SN54HC541, SN74HC541
SCLS305E – JANUARY 1996 – REVISED MAY 2022
SNx4HC541 Octal Buffers and Line Drivers With 3-State Outputs
1 Features
3 Description
•
•
These octal buffers and line drivers feature the
performance of the SNx4HC541 devices and a pinout
with inputs and outputs on opposite sides of the
package. This arrangement greatly facilitates printed
circuit board layout.
•
•
•
•
•
Wide Operating Voltage Range of 2 V to 6 V
High-Current 3-State Outputs Drive Bus Lines
Directly or Up to 15 LSTTL Loads
Low Power Consumption, 80-µA Maximum ICC
Typical tpd = 10 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 µA Maximum
Data Flow-Through Pinout (All Inputs on Opposite
Side From Outputs)
2 Applications
•
•
•
•
•
LEDs
Servers
PCs and Notebooks
Wearable Health and Wellness Devices
Electronic Points of Sale
The 3-state outputs are controlled by a two-input NOR
gate. If either output-enable (OE1 or OE2) input is
high, all eight outputs are in the high-impedance state.
The SNx4HC541 devices provide true data at the
outputs.
Device Information
PART NUMBER
PACKAGE
(1)
BODY SIZE (NOM)
SN74HC541DW
SOIC (20)
12.80 mm × 7.50 mm
SN74HC541DB
SSOP (20)
7.20 mm × 5.30 mm
SN74HC541N
PDIP (20)
24.33 mm × 6.35 mm
SN74HC541NS
SO (20)
12.60 mm × 5.30 mm
SN74HC541PW
TSSOP (20)
6.50 mm × 4.40 mm
SN54HC541J
CDIP (20)
24.20 mm × 6.92 mm
SN54HC541FK
LCCC (20)
8.89 mm × 8.89 mm
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
1
OE1
OE2
A1
19
2
18
Y1
To Seven Other Channels
Copyright © 2016, Texas Instruments Incorporated
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC541, SN74HC541
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SCLS305E – JANUARY 1996 – REVISED MAY 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
Pin Functions.................................................................... 3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics, TA = 25°C.......................... 5
6.6 Electrical Characteristics, SN54HC541...................... 5
6.7 Electrical Characteristics, SN74HC541...................... 6
6.8 Switching Characteristics, CL = 50 pF, TA = 25°C.......6
6.9 Switching Characteristics, CL = 50 pF,
SN54HC541.................................................................. 7
6.10 Switching Characteristics, CL = 50 pF,
SN74HC541.................................................................. 7
6.11 Switching Characteristics, CL = 150 pF, TA =
25°C.............................................................................. 7
6.12 Switching Characteristics, CL = 150 pF,
SN54HC541.................................................................. 8
6.13 Switching Characteristics, CL = 150 pF,
SN74HC541.................................................................. 8
6.14 Operating Characteristics......................................... 8
6.15 Typical Characteristics.............................................. 9
7 Parameter Measurement Information.......................... 10
8 Detailed Description...................................................... 11
8.1 Overview................................................................... 11
8.2 Functional Block Diagram......................................... 11
8.3 Feature Description...................................................11
8.4 Device Functional Modes..........................................11
9 Application and Implementation.................................. 12
9.1 Application Information............................................. 12
9.2 Typical Application.................................................... 12
10 Power Supply Recommendations..............................14
11 Layout........................................................................... 14
11.1 Layout Guidelines................................................... 14
11.2 Layout Example...................................................... 14
12 Device and Documentation Support..........................15
12.1 Related Links.......................................................... 15
12.2 Receiving Notification of Documentation Updates..15
12.3 Support Resources................................................. 15
12.4 Trademarks............................................................. 15
12.5 Electrostatic Discharge Caution..............................15
12.6 Glossary..................................................................15
13 Mechanical, Packaging, and Orderable
Information.................................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (September 2016) to Revision E (May 2022)
Page
• Updated ESD ratings table to include modern TI terminology............................................................................4
• Junction-to-ambient thermal resistance values increased. DB was 90.2 is now 122.7, DW was 77.5 is now
109.1, N was 45.2 is now 84.6, NS was 72.8 is now 113.4, PW was 98.3 is now 131.8.................................... 5
Changes from Revision C (August 2003) to Revision D (September 2016)
Page
• Added Applications section, Thermal Information table, ESD Ratings table, Feature Description section,
Device Functional Modes, Application and Implementation section, Power Supply Recommendations section,
Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable
Information section............................................................................................................................................. 1
• Deleted Ordering Information table, see Mechanical, Packaging, and Orderable Information at the end of the
datasheet............................................................................................................................................................ 1
• Changed RθJA for DB package from 70°C/W: to 90.2°C/W................................................................................ 5
• Changed RθJA for DW package from 58°C/W: to 77.5°C/W............................................................................... 5
• Changed RθJA for N package from 69°C/W: to 45.2°C/W...................................................................................5
• Changed RθJA for NS package from 60°C/W: to 72.8°C/W................................................................................ 5
• Changed RθJA for PW package from 83°C/W: to 98.3°C/W............................................................................... 5
2
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SCLS305E – JANUARY 1996 – REVISED MAY 2022
5 Pin Configuration and Functions
FK Package
20-Pin LCCC
Top View
DB, DW, N, NS, J, or PW Package
20-Pin SSOP, SOIC, PDIP, SO, CDIP, or TSSOP
Top View
Pin Functions
PIN
NO.
