAX
70
90
UNIT
MHz
5
5
5
ns
5
5.5
5.5
ns
1.5
1.5
1.5
ns
5.6 Switching Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Load Circuit and
Voltage Waveforms)
PARAMETER
FROM (INPUT)
TO (OUTPUT)
TA = 25°C
MIN
TYP
fmax
100
160
tPLH
2
tPHL
tPZH
tPZL
tPHZ
tPLZ
CLK
Q
OE
Q
OE
Q
SN54ACT374
MAX
SN74ACT374
MAX
MIN
8.5
10
1.5
12
2
11.5
2
8
9.5
1.5
11.5
1.5
11
2
8
9.5
1.5
11.5
1.5
10.5
1.5
8
9
1.5
11.5
1.5
10.5
1.5
8.5
11.5
1.5
13
1
12.5
1.5
7
8.5
1.5
11
1
10
70
MIN
MAX
90
UNIT
MHz
ns
ns
ns
5.7 Operating Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
f = 1 MHz
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TYP
40
UNIT
pF
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SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
6 Parameter Measurement Information
A.
B.
C.
D.
CL includes probe and jig capacitance.
Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2
is for an output with internal conditions such that the output is high except when disabled by the output control.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
The outputs are measured one at a time with one input transition per measurement.
Figure 6-1. Load Circuit and Voltage Waveforms
TEST
S1
tPLH/tPHL
Open
tPLZ/tPZL
2 × VCC
tPHZ/tPZH
Open
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SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
7 Detailed Description
7.1 Overview
The eight flip-flops of the ’ACT374 devices are D-type edge-triggered flip-flops. On the positive transition of the
clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or
low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines
in bus-organized systems without need for interface or pullup components.
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
For specified high-impedance state during power up or power down, OE must be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
7.2 Functional Block Diagram
Figure 7-1. Logic Diagram (Positive Logic)
7.3 Device Functional Modes
Table 7-1. Function Table (Each Flip-Flop)
INPUTS
8
OUTPUT Q
OE
CLK
D
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
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SCAS539G – OCTOBER 1995 – REVISED AUGUST 2023
8 Device and Documentation Support
8.1 Documentation Support (Analog)
8.1.1 Related Documentation
For related documentation see the following:
Implications of Slow or Floating CMOS Inputs, SCBA004
8.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
8.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
8.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
8.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
8.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Dec-2023
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
5962-87631012A
ACTIVE
LCCC
FK
20
55
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
596287631012A
SNJ54ACT
374FK
5962-8763101RA
ACTIVE
CDIP
J
20
20
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8763101RA
SNJ54ACT374J
Samples
5962-8763101SA
ACTIVE
CFP
W
20
25
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8763101SA
SNJ54ACT374W
Samples
5962-8763101VSA
ACTIVE
CFP
W
20
25
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8763101VS
A
SNV54ACT374W
SN74ACT374DBR
ACTIVE
SSOP
DB
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AD374
SN74ACT374DW
LIFEBUY
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ACT374
SN74ACT374DWE4
LIFEBUY
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ACT374
SN74ACT374DWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ACT374
Samples
SN74ACT374N
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74ACT374N
Samples
SN74ACT374NSR
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
ACT374
Samples
SN74ACT374PWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AD374
Samples
SNJ54ACT374FK
ACTIVE
LCCC
FK
20
55
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
596287631012A
SNJ54ACT
374FK
SNJ54ACT374J
ACTIVE
CDIP
J
20
20
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8763101RA
SNJ54ACT374J
Samples
SNJ54ACT374W
ACTIVE
CFP
W
20
25
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-8763101SA
SNJ54ACT374W
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
Samples
Samples
Samples
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
3-Dec-2023
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of