TAS2780
SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
TAS2780 Digital Input Mono Class-D Audio Amplifier With Speaker IV Sense
1 Features
3 Description
Key Features
• 24-V Supply for Class-D Output Stage
• Y-Bridge Multi-Level Supply Architecture
• Spread Spectrum Control
• Ultrasonic Output Support up to 40 kHz
The TAS2780 is a mono, digital input Class-D audio
amplifier optimized for efficiently driving high peak
power into loudspeakers. The Class-D amplifier is
capable of delivering 25 W of continuous power into
a 4 Ω load with less than 1% THD+N at a supply
voltage of 18 V. The broad voltage input range and
the high output power makes this amplifier versatile
enough to work with battery or line powered systems.
The TAS2780 is available in a 30 pin HR-QFN
package for a compact PCB footprint.
Device Information(1)
PACKAGE
BODY SIZE (NOM)
TAS2780
HR QFN
4 mm x 3.5 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
SDA
Laptop and Desktop Computers
Smart Speakers
Tablets and Handhelds
Wireless Speakers
TMP SNS
IRQZ
ADDR
SDOUT
FSYNC
VBAT1S
PVDD
BST_P
OUT_P
SCL
OUT_N
System
Interface
+
Limiter
+
BOP
SBCLK
Class-D Amplifier
with
IV-Sense
DAC
BST_N
VSNS_P
IV-SNS
ADCs
VSNS_N
ICC
BYP_EN
PLL
Address Det
Diagnostics
Pop/Click
Over Current
Over Temp
Protection
PGND
•
•
•
•
VREG
2.7 - 5.5 V
SAR
ADC
SDZ
SDIN
2 Applications
3-24 V
1.8 V
1.8 V / 3.3 V
PVDD_SNS
(1)
PART NUMBER
AVDD
Integrated Speaker Management, Protection and EMI:
• Real-time IV-Sense for Speaker Protection
• Short and Open Load Protection
• Thermal and Over Current Protection
• Brownout Protection with Power Limiter
• Over Power and Low Battery Protection
• PVDD and VBAT1S Supply Tracking Limiters
• Thermal Foldback
• Post Filter Feedback
• Output Slew Rate Control
Up to eight TAS2780 devices can share a common
bus via I2S/TDM and I2C/SPI interfaces.
DGND
Interfaces and Control:
• SDOUT for Echo Cancellation
• I2S/TDM: 8 Channels of 32 bits up to 96 KSPS
• I2C: Selectable Addresses with Fast Mode+
• Inter-Chip Communication Bus
• 44.1 kHz to 96 kHz Sample Rates
Y-Bridge power architecture improves amplifier
efficiency by internally selecting the supplies for
optimal headroom. Brownout prevention scheme with
multiple thresholds allows reducing the gain in signal
path when the supply drops.
DREG
Power Supplies and Management:
• PVDD: 3 V to 24 V
• VBAT1S: 2.7 V to 5.5 V
• AVDD: 1.8 V
• IOVDD: 1.8 V/ 3.3 V
The TAS2780 can be used as a conventional amp
or with host-based speaker protection algorithms.
The integrated speaker voltage and current sense
provides for real time feedback of loudspeaker
conditions to the protection algorithms through a
return I2S path.
IOVDD
Efficiency (1% THDN) and Power Consumption
• 83% at 1W, 4 Ω, PVDD = 12 V, VBAT1S = 3.8 V
• 83% at 1W, 8 Ω, PVDD = 18 V, VBAT1S = 5 V
• 85% at 1W, 4 Ω, PVDD = 18 V, VBAT1S = 5 V
• 89% at 15W, 4 Ω, PVDD = 18 V, VBAT1S = 5 V
• 93% at 15W , 8 Ω, PVDD = 18 V, VBAT1S = 5 V
• 48 kHz
fs
Minimum Sample Rates
88.2
Maximum Sample Rate
96
Frequency for Passband
Ripple
fs = 96 kHz
Passband 3db Frequency
fs = 96 kHz
Passband Ripple
DC to LPF cutoff frequency
Stop Band Attenuation
kHz
0.437
fs
0.459
-0.5
≥ 0.56 fs
60
≥ 1 fs
65
Group Delay (Including Noise
DC to 0.375 fs for 96 kHz, DC blocker disabled
Gate)
fs
0.5
dB
dB
35
1/fs
16
bits
70
dB
-64
dB
SPEAKER CURRENT SENSE
Resolution
DNR
Dynamic Range
THD+N
Total Harmonic Distortion and
Pout = 15 W
Noise
Full Scale Input Current
Un-weighted, relative to 0 dBFS.
Measured at -6 dBFS. Re-scaled at 0 dBFS.
Differential Mode Gain
Frequency Response
5
0.98
20 Hz - 20 kHz
-0.1
Group Delay
A
1.02
0.1
dB
5
1/fs
16
bits
75
dB
SPEAKER VOLTAGE SENSE
Resolution
DNR
Dynamic Range
Un-Weighted, Relative 0 dBFS
THD+N
Total Harmonic Distortion and
Pout = 15 W
Noise
-71
dB
Full Scale Input Voltage
16
VPK
Differential Mode Gain
Frequency Response
0.98
20 Hz - 20 kHz
1.02
-0.1
Group Delay
0.1
5
dB
1/fs
SPEAKER VOLTAGE/CURRENT SENSE RATIO
Gain Linearity
Pout ≥ 40 mW to 0.1% THD+N, using a 40 Hz -40 dBFS
pilot tone, PWR_MODE0 and PWR_MODE1
Gain error over temperature
-20°C to 70°C, Pout = 1 W
-1
1
%
±0.6
%
300
ns
Brownout Prevention Latency
BOP_SRC=1
to First Attack
19
µs
Thermal Shutdown
Temperature
142
°C
1.5
s
Phase Error between V and I
PROTECTION CIRCUITRY
Thermal Shutdown Retry
8
OTE_RETRY=1
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
TA = 25 °C, PVDD = 18 V, VBAT1S = 3.8 V, AVDD = 1.8V, IOVDD =1.8 V, RL = 4Ω + 15µH, fin = 1 kHz, fs = 48 kHz, Gain = 21
dBV, SDZ = 1, NG_EN=0, EN_LLSR=0, PWR_MODE1(2), measured filter free as in Section 7 (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
5.5
6.6
A
2
2.6
A
Output Over Current Limit on
PVDD
Output to Output, Output to GND or Output to PVDD Short
Output Over Current Limit on
VBAT1S
Output to Output, Output to GND or Output to VBAT1S
Short
VBAT1S Undervoltage
Lockout Threshold
UVLO is asserted
UVLO is de-asserted
2.16
AVDD Undervoltage Lockout
Threshold
UVLO is asserted
1.45
UVLO is de-asserted
1.51
IOVDD Undervoltage Lockout UVLO is asserted
Threshold
UVLO is de-asserted
1.13
VBAT1S Internal LDO
Undervoltage Lockout
Threshold
UVLO is asserted
2
1.25
4
MAX
UNIT
V
V
V
V
TYPICAL CURRENT CONSUMPTION
Hardware Shutdown
Software Shutdown
Noise Gate Mode
Idle Mode - PWR_MODE1
SDZ = 0, PVDD
0.05
SDZ = 0, VBAT1S
0.01
SDZ = 0, AVDD
0.14
SDZ = 0, IOVDD
0.005
All Clocks Stopped, PVDD
0.05
All Clocks Stopped, VBAT1S
0.5
All Clocks Stopped, AVDD
10.2
All Clocks Stopped, IOVDD
0.55
fs = 48 kHz, PVDD
0.012
fs = 48 kHz, VBAT1S
0.13
fs = 48 kHz, AVDD
3
fs = 48 kHz, IOVDD
0.01
fs = 48 kHz, PVDD
0.04
fs = 48 kHz, VBAT1S
2.2
fs = 48 kHz, AVDD, IV Sense = Enabled
9.2
fs = 48 kHz, AVDD, IV Sense = Disabled
6.8
fs = 48 kHz, IOVDD
0.02
fs = 48 kHz, PVDD
Idle Mode - PWR_MODE2
Idle Mode - PWR_MODE0
(1)
(2)
(3)
(4)
µA
µA
mA
mA
3
fs = 48 kHz, AVDD, IV Sense = Enabled
9.2
fs = 48 kHz, AVDD, IV Sense = Disabled
6.8
fs = 48 kHz, IOVDD
0.02
fs = 48 kHz, PVDD
2.28
fs = 48 kHz, VBAT1S
2.1
fs = 48 kHz, AVDD, IV Sense = Enabled
9.2
fs = 48 kHz, AVDD, IV Sense = Disabled
6.8
fs = 48 kHz, IOVDD
0.02
mA
mA
PWR_MODE0: CDS_MODE=10, VBAT1S_MODE=0
PWR_MODE1: CDS_MODE=00, VBAT1S_MODE=0
PWR_MODE2: CDS_MODE=11, VBAT1S_MODE=1
PWR_MODE3: CDS_MODE=01, VBAT1S_MODE=0
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
6.6 I2C Timing Requirements
TA = 25 °C, AVDD = IOVDD = 1.8 V (unless otherwise noted)
MIN
MAX
UNIT
100
kHz
Standard-Mode
fSCL
SCL clock frequency
0
tHD;STA
Hold time (repeated) START condition. After this period, the first clock pulse is
generated.
4
μs
tLOW
LOW period of the SCL clock
4.7
μs
tHIGH
HIGH period of the SCL clock
4
μs
tSU;STA
Setup time for a repeated START condition
tHD;DAT
Data hold time: For I2C bus devices
tSU;DAT
Data set-up time
tr
SDA and SCL rise time
1000
tf
SDA and SCL fall time
300
tSU;STO
Set-up time for STOP condition
tBUF
Bus free time between a STOP and START condition
Cb
Capacitive load for each bus line
4.7
μs
3.45
250
μs
ns
4
ns
ns
μs
4.7
μs
400
pF
400
kHz
Fast-Mode
fSCL
SCL clock frequency
tHD;STA
Hold time (repeated) START condition. After this period, the first clock pulse is
generated.
0
0.6
μs
tLOW
LOW period of the SCL clock
1.3
μs
tHIGH
HIGH period of the SCL clock
0.6
μs
tSU;STA
Setup time for a repeated START condition
0.6
tHD;DAT
Data hold time: For I2C bus devices
tSU;DAT
Data set-up time
0
μs
0.9
100
μs
ns
tr
SDA and SCL rise time
20 + 0.1 ×
Cb[pF]
tf
SDA and SCL fall time
20 + 0.1 ×
Cb[pF]
tSU;STO
Set-up time for STOP condition
0.6
tBUF
Bus free time between a STOP and START condition
1.3
Cb
Capacitive load for each bus line (10pF to 400pF)
400
pF
fSCL
SCL clock frequency
1000
kHz
tHD;STA
Hold time (repeated) START condition. After this period, the first clock pulse is
generated.
tLOW
tHIGH
300
ns
300
ns
μs
μs
Fast-Mode Plus
0.26
μs
LOW period of the SCL clock
0.5
μs
HIGH period of the SCL clock
0.26
μs
tSU;STA
Setup time for a repeated START condition
0.26
μs
tHD;DAT
Data hold time: For
I2C
0
μs
tSU;DAT
Data set-up time
tr
SDA and SCL Rise Time
120
tf
SDA and SCL Fall Time
120
tSU;STO
Set-up time for STOP condition
0.26
tBUF
Bus free time between a STOP and START condition
0.5
Cb
Capacitive load for each bus line
bus devices
50
ns
ns
ns
μs
μs
550
pF
6.7 TDM Port Timing Requirements
TA = 25 °C, AVDD = IOVDD = 1.8 V, 20 pF load on all outputs(unless otherwise noted)
MIN
MAX
UNIT
tH(SBCLK)
SBCLK high period
20
ns
tL(SBCLK)
SBCLK low period
20
ns
10
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
TA = 25 °C, AVDD = IOVDD = 1.8 V, 20 pF load on all outputs(unless otherwise noted)
MIN
MAX
UNIT
tSU(FSYNC)
FSYNC setup time
8
ns
tHLD(FSYNC)
FSYNC hold time
8
ns
tSU(SDIN/ICC)
SDIN/ICC setup time
8
ns
tHLD(SDIN/ICC)
SDIN/ICC hold time
8
ns
td(SBCLK_SDOUT/ICC)
SBCLK to SDOUT/ICC
delay
50% of SBCLK to 50% of SDOUT/ICC,
IOVDD = 1.8 V
30
ns
tr(SBCLK)
SBCLK rise time
10 % - 90 % Rise Time
8
ns
tf(SBCLK)
SBCLK fall time
90 % - 10 % Fall Time
8
ns
SDA
tBUF
SCL
tLOW
th(STA)
tr
th(STA)
STO
STA
th(DAT)
tHIGH
tsu(STA)
tf
Figure 6-1.
I2C
tsu(DAT)
tsu(STO)
STA
STO
Timing Diagram
Figure 6-2. TDM and ICC Timing Diagram
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
6.8 Typical Characteristics
At TA = 25 0C, fs = 48 kHz, Class-D Switching Frequency = 384 kHz, input signal fIN = 1kHz - Sine, Load = 4Ω
+15 μH, unless otherwise noted.
0
0
VBAT
VBAT
VBAT
VBAT
3.8 V, PVDD = 18 V
3.8 V, PVDD = 12 V
5 V, PVDD = 18 V
5 V, PVDD = 21 V
VBAT
VBAT
VBAT
VBAT
-20
THD+N (dB)
THD+N (dB)
-20
=
=
=
=
-40
-60
-80
=
=
=
=
3.8 V, PVDD = 18 V
3.8 V, PVDD = 12 V
5 V, PVDD = 18 V
5 V, PVDD = 21 V
-40
-60
-80
-100
0.001
0.01
0.1
POUT (W)
1
10
-100
0.001
50
0.01
0.1
POUT (W)
1
PWR_MODE1
Figure 6-4. THD+N vs Output Power
0
0
VBAT
VBAT
VBAT
VBAT
=
=
=
=
3.8 V, PVDD = 18 V
3.8 V, PVDD = 12 V
5 V, PVDD = 18 V
5 V, PVDD = 21 V
-40
-60
-80
0.01
0.1
POUT (W)
1
fIN= 6.667 kHz
10
-60
-100
0.001
50
PWR_MODE1
-77
THD+N (dB)
THD+N (dB)
-78
-79
-80
-85
10
=
=
=
=
=
=
3.8 V, PVDD = 18 V
3.8 V, PVDD = 12 V
5 V, PVDD = 18 V
3.4 V, PVDD = 21 V
5 V, PVDD = 21 V
5.5 V, PVDD = 23 V
100
1000
Frequency (Hz)
POUT= 0.1 W
10K 20K
PWR_MODE1
Figure 6-7. THD+N vs Frequency
0.1
POUT (W)
1
10
50
PWR_MODE0
Figure 6-6. THD+N vs Output Power
-76
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
0.01
fIN= 6.667 kHz
-75
12
3.8 V, PVDD = 18 V
3.8 V, PVDD = 12 V
5 V, PVDD = 18 V
5 V, PVDD = 21 V
-40
Figure 6-5. THD+N vs Output Power
-84
=
=
=
=
-80
-100
0.001
-83
VBAT
VBAT
VBAT
VBAT
-20
THD+N (dB)
THD+N (dB)
-20
-82
50
PWR_MODE0
Figure 6-3. THD+N vs Output Power
-81
10
-65
-67
-69
-71
-73
-75
-77
-79
-81
-83
-85
-87
-89
-91
-93
-95
10
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
100
POUT = 1 W
=
=
=
=
=
=
3.8 V, PVDD = 12 V
3.8 V, PVDD = 18 V
5 V, PVDD = 18 V
3.4 V, PVDD = 21 V
5 V, PVDD = 21 V
5.5 V, PVDD = 23 V
1000
Frequency (Hz)
10K 20K
PWR_MODE1
Figure 6-8. THD+N vs Frequency
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
45
ICN A Weighed (uV)
42
39
36
33
VBAT = 3.8 V, AVDD and IOVDD = 1.8 V
30
4
6
8
10
12
14
16
PVDD (V)
PWR_MODE1
20
22
24
PWR_MODE0
Figure 6-9. ICN vs VBAT
Figure 6-10. ICN vs PVDD
6.05
6.15
VBAT = 3.8 V, PVDD = 18 V
VBAT = 5 V, PVDD = 18 V
6.125
6.02
Class D Amplitude (dBV)
Class D Amplitude (dBV)
18
5.99
5.96
5.93
6.1
6.075
6.05
6.025
6
5.975
5.95
5.925
5.9
5.9
20
100
1000
Frequency (Hz)
10K
20
20K
100
fs = 96 kHz
PWR_MODE1
10K 20K 40K
PWR_MODE3
Figure 6-12. Class-D Amplitude vs Frequency
Figure 6-11. Class-D Amplitude vs Frequency
90
32.5
30
27.5
25
22.5
20
17.5
15
12.5
10
7.5
5
2.5
0
THDN = 0.1 %
THDN = 1 %
THDN = 10 %
80
70
Efficiency (%)
Output Power (W)
1000
Frequency (Hz)
60
50
40
30
PVDD
PVDD
PVDD
PVDD
20
10
2
4
VBAT1S = 5 V
6
8
10
12
14
PVDD (V)
16
18
20
22
24
0
0.02
PWR_MODE0/ PWR_MODE1
Figure 6-13. Output Power vs PVDD
0.1
=
=
=
=
12
18
18
21
V,
V,
V,
V,
VBAT
VBAT
VBAT
VBAT
1
POUT (W)
=
=
=
=
3.8 V, AVDD = 1.8 V
3.8 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
10
25
PWR_MODE1
Figure 6-14. Efficiency vs Output Power
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90
100
80
90
70
80
70
60
Efficiency (%)
Efficiency (%)
SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
50
40
30
60
50
40
30
PVDD
PVDD
PVDD
PVDD
20
10
0
0.02
=
=
=
=
12
18
18
21
V,
V,
V,
V,
VBAT
VBAT
VBAT
VBAT
0.1
=
=
=
=
3.8 V, AVDD = 1.8 V
3.8 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
1
(W)
POUT
10
PVDD
PVDD
PVDD
PVDD
20
10
0
0.02
25
0.1
12
18
18
21
V,
V,
V,
V,
VBAT
VBAT
VBAT
VBAT
=
=
=
=
3.8 V, AVDD = 1.8 V
3.8 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
1
POUT (W)
Load = 8Ω
PWR_MODE0
10
20
PWR_MODE1
Figure 6-16. Efficiency vs Output Power
Figure 6-15. Efficiency vs Output Power
120
100
90
110
80
100
70
60
PSRR (dB)
Efficiency (%)
=
=
=
=
50
40
90
80
70
30
20
PVDD
PVDD
PVDD
PVDD
10
0
0.02
=
=
=
=
12
18
18
21
0.1
POUT
V,
V,
V,
V,
VBAT
VBAT
VBAT
VBAT
1
(W)
Load = 8Ω
=
=
=
=
60
3.8 V, AVDD = 1.8 V
3.8 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
10
40
20
20
1000
Frequency (Hz)
10K
20K
PWR_MODE1
Figure 6-18. AVDD PSRR vs Frequency
140
130
130
120
120
110
110
PSRR (dB)
140
100
90
80
100
90
80
VBAT = 3.8 V, PVDD = 18 V
VBAT = 5 V, PVDD = 18 V
VBAT = 3.4 V, PVDD = 21 V
70
VBAT = 3.8 V, PVDD = 18 V
VBAT = 5 V, PVDD = 18 V
VBAT = 3.4 V, PVDD = 21 V
70
60
60
20
100
1000
Frequency (Hz)
10K
20K
20
PWR_MODE1
Figure 6-19. VBAT1S PSRR vs Frequency
14
100
PWR_MODE0
Figure 6-17. Efficiency vs Output Power
PSRR (dB)
AVDD = 1.8 V, PVDD = 18 V, VBAT = 3.8 V
AVDD = 1.95 V, PVDD = 21 V, VBAT = 3.4 V
AVDD = 1.65 V, PVDD = 23 V, VBAT = 2.7 V
50
100
1000
Frequency (Hz)
10K
20K
PWR_MODE1
Figure 6-20. PVDD PSRR vs Frequency
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1.4
1
0.8
0.6
0.6
VBAT
VBAT
VBAT
VBAT
VBAT
VBAT
=
=
=
=
=
=
3.8 V, PVDD = 12 V
3.8 V, PVDD = 18 V
5 V, PVDD = 18 V
5 V, PVDD = 21 V
3.4 V, PVDD = 21 V
5.5 V, PVDD = 23 V
0.4
V/ISENSE Gain Linearity (%)
V/ISENSE Gain Linearity (%)
1.2
0.4
0.2
0
-0.2
-0.4
0.2
0
-0.2
-0.4
VBAT
VBAT
VBAT
VBAT
VBAT
-0.6
-0.6
-0.8
0.02
0.1
1
POUT (W)
10
-0.8
0.02
25
0.1
3.8 V, PVDD = 12 V
3.8 V, PVDD = 18 V
5 V, PVDD = 18 V
5 V, PVDD = 21 V
3.4 V, PVDD = 21 V
1
POUT (W)
PWR_MODE1
10
25
PWR_MODE0
Figure 6-21. V/I Gain Linearity vs Output Power
Figure 6-22. V/I Gain Linearity vs Output Power
9.5
1
VBAT = 3.8 V, PVDD = 18 V
0.8
PVDD = 18 V, VBAT = 3.8 V, IOVDD = 1.8 V
AVDD Idle Current (mA)
0.6
V/ISENSE Linearity (%)
=
=
=
=
=
0.4
0.2
0
-0.2
-0.4
-0.6
9.3
9.1
-0.8
-1
-20
-10
0
10
20
30
40
Temperature (C)
50
60
8.9
1.6
70
1.65
1.7
1.75
1.8
1.85
AVDD (V)
PWR_MODE1
1.9
1.95
2
PWR_MODE1
Figure 6-23. V/I Linearity vs Temperature
Figure 6-24. AVDD Idle Current vs AVDD
2.5
3.5
PVDD = 18 V, AVDD = 1.8 V, IOVDD = 1.8 V
VBAT = 3.8 V, AVDD = 1.8 V, IOVDD = 1.8 V
3
PVDD Idle Current (mA)
VBAT Idle Current (mA)
2.3
2.5
2
2.1
1.9
1.7
1.5
1.3
1.1
1.5
2.6
3
3.4
3.8
4.2
VBAT (V)
4.6
5
5.4
0.9
4
6
PWR_MODE1
Figure 6-25. VBAT Idle Current vs VBAT
8
10
12
14
16
PVDD (V)
18
20
22
24
PWR_MODE0
Figure 6-26. PVDD Idle Current vs PVDD
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7 Parameter Measurement Information
The typical characteristics for the device are measured using the Bench Evaluation Module (EVM) and an
Audio Precision Analyzer. A PSIA interface is used to allow the I2S interface to be driven directly into the Audio
Precision Analyzer.