(1)
NAME
I/O
DESCRIPTION
1
OE1
I
Output enable (active low) Both OE must be low to enable outputs
2
A1
I
Channel 1 input
3
A2
I
Channel 2 input
4
A3
I
Channel 3 input
5
A4
I
Channel 4 input
6
A5
I
Channel 5 input
7
A6
I
Channel 6 input
8
A7
I
Channel 7 input
Channel 8 input
9
A8
I
10
GND
—
Ground
11
Y8
O
Channel 8 output
12
Y7
O
Channel 7 output
13
Y6
O
Channel 6 output
14
Y5
O
Channel 5 output
15
Y4
O
Channel 4 output
16
Y3
O
Channel 3 output
17
Y2
O
Channel 2 output
18
Y1
O
Channel 1 output
19
OE2
I
Output enable (active low) both OE must be low to enable outputs
20
VCC
—
(1)
Power pin
Signal Types: I = Input, O = Output, I/O = Input or Output.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Supply voltage
current(2)
MIN
MAX
–0.5
7
UNIT
V
IIK
Input clamp
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current(2)
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
±70
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
Storage temperature
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
See note(1)
VCC
Supply voltage
VCC = 2 V
VIH
High-level input voltage
VCC = 4.5 V
VCC = 6 V
MIN
NOM
MAX
2
5
6
Low-level input voltage
VI
Input voltage
VO
Output voltage
3.15
0.5
VCC = 4.5 V
1.35
0
TA
(1)
4
VCC
V
VCC
V
1000
VCC = 4.5 V
500
VCC = 6 V
Operating free-air temperature
V
1.8
0
VCC = 2 V
Input transition rise and fall time
V
4.2
VCC = 6 V
Δt/Δv
V
1.5
VCC = 2 V
VIL
UNIT
ns
400
SN54HC541
–55
125
SN74HC541
–40
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating
CMOS Inputs, SCBA004.