In some measurements (THD+N, ICN, DNR, and so forth), Class-D output terminals are connected to the Audio
Precision Analyzer analog inputs through a Differential-to-Single Ended (D2S) filter as shown below. The D2S
filter contains a second order passive pole at 120 kHz and an instrumenation amplifier. The D2S filter ensures
the TAS2780 high performance Class-D amplifier has its outputs filtered and buffered before processed. This
prevents measurement errors due to loading effects of AUX-00XX filter on the Class-D outputs.
Figure 7-1. Differential to Single Ended (D2S) Filter
8 Detailed Description
8.1 Overview
The TAS2780 is a mono digital input Class-D amplifier optimized for applications where efficient battery
operation and small solution size are critical. It integrates speaker IV (current/voltage) sensing and battery
tracking limiting with brown out prevention. The device operates using TDM/I2S and I2C interfaces.
Table 8-1. Full Scales
16
Input/Output Signal
Full Scale Value
Class-D Output
21 dBV
Voltage Monitor
23 V
Current Sense
5A
Voltage Sense
16 Vpk
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8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Device Address Selection
The TAS2780 operates using a TDM/I2S interface. Audio input and output are provided via the FSYNC, SBCLK,
SDIN and SDOUT pins using formats including I2S, Left Justified and TDM. Configuration and status are
provided via the SDA and SCL pins using the I2C protocol.
The table below illustrates how to configure the device for I2C address . The peripheral addresses are shown left
shifted by one bit with the R/W bit set to 0 (for example, {ADDR[6:0],1b0}). Resistors with tolerance better than
5% must be used for setting the address configuration.
Table 8-2. I2C Address Selection
I2C
Address
ADDR PIN
0x70
0x72
0x74
0x76
0x78
0x7A
0x7C
0x7E
Short to
GND
470 Ω to
GND
470 Ω to
AVDD
2.2 kΩ to
GND
2.2 kΩ to
AVDD
10 kΩ to
GND
10 kΩ to
AVDD
Short to AVDD
The TAS2780 has a global 7-bit I2C address 0x80. When enabled, the device will additionally respond to I2C
commands at this address regardless of the ADDR pin settings. This is used to speed up device configuration
when using multiple TAS2780 devices and programming similar settings across all devices. The I2C ACK/ NACK
cannot be used during the multi-device writes since multiple devices are responding to the I2C command.
The I2C CRC function should be used to ensure each device properly received the I2C commands. At the
completion of writing multiple devices using the global address, the CRC at I2C_CKSUM register should be
checked on each device using the local address for a proper value. The global I2C address can be disabled
using I2C_GBL_EN register bit. The I2C address is detected by automatically sampling the ADDR pin when
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SDZ pin is released. Additionally, the address may be re-detected by setting I2C_AD_DET register bit high after
power up and the ADDR pin will be re-sampled.
8.3.2 Register Organization
Device configuration and coefficients are stored using a page and book scheme. Each page contains 128 bytes
and each book contains 256 pages. All device configuration registers are stored in book 0 which is the default
setting at power up and after a software reset. The book and page can be set by the BOOK[7:0] bits of register
from and PAGE[7:0] bits of register from .
Note
Programming register bits from book 0x00, page 0x04 needs to be done in groups of four registers (32
bit format), each byte corresponding to a register and with less significant byte corresponding to the
highest register address. For instance, when programing limiter maximum threshold, in registers 0x0C
- 0x0F of page 0x04, the MSBs will be in register 0x0C and the LSBs in register 0x0F.
8.4 Device Functional Modes
8.4.1 TDM Port
The TAS2780 provides a flexible serial audio port. The port can be configured to support a variety of formats
including stereo I2S, Left Justified and TDM. Mono audio playback is available via the SDIN pin. The SDOUT pin
is used to transmit sample streams including speaker voltage and current sense, PVDD voltage, die temperature
and channel gain.
The TDM serial audio port supports up to 16 of 32 bit time slots at 44.1/48 kHz or 8 of 32 bit time slots at a
88.2/96 kHz sample rate. Valid SBCLK to FSYNC ratios are 16, 24, 32, 48, 64, 96, 128, 192, 256, and 512. The
device can automatically detect the number of time slots and it does not need to be programmed.
By default, the TAS2780 will automatically detect the PCM playback sample rate. This feature can be disabled
and the device can manually be configured by setting the AUTO_RATE register bit high.
The SAMP_RATE[2:0] and SAMP_RATIO[3:0] register bits are used to configure the PCM audio sample rate
when AUTO_RATE register bit is high (auto detection of TDM sample rate is disabled). The TAS2780 employs
a robust clock fault detection engine that will automatically volume ramp down the playback path if FSYNC does
not match the configured sample rate (if AUTO_RATE = 1) or the ratio of SBCLK to FSYNC is not supported
(minimizing any audible artifacts). Once the clocks are detected to be valid in both frequency and ratio, the
device will automatically volume ramp the playback path back to the configured volume and resume playback.
When using the auto rate detection the sampling rate and SBCLK to FSYNC ratio detected on the TDM bus are
reported back on the read-only register bits FS_RATE[2:0] and FS_RATIO[3:0].
The TAS2780 supports a 12 MHz SBCLK operation. The system will detect or should be manually configured
for a ratio of 125 or 250. In this specific ratio the last 32 bit slot should not be used to transmit data over TDM
(SDOUT) or ICC (Section 8.4.2.10.1), as data will be truncated.
Figure 8-1 and Figure 8-2 below illustrate the receiver frame parameters required to configure the port for
playback. A frame begins with the transition of FSYNC from either high to low or low to high (set by the
FRAME_START register bit). FSYNC and SDIN are sampled by SBCLK using either the rising or falling edge
(set by the RX_EDGE register bit). The RX_OFFSET[4:0] register bits define the number of SBCLK cycles from
the transition of FSYNC until the beginning of time slot 0. This is typically set to a value of 0 for Left Justified
format and 1 for an I2S format.
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SBCLK
FSYNC
SDIN
MSB
MSB-1
RX_OFFSET
LSB+1
LSB
RX_WLEN
RX_SLEN
Figure 8-1. TDM RX Time Slot with Left Justification
SBCLK
FSYNC
Slot 0
Bit 31
SDIN
RX_OFFSET
Slot0
Bit 0
Time Slot 0
Slot 1
Bit 31
Slot1
Bit 0
Slot2
Bit 31
Time Slot 1
Figure 8-2. TDM RX Time Slots
The RX_SLEN[1:0] register bits set the length of the RX time slot to 16, 24 or 32 (default) bits. The length of the
audio sample word within the time slot is configured by the RX_WLEN[1:0] register bits to 16, 20, 24 (default) or
32 bits. The RX port will left justify the audio sample within the time slot by default, but this can be changed to
right justification via the RX_JUSTIFY register bit. The TAS2780 supports mono and stereo down mix playback
([L+R]/2). By default the device will playback mono from the time slot equal to the I2C base address offset (set by
the ADDR pin) for playback. The RX_SCFG[1:0] register bits can be used to override the playback source to the
left time slot, right time slot or stereo down mix set by the RX_SLOT_L[3:0] and RX_SLOT_R[3:0] register bits.
If time slot selection places reception either partially or fully beyond the frame boundary, the receiver will return a
null sample equivalent to a digitally muted sample.
The TDM port can transmit a number of sample streams on the SDOUT pin including speaker voltage sense,
speaker current sense, interrupts and status, PVDD voltage, die temperature and channel gain. Figure 8-3 below
illustrates the alignment of time slots to the beginning of a frame and how a given sample stream is mapped to
time slots.
SBCLK
FSYNC
Slot 0
Bit 7
SDOUT
TX_OFFSET
Slot0
Bit 0
Time Slot 0
Slot 1
Bit 7
Slot1
Bit 0
Slot2
Bit 7
Time Slot 1
Ex: V_SENSE[15:0]
Figure 8-3. TDM Port TX Diagram
Either the rising or falling edge of SBCLK can be used to transmit data on the SDOUT pin. This can be
configured by setting the TX_EDGE register bit. The TX_OFFSET[2:0] register bits define the number of SBCLK
cycles between the start of a frame and the beginning of time slot 0. The TDM and ICC TX can either transmit
logic 0 or Hi-Z depending on the setting of the TX_FILL register bit. An optional bus keeper will weakly hold the
state of SDOUT and ICC pins when all devices driving the bus are Hi-Z. Since only one bus keeper is required
on SDOUT, this feature can be disabled via the TX_KEEPEN register bit. The bus keeper can be configured to
hold the bus for only 1LSB or Always using TX_KEEPLN register bit. Additionally, the keeper LSB can be driven
for a full cycle or half of cycle using TX_KEEPCY register bit.
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TX_FILL register bit is used in mono systems where there is only one amplifier on I2S bus. All the slots unused
by the amplifier will be filled with zeros when TX_FILL register bit is set to low.
The SDOUT_HIZ registers from page 0x01 are useful when multiple devices are on the same I2S bus. Each
device does not know the configuration of slots in the other devices on the bus. It is required at the system level
to program the SDOUT_HIZ registers appropriately, in such way that the settings are done correctly and do not
create any contention, internally and externally.
Each sample stream is composed of either one or two 8 bit time slots. Speaker voltage sense and speaker
current sense sample streams are 16 bit precision, so they will always utilize two TX time slots. The PVDD and
VBAT1S voltage streams are 10 bit precision, and can either be transmitted left justified in a 16 bit word (using
two time slots) or can be truncated to 8 bits (the top 8 MSBs) and be transmitted in a single time slot. This is
configured by setting PVDD_SLEN and VBAT1S_SLEN register bits. The die temperature and the gain are both
8 bit precision and are transmitted in a single time slot.
The time slot register for each sample stream defines where the MSB transmission begins. By default
VSNS_SLOT[5:0] register bits are set to 2 (decimal), the upper 8 MSBs will be transmitted in time slot 2 and the
lower 8 LSBs will be transmitted in time slot 3. This sample stream can be individually enabled or disabled by
using VSNS_TX register bit. The ISNS_SLOT[5:0] register bits are set by default to 0 (decimal) and the sample
stream can be enabled or disabled by using ISNS_TX register bit. The enable/disable feature of the streams is
useful to manage limited TDM bandwidth since it may not be necessary to transmit all streams for all devices on
the bus.
It is important to ensure that time slot assignments for actively transmitted sample streams do not conflict. This
will avoid producing unpredictable transmission results in the conflicting bit slots (i.e. the priority is not defined).
The current and voltage values are transmitted at the full 16 bit measured values by default. The
IVMON_LEN[1:0] register bits can be used to transmit only the 8 MSB bits in one slot or 12 MSB bits values
across multiple slots. The special 12 bit mode is used when only 24 bit I2S/ TDM data can be processed by the
host processor. The device should be configured with the voltage-sense slot and current-sense slot off by 1 slot
and will consume 3 consecutive 8 bit slots. In this mode the device will transmit the first 12 MSB bits followed by
the second 12 MSB bits specified by the preceding slot.
If time slot selections place transmission beyond the frame boundary, the transmitter will truncate transmission at
the frame boundary.
The time slots for VBAT1S, PVDD and temperature measurements are set using VBAT1S_SLOT[5:0],
PVDD_SLOT[5:0] and TEMP_SLOT[5:0] register bits. To enable each of the sample streams, register bits
VBAT1S_TX, PVDD_TX and TEMP_TX must be set high. The slot length is selected by VBAT1S_SLEN and
PVDD_SLEN register bits.
For TDM final processed audio slot, enable and length settings, use AUDIO_SLOT[5:0], AUDIO_TX and
AUDIO_SLEN register bits.
Information about status of slots can be find in STATUS_SLOT[5:0] register bits. STATUS_TX register bit set
high enables the status transmit.
The slot configuration for the TX limiter gain reduction can be set between 0 (default) and 63 by setting
GAIN_SLOT[5:0] register bits. It is used for ICC (Section 8.4.2.10) and can be either over the TDM bus or ICC
bus. To use this feature, the register bit GAIN_TX needs to be set high.
8.4.2 Playback Signal Path
8.4.2.1 High Pass Filter
Excessive DC and low frequency content in audio playback signal can damage loudspeakers. The
TAS2780 employs a high-pass filter (HPF) to prevent this from occurring for the PCM playback path. The
HPF_FREQ_PB[2:0] register bits set the corner frequencies of HPF. The filter can be bypassed by setting the
register bits to 3'b000.
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8.4.2.2 Amplifier Inversion
The TAS2780 will output a non-inverted signal to the OUT_P and OUT_N pins. The output can be inverted with
respect to the digital input value by setting the AMP_INV register bit to high.
8.4.2.3 Digital Volume Control and Amplifier Output Level
The gain from audio input to speaker terminals is controlled by setting the amplifier output level and the digital
volume control (DVC).
Amplifier output level settings are programmed using the AMP_LVL[4:0] register bits. The amplifier levels are
presented in Section 8.9.9. The Digital Volume Control (DVC) is set by default to 0 dB. It should be noted that
these levels may not be achievable because of analog clipping in the amplifier, so they should be used only to
convey gain.
Equation (1) calculates amplifier output voltage:
VAMP= INPUT+ADVC+AAMP
(1)
where
•
•
•
•
VAMP is the amplifier output voltage in dBV
INPUT is the digital input amplitude as a number of dB with respect to 0 dBFS
ADVC is the digital volume control setting as a number of dB
AAMP is the amplifier output level setting as a number of dBV
The DVC is configurable from 0 dB to -100 dB in 0.5 dB steps by setting the DVC_LVL[7:0] register bits. Settings
greater than C8h are interpreted as mute. When a change in digital volume control occurs, the device ramps the
volume to the new setting based on the DVC_RAMP_RATE[1:0] register bits status.
If DVC_RAMP_RATE[1:0] bits are set to 2'b11 the volume ramping is disabled. This setting can be used
to speed up startup, shutdown and digital volume changes when volume ramping is handled by the system
controller.
The Class-D amplifier uses a closed-loop architecture. The approximate threshold for output signal clipping is
given by equation (2).
(2)
where:
•
•
•
•
•
VPK is the maximum peak un-clipped output voltage in V
VSUP is the power supply of Class-D output stage
RL is the speaker load in Ω
RP is the parasitic resistance on PCB (routing, filters) in Ω
RFET is the power stage total resistance (HS FET, LS FET, Sense Resistor, bonding, packaging) in Ω
When VBAT1S supplies Class-D output stage typical RFET value is 0.5 Ω. For PVDD supply RFET typical value is
0.25 Ω.
8.4.2.3.1 Safe Mode
The safe mode is a single bit that will enable an 18 dB attenuation in the forward path. It is similar to setting the
DVC_LVL[7:0] register bits to 24h (-18 dB). When the SMODE_EN bit is set to high, the DVC_LVL[7:0] register
bits will be ignored and volume ramping disabled.
8.4.2.4 VBAT1S Supply
The TAS2780 can operate with or without an external VBAT1S supply. When configured without an external
VBAT1S supply, the PVDD voltage will be used with an internal LDO to generate this supply voltage. A
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decoupling capacitor should still be populated as recommended in Table 9-1. In this case, VBAT1S_MODE
bit should be set to high before transitioning from software shutdown. More details about VBAT1S supply modes
of operation can be found in Section 11.1.
8.4.2.5 Low Voltage Signaling (LVS)
The TAS2780 monitors the absolute value of the audio stream.
When the input is initially above the programmed fixed threshold set by LVS_FTH[4:0] register bits, the Class-D
is supplied by the PVDD rail. When the signal level drops below this threshold for longer than the hysteresis time
defined by LVS_HYS[3:0] bits the Class-D supply will switch to VBAT1S (see Figure 8-4).
All values of LVS_HYS[3:0] bit settings will ensure the remaining samples will be output before BYP_EN pin is
asserted (high). When multiple devices have BYP_EN pin connected together, any of the devices requiring a
supply voltage higher than the threshold will pull the open drain output low.
When the signal level crosses above the programmed fixed threshold set by LVS_FTH[4:0] bits the Class-D
supply will switch to PVDD.
The open-drain BYP_EN pin will be de-asserted (actively pulling the output low) after a delay programmed by
the LVS_DLY[1:0] register bits . The Y Bridge will switch from the VBAT1S supply to the PVDD supply after a
delay programmed by the CDS_DLY[1:0] register bits.
The fixed LVS threshold is set based on the output signal level and is measured in dBFS.
By default, the LVS threshold is configured to be a value relative to the VBAT1S voltage. The LVS_TMODE bit is
set to high and the LVS_RTH[3:0] register bits are set to 3'b010 (0.7 V from VBAT1S).
Figure 8-4. Low Voltage Signaling
The LVS fixed thresholds, when CDS_MODE[1:0]=11 (PWR_MODE2 from Section 11.1), can be set using
register bits LVS_FTH_LOW[1:0]. When CDS_MODE[1:0]=00 (PWR_MODE1 from Section 11.1) the fixed
thresholds should be set with register bits LVS_FTH[4:0].
BOP, Limiter, Thermal Foldback and Thermal Gradient gain attenuations should not be taken into account for
calculating LVS threshold.
8.4.2.6 Y-Bridge
The TAS2780 Class-D output uses a Y-Bridge configuration to improve efficiency during playback. The LVS
(Section 8.4.2.5) is internally used to select between the PVDD and VBAT1S supplies. This feature is enabled by
setting CDS_MODE[1:0] bits to 2'b00 when both PVDD and VBAT1S are supplied externally to the device. In this
case the VBAT1S rail must be capable of delivering power (up to 1 W).
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If not configured to Y-bridge mode the device will use only the selected supply for Class-D output even if
clipping would occur. The device can operate using only PVDD to supply Class-D output. In this configuration the
VBAT1S can be provided from external supply (register bit VBAT1S_MODE=0) or generated by an internal LDO
(register bit VBAT1S_MODE=1). In this case CDS_MODE[1:0] bits should be set to 2'b10.
The TAS2780 Y-Bridge with low power on VBAT1S can be used to switch to the VBAT1S rail only at very
low power when close to idle. This will reduce the Class-D output swing when near idle and limit the current
requirements of the VBAT1S supply. Set the CDS_MODE[1:0] register to 2'b11 for this mode.
See Section 11.1 for details on programming the power mode of operation.
When in Y-Bridge mode, if the PVDD falls below (VBAT1S + 2.5 V) level the Y-bridge will stop switching between
supplies and will remain on the PVDD supply.
8.4.2.7 Noise Gate
The TAS2780 has a noise-gate feature that monitors the input signal and powers down the Class-D when the
signal goes below the set threshold set by NG_LVL[1:0] bits for longer than the time set by NG_HYST[2:0]
register bits. When the signal goes above the threshold the Class-D will re-power in seven samples, before
the samples applied to the audio input interface reach the Class-D bridge. This feature is enabled by setting
NG_EN bit to high. Once enabled it is able to power up and down the channel within the device processing
delay, with no additional external control. Volume ramping can be also used during noise gate operations by
setting NG_DVR_EN bit to low.
The noise gate can be configured with finer resolution at the expense of additional I2C writes. Use NGFR_EN bit
to enable this mode and register bits NGFR_LVL[23:0] to set the fine resolution. The fine resolution hysteresis is
set using NGFR_HYST[18:3] register bits.
8.4.2.8 Supply Tracking Limiter with Brown Out Prevention
The TAS2780 contains a supply tracking limiter to control distortion and brownout prevention to mitigate
brownout events. The gain reduction that occurs due to this block can be aligned across multiple devices
using the Inter Chip Gain Alignment (ICGA) (Section 8.4.2.10) feature. The maximum device attenuation set by
DEV_MAX_ATTN[6:0] register bits can be used to limit the combination of the limiter and brownout attenuation.
The Supply Tracking Limiter (STL) (Section 8.4.2.8.1) and the Brownout Prevention (BOP) (Section 8.4.2.8.2)
are configured independently. The ICGA, if enabled, keeps multiple device gains in sync if the STL and BOP
need to reduce the gain. However, the BOP will take priority in the device. In order to prevent the STL and BOP
from both making simultaneous adjustments to the system, the STL and ICGA will be paused once the BOP
engages, until it fully releases.
The attenuation applied to the device can be selected to be either the sum of the limiter attenuation (ICLA) and
Brownout attenuation (ICBA) or the maximum of the two of them by setting the ICG_MODE register bit.
8.4.2.8.1 Supply Tracking Limiter (STL)
The TAS2780 monitors PVDD supply voltage and the audio signal to automatically decrease gain when the
audio signal peaks exceed a programmable threshold. This helps prevent clipping and extends playback time
through end of charge battery conditions.
The Supply Tracking Limiter feature is enabled by setting the LIM_EN bit register to high.
Configurable attack rate, hold time and release rate are provided to shape the dynamic response of the limiter
(LIM_ATK_RT[3:0], LIM_HLD_TM[2:0] and LIM_RLS_RT [3:0] register bits).
A maximum level of attenuation applied by the limiter is configurable via the LIM_MAX_ATTN[3:0] register bits. If
the limiter mode is attacking and if it reaches the maximum attenuation, gain will not be reduced any further.
The limiter begins reducing gain when the output signal level is greater than the limiter threshold. The limiter
can be configured to track PVDD below a programmable inflection point with a minimum threshold value. Figure
8-5 below shows the limiter configured to limit to a constant level regardless of PVDD level. To achieve this
behavior, set the limiter maximum threshold to the desired level via the LIM_TH_MAX[31:0] register bits. Set the
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limiter inflection point (register bits LIM_INF_PT[31:0]) below the minimum allowable PVDD setting. The limiter
minimum threshold, set by register bits LIM_TH_MIN[31:0], does not impact limiter behavior in this use case.
Inflection
Point
LIM_TH_MAX
LIM_TH_MAX
Peak Out (V)
Peak Out (V)
slope
Brown
Out
BOP_TH
Brown
Out
BOP_TH
PVDD (V)
Figure 8-5. Limiter with Fixed Threshold
LIM_INF_PT
PVDD (V)
Figure 8-6. Limiter with Inflection Point
Inflection
Point
1:1
LIM_TH_MAX
LIM_TH_MAX
slope
Brown
Out
LIM_TH_MIN
Peak Out (V)
Peak Out (V)
- x%
Headroom
+ x%
Headroom
BOP_TH
Brown
Out
BOP_TH
PVDD (V)
Figure 8-7. Limiter with Dynamic Threshold
LIM_INF_PT
PVDD (V)
Figure 8-8. Limiter with Inflection Point and
Minimum Threshold
Figure 8-6 shows how to configure the limiter to track PVDD supply below a certain level without setting a
minimum threshold. Set the LIM_TH_MAX[31:0] register bits to the desired threshold and LIM_INF_PT[31:0]
register bits to the desired inflection point where the limiter will begin reducing the threshold with PVDD. The
LIM_SLOPE[31:0] register bits can be used to change the slope of the limiter tracking with PVDD. The default
value of 1 V/V will reduce the threshold 1 V for every 1 V of drop in PVDD. More aggressive tracking slopes can
be programmed if desired. Program the LIM_TH_MIN[31:0] bits below the minimum PVDD to prevent the limiter
from having a minimum threshold reduction when tracking PVDD supply.
The limiter with a supply tracking slope can be configured in an alternate way. By setting LIM_HR_EN register
bit to high , a headroom can be specified as a percentage of the supply voltage using a 1V/V slope by setting
LIM_DHR[4:0] register bits. For example if a headroom of -10% is specified, the peak output voltage will be set
to be 10% higher than PVDD. In this use case presented in Figure 8-7 the limiting begins for signals above the
supply voltage and will result in a fixed clipping. If a positive headroom of +10% is specified the peak output
voltage will be dynamically set 10% below the current PVDD. In this use case the limiting will begin at signal
levels lower than the supply voltage and will prevent clipping from occurring.
To achieve a limiter that tracks PVDD only up to a minimum threshold, configure the limiter LIM_TH_MAX [31:0]
and LIM_SLOPE[31:0] register bits as in the previous examples. Then, additionally set the LIM_TH_MIN[31:0]
register bits to the desired minimum threshold. Supply voltage below this minimum threshold will not continue to
decrease the signal output voltage. This is shown in Figure 8-8.
By setting register bit LIM_HR_EN to low the limiter mechanism depends on settings for maximum/minimum
thresholds, inflection point and slope. Once this bit is set high the limiter dynamic headroom is enabled.
When a BOP (Brownout Prevention) event occurs the limiter updates can be paused (LIM_PDB register bit set
to high) until the BOP fully releases. This can be used to prevent undesired interactions between both protection
systems.
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8.4.2.8.2 Brownout Prevention (BOP)
Brownout Prevention (BOP) feature provides a priority input to a dedicated limiter to generate a fast response to
transient dips in the supply voltage at the end of charge conditions that can cause system level brownout. When
supply voltage dips below the BOP threshold, the limiter begins reducing gain at a configurable attack rate.
When supply voltage rises above the BOP threshold, the limiter will begin to release after a programmed hold
time. The BOP feature can be enabled by setting the BOP_EN register bit high. The brownout supply source
can be set using BOP_SRC register bit to either PVDD (BOP_SRC =1) or VBAT1S (BOP_SRC =0) depending
on application need. It should be noted that the BOP feature is independent of the limiter and will function, if
enabled, even if the Supply Tracking Limiter is disabled.
The BOP can be configured to attack the gain through four levels as the supply voltage continues to drop.
The BOP threshold Level 3 is set using the BOP_TH3[7:0] register bits followed by threshold Level 2 using
BOP_TH2[7:0] register bits, Level 1 threshold set by BOP_TH1[7:0] bits and finally crossing Level 0 set by
BOP_TH0[7:0] register bits.
The BOP level that is not used can be disabled individually (register bits BOP_DIS0, BOP_DIS1 , BOP_DIS2,
BOP_DIS3) providing flexibility from one to four levels. For proper operation levels should be disabled in order,
starting with Level 3.
Each level has a separate attack rate (register bits BOP_ATK_RT0[2:0] to BOP_ATK_RT3[2:0]), attack step
size (register bits BOP_ATK_ST0[3:0] to BOP_ATK_ST3[3:0]), release rate (register bits BOP_RLS_RT0[2:0]
to BOP_RLS_RT3[2:0]), release step size (register bits BOP_RLS_ST0[3:0] to BOP_RLS_ST3[3:0]), dwell
time (register bits BOP_DT0[2:0] to BOP_DT3[2:0]), hold time (register bits BOP_HT0[2:0] to BOP_HT3[2:0]),
maximum attenuation (BOP_MAX_ATTN0[4:0] to BOP_MAX_ATTN3[4:0]).
For proper device operation the following conditions must be met:
● BOP_MAX_ATTN0 > BOP_MAX_ATTN1 > BOP_MAX_ATTN2 > BOP_MAX_ATTN3
● BOP_TH Level 3 > BOP_TH Level 2 > BOP_TH Level 1 > BOP_TH Level 0.
Use bits BOP_MAX_ATTN of registers BOP_CFG4, BOP_CFG9, BOP_CFG14, BOP_CFG20 to program
attenuation levels. Registers BOP_CFG5, BOP_CFG10, BOP_CFG15, BOP_CFG21 will be used for setting
the BOP threshold levels.
The TAS2780 can also immediately mute and then shutdown the device when a BOP event occurs by reaching
Level 0 if the BOP_SHDN register bit is set high. For the device to continue playing audio again it must transition
through a Software/Hardware Shutdown state. If the hold time set by BOP_HT0÷4[2:0] register bits is at 7h
(Infinite) the device needs to transition through a Mute or Software/Hardware Shutdown state, or the register bit
BOP_HLD_CLR can be set to high causing the device to exit the hold state and begin releasing. This bit is self
clearing and will always read-back low.
VBAT
BOP Thresh
BOP Active
BOP Mode
BOP Inactive
BOP
Attacking
BOP
Holding
Limiter Releasing
(BOP Inactive)
BOP Inactive
Figure 8-9. Brownout Prevention Event
The TAS2780 BOP engine will keep track of the current level state, the lowest BOP level that has been engaged
and the lowest measued BOP supply voltage. This information is continuously updated until requested. To
access this information the register BOP_STAT_HLD should be set high. This will pause the updates of the
current state (BOP_STAT_STATE[3:0]) and lowest BOP level (BOP_STAT_LLVL[2:0]) registers bits allowing
them to be read back. Once the read is complete the register bit BOP_STAT_HLD should be set low again
clearing the current BOP status registers and re-enabling the updates based on current BOP state.
The lowest PVDD measurement since the last read is available in the register bits BOP_STAT_PVDD[9:0] if
BOP_STAT_HLD register bit is set high before reading.
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A hold condition (infinite or not) for a higher BOP level will not be reached if the supply ramps up faster than the
lower levels release. Specifically, whether the infinite hold for a level is reached or not, it depends on the release
rates of the lower levels, so even if infinite hold is set, it might not be reached.
8.4.2.9 Low Battery Tracking Limiter (LBTL)
The VBAT1S limiter attenuates the channel gain at lower VBAT1S voltages (< 3.2 V) to reduce the maximum
power delivery and prevent thermal shutdown.
Using the SAR measurement on VBAT1S the limiter calculates its gain based on the equation below.
LBTL_GAIN (dBV) = 21dBV + VBLIM_GAIN (dBV)
(3)
If the programmed signal gain (amplifier level and DVC) meets the following condition:
AAMP + ADVC < LBTL_GAIN,
(4)
the LBTL mechanism will not be activated.
The VBLIM_GAIN from equation (3) is dependent on VBAT1S level (see the table below).
Table 8-3. VBLIM_GAIN vs VBAT1S
VBAT1S [V]
VBLIM_GAIN [dBV]
3.2
0
3.1
-0.5
3
-0.75
2.9
-1.2
2.8
-1.56
2.7
-2
The overall gain in the signal chain will be the minimum of gains defined by SPL, BOP and LBTL.
8.4.2.10 Inter Chip Gain Alignment (ICGA)
The TAS2780 supports alignment of STL and brownout BOP dynamics across devices using the dedicated ICC
feature (Section 8.4.2.10.1) or across the TDM output bus (SDOUT). This ensures consistent gain between
channels during limiting or brownout events since these dynamics are dependent on audio content, which can
vary across channels. Each device can be configured to align to a specified number of other devices, which
allows creation of groupings of devices that align only to each other.
STL and BOP activity is optionally transmitted by each device on SDOUT pin or ICC pin in a 24-bit time slot.
When both limiter and brownout are enabled, the data is comprised of an 11-bit word for limiter and a 13-bit
word for brownout data. If only the limiter is enabled, the data will be 12-bit word for limiter data. Gain reduction
should be transmitted in adjacent time slots for all devices that are to be aligned beginning with the first slot that
is specified by the ICGA_SLOT[5:0] register bits. The order of the devices is not important as long as they are
adjacent. The time slot for limiter gain reduction is configured by the GAIN_SLOT[5:0] register bits and enabled
by the GAIN_TX register bit being set high. The ICGA_SEN[7:0] register bits specify which time slots should be
listened to for gain alignment. This allows any number of devices between two and eight to be grouped together.
At least two of these devices should be enabled for alignment to take place.
To enable the inter-chip limiter alignment the ICLA_EN register bit should be set to high. To enable the inter chip
BOP alignment the ICBA_EN register bit should be set to high. All devices should be configured with identical
limiter and brownout prevention settings.
8.4.2.10.1 Inter-Chip Communication (ICC) Pin
The TAS2780 has a dedicated ICC bus pin that enables gain alignment (ICGA) without consuming slots on the
TDM bus. The ICC pin is connected to all TAS2780 devices in the system and slots are configured using register
bits GAIN_SLOT[5:0]. This bus uses the TDM (Section 8.4.1) BCLK and FSYNC inputs and requires all devices
to be configured using the same sampling clock. The ICC pin supports separate bus keeper configuration from
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the SDOUT pin (TDM bus). If the ICC pin is disabled or used for GPIO functionality, the ICGA (Section 8.4.2.10)
will occur on the TDM bus instead of the ICC pin. Register bits ICC_MODE[2:0] are used to set the ICC pin
functionality.
8.4.2.11 Class-D Settings
8.4.2.11.1 Synchronization
The TAS2780 Class-D amplifier supports spread spectrum PWM modulation, which can be enabled by setting
the AMP_SS register bit high. This can help reduce EMI in the system.
By default the Class-D amplifier switching frequency is based on the device trimmed internal oscillator. To
synchronize switching to the audio sample rate, set the CLASSD_SYNC register bit high. When the Class-D is
synchronized to the audio sample rate, the RAMP_RATE register bit must be set depending on the audio sample
rate of either 44.1 kHz or 48 kHz based frequency.
For 44.1, 88.2 and 176.4 kHz, set RAMP_RATE bit high and for 48, 96 and 192 kHz, set this bit low. This
ensures that the internal ramp generator has the appropriate slope.
8.4.2.11.2 Output Slew Rate Control
The output slew rate can be programmed using register bits EDGE_CTRL[1:0] form page 0x01, register 0x4C.
By default, if PVDD supply is below 20 V the output slew rate will be fast. If PVDD goes above 20 V the slew rate
will be automatically change to slow.
Optionally, to improve EMI performance, is to set the slew rate to slow for the entire range of PVDD supply by
setting the bits EDGE_CTRL[1:0] to 2'b11.
8.4.3 SAR ADC
A SAR ADC monitors PVDD voltage, VBAT1S voltage and die temperature. The results of these conversions are
available via register readback (PVDD_CNV[11:0], VBAT1S_CNV[11:0] and TMP_CNV[7:0] register bits). PVDD
and VBAT1S voltage conversions are also used by the limiter and brown out prevention blocks.
By default, VBAT1S conversion is enabled along with PVDD and temperature in both cases, when BOP source
is VBAT1S (BOP_SRC=0) or BOP source is PVDD (BOP_SRC=1). To disable VBAT1S conversion set the bit
register CONV_VBAT to low.
The ADC runs at a fixed 192 kHz sample rate with a conversion time of 5.2 µs.
Sampling rate for temperature is 10K samples/sec.
PVDD and VBAT1S voltages and the die temperature are calculated using equations from Registers 0x52 to
0x56 of Page 0x00.
The register bits content should always be read from MSB to LSB.
8.4.4 Current and Voltage (IV) Sense
The TAS2780 provides speaker voltage and current sense measurements for real time monitoring of
loudspeaker behavior. The VSNS_P and VSNS_N pins should be connected after any ferrite bead filter or
directly to the OUT_P and OUT_N connections if no EMI filter is used. The V-Sense connections eliminate
voltage drop error due to packaging, PCB interconnect or ferrite bead filter resistance. The V-sense connections
are also used for Post Filter Feed-Back (Section 8.4.5) to correct for any voltage drop induced gain error or
non-linearity due to the ferrite bead. It should be noted that any interconnect resistance after the VSNS terminals
will not be corrected for, so it is advised to connect the VSNS pins as close to the load as possible.
The voltage and current sense ADCs have a DC blocking filter. This filter cut-off frequency can be adjusted, or
the filter can be bypassed using the HPF_FREQ_REC[2:0] register bits.
I-Sense and V-Sense blocks can be powered up by programming to low the ISNS_PD and VSNS_PD register
bits. When powered down, the device will return null samples for the powered down block.
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8.4.5 Post Filter Feed-Back (PFFB)
The device supports post-filter feedback by closing the amplifier feedback loop after the external filter. The
feedback is applied using the VSNS_N and VSNS_P terminals of the device. This feature can be disabled using
the PFFB_EN register bit, for instance if an external filter that violates the amplifier loop stability is implemented.
When PFFB is disabled, the feedback will be internally routed from the OUT_N and OUT_P pins of the device.
In the PFFB mode of operation the following conditions have to be met by the external filter: f0 > 10 MHz and
f0/Q > 2.5 MHz (f0 and Q are the cutoff frequency and the quality factor of the external filter).
8.4.6 Load Diagnostics
The TAS2780 can check the speaker terminal for open or short. This can be used to verify the continuity of the
speaker or the traces to the speaker. The entire operation is performed by the TAS2780 and result is reported
using the IRQZ pin or by reading over I2C bus on completion. The load diagnostics can be performed using
external audio clock (register bit LDG_CLK=0) or the internal oscillator (LDG_CLK=1).
The speaker open (upper - UT) and short (lower - LT) thresholds are configured using the LDG_RES_UT[31:0]
and LDG_RES_LT[31:0] register bits. The diagnostic is run by selecting one of the load diagnostic modes
set by MODE[2:0] register bits. The load diagnostic can be run before transitioning to active mode or standalone returning to software shutdown when complete. When the load diagnostics is run it will play a 22
kHz at -35 dBFS for 100 ms and measure the resistance of the speaker trace. The result is averaged over
the time specified by the LDG_AVG[1:0] register bits. The measured speaker impedance can be read from
LDS_RES_VAL[31:0] register bits.
8.4.7 Thermal Foldback
The TAS2780 monitors the die temperature and can automatically limit the audio signal when the die
temperature reaches a set threshold. It is recommended to use the thermal fold-back registers to configure
this protection mechanism as the internal DSP will perform the necessary calculation for each register.
Thermal fold-back can be disabled using TFB_EN register bit. If the die temperature reaches the value set by
TF_TEMP_TH[31:0] register bits this feature will begin to attenuate the audio signal to prevent the device from
shutting down due to over-temperature. It will attenuate the audio signal by a value set in TF_LIMS[31:0] register
bits over a range of temperature set by TF_TEMP_TH[31:0] register bits. The thermal fold-back attack is at
a fixed rate of 0.25dB/ms. A maximum attenuation can be specified using register bits TF_MAX_ATTN[31:0].
However, if the device continues to heat up, eventually the over-temperature will be triggered. The attenuation
will be held for a number of samples set by register bits TF_HOLD_CNT[31:0], before the attenuation will begin
releasing.
8.4.8 Over Power Protection
The TAS2780 monitors the temperature of the internal power FETs. If the maximum continue power is high and
power FETs temperature goes above a threshold, an internal protection circuit will trigger a thermal fold-back
and, if temperature still increases, shutdown the device.
The protection mechanism is based on two thresholds TH1 and TH2. The TH1 threshold is set at a temperature
1160C higher than the temperature measured by the internal bandgap but not less than 2500C. The TH1
threshold triggers a thermal foldback.
The TH2 threshold is 400 C above TH1 and triggers thermal shutdown.
The two detection mechanisms can be disabled by setting bits TG_TH2 and TG_TH1 of register 0x47, page
0x01 to low.
8.4.9 Low Battery Protection
For VBAT1S supply below 3.4 V the power FETs can go into saturation at higher load currents which could result
in device damage due to the FETs connected to PVDD going into thermal runaway.
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To prevent the damage the OCP limit needs to be adjusted based on VBAT1S level measured by the internal
SAR ADC. The table below presents the thresholds where the OCP will be adjusted and the settings of the
registers to program these thresholds.
Once the VBAT1S supply is detected to a level below 3.4 V the device needs to be put in software shutdown or
in idle mode before programming the registers.