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6.4 Thermal Information
SN74HC541
DB (SSOP)
DW (SOIC)
N (PDIP)
NS (SO)
PW (TSSOP)
20 PINS
20 PINS
20 PINS
20 PINS
20 PINS
UNIT
THERMAL METRIC
RθJA
Junction-to-ambient thermal
(1)
resistance
122.7
109.1
84.6
113.4
131.8
°C/W
RθJC (top)
Junction-to-case (top) thermal
resistance
81.6
76
72.5
78.6
72.2
°C/W
RθJB
Junction-to-board thermal
resistance
77.5
77.6
65.3
78.4
82.8
°C/W
ΨJT
Junction-to-top characterization
parameter
46.1
51.5
55.3
47.1
21.5
°C/W
ΨJB
Junction-to-board
characterization parameter
77.1
77.1
65.2
78.1
82.4
°C/W
RθJC(bot)
Junction-to-case (bottom)
thermal resistance
N/A
N/A
N/A
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics, TA = 25°C
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
TEST CONDITIONS
MIN
TYP
MAX
2V
1.9
1.998
IOH = –20 µA
4.5 V
4.4
4.499
6V
5.9
5.999
IOH = –6 mA
4.5 V
3.98
4.3
6V
5.48
5.8
2V
0.002
0.1
4.5 V
0.001
0.1
6V
0.001
0.1
4.5 V
0.17
0.26
6V
0.15
0.26
VI = VIH or VIL
IOH = –7.8 mA
IOL = 20 µA
VOL
VCC
VI = VIH or VIL
IOL = 6 mA
IOL = 7.8 mA
UNIT
V
V
II
VI = VCC or 0
6V
±0.1
±100
nA
IOZ
VO = VCC or 0
6V
±0.01
±0.5
µA
ICC
VI = VCC or 0, IO = 0
6V
Ci
2 V to 6 V
8
µA
3
10
pF
TYP
MAX
6.6 Electrical Characteristics, SN54HC541
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
TEST CONDITIONS
VCC
MIN
2V
1.9
IOH = –20 µA
4.5 V
4.4
6V
5.9
IOH = –6 mA
4.5 V
3.7
6V
5.2
VI = VIH or VIL
IOH = –7.8 mA
UNIT
V
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOL = 20 µA
VOL
VI = VIH or VIL
IOL = 6 mA
IOL = 7.8 mA
MIN
TYP
MAX
2V
0.1
4.5 V
0.1
6V
0.1
4.5 V
0.4
UNIT
V
6V
0.4
±1000
nA
II
VI = VCC or 0
6V
IOZ
VO = VCC or 0
6V
±10
µA
ICC
VI = VCC or 0, IO = 0
6V
160
µA
2 V to 6 V
10
pF
Ci
6.7 Electrical Characteristics, SN74HC541
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –20 µA
VOH
VI = VIH or VIL
IOH = –6 mA
IOH = –7.8 mA
VOL
VCC
MIN
2V
1.9
4.5 V
4.4
6V
5.9
4.5 V
3.84
6V
5.34
TYP
MAX
V
2V
0.1
IOL = 20 µA
4.5 V
0.1
6V
0.1
IOL = 6 mA
4.5 V
0.33
VI = VIH or VIL
IOL = 7.8 mA
UNIT
V
6V
0.33
II
VI = VCC or 0
6V
±1000
nA
IOZ
VO = VCC or 0
6V
±5
µA
ICC
VI = VCC or 0, IO = 0
6V
80
µA
2 V to 6 V
10
pF
Ci
6.8 Switching Characteristics, CL = 50 pF, TA = 25°C
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 7-1)
PARAMETER
tpd
ten
TO
(OUTPUT)
VCC
A
Y
6V
10
20
2V
80
150
4.5 V
17
30
6V
15
26
OE
tdis
OE
tt
6
FROM
(INPUT)
Y
Y
Y
MIN
TYP
MAX
2V
40
115
4.5 V
12
23
2V
40
150
4.5 V
18
30
6V
17
26
2V
28
60
4.5 V
8
12
6V
6
10
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UNIT
ns
ns
ns
ns
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6.9 Switching Characteristics, CL = 50 pF, SN54HC541
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 7-1)
PARAMETER
tpd
ten
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
171
A
Y
4.5 V
34
OE
tdis
OE
tt
Y
Y
Y
MIN
TYP
MAX
6V
29
2V
224
4.5 V
45
6V
38
2V
224
4.5 V
45
6V
38
2V
90
4.5 V
18
6V
15
UNIT
ns
ns
ns
ns
6.10 Switching Characteristics, CL = 50 pF, SN74HC541
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 7-1)
PARAMETER
tpd
FROM
(INPUT)
A
ten
OE
tdis
OE
tt
TO
(OUTPUT)
Y
Y
Y
Y
VCC
MIN
TYP
MAX
2V
144
4.5 V
29
6V
25
2V
188
4.5 V
38
6V
32
2V
188
4.5 V
38
6V
32
2V
75
4.5 V
15
6V
13
UNIT
ns
ns
ns
ns
6.11 Switching Characteristics, CL = 150 pF, TA = 25°C
over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 7-1)
PARAMETER
tpd
ten
FROM
(INPUT)
TO
(OUTPUT)
VCC
A
Y
OE
tt
Y
Y
MIN
TYP
MAX
2V
65
165
4.5 V
16
33
6V
14
28
2V