Table 8-4. OCP Thresholds vs VBAT
VBAT1S Range
PVDD OCP Level
Book/Page/Register - New Setting
VBAT1S ≥ 3.4 V
6.6 A
NA
3.1 V ≤ VBAT1S < 3.4 V
6A
B_0/P_0/R_6 - 01
2.9 V ≤ VBAT1S < 3.1 V
5.3 A
B_0/P_0/R_6 - 02
2.7 V ≤ VBAT1S < 2.9 V
4.3 A
B_0/P_FD/R_3B - See Section 10.7
B_0/P_FD/R_3A - 7D
B_0/P_FD/R_5C - C0
The control of OCP threshold from above is needed only in power modes where VBAT1S is supplied externaly
and the Class-D outputs are switching on PVDD (PWR_MODE0, PWR_MODE1).
8.4.10 Clocks and PLL
The device clocking is derived from the SBCLK input clock. Table 8-5 and Table 8-6 show the valid SBCLK clock
frequencies for each sample rate and SBCLK to FSYNC ratios.
Table 8-5. Supported SBCLK Frequencies (48 kHz based sample rates)
Sample Rate
(kHz)
SBCLK to FSYNC Ratio
16
24
32
48
64
96
125
48 kHz
768 kHz
1.152 MHz
1.536 MHz
2.304 MHz
3.072 MHz
4.608 MHz
6 MHz
96 kHz
1.536 MHz
2.304 MHz
3.072 MHz
4.608 MHz
6.144 MHz
9.216 MHz
12 MHz
Sample Rate
(kHz)
128
192
250
256
384
500
512
48 kHz
6.144 MHz
9.216 MHz
12 MHz
12.288 MHz
18.432 MHz
24 MHz
24.576 MHz
96 kHz
12.288 MHz
18.432 MHz
24 MHz
24.576 MHz
-
-
-
SBCLK to FSYNC Ratio
Table 8-6. Supported SBCLK Frequencies (44.1 kHz based sample rates)
Sample Rate
(kHz)
SBCLK to FSYNC Ratio
16
24
32
48
64
96
125
44.1 kHz
705.6 kHz
1.0584 MHz
88.2 kHz
1.4112 MHz
2.1168 MHz
1.4112 MHz
2.1168 MHz
2.8224 MHz
4.2336 MHz
5.5125 MHz
2.8224 MHz
4.2336 MHz
5.6448 MHz
8.4672 MHz
11.025 MHz
Sample Rate
(kHz)
128
192
250
SBCLK to FSYNC Ratio
256
384
500
512
44.1 kHz
5.6448 MHz
8.4672 MHz
11.025 MHz
11.2896 MHz
16.9344 MHz
22.05 MHz
22.5792 MHz
88.2 kHz
11.2896 MHz
16.9344 MHz
22.05 MHz
22.5792 MHz
-
-
-
If the sample rate is properly configured via the SAMP_RATE[2:0] register bits, no additional configuration is
required as long as the SBCLK to FSYNC ratio is valid. The device will detect improper SBCLK frequencies and
SBCLK to FSYNC ratios and volume ramp down the playback path to minimize audible artifacts. After the clock
error is detected, the device will enter a low power halt mode after a time set by CLK_HALT_TIMER[2:0] register
bits if DIS_CLK_HALT bit is low. Additionally, the device can automatically power up and down on valid clock
signals if CLK_PWR_UD_EN register bit is set to high. The device sampling rate should not be changed while
this feature is enabled. In this mode the DIS_CLK_HALT bit register should be set low in order for this feature to
work properly.
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8.4.11 Ultrasonic
The TAS2780 has a dedicated power mode (PWR_MODE3) to play ultasound in advanced ultrasonic
applications like presence detection, gesture recognition, etc.
When playing ultrasound it is recommended to use settings from .
In PWR_MODE3 mode of operation the output stage of Class-D will be supplied by external VBAT1S rail.
8.4.12 Echo Reference
The TAS2780 can loop back the DSP output.
This feature allows user to do noise cancellation or echo correction algorithms.
A block diagram is presented in the figure below.
Figure 8-10. Echo Reference Loopback
The echo reference can be enabled by configuring AUDIO_TX register bit. The slot length and the time slot can
be selected using AUDIO_SLEN and AUDIO_SLOT[5:0] register bits.
8.5 Operational Modes
8.5.1 Hardware Shutdown
The device enters Hardware Shutdown mode if the SDZ pin is asserted low. In Hardware Shutdown mode, the
device consumes the minimum quiescent current from AVDD, IOVDD, PVDDPVDDH and VBAT1S supplies. All
registers lose state in this mode and I2C communication is disabled.
By default, when SDZ pin goes low, the device will force a hardware shutdown after a timeout set by the
configurable shutdown timer (register bits SDZ_TIMEOUT[1:0]). If SDZ is asserted low while audio is playing, the
device will ramp down volume of the audio, stop the Class-D switching, power down analog and digital blocks
and finally put the device into Hardware Shutdown mode. The device can also be configured for forced hardware
shutdown and in this case it will not attempt to gracefully disable the audio channel. The shutdown mode can be
controlled using SDZ_MODE[1:0] register bits.
When SDZ is released, the device will sample the ADDR pin and enter the Software Shutdown mode.
8.5.2 Mode Control and Software Reset
The TAS2780 mode can be configured by writing the MODE[2:0] register bits.
A software reset can be accomplished by setting high the SW_RESET register bit. This bit is self clearing. Once
enabled it will restore all registers to their default values.
8.5.3 Software Shutdown
Software Shutdown mode powers down all analog blocks required to playback audio, but does not cause the
device to lose register state.
The registers are available through I2C interface.
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Software Shutdown is enabled by asserting the MODE[2:0] register bits to 3'b010. If audio is playing when
Software Shutdown is asserted, the Class-D will volume ramp down before shutting down. When de-asserted,
the Class-D will begin switching and volume will ramp back to the programmed digital volume setting.
8.5.4 Mute Mode
The TAS2780 will ramp down volume of the Class-D amplifier to a mute state by setting the MODE[2:0] register
bits to 3'b001. During mute the Class-D still switches but transmits no audio content. If mute is de-asserted, the
device will ramp volume back to the programmed digital setting.
8.5.5 Active Mode
In Active Mode the Class-D switches and plays back audio. Speaker voltage and current sensing are operational
if enabled. Set the MODE[2:0] register bits to 3'b000 to enter Active Mode.
8.5.6 Diagnostic Mode
The TAS2780 has a diagnostic generator that can be used without any PCM clocking to the device. If DG_CLK
register bit is set low, an internal oscillator is used to generate the test patterns selected by DG_SIG[4:0] register
bits. For sine-wave generation the sampling frequency fs should be first set using the SAMP_RATE[2:0] register
bits.
The programable DC level for diagnostic mode can be set using the DG_DC_VAL[31:0] register bits.
To play a DC diagnostic tone set the bits HPF_FREQ_PB[2:0] in register 0x04 to 0h (disabled DC blocker).
8.5.7 Noise Gate Mode
In this mode of operation described in section the TAS2780 monitors the signal and powers down the class-D
when signal goes below a threshold.
8.6 Faults and Status
During the power-up sequence, the circuit monitoring the AVDD pin will hold the device in reset (including all
configuration registers) until the supply is valid. The device will not exit hardware shutdown until AVDD is valid
and the SDZ pin is released. Once SDZ is released, the digital core voltage regulator will power up, enabling
detection of the operational mode. If AVDD dips below the under voltage threshold, the device will immediately
be forced into a reset state.
The device also monitors the PVDD supply and holds the analog core in power down if the supply is below the
PVDD under voltage threshold (set by register bits PVDD_UVLO_TH[5:0]). If the TAS2780 is in active operation
and an under voltage fault occurs, the analog blocks will immediately be powered down to protect the device.
These faults are latched and require a transition through Hardware or Software Shutdown to clear the fault. The
latched registers will report under voltage faults.
The device transitions into Software Shutdown mode if it detects any faults with the TDM clocks such as:
• Invalid SBCLK to FSYNC ratio
• Invalid FSYNC frequency
• Halting of SBCLK or FSYNC clocks
Upon detection of a TDM clock error, the device transitions into Software Shutdown mode as quickly as possible
to limit the possibility of audio artifacts. Once all TDM clock errors are resolved, the device volume ramps back
to its previous playback state. During a TDM clock error, the IRQZ pin will assert low if the clock error interrupt
mask register bit IM_TDMCE is set low. The clock fault is also available for read-back in the latched fault status
register (bit IR_TDMCE]).
Note
It is mandatory to have TDM clocks available before programming I2C to enter Active mode. Entering
Active mode with no clocks present will trigger a clock error, device will go into Software Shutdown
and the interrupts associated with the clock errors will be raised.
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The TAS2780 also monitors die temperature and Class-D load current and will enter Software Shutdown mode
if either of these exceed safe values. As with the TDM clock error, the IRQZ pin will assert low for these faults if
the fault interrupt mask register bit is set low for over temperature and for over current. The fault status can also
be monitored in the latched fault registers.
Die over temperature and Class-D over current errors can either be latching (for example, the device will enter
Software Shutdown until a Hardware or Software Shutdown sequence is applied) or they can be programmed to
automatically retry after a prescribed time. This behavior can be configured in the OTE_RETRY, OCE_RETRY
register bits (for over temperature and over current respectively). Even in latched mode, the Class-D will not
attempt to retry after an over temperature or over current error until the retry time period (1.5 s) has elapsed.
This prevents applying repeated stress to the device in a rapid fashion that could lead to device damage. If the
device has been cycled through a Hardware or Software Shutdown, it will only begin to operate after the retry
time period.
By default all retry features are disabled.
When exiting Software Shutdown to Active mode (for example: MODE[2:0] bits from 010b to 000b), if PVDD
under voltage is detected, the device will go back into Software Shutdown mode and an interrupt (IL_PUVLO)
will be flagged. To exit this fault user needs to clear the interrupt and program the device in Software Shutdown
using MODE[2:0] bits, before making another attempt to go to Active mode.
A similar situation might occur in PWR_MODE2, if internal VBAT1S LDO undervoltage is detected and
IL_LDO_UV interrupt is flagged.
The status registers (and IRQZ pin, if enabled via the status mask register) also indicate limiter behavior
including when the limiter is activated, when PVDD is below the inflection point, when maximum attenuation has
been applied, when the limiter is in infinite hold and when the limiter has muted the audio.
In situations when the device operates in PWR_MODE2 the VBAT1S pin is supplied by an internal LDO.
Protection circuits monitor this block and generate faults in case of under voltage, over voltage or if the LDO is
over loaded. The device goes into Software Shutdown mode if one of these faults triggers.
The IRQZ pin is an open drain output that asserts low during unmasked fault conditions and therefore must be
pulled up with a resistor to IOVDD. An internal pull up resistor is provided and can be accessed (connected to
the pin) by setting the IRQZ_PU register bit high.
The IRQZ interrupt configuration can be set using IRQZ_PIN_CFG[1:0] register bits. The IRQZ_POL register bit
sets the interrupt polarity.
The INT_LTCH_CLR register bit allows to clear all the interrupt latch register bits.
Live flag registers are active only when the device is in Active mode of operation. If the device is shutdown by
I2C command or due to any fault condition described below, the live flags will be reset. Latched flags will not be
reset in this condition and available for user to read their status.
Table 8-7. Fault Interrupt Mask
Interrupt
Live Register Bit
Latch Register Bit
Mask Register Bit
Default (1 = Mask)
Temp Over 105°C
IL_TO105
IR_TO105
IM_TO105
1
Temp Over 115°C
IL_TO115
IR_TO115
IM_TO115
1
Temp Over 125°C
IL_TO125
IR_TO125
IM_TO125
1
Temp Over 135°C
IL_TO135
IR_TO135
IM_TO135
1
Over Temp Error
Device in shutdown
IR_OT
IM_OT
0
Over Current Error
Device in shutdown
IR_OC
IM_OC
0
TDM Clock Error
Device in shutdown
IR_TDMCE
IM_TDMCE
1
TDM Clock Error: Invalid SBCLK ratio or FS
rate
IR_TDMCEIR
TDM Clock Error: FS changed on the fly
IR_TDNCEFC
TDM Clock Error: SBCLK FS ratio changed on
the fly
IR_TDMCERC
32
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Table 8-7. Fault Interrupt Mask (continued)
Interrupt
Live Register Bit
Latch Register Bit
Mask Register Bit
Default (1 = Mask)
BOP Active
IL_BOPA
IR_BOPA
IM_BOPA
0
BOP Level 0 Active
IL_BOPL0A
IR_BOPL0A
IM_BOPL0A
0
BOP Level 1 Active
IL_BOPL1A
IR_BOPL1A
IM_BOPL1A
0
BOP Level 2 Active
IL_BOPL2A
IR_BOPL2A
IM_BOPL2A
0
BOP Level 3 Active
IL_BOPL3A
IR_BOPL3A
IM_BOPL3A
0
BOP Infinite Hold
IL_BOPIH
IR_BOPIH
IM_BOPIH
1
BOP Mute
IL_BOPM
IR_BOPM
IM_BOPM
1
PVDD Below LImiter Inflection
IL_PBIP
IR_PBIP
IM_PBIP
1
Limiter Active
IL_LIMA
IR_LIMA
IM_LIMA
1
Limiter Max Atten
IL_LIMMA
IR_LIMMA
IM_LIMMA
1
PVDD UVLO
Device in shutdown
IR_PUVLO
IM_PUVLO
0
IM_VBAT1S_UVLO
0
VBAT1S UVLO
Device in shutdown
IR_VBAT1S_UVLO
OTP CRC Error
Device in shutdown
IR_OTPCRC
VBAT Gain Limiter
IL_VBATLIM
IR_VBATLIM
IM_VBATLIM
1
IR_LDC
IM_LDC
1
IR_LDMODE[1:0]
IM_LDMODE[1:0]
11
IR_PLL_CLK
IM_PLL_CLK
1
Load Diagnostic Complete
Load Diagnostic Mode Fault
Internal PLL Clock Error
Device in shutdown
Noise Gate Active
IL_NGA
PVDD-VBAT1S Below Threshold
IL_PVBT
IR_PVBT
IM_PVBT
0
Internal VBAT1S LDO Over Voltage
Device in shutdown
IR_LDO_OV
IM_LDO_OV
1
Internal VBAT1S LDO Under Voltage
Device in shutdown
IR_LDO_UV
IM_LDO_UV
0
Internal VBAT1S LDO Over Load
Device in shutdown
IR_LDO_OL
IM_LDO_OL
1
Thermal Detection Threshold 2
Device in shutdown
IR_TDTH2
IM_TDTH2
0
Thermal Detection Threshold 1
IL_TDTH1
IR_TDTH1
IM_TDTH1
0
8.6.1 Faults and Status Over TDM
Faults and device operation information can be sent over the TDM bus when STATUS_TX register bit is set high.
The slot position in TDM bus can be configured using STATUS_SLOT[5:0] register bits.
Table 8-8. TDM Information Bits
TDM_STATUS[7:0] Bit
(1)
Bit Information
0 Value
Powered
down(1)
1 Value
0
Power up state
1
Y-Bridge
2
Noise-Gate Status
Normal operation
Noise gate active
3
Limiter Active
No Limiter or ICLA attn applied
Limiter or ICLA attn applied
PVDD active
Powered up
VBAT1S active
4
BOP Active
No BOP attn applied
BOP attn applied
5
Over Temperature Error
No Over-temperature
Over-temperature detected(1)
6
Over Current Error
No Over-current
Over-current detected(1)
7
PVDD Status
No PVDD UVLO
PVDD UVLO detected(1)
Can be read only during the transient shutdown phase. After shutdown the TDM bis are not available.
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8.6.2 Temperature Warnings
The TAS2780 monitors the die temperature and flags warnings if the temperature is above 105 ºC, 115 ºC, 125
ºC and 135 ºC.
The warnings can be read live in Register 0x47 or latched in Register 0x4F, Page 0x00.
8.7 Power Sequencing Requirements
There are no power sequencing requirements for order of rate of ramping up or down as long as SDZ pin is kept
low.
8.8 Digital Input Pull Downs
The I2S/TDM interface pins and the ICC pin have optional weak pull down resistors to prevent the pins from
floating. Register bits DIN_PD[4:0] are used to enable/disable pull downs. The pull downs are not enabled during
Hardware Shutdown.
8.9 Register Map
8.9.1 Register Summary Table Page=0x00
Addr
34
Register
Description
Section
0x00
PAGE
Device Page
Section 8.9.6
0x01
SW_RESET
Software Reset
Section 8.9.7
0x02
MODE_CTRL
Device operational mode
Section 8.9.8
0x03
CHNL_0
Y Bridge and Channel settings
Section 8.9.9
0x04
DC_BLK0
SAR Filter and DC Path Blocker
Section 8.9.10
0x05
DC_BLK1
Record DC Blocker
Section 8.9.11
0x06
MISC_CFG1
Misc Configuration 1
Section 8.9.12
0x07
MISC_CFG2
Misc Configuration 2
Section 8.9.13
0x08
TDM_CFG0
TDM Configuration 0
Section 8.9.14
0x09
TDM_CFG1
TDM Configuration 1
Section 8.9.15
0x0A
TDM_CFG2
TDM Configuration 2
Section 8.9.16
0x0B
LIM_MAX_ATTN
Limiter
Section 8.9.17
0x0C
TDM_CFG3
TDM Configuration 3
Section 8.9.18
0x0D
TDM_CFG4
TDM Configuration 4
Section 8.9.19
0x0E
TDM_CFG5
TDM Configuration 5
Section 8.9.20
0x0F
TDM_CFG6
TDM Configuration 6
Section 8.9.21
0x10
TDM_CFG7
TDM Configuration 7
Section 8.9.22
0x11
TDM_CFG8
TDM Configuration 8
Section 8.9.23
0x12
TDM_CFG9
TDM Configuration 9
Section 8.9.24
0x13
TDM_CFG10
TDM Configuration 10
Section 8.9.25
0x14
TDM_CFG11
TDM Configuration 11
Section 8.9.26
0x15
ICC_CNFG2
ICC Mode
Section 8.9.27
0x16
TDM_CFG12
TDM Configuration 12
Section 8.9.28
0x17
ICLA_CFG0
Inter Chip Limiter Alignment 0
Section 8.9.29
0x18
ICLA_CFG1
Inter Chip Gain Alignment 1
Section 8.9.30
0x19
DG_0
Diagnostic Signal
Section 8.9.31
0x1A
DVC
Digital Volume Control
Section 8.9.32
0x1B
LIM_CFG0
Limiter Configuration 0
Section 8.9.33
0x1C
LIM_CFG1
Limiter Configuration 1
Section 8.9.34
0x1D
BOP_CFG0
Brown Out Prevention 0
Section 8.9.35
0x1E
BOP_CFG1
Brown Out Prevention 1
Section 8.9.36
0x1F
BOP_CFG2
Brown Out Prevention 2
Section 8.9.37
0x20
BOP_CFG3
Brown Out Prevention 3
Section 8.9.38
0x21
BOP_CFG4
Brown Out Prevention 4
Section 8.9.39
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0x22
BOP_CFG5
BOP Configuration 5
Section 8.9.40
0x23
BOP_CFG6
Brown Out Prevention 6
Section 8.9.41
0x24
BOP_CFG7
Brown Out Prevention 7
Section 8.9.42
0x25
BOP_CFG8
Brown Out Prevention 8
Section 8.9.43
0x26
BOP_CFG9
Brown Out Prevention 9
Section 8.9.44
0x27
BOP_CFG10
BOP Configuration 10
Section 8.9.45
0x28
BOP_CFG11
Brown Out Prevention 11
Section 8.9.46
0x29
BOP_CFG12
Brown Out Prevention 12
Section 8.9.47
0x2A
BOP_CFG13
Brown Out Prevention 13
Section 8.9.48
0x2B
BOP_CFG14
Brown Out Prevention 14
Section 8.9.49
0x2C
BOP_CFG15
BOP Configuration 15
Section 8.9.50
0x2D
BOP_CFG17
Brown Out Prevention 17
Section 8.9.51
0x2E
BOP_CFG18
Brown Out Prevention 18
Section 8.9.52
0x2F
BOP_CFG19
Brown Out Prevention 19
Section 8.9.53
0x30
BOP_CFG20
Brown Out Prevention 20
Section 8.9.54
0x31
BOP_CFG21
BOP Configuration 21
Section 8.9.55
0x32
BOP_CFG22
Brown Out Prevention 22
Section 8.9.56
0x33
BOP_CFG23
Lowest PVDD Measured
Section 8.9.57
0x34
BOP_CFG24
Lowest BOP Attack Rate
Section 8.9.57
0x35
NG_CFG0
Noise Gate 0
Section 8.9.59
0x36
NG_CFG1
Noise Gate 1
Section 8.9.60
0x37
LVS_CFG0
Low Voltage Signaling
Section 8.9.61
0x38
DIN_PD
Digital Input Pin Pull Down
Section 8.9.62
0x3B
INT_MASK0
Interrupt Mask 0
Section 8.9.63
0x3C
INT_MASK1
Interrupt Mask 1
Section 8.9.64
0x3D
INT_MASK4
Interrupt Mask 4
Section 8.9.65
0x40
INT_MASK2
Interrupt Mask 2
Section 8.9.66
0x41
INT_MASK3
Interrupt Mask 3
Section 8.9.67
0x42
INT_LIVE0
Live Interrupt Read-back 0
Section 8.9.68
0x43
INT_LIVE1
Live Interrupt Read-back 1
Section 8.9.69
0x44
INT_LIVE1_0
Live Interrupt Read-back 1_0
Section 8.9.70
0x47
INT_LIVE2
Live Interrupt Read-back 2
Section 8.9.71
0x48
INT_LIVE3
Live Interrupt Read-back 3
Section 8.9.72
0x49
INT_LTCH0
Latched Interrupt Read-back 0
Section 8.9.73
0x4A
INT_LTCH1
Latched Interrupt Read-back 1
Section 8.9.74
0x4B
INT_LTCH1_0
Latched Interrupt Read-back 1_0
Section 8.9.75
0x4F
INT_LTCH2
Latched Interrupt Read-back 2
Section 8.9.76
0x50
INT_LTCH3
Latched Interrupt Read-back 3
Section 8.9.77
0x51
INT_LTCH4
Latched Interrupt Read-back 4
Section 8.9.78
0x52
VBAT_MSB
SAR VBAT1S 0
Section 8.9.79
0x53
VBAT_LSB
SAR VBAT1S 1
Section 8.9.80
0x54
PVDD_MSB
SAR PVDD 0
Section 8.9.81
0x55
PVDD_LSB
SAR PVDD 1
Section 8.9.82
0x56
TEMP
SAR ADC Conversion 2
Section 8.9.83
0x5C
INT_CLK_CFG
Clock Setting and IRQZ
Section 8.9.84
0x5D
MISC_CFG3
Misc Configuration 3
Section 8.9.85
0x60
CLOCK_CFG
Clock Configuration
Section 8.9.86
0x63
IDLE_IND
Idle channel current optimization
Section 8.9.87
0x64
SAR_SAMP
SAR Sampling Time
Section 8.9.88
0x65
MISC_CFG4
Misc Configuration 4
Section 8.9.89
0x67
TG_CFG0
Tone Generator
Section 8.9.90
0x68
CLK_CFG
Detect Clock Ration and Sample Rate
Section 8.9.91
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0x6A
LV_EN_CFG
Class-D and LVS Delays
Section 8.9.92
0x6B
NG_CFG2
Noise Gate 2
Section 8.9.93
0x6C
NG_CFG3
Noise Gate 3
Section 8.9.94
0x6D
NG_CFG4
Noise Gate 4
Section 8.9.95
0x6E
NG_CFG5
Noise Gate 5
Section 8.9.96
0x6F
NG_CFG6
Noise Gate 6
Section 8.9.97
0x70
NG_CFG7
Noise Gate 7
Section 8.9.98
0x71
PVDD_UVLO
UVLO Threshold
Section 8.9.99
0x73
DMD
DAC Modulator Dither
Section 8.9.100
0x7E
I2C_CKSUM
I2C Checksum
Section 8.9.101
0x7F
BOOK
Device Book
Section 8.9.102
8.9.2 Register Summary Table Page=0x01
Addr
Register
Description
Section
0x17
INIT_0
Initialization
Section 8.9.103
0x19
LSR
Modulation
Section 8.9.104
0x21
INIT_1
Initialization
Section 8.9.105
0x35
INIT_2
Initialization
Section 8.9.106
0x36
INT_LDO
Internal LDO Setting
Section 8.9.107
0x3D
SDOUT_HIZ_1
Slots Control
Section 8.9.108
0x3E
SDOUT_HIZ_2
Slots Control
Section 8.9.109
0x3F
SDOUT_HIZ_3
Slots Control
Section 8.9.110
0x40
SDOUT_HIZ_4
Slots Control
Section 8.9.111
0x41
SDOUT_HIZ_5
Slots Control
Section 8.9.112
0x42
SDOUT_HIZ_6
Slots Control
Section 8.9.113
0x43
SDOUT_HIZ_7
Slots Control
Section 8.9.114
0x44
SDOUT_HIZ_8
Slots Control
Section 8.9.115
0x45
SDOUT_HIZ_9
Slots Control
Section 8.9.116
0x47
TG_EN
Thermal Detection Enable
Section 8.9.117
0x4C
EDGE_CTRL
Slew rate control
Section 8.9.118
8.9.3 Register Summary Table Page=0x04
Addr
36
Register
Description
Section
0x08
DG_DC_VAL1
Diagnostic DC Level
Section 8.9.119
0x09
DG_DC_VAL2
Diagnostic DC Level
Section 8.9.120
0x0A
DG_DC_VAL3
Diagnostic DC Level
Section 8.9.121
0x0B
DG_DC_VAL4
Diagnostic DC Level
Section 8.9.122
0x0C
LIM_TH_MAX1
Limiter Maximum Threshold
Section 8.9.123
0x0D
LIM_TH_MAX2
Limiter Maximum Threshold
Section 8.9.124
0x0E
LIM_TH_MAX3
Limiter Maximum Threshold
Section 8.9.125
0x0F
LIM_TH_MAX4
Limiter Maximum Threshold
Section 8.9.126
0x10
LIM_TH_MIN1
Limiter Minimum Threshold
Section 8.9.127
0x11
LIM_TH_MIN2
Limiter Minimum Threshold
Section 8.9.128
0x12
LIM_TH_MIN3
Limiter Minimum Threshold
Section 8.9.129
0x13
LIM_TH_MIN4
Limiter Minimum Threshold
Section 8.9.130
0x14
LIM_INF_PT1
Limiter Inflection Point
Section 8.9.131
0x15
LIM_INF_PT2
Limiter Inflection Point
Section 8.9.132
0x16
LIM_INF_PT3
Limiter Inflection Point
Section 8.9.133
0x17
LIM_INF_PT4
Limiter Inflection Point
Section 8.9.134
0x18
LIM_SLOPE1
Limiter Slope
Section 8.9.135
0x19
LIM_SLOPE2
Limiter Slope
Section 8.9.136
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0x1A
LIM_SLOPE3
Limiter Slope
Section 8.9.137
0x1B
LIM_SLOPE4
Limiter Slope
Section 8.9.138
0x1C
TF_HLD1
TFB Maximum Hold
Section 8.9.139
0x1D
TF_HLD2
TFB Maximum Hold
Section 8.9.140
0x1E
TF_HLD3
TFB Maximum Hold
Section 8.9.141
0x1F
TF_HLD4
TFB Maximum Hold
Section 8.9.142
0x20
TF_RLS1
TFB Release Rate
Section 8.9.143
0x21
TF_RLS2
TFB Release Rate
Section 8.9.144
0x22
TF_RLS3
TFB Release Rate
Section 8.9.145
0x23
TF_RLS4
TFB Release Rate
Section 8.9.146
0x24
TF_SLOPE1
TFB Limiter Slope
Section 8.9.147
0x25
TF_SLOPE2
TFB Limiter Slope
Section 8.9.148
0x26
TF_SLOPE3
TFB Limiter Slope
Section 8.9.149
0x27
TF_SLOPE4
TFB Limiter Slope
Section 8.9.150
0x28
TF_TEMP_TH1
TFB Threshold
Section 8.9.151
0x29
TF_TEMP_TH2
TFB Threshold
Section 8.9.152
0x2A
TF_TEMP_TH3
TFB Threshold
Section 8.9.153
0x2B
TF_TEMP_TH4
TFB Threshold
Section 8.9.154
0x2C
TF_MAX_ATTN1
TFB Gain Reduction
Section 8.9.155
0x2D
TF_MAX_ATTN2
TFB Gain Reduction
Section 8.9.156
0x2E
TF_MAX_ATTN3
TFB Gain Reduction
Section 8.9.157
0x2F
TF_MAX_ATTN4
TFB Gain Reduction
Section 8.9.158
0x40
LD_CFG0
Load Diagnostics Resistance Upper Threshold
Section 8.9.159
0x41
LD_CFG1
Load Diagnostics Resistance Upper Threshold
Section 8.9.160
0x42
LD_CFG2
Load Diagnostics Resistance Upper Threshold
Section 8.9.161
0x43
LD_CFG3
Load Diagnostics Resistance Upper Threshold
Section 8.9.162
0x44
LD_CFG4
Load Diagnostics Resistance Lower Threshold
Section 8.9.163
0x45
LD_CFG5
Load Diagnostics Resistance Lower Threshold
Section 8.9.164
0x46
LD_CFG6
Load Diagnostics Resistance Lower Threshold
Section 8.9.165
0x47
LD_CFG7
Load Diagnostics Resistance Lower Threshold
Section 8.9.166
0x48
CLD_EFF_1
Class D Efficiency
Section 8.9.167
0x49
CLD_EFF_2
Class D Efficiency
Section 8.9.168
0x4A
CLD_EFF_3
Class D Efficiency
Section 8.9.169
0x4B
CLD_EFF_4
Class D Efficiency
Section 8.9.170
0x4C
LDG_RES1
Load Diagnostics Resistance Value
Section 8.9.171
0x4D
LDG_RES2
Load Diagnostics Resistance Value
Section 8.9.172
0x4E
LDG_RES3
Load Diagnostics Resistance Value
Section 8.9.173
0x4F
LDG_RES4
Load Diagnostics Resistance Value
Section 8.9.174
8.9.4 Register Summary Table Page=0xFD
Addr
0x3E
Register
INIT_3
Description
Initialization
Section
Section 8.9.175
8.9.5 Note and Legend
NOTE: all register bits described in italic font can be programmed in Active mode.
LEGEND: R/W = Read/Write, R = Read only; -n = Value after reset
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8.9.6 PAGE (page=0x00 address=0x00) [reset=00h]
Bit
Field
Type
7-0
PAGE[7:0]
Reset
RW
Description
0h
Sets the device page.
00h = Page 0
01h = Page 1
...
FFh = Page 255
8.9.7 SW_RESET (page=0x00 address=0x01) [reset=00h]
Bit
Field
Type
Reset
Description
7-1
Reserved
R
0h
Reserved
0
SW_RESET
RW
0h
Software reset. Bit is self clearing.
0b = Do not reset
1b = Reset
8.9.8 MODE_CTRL (page=0x00 address=0x02) [reset=1Ah]
Bit
Field
Type
Reset
Description
7
BOP_SRC
RW
0h
BOP input source and PVDD UVLO
0b = VBAT1S input and PVDD UVLO disabled.
1b = PVDD input and PVDD UVLO enabled.
6-5
Reserved
RW
0h
Reserved
4
ISNS_PD
RW
1h
Current sense is
0b = Active
1b = Powered down
3
VSNS_PD
RW
1h
Voltage sense is
0b = Active
1b = Powered down
2h
Device operational mode.
000b = Active without Mute
001b = Active with Mute
010b = Software Shutdown
011b = Load Diagnostics followed by normal device power up
100b = Standalone Load Diagnostic, after completion these bits
are self reset to 010b
101b = Diagnostic Generator Mode
110b -111b = Reserved
2-0
MODE[2:0]
RW
8.9.9 CHNL_0 (page=0x00 address=0x03) [reset=28h]
Bit
7-6
38
Field
CDS_MODE[1:0]
Type
RW
Reset
0h
Description
Class-D switching mode
00b = Y-Bridge, high power on VBAT1S
01b = VBAT1S Only Supply of Class D
10b = PVDD Only Supply of Class D
11b = Y-Bridge, low power on VBAT1S
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Bit
SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Field
Type
Reset
Description
Setting
5-1
AMP_LEVEL[4:0]
RW
14h
@48ksps
@96 ksps
00h
11 dBV
9 dBV
01h
11.5 dBV
9.5 dBV
02h
12.0 dBV
10 dBV
03h
12.5 dBV
10.5 dBV
04h
13.0 dBV
11 dBV
05h
13.5 dBV
11.5 dBV
06h
14.0 dBV
12 dBV
07h
14.5 dBV
12.5 dBV
08h
15.0 dBV
13 dBV
09h
15.5 dBV
13.5 dBV
0Ah
16.0 dBV
14 dBV
0Bh
16.5 dBV
14.5 dBV
0Ch
17.0 dBV
15 dBV
0Dh
17.5 dBV
15.5 dBV
0Eh
18.0 dBV
16 dBV
0Fh
18.5 dBV
16.5 dBV
10h
19 dBV
17 dBV
17.5 dBV
11h
19.5 dBV
12h
20 dBV
18 dBV
13h
20.5 dBV
18.5 dBV
14h
21 dBV
19 dBV
Others : Reserved
0
Reserved
RW
0h
Reserved
8.9.10 DC_BLK0 (page=0x00 address=0x04) [reset=21h]
Bit
Field
Type
Reset
Description
7
VBAT1S_MODE
RW
0h
VBAT1S supply
0b = Supplied externally
1b = Internally generated from PVDD
6
IRQZ_PU
RW
0h
IRQZ internal pull up enable.
0b = Disabled
1b = Enabled
5
AMP_SS
*When Spread Spectrum and Sync
Mode are both enabled, Sync Mode
takes priority
RW
1h
Low EMI spread spectrum is
0b = Disabled
1b = Enabled
4-3
Reserved
R
0h
Reserved
1h
Forward Path DC blocker
0h = Disabled (filter bypassed)
1h = 2 Hz
2h = 50 Hz
3h = 100 Hz
4h = 200 Hz
5h = 400 Hz
6h = 800 Hz
7h = Reserved
* For 44.1/88.2 kHz sampling rates divide the values from above
by 1.0884
2-0
HPF_FREQ_PB[2:0]
RW
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8.9.11 DC_BLK1 (page=0x00 address=0x05) [reset=41h]
Bit
Field
Type
Reset
7-4
Reserved
RW
4h
Reserved
3
TFB_EN
RW
0h
Thermal Foldback is
0b = Disabled
1b = Enabled
1h
Record Path DC blocker
0h = Disabled (filter bypassed)
1h = 2 Hz
2h = 50 Hz
3h = 100 Hz
4h = 200 Hz
5h = 400 Hz
6h = 800 Hz
7h = Reserved
* For 44.1/88.2 kHz sampling rates divide the values from above
by 1.0884
2-0
HPF_FREQ_REC[2:0]
RW
Description
8.9.12 MISC_CFG1 (page=0x00 address=0x06) [reset=00h]
Bit
Field
Type
Reset
7-6
Reserved
RW
0h
Reserved
5
OCE_RETRY
RW
0h
Retry after over current event.
0b = Disabled
1b = Enabled, retry after timer.
4
OTE_RETRY
RW
0h
Retry after over temperature event.
0b = Disabled
1b = Enabled, retry after timer.
3
PFFB_EN
RW
0h
Post-Filter Feedback is
0b = Disabled (uses OUT_N and OUT_P pins)
1b = Enabled (uses VSNS_N and VSNS_P pins)
0h
When safe mode is enabled adds 18dB attenuation on channel
gain. Safe mode is
0b = Disabled
1b = Enabled
2
SMODE_EN
RW
Description
OC Threshold Control
0h = Nominal Value
1-0
OC_CTRL[1:0]
RW
0h
1h = 10% below Nominal Value
2h = 20% below Nominal Value
3h = 30% below Nominal Value
8.9.13 MISC_CFG2 (page=0x00 address=0x07) [reset=20h]
Bit
7-6
5-4
3-2
40
Field
SDZ_MODE[1:0]
SDZ_TIMEOUT[1:0]
DVC_RAMP_RATE[1:0]
Type
RW
RW
RW
Reset
Description
0h
SDZ Mode configuration.
00b = Shutdown after timeout
01b = Immediate forced shutdown
10b - 11b = Reserved
2h
SDZ Timeout value
00b = 2 ms
01b = 4 ms
10b = 6 ms
11b = 23.8 ms
0h
Digital volume control ramp rate
00b = 0.5 dB per 1 sample
01b = 0.5 dB per 4 samples
10b = 0.5 dB per 8 samples
11b = Volume ramping disabled
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Bit
SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Field
Type
Reset
Description
1
I2C_GBL_EN
RW
0h
I2C global address is
0b = Disabled
1b = Enabled
0
I2C_AD_DET
RW
0h
Re-detect I2C peripheral address (self clearing bit).
0b = Normal detection
1b = Re-detect address after power up
8.9.14 TDM_CFG0 (page=0x00 address=0x08) [reset=09h]
Bit
Field
Type
Reset
Description
7
AMP_INV
RW
0h
6
CLASSD_SYNC
*When Spread Spectrum and Sync
Mode are both enabled, Sync Mode
takes priority
RW
0h
5
RAMP_RATE
RW
0h
Sample rate based on 44.1 kHz or 48 kHz when
CLASSD_SYNC = 1
0b = 48 kHz
1b = 44.1 kHz
4
AUTO_RATE
RW
0h
Auto detection of TDM sample rate
0b = Enabled
1b = Disabled
Invert audio amplifier ouput
0b = Normal
1b = Invert
Class-D synchronization mode
0b = Not synchronized to audio clocks
1b = Synchronized to audio clocks
3-1
SAMP_RATE[2:0]
RW
4h
Sample rate of the TDM bus
000b - 011b = Reserved
100b = 44.1/48 kHz
101b = 88.2/96 kHz
110b - 111b = Reserved
0
FRAME_START
RW
1h
TDM frame start polarity
0b = Low to High on FSYNC
1b = High to Low on FSYNC
8.9.15 TDM_CFG1 (page=0x00 address=0x09) [reset=02h]
Bit
Field
Type
Reset
Description
7
Reserved
R
0h
Reserved
6
RX_JUSTIFY
RW
0h
TDM RX sample justification within the time slot
0b = Left
1b = Right
5-1
RX_OFFSET[4:0]
RW
1h
TDM RX start of frame to time slot 0 offset - number of SBCLK
cycles from transiton of FSYNC
0
RX_EDGE
RW
0h
TDM RX capture clock polarity
0b = Rising edge of SBCLK
1b = Falling edge of SBCLK
8.9.16 TDM_CFG2 (page=0x00 address=0x0A) [reset=0Ah]
Bit
7-6
5-4
Field
IVMON_LEN[1:0]
RX_SCFG[1:0]
Type
RW
RW
Reset
Description
0h
Sets the current and voltage data to length of
00b = 16 bits
01b = 12 bits
10b = 8 bits
11b = Reserved
0h
TDM RX time slot select config
00b = Mono with time slot equal to I2C address offset
01b = Mono left channel
10b = Mono right channel
11b = Stereo downmix (L+R)/2
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Bit
3-2
1-0
Field
RX_WLEN[1:0]
RX_SLEN[1:0]
Type
RW
RW
Reset
Description
2h
TDM RX word length
00b = 16 bits
01b = 20 bits
10b = 24 bits
11b = 32 bits
2h
TDM RX time slot length
00b = 16 bits
01b = 24 bits
10b = 32 bits
11b = Reserved
8.9.17 LIM_MAX_ATTN (page=0x00 address=0x0B) [reset=80h]
Bit
Field
Type
Reset
Description
7-4
LIM_MAX_ATTN[3:0]
RW
8h
Limiter Maximum Attenuation
0h = 1 dB
1h = 2 dB
2h = 3 dB
...
0Eh = 15 dB
0Fh = Reserved
3-0
Reserved
R
0h
Reserved
8.9.18 TDM_CFG3 (page=0x00 address=0x0C) [reset=10h]
Bit
Field
Type
Reset
Description
7-4
RX_SLOT_R[3:0]
RW
1h
TDM RX Right Channel Time Slot.
3-0
RX_SLOT_L[3:0]
RW
0h
TDM RX Left Channel Time Slot.