100
200
4.5 V
20
40
6V
17
34
2V
45
210
4.5 V
17
42
6V
13
36
UNIT
ns
ns
ns
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6.12 Switching Characteristics, CL = 150 pF, SN54HC541
over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 7-1)
PARAMETER
tpd
ten
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
246
A
Y
4.5 V
49
OE
Y
tt
Y
MIN
TYP
MAX
6V
42
2V
298
4.5 V
60
6V
51
2V
315
4.5 V
63
6V
53
UNIT
ns
ns
ns
6.13 Switching Characteristics, CL = 150 pF, SN74HC541
over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 7-1)
PARAMETER
tpd
ten
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
206
A
Y
4.5 V
41
OE
Y
tt
Y
MIN
TYP
MAX
6V
35
2V
250
4.5 V
50
6V
43
2V
265
4.5 V
53
6V
45
UNIT
ns
ns
ns
6.14 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
8
TEST CONDITIONS
TYP
UNIT
No load
35
pF
Power dissipation capacitance per buffer/driver
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6.15 Typical Characteristics
100
80
tpd
ten
tdis
tt
70
80
70
50
Time (ns)
Time (ns)
60
tpd
ten
tt
90
40
30
60
50
40
20
30
10
20
10
0
2
2.5
3
3.5
4
4.5
Vcc (Volts)
5
5.5
6
2
2.5
3
D001
Figure 6-1. Typical Delay vs. VCC for CL = 50 pF
3.5
4
4.5
Vcc (Volts)
5
5.5
6
D001
Figure 6-2. Typical Delay vs. VCC for CL = 150 pF
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7 Parameter Measurement Information
VCC
PARAMETER
From Output
Under Test
tPZH
S1
Test
Point
1 kΩ
t en
RL
CL
(see Note A)
RL
tPZL
tPHZ
t dis
S2
tPLZ
t pd or t t
1 kΩ
––
LOAD CIRCUIT
CL
S1
S2
50 pF
or
150 pF
Open
Closed
Closed
Open
Open
Closed
Closed
Open
Open
Open
50 pF
50 pF
or
150 pF
VCC
Input
50%
50%
0V
tPLH
In-Phase
Output
50%
10%
tPHL
90%
VOH
50%
10% V
OL
tf
90%
tr
tPHL
Out-of-Phase
Output
90%
tPLH
50%
10%
50%
10%
90%
VOH
VOL
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
Output
Control
(Low-Level
Enabling)
VCC
50%
50%
0V
tPZL
tPLZ
Output
Waveform 1
(See Note B)
10%
tPZH
Input
50%
10%
90%
90%
tr
50%
10% 0 V
tPHZ
Output
Waveform 2
(See Note B)
50%
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
D.
E.
CL includes probe and test-fixture capacitance.
Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
The outputs are measured one at a time with one input transition per measurement.
tPLZ and tPHZ are the same as tdis.
F.
G.
tPZL and tPZH are the same as ten.
tPLH and tPHL are the same as tpd.
C.
VOL
tf
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
A.
B.
VCC
≈VCC
≈VCC
50%
Figure 7-1. Load Circuit and Voltage Waveforms
10
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8 Detailed Description
8.1 Overview
The SN74HC541 device has 8 inputs and outputs where data from the A inputs go to the Y outputs. The output
enables of the device control whether the information from the A inputs go to the Y outputs. These enable pins
cause the device to go into high Z if either OE1 or OE2 are high. The OEs should be tied to VCC through a
pull up resistor to ensure the high impedance state during power up or power down; the minimum value of the
resistor is determined by the current sinking capability of the driver.
8.2 Functional Block Diagram
1
OE1
OE2
A1
19
2
18
Y1
To Seven Other Channels
Copyright © 2016, Texas Instruments Incorporated
Figure 8-1. Logic Diagram (Positive Logic)
8.3 Feature Description
The SNx4HC541 has a wide operating voltage range of 2 V to 6 V. The device has multiple enable pins, and the
device pinout enables simple board layout with outputs across from inputs.