8.9.19 TDM_CFG4 (page=0x00 address=0x0D) [reset=13h]
Bit
Field
Type
Reset
Description
7
TX_KEEPCY
RW
0h
TDM and ICC TX SDOUT LSB data will be driven for full/half
cycles when TX_KEEPEN is enabled
0b = Full-cycle
1b = Half-cycle
6
TX_KEEPLN
RW
0h
TDM and ICC TX SDOUT will hold the bus for the following
when TX_KEEPEN is enabled
0b = 1 LSB cycle
1b = Always
5
TX_KEEPEN
RW
0h
TDM and ICC TX SDOUT bus keeper enable
0b = Disable bus keeper
1b = Enable bus keeper
4
TX_FILL
RW
1h
TDM and ICC TX SDOUT unused bit field fill
0b = Transmit 0
1b = Transmit Hi-Z
3-1
TX_OFFSET[2:0]
RW
1h
TDM TX start of frame to time slot 0 offset
0
TX_EDGE
RW
1h
TDM TX launch clock polarity
0b = Rising edge of SBCLK
1b = Falling edge of SBCLK
8.9.20 TDM_CFG5 (page=0x00 address=0x0E) [reset=42h]
42
Bit
Field
Type
Reset
Description
7
Reserved
R
0h
Reserved
6
VSNS_TX
RW
1h
TDM TX voltage sense transmit
0b = Disabled
1b = Enabled
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Bit
Field
Type
Reset
5-0
VSNS_SLOT[5:0]
RW
2h
Description
TDM TX voltage sense time slot
8.9.21 TDM_CFG6 (page=0x00 address=0x0F) [reset=40h]
Bit
Field
Type
Reset
Description
7
Reserved
R
0h
Reserved
6
ISNS_TX
RW
1h
TDM TX current sense transmit
0b = Disabled
1b = Enabled
5-0
ISNS_SLOT[5:0]
RW
0h
TDM TX current sense time slot
8.9.22 TDM_CFG7 (page=0x00 address=0x10) [reset=04h]
Bit
Field
Type
Reset
Description
7
VBAT1S_SLEN
RW
0h
TDM TX VBAT1S time slot length
0b = Truncate to 8 bits
1b = Left justify to 16 bits
6
VBAT1S_TX
RW
0h
TDM TX VBAT1S transmit
0b = Disabled
1b = Enabled
5-0
VBAT1S_SLOT[5:0]
RW
4h
TDM TX VBAT1S time slot
8.9.23 TDM_CFG8 (page=0x00 address=0x11) [reset=05h]
Bit
Field
Type
Reset
7
Reserved
R
0h
Reserved
Description
6
TEMP_TX
RW
0h
TDM TX temp sensor transmit
0b = Disabled
1b = Enabled
5-0
TEMP_SLOT[5:0]
RW
5h
TDM TX temp sensor time slot
8.9.24 TDM_CFG9 (page=0x00 address=0x12) [reset=06h]
Bit
Field
Type
Reset
Description
7
PVDD_SLEN
RW
0h
TDM TX PVDD time slot length
0b = Truncate to 8 bits
1b = Left justify to 16 bits
6
PVDD_TX
RW
0h
TDM TX PVDD transmit
0b = Disabled
1b = Enabled
5-0
PVDD_SLOT[5:0]
RW
6h
TDM TX PVDD time slot
8.9.25 TDM_CFG10 (page=0x00 address=0x13) [reset=08h]
Bit
Field
Type
Reset
7
Reserved
R
0h
Reserved
Description
6
STATUS_TX
RW
0h
TDM TX status transmit
0b = Disabled
1b = Enabled
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Bit
Field
Type
Reset
Description
TDM TX status time slot
Status slot bit description:
*Bit7- PVDD status(Cannot be read post analog blocks
shutdown)
0b = PVDD UVLO not detected
1b = PVDD UVLO detected
*Bit6 -Over Current status(Cannot be read post analog blocks
shutdown)
0b = No OC detected
1b = OC detected
*Bit5- Over Temp status(Cannot be read post analog blocks
shutdown)
0b = No OT detected
1b = OT detected
5-0
STATUS_SLOT[5:0]
RW
8h
*Bit4- BOP status
0b = BOP not detected
1b = BOP detected
*Bit3- Signal distortion limiter status
0b = No distortion limiter or ICLA gain applied
1b = Gain attenuation done due to distortion limiter/ICLA
*Bit2- Noise Gate status
0b = Device in normal mode
1b = Device in Noise Gate mode
*Bit1- Class D Power Stage status
0b = Class D Power switch connected to PVDD
1b = Class D Power switch connected to VBAT1S
*Bit0- Power Up state (Cannot be read post analog blocks
shutdown)
0b = Device is powered down
1b = Device is in active state
8.9.26 TDM_CFG11 (page=0x00 address=0x14) [reset=0Ah]
Bit
Field
Type
Reset
7
Reserved
R
0h
Reserved
Description
6
GAIN_TX
RW
0h
TDM/ICC TX limiter gain reduction transmit
0b = Disabled
1b = Enabled
5-0
GAIN_SLOT[5:0]
RW
Ah
TDM/ICC TX limiter gain reduction time slot
8.9.27 ICC_CNFG2 (page=0x00 address=0x15) [reset=00h]
44
Bit
Field
Type
Reset
Description
7-5
Reserved
R
0h
Reserved
4-2
ICC_MODE[2:0]
RW
0h
Selects ICC pin function
0h = Gain alignment on ICC pin
1h = Reserved
2h = ICC pin buffers disabled
3h = ICC pin is a general purpose input
4h = ICC pin is a general purpose output
5h - 7h = Reserved
1-0
Reserved
R
0h
Reserved
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8.9.28 TDM_CFG12 (page=0x00 address=0x16) [reset=12h]
Bit
Field
Type
Reset
Description
7
AUDIO_SLEN
RW
0h
TDM audio slot length
0b = 16 bits
1b = 24 bits
6
AUDIO_TX
RW
0h
TDM audio output transmit
0b = Disabled
1b = Enabled
5-0
AUDIO_SLOT[5:0]
RW
12h
TDM TX status time slot
8.9.29 ICLA_CFG0 (page=0x00 address=0x17) [reset=0Ch]
Bit
Field
Type
Reset
Description
7
ICBA_EN
RW
0h
Inter chip brownout gain alignment
0b = Disabled
1b = Enabled
6-1
ICGA_SLOT[5:0]
RW
6h
Inter chip gain alignment starting time slot
0
ICLA_EN
RW
0h
Inter chip limiter alignment gain
0b = Disabled
1b = Enabled
8.9.30 ICLA_CFG1 (page=0x00 address=0x18) [reset=00h]
Bit
Field
Type
Reset
7
ICGA_SEN[7]
RW
0h
Time slot equals ICGA_SLOT[5:0]+7*3. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
0h
Time slot equals ICGA_SLOT[5:0]+6*3. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
6
ICGA_SEN[6]
RW
Description
5
ICGA_SEN[5]
RW
0h
Time slot equals ICGA_SLOT[5:0]+5*3. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
4
ICGA_SEN[4]
RW
0h
Time slot equals ICGA_SLOT[5:0]+4*3. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
0h
Time slot equals ICGA_SLOT[5:0]+3*3. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
3
ICGA_SEN[3]
RW
2
ICGA_SEN[2]
RW
0h
Time slot equals ICGA_SLOT[5:0]+2*3. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
1
ICGA_SEN[1]
RW
0h
Time slot equals ICGA_SLOT[5:0]+1*3. When enabled, the
limiter will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
0h
Time slot equals ICGA_SLOT[5:0]+0. When enabled, the limiter
will include this time slot in the alignment group.
0b = Disabled
1b = Enabled
0
ICGA_SEN[0]
RW
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.31 DG_0 (page=0x00 address=0x19) [reset=0Dh]
Bit
Field
Type
Reset
7
ICGA_NG_EN
RW
0h
Recommended with ICGA feature when Noise gate is enabled
0b = Feature disabled
1b = Feature enabled
6
DG_CLK
RW
0h
Diagnostic generated clock source
0b = Internal osscilator
1b = External SBCLK and FSYNC
5
ICG_MODE
RW
0h
Device attenuation
0b = BOP and Limiter attenuation added together
1b = Max attenuation of either BOP or Limiter
Dh
Selects Tone Freq for DG MODE
00h = Zero input (Idle channel)
01h = -6 dBFS positive DC
02h = -6 dBFS negative DC
03h = -12 dBFS positive DC
04h = -12 dBFS negative DC
05h = -18 dBFS positive DC
06h = -18 dBFS negative DC
07h = -24 dBFS positive DC
08h = -24 dBFS negative DC
09h = -30 dBFS positive DC
0Ah = -30 dBFS negative DC
0Bh = -6 dBFS fs/4
0Ch = -4.8 dBFS fs/6
0Dh = 0 dBFS 1 kHz sine
0Eh = Programmable DC using B0_P4, registers 0x08 to 0x0B
0Fh-1Fh = Reserved
4-0
DG_SIG[4:0]
RW
Description
8.9.32 DVC (page=0x00 address=0x1A) [reset=00h]
Bit
7-0
Field
DVC_LVL[7:0]
Type
RW
Reset
0h
Description
Digital volume control
00h = 0 dB
01h = -0.5 dB
02h = -1 dB
...
C8h = -100 dB
Others : Mute
8.9.33 LIM_CFG0 (page=0x00 address=0x1B) [reset=62h]
46
Bit
Field
Type
Reset
7-6
Reserved
R
1h
Reserved
Description
5
LIM_HR_EN
RW
1h
Limiter dynamic headroom
0b = Disabled
1b = Enabled
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Bit
SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Field
Type
Reset
Description
4-1
LIM_ATK_RT[3:0]
RW
1h
Limiter attack rate
00h = 20 μs/dB
01h = 40 μs/dB
02h = 80 μs/dB
03h = 160 μs/dB
04h = 320 μs/dB
05h = 640 μs/dB
06h = 1280 μs/dB
07h = 2560 μs/dB
08h = 5120 μs/dB
09h = 10240 μs/dB
10h = 20480 μs/dB
11h = 40960 μs/dB
12h = 81920 μs/dB
13h = 163840 μs/dB
Others : Reserved
0
LIM_EN
RW
0h
Limiter is
0b = Disabled
1b = Enabled
8.9.34 LIM_CFG1 (page=0x00 address=0x1C) [reset=32h]
Bit
7
6-3
2-0
Field
LIM_PDB
LIM_RLS_RT[3:0]
LIM_HLD_TM[2:0]
Type
RW
RW
RW
Reset
Description
0h
During BOP the limiter will be
0b =Running
1b = Paused
6h
Limter release rate
0h = Reserved
1h = 4 ms/dB
2h = 8 ms/dB
3h = 16 ms/dB
4h = 32 ms/dB
5h = 64 ms/dB
6h = 128 ms/dB
7h = 256 ms/dB
8h = 512 ms/dB
9h = 1024 ms/dB
Ah = 2048 ms/dB
Bh = 4096 ms/dB
Ch = 8192 ms/dB
Others : reserved
2h
Limiter hold time
0h = Reserved
1h = 10 ms
2h = 25 ms
3h = 50 ms
4h = 100 ms
5h = 250 ms
6h = 500 ms
7h = 1000 ms
8.9.35 BOP_CFG0 (page=0x00 address=0x1D) [reset=40h]
Bit
Field
Type
Reset
Description
7-3
LIM_DHR[4:0]
RW
8h
Limiter Maximum Headroom as % of PVDD
00h = -20
01h = -17.5
02h = -15
..
0Fh = 17.5
10h = 20
Others = Reserved
2
Reserved
R
0h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Bit
Field
Type
Reset
Description
1
BOP_SHDN
RW
0h
When BOP level 0 is reached device
0b = Attenuates based on level 0 setttings
1b = Mutes followed by device shutdown
0
BOP_EN
RW
0h
Brown out prevention
0b = Disabled
1b = Enabled
8.9.36 BOP_CFG1 (page=0x00 address=0x1E) [reset=32h]
Bit
Field
Type
Reset
7
BOP_HLD_CLR
RW
0h
BOP infinite hold clear (self clearing)
0b = Do not clear
1b = Clear
32h
Device maximum attenuation of limiter and BOP combined
00h = 0 dB
01h = -1 dB
02h = -2 dB
03h = -3 dB
..
2Eh = -46 dB
2Fh-7Fh = Disabled
6-0
DEV_MAX_ATTN[6:0]
RW
Description
8.9.37 BOP_CFG2 (page=0x00 address=0x1F) [reset=02h]
Bit
7-5
48
Field
BOP_DT3[2:0]
Type
RW
Reset
Description
0h
BOP level 3 dwell time
0h= 0 μs
1h = 100 μs
2h = 250 μs
3h = 500 μs
4h = 1000 μs
5h = 2000 μs
6h = 4000 μs
7h = 8000 μs
4-1
BOP_ATK_ST3[3:0]
RW
1h
BOP level 3 attack step size
0h = -0.0625 dB
1h = -0.5 dB
2h = -0.8958 dB
3h = -1.2916 dB
4h = -1.6874 dB
5h = -2.0832 dB
6h = -2.479 dB
7h = -2.8748 dB
8h = -3.2706 dB
9h = -3.6664 dB
Ah = -4.0622 dB
Bh = -4.458 dB
Ch = -4.8538 dB
Dh = -5.2496 dB
Eh = -5.6454 dB
Fh = -6 dB
0
Reserved
R
0h
Reserved
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8.9.38 BOP_CFG3 (page=0x00 address=0x20) [reset=06h]
Bit
7-5
Field
BOP_ATK_RT3[2:0]
Type
RW
Reset
Description
0h
BOP level 3 attack rate
0h= 2.5 μs
1h = 5 μs
2h = 10 μs
3h = 25 μs
4h = 50 μs
5h = 100 μs
6h = 250 μs
7h = 500 μs
4-1
BOP_RLS_ST3[3:0]
RW
3h
BOP level 3 release step size
0h = 0.0625 dB
1h = 0.5 dB
2h = 0.8958 dB
3h = 1.2916 dB
4h = 1.6874 dB
5h = 2.0832 dB
6h = 2.479 dB
7h = 2.8748 dB
8h = 3.2706 dB
9h = 3.6664 dB
0Ah = 4.0622 dB
0Bh = 4.458 dB
0Ch = 4.8538 dB
0Dh = 5.2496 dB
0Eh = 5.6454 dB
0Fh = 6 dB
0
Reserved
R
0h
Reserved
8.9.39 BOP_CFG4 (page=0x00 address=0x21) [reset=2Ch]
Bit
7-5
4-0
Field
BOP_RLS_RT3[2:0]
BOP_MAX_ATTN3[4:0]
Type
RW
RW
Reset
1h
0Ch
Description
BOP level 3 release rate time
0h= 5 ms
1h = 10 ms
2h = 25 ms
3h = 50 ms
4h = 100 ms
5h = 250 ms
6h = 500 ms
7h = 1000 ms
BOP level 3 maximum attenuation
00h = 0 dB
01h = -1 dB
02h = -2 dB
..
0Ch = -12 dB
..
1Eh = -30 dB
1Fh = -31 dB
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.40 BOP_CFG5 (page=0x00 address=0x22) [reset=4Ch]
Bit
Field
Type
Reset
Description
BOP level 3 threshold (V)
Setting
7-0
BOP_TH3[7:0]
RW
4Ch
BOP_SRC=0 (VBAT1S Source)
BOP_SRC=1 (PVDD Source)
00h
2.7
5.5
01h
2.75
5.55
02h
2.8
5.6
.....
.....
.....
38h
5.5
8.3
39h
Reserved
8.35
.....
Reserved
.....
5Ah
Reserved
10
.....
Reserved
.....
FDh
Reserved
18.15
FEh
Reserved
18.2
FFh
Reserved
18.25
8.9.41 BOP_CFG6 (page=0x00 address=0x23) [reset=20h]
Bit
Type
Reset
Description
7-5
BOP_HT3[2:0]
RW
1h
BOP level 3 hold time
0h = 0 ms
1h = 10 ms
2h = 100 ms
3h = 250 ms
4h = 500ms
5h = 1000 ms
6h = 2000 ms
7h = Infinte (This can be exited using BOP_HLD_CLR bit)
4
BOP_DIS3
RW
0h
BOP level 3
0b = Enabled
1b = Disabled
0h
BOP current state - set BOP_STAT_HLD bit high to hold update
and valid readack
0h = Idle
1h = Attacking Level 3
2h = Attacking Level 2
3h = Attacking Level 1
4h = Attacking Level 0
5h = Holding Level 3
6h = Holding Level 2
7h = Holding Level1
8h = Holding Level 0
9h = Releasing Level 3
Ah = Releasing Level 2
Bh = Releasing Level 1
Ch = Releasing Level 0
Dh-Fh = Reserved
3-0
50
Field
BOP_STAT_STATE[3:0]
R
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.42 BOP_CFG7 (page=0x00 address=0x24) [reset=02h]
Bit
7-5
Field
BOP_DT2[2:0]
Type
RW
Reset
Description
0h
BOP level 2 dwell time
0h= 0 μs
1h = 100 μs
2h = 250 μs
3h = 500 μs
4h = 1000 μs
5h = 2000 μs
6h = 4000 μs
7h = 8000 μs
4-1
BOP_ATK_ST2[3:0]
RW
1h
BOP level 2 attack step size
0h = -0.0625 dB
1h = -0.5 dB
2h = -0.8958 dB
3h = -1.2916 dB
4h = -1.6874 dB
5h = -2.0832 dB
6h = -2.479 dB
7h = -2.8748 dB
8h = -3.2706 dB
9h = -3.6664 dB
Ah = -4.0622 dB
Bh = -4.458 dB
Ch = -4.8538 dB
Dh = -5.2496 dB
Eh = -5.6454 dB
Fh = -6 dB
0
Reserved
R
0h
Reserved
8.9.43 BOP_CFG8 (page=0x00 address=0x25) [reset=06h]
Bit
7-5
Field
BOP_ATK_RT2[2:0]
Type
RW
Reset
Description
0h
BOP level 2 attack rate
0h= 2.5 μs
1h = 5 μs
2h = 10 μs
3h = 25 μs
4h = 50 μs
5h = 100 μs
6h = 250 μs
7h = 500 μs
4-1
BOP_RLS_ST2[3:0]
RW
3h
BOP level 2 release step size
0h = 0.0625 dB
1h = 0.5 dB
2h = 0.8958 dB
3h = 1.2916 dB
4h = 1.6874 dB
5h = 2.0832 dB
6h = 2.479 dB
7h = 2.8748 dB
8h = 3.2706 dB
9h = 3.6664 dB
Ah = 4.0622 dB
Bh = 4.458 dB
Ch = 4.8538 dB
Dh = 5.2496 dB
Eh = 5.6454 dB
Fh = 6 dB
0
Reserved
R
0h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.44 BOP_CFG9 (page=0x00 address=0x26) [reset=32h]
Bit
7-5
4-0
Field
Type
BOP_RLS_RT2[2:0]
Reset
RW
BOP_MAX_ATTN2[4:0]
RW
Description
1h
BOP level 2 release rate time
0h= 5 ms
1h = 10 ms
2h = 25 ms
3h = 50 ms
4h = 100 ms
5h = 250 ms
6h = 500 ms
7h = 1000 ms
12h
BOP level 2 maximum attenuation
00h = 0 dB
01h = -1 dB
02h = -2 dB
..
12h = -18 dB
..
1Eh = -30 dB
1Fh = -31 dB
8.9.45 BOP_CFG10 (page=0x00 address=0x27) [reset=46h]
Bit
Field
Type
Reset
Description
BOP level 2 threshold (V)
Setting
7-0
BOP_TH2[7:0]
RW
46h
BOP_SRC=0 (VBAT1S Source)
BOP_SRC=1 (PVDD Source)
00h
2.7
5.5
01h
2.75
5.55
02h
2.8
5.6
.....
.....
.....
38h
5.5
8.3
39h
Reserved
8.35
.....
Reserved
.....
5Ah
Reserved
10
.....
Reserved
.....
FDh
Reserved
18.15
FEh
Reserved
18.2
FFh
Reserved
18.25
8.9.46 BOP_CFG11 (page=0x00 address=0x28) [reset=20h]
Bit
52
Field
Type
Reset
Description
7-5
BOP_HT2[2:0]
RW
1h
BOP level 2 hold time
0h = 0 ms
1h = 10 ms
2h = 100 ms
3h = 250 ms
4h = 500ms
5h = 1000 ms
6h = 2000 ms
7h = Infinte (This can be exited using BOP_HLD_CLR bit)
4
BOP_DIS2
RW
0h
BOP level 2
0b = Enabled
1b = Disabled
3-0
Reserved
R
0h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.47 BOP_CFG12 (page=0x00 address=0x29) [reset=02h]
Bit
7-5
Field
BOP_DT1[2:0]
Type
RW
Reset
Description
0h
BOP level 1 dwell time
0h= 0 μs
1h = 100 μs
2h = 250 μs
3h = 500 μs
4h = 1000 μs
5h = 2000 μs
6h = 4000 μs
7h = 8000 μs
4-1
BOP_ATK_ST1[3:0]
RW
1h
BOP level 1 attack step size
0h = -0.0625 dB
1h = -0.5 dB
2h = -0.8958 dB
3h = -1.2916 dB
4h = -1.6874 dB
5h = -2.0832 dB
6h = -2.479 dB
7h = -2.8748 dB
8h = -3.2706 dB
9h = -3.6664 dB
Ah = -4.0622 dB
Bh = -4.458 dB
Ch = -4.8538 dB
Dh = -5.2496 dB
Eh = -5.6454 dB
Fh = -6 dB
0
Reserved
R
0h
Reserved
8.9.48 BOP_CFG13 (page=0x00 address=0x2A) [reset=06h]
Bit
7-5
Field
BOP_ATK_RT1[2:0]
Type
RW
Reset
Description
0h
BOP level 1 attack rate
0h= 2.5 μs
1h = 5 μs
2h = 10 μs
3h = 25 μs
4h = 50 μs
5h = 100 μs
6h = 250 μs
7h = 500 μs
4-1
BOP_RLS_ST1[3:0]
RW
3h
BOP level 1 release step size
0h = 0.0625 dB
1h = 0.5 dB
2h = 0.8958 dB
3h = 1.2916 dB
4h = 1.6874 dB
5h = 2.0832 dB
6h = 2.479 dB
7h = 2.8748 dB
8h = 3.2706 dB
9h = 3.6664 dB
Ah = 4.0622 dB
Bh = 4.458 dB
Ch = 4.8538 dB
Dh = 5.2496 dB
Eh = 5.6454 dB
Fh = 6 dB
0
Reserved
R
0h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.49 BOP_CFG14 (page=0x00 address=0x2B) [reset=38h]
Bit
7-5
4-0
Field
Type
BOP_RLS_RT1[2:0]
Reset
RW
BOP_MAX_ATTN1[4:0]
RW
Description
1h
BOP level 1 release rate time
0h= 5 ms
1h = 10 ms
2h = 25 ms
3h = 50 ms
4h = 100 ms
5h = 250 ms
6h = 500 ms
7h = 1000 ms
18h
BOP level 1 maximum attenuation
0h = 0 dB
1h = -1 dB
2h = -2 dB
..
18h = -24 dB
..
1Eh = -30 dB
1Fh = -31 dB
8.9.50 BOP_CFG15 (page=0x00 address=0x2C) [reset=40h]
Bit
Field
Type
Reset
Description
BOP level 1 threshold (V)
Setting
7-0
BOP_TH1[7:0]
RW
40h
BOP_SRC=0 (VBAT1S Source)
BOP_SRC=1 (PVDD Source)
00h
2.7
5.5
01h
2.75
5.55
02h
2.8
5.6
.....
.....
.....
38h
5.5
8.3
39h
Reserved
8.35
.....
Reserved
.....
5Ah
Reserved
10
.....
Reserved
.....
FDh
Reserved
18.15
FEh
Reserved
18.2
FFh
Reserved
18.25
8.9.51 BOP_CFG17 (page=0x00 address=0x2D) [reset=20h]
Bit
54
Field
Type
Reset
Description
7-5
BOP_HT1[2:0]
RW
1h
BOP level 1 hold time
0h = 0 ms
1h = 10 ms
2h = 100 ms
3h = 250 ms
4h = 500ms
5h = 1000 ms
6h = 2000 ms
7h = Infinte (This can be exited using BOP_HLD_CLR bit)
4
BOP_DIS1
RW
0h
BOP level 1
0b = Enabled
1b = Disabled
3-0
Reserved
R
0h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.52 BOP_CFG18 (page=0x00 address=0x2E) [reset=02h]
Bit
7-5
Field
BOP_DT0[2:0]
Type
RW
Reset
Description
0h
BOP level 0 dwell time
0h= 0 μs
1h = 100 μs
2h = 250 μs
3h = 500 μs
4h = 1000 μs
5h = 2000 μs
6h = 4000 μs
7h = 8000 μs
4-1
BOP_ATK_ST0[3:0]
RW
1h
BOP level 0 attack step size
0h = -0.0625 dB
1h = -0.5 dB
2h = -0.8958 dB
3h = -1.2916 dB
4h = -1.6874 dB
5h = -2.0832 dB
6h = -2.479 dB
7h = -2.8748 dB
8h = -3.2706 dB
9h = -3.6664 dB
Ah = -4.0622 dB
Bh = -4.458 dB
Ch = -4.8538 dB
Dh = -5.2496 dB
Eh = -5.6454 dB
Fh = -6 dB
0
Reserved
R
0h
Reserved
8.9.53 BOP_CFG19 (page=0x00 address=0x2F) [reset=06h]
Bit
7-5
Field
BOP_ATK_RT0[2:0]
Type
RW
Reset
Description
0h
BOP level 0 attack rate
0h= 2.5 μs
1h = 5 μs
2h = 10 μs
3h = 25 μs
4h = 50 μs
5h = 100 μs
6h = 250 μs
7h = 500 μs
4-1
BOP_RLS_ST0[3:0]
RW
3h
BOP level 0 release step size
0h = 0.0625 dB
1h = 0.5 dB
2h = 0.8958 dB
3h = 1.2916 dB
4h = 1.6874 dB
5h = 2.0832 dB
6h = 2.479 dB
7h = 2.8748 dB
8h = 3.2706 dB
9h = 3.6664 dB
Ah = 4.0622 dB
Bh = 4.458 dB
Ch = 4.8538 dB
Dh = 5.2496 dB
Eh = 5.6454 dB
Fh = 6 dB
0
Reserved
R
0h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.54 BOP_CFG20 (page=0x00 address=0x30) [reset=3Eh]
Bit
7-5
4-0
Field
Type
BOP_RLS_RT0[2:0]
Reset
RW
BOP_MAX_ATTN0[4:0]
1h
RW
1Eh
Description
BOP level 0 release rate time
0h= 5 ms
1h = 10 ms
2h = 25 ms
3h = 50 ms
4h = 100 ms
5h = 250 ms
6h = 500 ms
7h = 1000 ms
BOP level 0 maximum attenuation.
0h = 0 dB
1h = -1 dB
2h = -2 dB
..
Ch = -12 dB
..
1Eh = -30 dB
1Fh = -31 dB
8.9.55 BOP_CFG21 (page=0x00 address=0x31) [reset=37h]
Bit
Field
Type
Reset
Description
BOP level 0 threshold (V)
Setting
7-0
BOP_TH0[7:0]
RW
37h
BOP_SRC=0 (VBAT1S Source)
BOP_SRC=1 (PVDD Source)
00h
2.7
5.5
01h
2.75
5.55
02h
2.8
5.6
.....
.....
.....
38h
5.5
8.3
39h
Reserved
8.35
.....
Reserved
.....
5Ah
Reserved
10
.....
Reserved
.....
FDh
Reserved
18.15
FEh
Reserved
18.2
FFh
Reserved
18.25
8.9.56 BOP_CFG22 (page=0x00 address=0x32) [reset=20h]
Bit
56
Field
Type
Reset
Description
7-5
BOP_HT0[2:0]
RW
1h
BOP level 0 hold time
0h = 0 ms
1h = 10 ms
2h = 100 ms
3h = 250 ms
4h = 500ms
5h = 1000 ms
6h = 2000 ms
7h = Infinte (This can be exited using BOP_HLD_CLR bit)
4
BOP_DIS0
RW
0h
BOP level 0
0b = Enabled
1b = Disabled
3-1
Reserved
RW
0h
Reserved
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Bit
0
SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Field
BOP_STAT_HLD
Type
RW
Reset
Description
0h
Hold BOP status for BOP_STAT_STATE[3:0],
BOP_STAT_LLVL[2:0], and BOP_STAT_PVDD[9:0] register bits.
When this bit is set back to low the status registers will be reset
and updating will resume.
0b= Hold update disabled, status register readback invalid
1b= Hold update enabled, status register readback valid
8.9.57 BOP_CFG23 (page=0x00 address=0x33) [reset=FFh]
Bit
7-0
Field
BOP_STAT_PVDD[9:2]
Type
R
Reset
FFh
Description
Lowest PVDD measured since last read. Set BOP_STAT_HLD
high before reading.Till the time SAR does not get enabled in
device, this register wll readback default value on PVDD (FFh)
if device is in PWR_MODE2, else it will readback default value
on VBAT (FFh) when device is in PWR_MODE1. Note: default
value of PVDD is 23V and of VBAT1S is 6V.
8.9.58 BOP_CFG24 (page=0x00 address=0x34) [reset=E6h]
Bit
7-6
5-3
Field
BOP_STAT_PVDD[1:0]
BOP_STAT_LLVL[2:0]
Type
R
R
Reset
Description
3h
Lowest PVDD measured since last read. Set BOP_STAT_HLD
high before reading.Till the time SAR does not get enabled in
device, this register wll readback default value on PVDD (3h) if
device is in PWR_MODE2, else it will readback default value on
VBAT (3h) when device is in PWR_MODE1. Note: default value
of PVDD is 23V and of VBAT1S is 6V.
4h
Lowest BOP level attacked since last read. Set
BOP_STAT_HLD high before reading.
0h = Attack level 0 was lowest attack level
1h = Attack level 1 was lowest attack level
2h = Attack level 2 was lowest attack level
3h = Attack level 3 was lowest attack level
4h = No BOP attacked since last read
5h - 7h = Reserved
2-1
LVS_FTH_LOW[1:0]
RW
3h
Threshold for LVS when CDS_MODE = 3h
0h = -121.5 dBFS
1h= -101.5 dBFS (default)
2h= -81.5 dBFS
3h = -71.5 dBFS
0
Reserved
R
0h
Reserved
8.9.59 NG_CFG0 (page=0x00 address=0x35) [reset=BDh]
Bit
7-5
Field
NG_HYST[2:0]
Type
RW
Reset
Description
5h
Noise Gate entry hysteris timer
0h = 400 μs
1h = 600 μs
2h = 800 μs
3h = 2 ms
4h = 10 ms
5h = 50 ms
6h = 100 ms
7h = 1000 ms
4-3
NG_LVL[1:0]
RW
3h
Noise Gate audio threshold level
0h = -90 dBFS
1h= -100 dBFS
2h = -110 dBFS
3h = -120 dBFS
2
NG_EN
RW
1h
Noise Gate
0b = Disabled
1b= Enabled
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Bit
Field
Type
Reset
1-0
Reserved
RW
1h
Description
Reserved
8.9.60 NG_CFG1 (page=0x00 address=0x36) [reset=ADh]
Bit
Field
Type
Reset
7-6
Reserved
RW
2h
Reserved
5
NG_DVR_EN
RW
1h
Volume ramping on Noise Gate control
0b = Enabled
1b = Disabled
4
Reserved
R
0h
Reserved
Dh
PVDD to VBAT1S hysteresis time
0h - 9h = Reserved
Ah = 1 ms
Bh = 10 ms
Ch = 20 ms
Dh = 50 ms
Eh = 75 ms
Fh = 100 ms
3-0
LVS_HYS[3:0]
RW
Description
8.9.61 LVS_CFG0 (page=0x00 address=0x37) [reset=A8h]
Bit
Field
Type
Reset
Description
7
LVS_TMODE
RW
1h
Low Voltage Signaling detection threshold
0b = Fixed
1b = Relative to VBAT1S voltage
6
Reserved
RW
1h
Reserved
8h
Threshold for LVS when CDS_MODE = 0h
00h = -18.5 dBFS
01h = -18.25 dBFS (default)
02h = -18 dBFS
03h = -17.75 dBFS
04h = -17.5 dBFS
..
08h = -16.5 dBFS
..
1Eh = -11 dBFS
1Fh = -10.75 dBFS
4-0
LVS_FTH[4:0]
RW
8.9.62 DIN_PD (page=0x00 address=0x38) [reset=03h]
58
Bit
Field
Type
Reset
Description
7
Reserved
RW
0h
Reserved
6
DIN_PD[4]
RW
0h
Weak pull down for ICC
0b = Disabled
1b = Enabled
5
DIN_PD[3]
RW
0h
Weak pull down for SDOUT
0b = Disabled
1b = Enabled
4
DIN_PD[2]
RW
0h
Weak pull down for SDIN
0b = Disabled
1b = Enabled
3
DIN_PD[1]
RW
0h
Weak pull down for FSYNC
0b = Disabled
1b = Enabled
2
DIN_PD[0]
RW
0h
Weak pull down for SBCLK
0b = Disabled
1b = Enabled
1-0
Reserved
RW
3h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.63 INT_MASK0 (page=0x00 address=0x3B) [reset=FCh]
Bit
Field
Type
Reset
Description
7
IM_BOPM
RW
1h
BOP mute interrupt
0b = No Mask
1b = Mask
6
IM_BOPIH
RW
1h
Bop infinite hold interrupt.
0b = No Mask
1b = Mask
5
IM_LIMMA
RW
1h
Limiter max attenuation interrupt
0b = No Mask
1b = Mask
4
IM_PBIP
RW
1h
PVDD below limiter inflection point interrupt
0b = No Mask
1b = Mask
3
IM_LIMA
RW
1h
Limiter active interrupt
0b = No Mask
1b = Mask
2
IM_TDMCE
RW
1h
TDM clock error interrupt
0b = No Mask
1b = Mask
1
IM_OC
RW
0h
Over current error interrupt
0b = No Mask
1b = Mask
0
IM_OT
RW
0h
Over temp error interrupt
0b = No Mask
1b = Mask
8.9.64 INT_MASK1 (page=0x00 address=0x3C) [reset=BFh]
Bit
Field
Type
Reset
Description
7-6
Reserved
RW
2h
Reserved
5
IM_LDC
RW
1h
Load diagnostic completion
0h = No Mask
1h = Mask
4-3
IM_LDMODE[1:0]
RW
3h
Speaker Load
0h = No Mask
1h = Mask Open Load Detection
2h = Mask Short Load Detection
3h = Mask Both
2-11
Reserved
RW
1h
Reserved
0
IM_VBATLIM
RW
1h
Gain limiter active interrupt
0h = No Mask
1h = Mask
8.9.65 INT_MASK4 (page=0x00 address=0x3D) [reset=DFh]
Bit
Field
Type
Reset
Description
7
IM_PLL_CLK
RW
1h
Internal PLL Derived Clock Error Mask
0h = No Mask
1h = Mask
6
Reserved
RW
1h
Reserved
5
IM_VBAT1S_UVLO
RW
0h
VBAT1S Under Voltage
0h = No Mask
1h = Mask
4-0
Reserved
RW
1Fh
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.66 INT_MASK2 (page=0x00 address=0x40) [reset=F6h]
Bit
Field
Type
Reset
Description
7
IM_TO105
RW
1h
Temperature over 105 ºC interrupt.
0h = No Mask
1h = Mask
6
IM_TO115
RW
1h
Temperature over 115 ºC interrupt.
0h = No Mask
1h = Mask
5
IM_TO125
RW
1h
Temperature over 125 ºC interrupt.
0h = No Mask
1h = Mask
4
IM_TO135
RW
1h
Temperature over 135 ºC interrupt.
0h = No Mask
1h = Mask
3
IM_LDO_UV
RW
0h
Internal VBAT1S LDO Under Voltage
0h = No Mask
1h = Mask
2
IM_LDO_OV
RW
1h
Internal VBAT1S LDO Over Voltage
0h = No Mask
1h = Mask
1
IM_LDO_OL
RW
1h
Internal VBAT1S LDO Over Load
0h = No Mask
1h = Mask
0
IM_PUVLO
RW
0h
PVDD UVLO interrupt.
0h = No Mask
1h = Mask
8.9.67 INT_MASK3 (page=0x00 address=0x41) [reset=00h]
60
Bit
Field
Type
Reset
Description
7
IM_TDTH2
RW
0h
Thermal Detection threshold 2
0h = No Mask
1h = Mask
6
IM_TDTH1
RW
0h
Thermal Detection threshold 1
0h = No Mask
1h = Mask
5
IM_PVBT
RW
0h
PVDD - VBAT1S below threshold
0h = No Mask
1h = Mask
4
IM_BOPA
RW
0h
BOP active interrupt
0h = No mask
1h = Mask
3
IM_BOPL3A
RW
0h
BOP level 3 detected interrupt
0h = No Mask
1h = Mask
2
IM_BOPL2A
RW
0h
BOP level 2 detected interrupt
0h = No Mask
1h = Mask
1
IM_BOPL1A
RW
0h
BOP level 1 detected interrupt
0h = No Mask
1h = Mask
0
IM_BOPL0A
RW
0h
BOP level 0 detected interrupt
0h = No mask
1h = Mask
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.68 INT_LIVE0 (page=0x00 address=0x42) [reset=00h]
Bit
Field
Type
Reset
Description
7
IL_BOPM
R
0h
Interrupt due to bop mute
0h = No interrupt
1h = Interrupt
6
IL_BOPIH
R
0h
Interrupt due to bop infinite hold
0h = No interrupt
1h = Interrupt
5
IL_LIMMA
R
0h
Interrupt due to limiter max attenuation
0h = No interrupt
1h = Interrupt
4
IL_PBIP
R
0h
Interrupt due to PVDD below limiter inflection point
0h = No interrupt
1h = Interrupt
3
IL_LIMA
R
0h
Interrupt due to limiter active
0h = No interrupt
1h = Interrupt
2
IL_TDMCE
R
0h
Interrupt due to TDM clock error
0h = No interrupt
1h = Interrupt - Device in shutdown
1
IL_OC
R
0h
Interrupt due to over current error
0h = No interrupt
1h = Interrupt - Device in shutdown
0
IL_OT
R
0h
Interrupt due to over temp error
0h = No interrupt
1 = Interrupt - Device in shutdown
8.9.69 INT_LIVE1 (page=0x00 address=0x43) [reset=00h]
Bit
Field
Type
Reset
Description
7
Reserved
R
0h
Reserved
6
IL_OTPCRC
R
0h
Interrupt due to OTP CRC Error Flag
0h = No interrupt
1h = Interrupt - Device in shutdown
5-3
Reserved
R
0h
Reserved
2
IL_NGA
R
0h
Noise Gate active flag
0h = Noise Gate not detected
1h = Noise Gate detected
1
Reserved
R
0h
Reserved
0
IL_VBATLIM
R
0h
Gain Limiter
0h = No interuupt
1h = Interrupt
8.9.70 INT_LIVE1_0 (page=0x00 address=0x44) [reset=00h]
Bit
Field
Type
Reset
Description
7
IL_PLL_CLK
R
0h
Internal PLL Clock Error
0h = No interrupt
1h = Interrupt - Device in shutdown
6
Reserved
R
0h
Reserved
5
IL_VBAT1S_UVLO
R
0h
VBAT1S Under Voltage
0h = No interrupt
1h = Interrupt - Device in shutdown
4-0
Reserved
R
0h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.71 INT_LIVE2 (page=0x00 address=0x47) [reset=00h]
Bit
Field
Type
Reset
Description
7
IL_TO105
R
0h
Temperature over 105 ºC
0h = No Interrupt
1h = Interrupt
6
IL_TO115
R
0h
Temperature over 115 ºC
0h = No Interrupt
1h = Interrupt
5
IL_TO125
R
0h
Temperature over 125 ºC
0h = No Interrupt
1h = Interrupt
4
IL_TO135
R
0h
Temperature over 135 ºC
0h = No Interrupt
1h = Interrupt
3
IL_LDO_UV
R
0h
VBAT1S Internal LDO Under Voltage
0h = No Interrupt
1h = Interrupt - Device in shutdown
2
IL_LDO_OV
R
0h
VBAT1S Internal LDO Over Voltage
0h = No Interrupt
1h = Interrupt - Device in shutdown
1
IL_LDO_OL
R
0h
VBAT1S Internal LDO Over Load
0h = No Interrupt
1h = Interrupt - Device in shutdown
0
IL_PUVLO
R
0h
PVDD UVLO
0h = No Interrupt
1h = Interrupt - Device in shutdown
8.9.72 INT_LIVE3 (page=0x00 address=0x48) [reset=00h]
62
Bit
Field
Type
Reset
Description
7
IL_TDTH2
R
0h
Thermal Detection Threshold 2 active flag
0h = No interrupt
1h = Interrupt - Device in shutdown
6
IL_TDTH1
R
0h
Thermal Detection Threshold 1 active flag
0h = No interrupt
1h = Interrupt
5
IL_PVBT
R
0h
PVDD -VBAT1S going below the threshold flag
0h = No interrupt
1h = Interrupt
4
IL_BOPA
R
0h
BOP active flag
0h = No interrupt
1h = Interrupt
3
IL_BOPL3A
R
0h
BOP level 3 detected flag
0h = No interrupt
1h = Interrupt
2
IL_BOPL2A
R
0h
BOP level 2 detected flag
0h = No interrupt
1h = Interrupt
1
IL_BOPL1A
R
0h
BOP level 1 detected flag
0h = No interrupt
1h = Interrupt
0
IL_BOPL0A
R
0h
BOP level 0 detected flag
0h = No interrupt
1h = Interrupt
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.73 INT_LTCH0 (page=0x00 address=0x49) [reset=00h]
Bit
Field
Type
Reset
Description
7
IR_BOPM
R
0h
Interrupt due to bop mute
0h = No interrupt
1h = Interrupt
6
IR_BOPIH
R
0h
Interrupt due to BOP infinite hold
0h = No interrupt
1h = Interrupt
5
IR_LIMMA
R
0h
Interrupt due to limiter max attenuation
0h = No interrupt
1h = Interrupt
4
IR_PBIP
R
0h
Interrupt due to PVDD below limiter inflection point
0h = No interrupt
1h = Interrupt
3
IR_LIMA
R
0h
Interrupt due to limiter active
0h = No interrupt
1h = Interrupt
2
IR_TDMCE
R
0h
Interrupt due to TDM clock error (type of clock error can be seen
in INT_LTCH4 register)
0h = No interrupt
1h = Interrupt
1
IR_OC
R
0h
Interrupt due to over current error
0h = No interrupt
1h = Interrupt
0
IR_OT
R
0h
Interrupt due to over temp error
0h = No interrupt
1h = Interrupt
8.9.74 INT_LTCH1 (page=0x00 address=0x4A) [reset=00h]
Bit
Field
Type
Reset
7
Reserved
R
0h
Reserved
Description
6
IR_OTPCRC
R
0h
Interrupt due to OTP CRC error flag
0h = No interrupt
1h = Interrupt
5
IR_LDC
R
0h
Interrupt due to load diagnostic completion
0h = Not completed
1h = Completed
4-3
IR_LDMODE[1:0]
R
0h
Interrupt due to Load Diagnostic mode fault status
0h = Normal Load
1h = Open Load Detected
2h =Short Load Detected
3h =Reserved
2-1
Reserved
R
0h
Reserved
0
IR_VBATLIM
R
0h
Gain Limiter interrupt
0h = No interrupt
1h = Interrupt
8.9.75 INT_LTCH1_0 (page=0x00 address=0x4B) [reset=00h]
Bit
Field
Type
Reset
Description
7
IR_PLL_CLK
R
0h
Internal PLL Clock Error
0h = No interrupt
1h = Interrupt
6
Reserved
R
0h
Reserved
5
IR_VBAT1S_UVLO
R
0h
VBAT1S Under Voltage
0h = No interrupt
1h = Interrupt
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Bit
Field
Type
Reset
4-0
Reserved
R
0h
Description
Reserved
8.9.76 INT_LTCH2 (page=0x00 address=0x4F) [reset=00h]
Bit
Field
Type
Reset
Description
7
IR_TO105
R
0h
Temperature over 105 ºC
0h = No Interrupt
1h = Interrupt
6
IR_TO115
R
0h
Temperature over 115 ºC
0h = No Interrupt
1h = Interrupt
5
IR_TO125
R
0h
Temperature over 125 ºC
0h = No Interrupt
1h = Interrupt
4
IR_TO135
R
0h
Temperature over 135 ºC
0h = No Interrupt
1h = Interrupt
3
IR_LDO_UV
R
0h
Internal VBAT1S LDO Under Voltage
0h = No Interrupt
1h = Interrupt
2
IR_LDO_OV
R
0h
Internal VBAT1S LDO Over Voltage
0h = No Interrupt
1h = Interrupt
1
IR_LDO_OL
R
0h
Internal VBAT1S LDO Over Load
0h = No Interrupt
1h = Interrupt
0
IR_PUVLO
R
0h
PVDD UVLO
0h = No Interrupt
1h = Interrupt
8.9.77 INT_LTCH3 (page=0x00 address=0x50) [reset=00h]
Bit
64
Field
Type
Reset
Description
7
IR_TDTH2
R
0h
Thermal Detection Threshold 2
0h = No interrupt
1h = Interrupt
6
IR_TDTH1
R
0h
Thermal Detection Threshold 1
0h = No interrupt
1h = Interrupt
5
IR_PVBT
R
0h
Interrupt due to PVDD-VBAT1S going below the threshold
0h = No interrupt
1h = Interrupt
4
IR_BOPA
R
0h
BOP active flag
0h = No interrupt
1h = Interrupt
3
IR_BOPL3A
R
0h
BOP level 3 detected
0h = No interrupt
1h = Interrupt
2
IR_BOPL2A
R
0h
BOP level 2 detected
0h = No interrupt
1h = Interrupt
1
IR_BOPL1A
R
0h
BOP level 1 detected
0h = No interrupt
1h = Interrupt
0
IR_BOPL0A
R
0h
BOP level 0 detected
0h = No interrupt
1h = Interrupt
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.78 INT_LTCH4 (page=0x00 address=0x51) [reset=00h]
Bit
Field
Type
Reset
Description
7-3
Reserved
R
0h
Reserved
2
IR_TDMCEIR
R
0h
TDM clock error type = Invalid SBCLK ratio or sampling rate
0b = Not detected during TDM clock error
1b = Detected during TDM clock error
1
IR_TDMCEFC
R
0h
TDM clock error type = Sampling rate changed on the fly
0b = Detected during TDM clock error
1b = Not detected during TDM clock error
0
IR_TDMCERC
R
0h
TDM clock error type = SBCLK ratio changed on the fly
0b = Not detected during TDM clock error
1b = Detected during TDM clock error
8.9.79 VBAT_MSB (page=0x00 address=0x52) [reset=00h]
Bit
Field
Type
Reset
7-0
VBAT1S_CNV[11:4]
R
0h
Description
Returns SAR ADC VBAT1S conversion MSBs.