8.4 Device Functional Modes
Table 8-1 lists the functional modes of the SNx4HC541.
Table 8-1. Function Table (Each Buffer/Driver)
INPUTS
A
OUTPUT
Y
OE1
OE2
L
L
L
L
L
L
H
H
H
X
X
Hi-Z
X
H
X
Hi-Z
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
SN74HC541 is a wide range CMOS device that can be used over large voltage ranges. The device can be used
anywhere from 2 to 6 Volts. The device can drive up to 6 mA of current at 5 Volts. This makes it perfect for
driving bus lines directly or up to 15 LSTTL Loads. It can be used to drive anything from micro controllers and
system logic devices to LEDs.
9.2 Typical Application
OE1
VCC
OE2
A1
Microcontroller or
System Logic
A8
Y1
Y8
Microcontroller
System Logic
LEDs
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 9-1. Typical Application Diagram
9.2.1 Design Requirements
This device uses CMOS technology and has a wide voltage range. Take care to avoid pulling too much current
from the outputs as to not exceed 6 mA. Also, take care to not go over VCC voltage to avoid damage to the
device.
9.2.2 Detailed Design Procedure
1. Recommended Input Conditions
• Rise time and fall time specs: See (Δt/ΔV) in the Section 6.3 table.
• Specified high and low levels: See (VIH and VIL) in the Section 6.3 table.
• Inputs should not be pulled above VCC.
2. Recommended Output Conditions
• Load currents should not exceed 6 mA for the part
• Outputs should not be pulled above VCC.
12
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SN54HC541, SN74HC541
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SCLS305E – JANUARY 1996 – REVISED MAY 2022
9.2.3 Application Curve
1000
950
Input Transition Time (ns)
900
850
800
750
700
650
600
550
500
450
400
2
2.5
3
3.5
4
4.5
Vcc (Volts)
5
5.5
6
D001
Figure 9-2. Input Transition Time vs. VCC
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Product Folder Links: SN54HC541 SN74HC541
13
SN54HC541, SN74HC541
www.ti.com
SCLS305E – JANUARY 1996 – REVISED MAY 2022
10 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply voltage rating located in the Section 6.3
table.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, 0.1-μF is recommended; if there are multiple VCC pins, then 0.01-μF or 0.022-μF is recommended for
each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1-μF
and a 1-μF are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as
possible for best results.
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices inputs should never float.
In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two
inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not
be left unconnected because the undefined voltages at the outside connections result in undefined operational
states. The Section 6.3 section specifies the rules that must be observed under all circumstances. All unused
inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic
level that should be applied to any particular unused input depends on the function of the device. Generally they
will be tied to GND or VCC whichever makes more sense or is more convenient. It is generally acceptable to
float outputs, unless the part is a transceiver. If the transceiver has an output enable pin, it disables the output
section of the part when asserted. This does not disable the input section of the I/Os, so they cannot float when
disabled.
11.2 Layout Example
Vcc
Unused Input
Input
Output
Unused Input
Output
Input
Figure 11-1. Layout Diagram
14
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SN54HC541, SN74HC541
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SCLS305E – JANUARY 1996 – REVISED MAY 2022
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 12-1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN54HC541
Click here
Click here
Click here
Click here
Click here
SN74HC541
Click here
Click here
Click here
Click here
Click here
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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15
PACKAGE OPTION ADDENDUM
www.ti.com
18-Nov-2023
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
JM38510/65711BRA
ACTIVE
CDIP
J
20
20
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
JM38510/
65711BRA
Samples
M38510/65711BRA
ACTIVE
CDIP
J
20
20
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
JM38510/
65711BRA
Samples
SN54HC541J
ACTIVE
CDIP
J
20
20
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SN54HC541J
Samples
SN74HC541DBR
ACTIVE
SSOP
DB
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC541
Samples
SN74HC541DWR
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC541
Samples
SN74HC541N
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC541N
Samples
SN74HC541NE4
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC541N
Samples
SN74HC541NSR
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC541
Samples
SN74HC541PWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC541
Samples
SNJ54HC541FK
ACTIVE
LCCC
FK
20
55
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SNJ54HC
541FK
Samples
SNJ54HC541J
ACTIVE
CDIP
J
20
20
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
SNJ54HC541J
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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