{hex2dec(VBAT1S_CNV[11:0])}/128
8.9.80 VBAT_LSB (page=0x00 address=0x53) [reset=00h]
Bit
Field
Type
Reset
Description
7-4
VBAT1S_CNV[3:0]
R
0h
Returns SAR ADC VBAT1S conversion LSBs.
{hex2dec(VBAT1S_CNV[11:0])}/128
3-0
Reserved
R
0h
Reserved
8.9.81 PVDD_MSB (page=0x00 address=0x54) [reset=00h]
Bit
7-0
Field
PVDD_CNV[11:4]
Type
R
Reset
0h
Description
Returns SAR ADC PVDD conversion MSBs.
{hex2dec(PVDD_CNV[11:0])}/64
8.9.82 PVDD_LSB (page=0x00 address=0x55) [reset=00h]
Bit
Field
Type
Reset
Description
7-4
PVDD_CNV[3:0]
R
0h
Returns SAR ADC PVDD conversion LSBs.
{hex2dec(PVDD_CNV[11:0])}/64
3-0
Reserved
R
0h
Reserved
8.9.83 TEMP (page=0x00 address=0x56) [reset=00h]
Bit
7-0
Field
TMP_CNV[7:0]
Type
R
Reset
0h
Description
Returns SAR ADC temp sensor conversion.
{hex2dec(TMP_CNV[7:0])} - 95
8.9.84 INT_CLK_CFG (page=0x00 address=0x5C) [reset=19h]
Bit
Field
Type
Reset
Description
7
CLK_PWR_UD_EN
RW
0h
Clock based device power up/power down feature
0h = Disabled
1h = Enabled
6
DIS_CLK_HALT
RW
0h
Clock halt timer
0h = Enable clock halt detection, after clock error detected
1h = Disable clock halt detection, after clock error detected
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Bit
Field
Type
Reset
Description
5-3
CLK_HALT_TIMER[2:0]
RW
3h
Clock halt timer values
0h = 820 μs
1h = 3.27 ms
2h = 26.21 ms
3h = 52.42 ms
4h = 104.85 ms
5h = 209.71 ms
6h = 419.43 ms
7h = 838.86 ms
2
INT_LTCH_CLR
RW
0h
Clear interrupt latch registers
0h = Don't clear
1h = Clear (self clearing bit)
1h
IRQZ interrupt configuration. IRQZ will assert
0h = On any unmasked live interrupts
1h = On any unmasked latched interrupts
2h = For 2 - 4 ms one time on any unmasked live interrupt event
3h = For 2 - 4 ms every 4 ms on any unmasked latched
interrupts
1-0
IRQZ_PIN_CFG[1:0]
RW
8.9.85 MISC_CFG3 (page=0x00 address=0x5D) [reset=80h]
Bit
Field
Type
Reset
Description
7
IRQZ_POL
RW
1h
IRQZ pin polarity for interrupt
0h = Active high (IRQ)
1h = Active low (IRQZ)
6-4
Reserved
RW
0h
Reserved
3-2
YB_BOP_CTRL[1:0]
RW
0h
This register selects on which BOP level, Y-bridge and BYP_EN
pad need to shift to PVDD when BOP_SRC=0
0h = shift to PVDD when BOP LVL0 is detected
1h = shift to PVDD when BOP LVL1 or LVL0 is detected
2h = shift to PVDD when BOP LVL2 or LVL1 or LVL0 is detected
3h = shift to PVDD when BOP LVL3 or LVL2 or LVL1 or LVL0 is
detected
1-0
Reserved
RW
0h
Reserved
8.9.86 CLOCK_CFG (page=0x00 address=0x60) [reset=0Dh]
66
Bit
Field
Type
Reset
Description
7-6
Reserved
R
0h
Reserved
5-2
SAMP_RATIO[3:0]
RW
3h
SBCLK to FSYNC ratio when AUTO_RATE = 1 (disabled)
00h = 16
01h = 24
02h = 32
03h = 48
04h = 64
05h = 96
06h = 128
07h = 192
08h = 256
09h = 384
0Ah = 512
0Bh = 125
0Ch = 250
0Dh = 500
0Eh - 0Fh = Reserved
1-0
Reserved
RW
1h
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
8.9.87 IDLE_IND (page=0x00 address=0x63) [reset=48]
Bit
Field
Type
Reset
Description
7
IDLE_IND
RW
0h
Idle channel Class D output current optimization
0h = Used for inductors 15 μH and higher
1h = Used for 5 μH inductors
6-0
Reserved
RW
48h
Reserved
8.9.88 SAR_SAMP (page=0x00 address=0x64) [reset=84h]
Bit
Field
Type
Reset
7-6
Reserved
RW
2h
Reseved
Description
5-4
SAR_SAMP_TIME[1:0]
RW
0h
Sampling time and ADC filter frequency
0h = 1.3 μs, filter disabled
1h = 4.1 μs, 300 kHz
2h = 12.1 μs, 150 KHz
3h = 24.2 μs, 50 KHz
3-0
Reserved
RW
4h
Reserved
8.9.89 MISC_CFG4 (page=0x00 address=0x65) [reset=08]
Bit
Field
Type
Reset
7-4
Reserved
RW
0h
Reserved
Description
3
LDG_CLK
RW
1h
Clock source for load diagnostic
0h = External TDM
1h = Internal oscillator
2-1
LDG_AVG[1:0]
RW
0h
Duration of averaging on V/I data
0h = 5 ms
1h = 10 ms
2h = 50 ms
3h =100 ms
0
Reserved
RW
0h
Reserved
8.9.90 IDLE_CFG (page=0x00 address=0x67) [reset=00h]
Bit
Field
Type
Reset
7-2
Reserved
R
00h
Reserved
0h
Idle channel hysteresis timer.
0h = 50 ms
1h = 100 ms
2h = 200 ms
3h = 1000 ms
1-0
ID_CH_HYST_TIME[1:0]
RW
Description
8.9.91 CLK_CFG (page=0x00 address=0x68) [reset=7Fh]
Bit
Field
Type
Reset
7
Reserved
R
0h
Description
Reserved
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Bit
Field
Type
Reset
6-3
FS_RATIO[3:0]
R
Fh
2-0
FS_RATE[2:0]
R
7h
Description
Detected SBCLK to FSYNC ratio.
00h = 16
01h = 24
02h = 32
03h = 48
04h = 64
05h = 96
06h = 128
07h = 192
08h = 256
09h = 384
0Ah = 512
0Bh = 125
0Ch = 250
0Dh = 500
0Eh = Reserved
0F = Invalid ratio
Detected sample rate of TDM bus.
0h - 3h = Reserved
4h = 44.1/48 kHz
5h = 88.2/96 kHz
6h = Reserved
7h = Error condition
8.9.92 LV_EN_CFG (page=0x00 address=0x6A) [reset=12h]
Bit
7-6
5-4
3-0
Field
CDS_DLY[1:0]
LVS_DLY[1:0]
LVS_RTH[3:0]
Type
RW
RW
RW
Reset
Description
0h
Delay (1/fs) of the Class-D Y-bridge switching with respect to the
input signal
0h = 8.1(NG enabled,48ksps), 6.1(NG disabled,48ksps)
0h = 12.6(NG enabled,96ksps), 9.6(NG disabled,96ksps)
1h = 7.1(NG enabled,48ksps), 5.1(NG disabled,48ksps),
1h = 10.6(NG enabled,96ksps), 7.6(NG disabled,96ksps)
2h = 6.1(NG enabled,48ksps), 4.1(NG disabled,48ksps)
2h = 8.5(NG enabled,96ksps), 5.6(NG disabled,96ksps)
3h = 5.6(NG enabled,48ksps), 3.6(NG disabled,48ksps
3h = 7.6(NG enabled,96ksps), 4.6(NG disabled,96ksps)
1h
Delay (1/fs) of the BYP_EN signaling with respect to the input
signal
0h = 7.8(NG enabled,48ksps), 5.8(NG disabled,48ksps)
0h = 12.1(NG enabled,96ksps), 9.1(NG disabled,96ksps)
1h = 6.8(NG enabled,48ksps), 4.8(NG disabled,48ksps),
1h = 10.1(NG enabled,96ksps), 7.1(NG disabled,96ksps)
2h = 5.8(NG enabled,48ksps), 3.8(NG disabled,48ksps)
2h = 8.1(NG enabled,96ksps), 5.1(NG disabled,96ksps)
3h = 5.1(NG enabled,48ksps), 3.1(NG disabled,48ksps
3h = 6.6(NG enabled,96ksps), 3.6(NG disabled,96ksps)
2h
Relative threshold for Low Voltage Signaling (LVS). The
headroom is from VBAT1S supply.
0h = 0.5 V
1h = 0.6 V
2h = 0.7 V
...
Eh = 1.9 V
Fh = 2 V
8.9.93 NG_CFG2 (page=0x00 address=0x6B) [reset=43h]
68
Bit
Field
Type
Reset
7
Reserved
R
0h
Reserved
Description
6
CONV_VBAT
RW
1h
Convert the VBAT1S when BOP source is PVDD
0h = No VBAT1S conversion
1h = VBAT1S conversion is performed by SAR
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SLOSE75B – FEBRUARY 2022 – REVISED MARCH 2023
Bit
Field
Type
Reset
5-3
Reserved
RW
0h
Reserved
Description
2
NGFR_EN
RW
0h
Noise Gate fine resolution register mode
0h = Disabled
1h = Enabled
1-0
Reserved
RW
3h
Reserved
8.9.94 NG_CFG3 (page=0x00 address=0x6C) [reset=00h]
Programmable bits for Noise Gate fine resolution threshold to a level NGLVL(dBFS); default is -110dBFS.
Bit
Field
Type
Reset
Description
7-0
NGFR_LVL[23:16]
RW
00h
dec2hex{round{ 10^(NGLVL)/20)]*2^23}
8.9.95 NG_CFG4 (page=0x00 address=0x6D) [reset=00h]
Programmable bits for Noise Gate fine resolution threshold to a level NGLVL(dBFS); default is -110dBFS.
Bit
Field
Type
Reset
Description
7-0
NGFR_LVL[15:8]
RW
00h
dec2hex{round{ 10^(NGLVL)/20)]*2^23}
8.9.96 NG_CFG5 (page=0x00 address=0x6E) [reset=1Ah]
Programmable bits for Noise Gate fine resolution threshold to a level NGLVL(dBFS); default is -110dBFS.
Bit
Field
Type
Reset
Description
7-0
NGFR_LVL[7:0]
RW
1Ah
dec2hex{round{ 10^(NGLVL)/20)]*2^23}
8.9.97 NG_CFG6 (page=0x00 address=0x6F) [reset=00h]
Programmable bits for Noise Gate fine resolution hysteresis to a value NGHYS(ms).
Recommended to be set above 1ms.
Bit
7-0
Field
NGFR_HYST[18:11]
Type
Reset
Description
0h
dec2bin[(NGHYS*fs),19]
fs=sampling rate in kHz
RW
8.9.98 NG_CFG7 (page=0x00 address=0x70) [reset=96h]
Programmable bits for Noise Gate fine resolution hysteresis to a value NGHYS(ms).
Recommended to be set above 1ms.
Bit
Field
Type
Reset
Description
7-0
NGFR_HYST[10:3]
RW
96h
dec2bin[(NGHYS*fs),19]
fs=sampling rate in kHz
Example:
NGFR_HYST[15:0] is the result of 19 bits processing with last three bits thrown away (000)
For 50 ms and 48ksps formula is:
dec2bin[50*48,19]=dec2bin[2400,19]=0000000100101100000
(5)
Result: 01h in register 0x6F and 2Ch in register 0x70.
8.9.99 PVDD_UVLO (page=0x00 address=0x71) [reset=02h]
When Y bridge is used (eg. PWR_MODE1) PVDD UVLO threshold needs to be set 2.5 V above VBAT1S level.
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Bit
Field
Type
Reset
7-6
Reserved
RW
0h
Reserved
02h
PVDD UVLO threshold
00h = 1.753 V
01h = 2.09 V
02h = 2.428 V
...........
3Fh = 23 V
5-0
PVDD_UVLO_TH[5:0]
RW
Description
8.9.100 DMD (page=0x00 address=0x73) [reset=00h]
Bit
Field
Type
Reset
Description
7-6
DEM_CTRL[1:0]
R
0h
DAC MSB and LSB DEM enable/disable control
0h = MSB Enabled, LSB = Enabled
1h = MSB Enabled, LSB = Disabled
2h = MSB Disabled, LSB = Enabled
3h = MSB Disabled, LSB = Disabled - Recommended for
ultrasonic use case
5
DIS_DITH
RW
0h
DAC MSB modulator dither control
0h = Enabled
1h = Disabled - Recommended for ultrasonic use case
4-0
Reserved
R
00
Reserved
8.9.101 I2C_CKSUM (page=0x00 address=0x7E) [reset=00h]
Bit
Field
Type
Reset
Description
7-0
I2C_CKSUM[7:0]
RW
0h
Returns I2C checksum. Writing to this register will reset the
checksum to the written value. This register is updated on writes
to other registers on all books and pages.
8.9.102 BOOK (page=0x00 address=0x7F) [reset=00h]
Bit
Field
Type
Reset
Description
7-0
BOOK[7:0]
RW
0h
Sets the device book.
00h = Book 0
01h = Book 1
...
FFh = Book 255
8.9.103 INIT_0 (page=0x01 address=0x17) [reset=D0h]
Bit
Field
Type
Reset
Description
7-5
Reserved
RW
6h
Reserved
4
CMP_HYST_LP
RW
1h
Class D comparator dependancy of low power
0h = Disabled
1h = Enabled
3
SAR_IDLE
RW
0h
Idle channel interraction to SAR
0h = Enabled
1h = Disabled
2-0
Reserved
RW
0h
Reserved
8.9.104 LSR (page=0x01 address=0x19) [reset=40h]
Bit
Field
Type
Reset
7
Reserved
R
0b
6
EN_LLSR
RW
1h
Description
Reserved
Modulation
0h = LSR
1h = Linear LSR
70
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Bit
Field
Type
Reset
5-0
Reserved
R
00h
Description
Reserved
8.9.105 INIT_1 (page=0x01 address=0x21) [reset=08h]
Bit
Field
Type
Reset
Description
7-4
Reserved
R
0h
Reserved
3
HSCMP_EN
RW
0h
Class D comparator voltage hysterisis
0h = Enabled
1h = Disabled
2-0
Reserved
R
0h
Reserved
8.9.106 INIT_2 (page=0x01 address=0x35) [reset=75h]
Bit
Field
Type
Reset
7-4
Reserved
R
7h
Reserved
Description
3-0
BIAS_NOISE
RW
5h
Settings for noise improvement
8.9.107 INT_LDO (page=0x01 address=0x36) [reset=08h]
Bit
Field
Type
Reset
Description
7-6
INT_LDO_SET[1:0]
RW
0h
Internal LDO Setting
0h = Setting done through register 04h of page 0x00h
1h = Force external supply, VBAT1S LDO is disabled
2h = Force internal LDO to be used
3h = Reserved
5-0
Reserved
R
08h
Reserved
8.9.108 SDOUT_HIZ_1 (page=0x01 address=0x3D) [reset=00h]
Bit
Field
Type
Reset
7-0
SDOUT_HIZ1[7:0]
RW
00h
Description
Force '0' output control for slots 7 down to 0. This register to be
programmed to zero in case the slot is not valid as per SBLK to
FSYNC ratio.
8.9.109 SDOUT_HIZ_2 (page=0x01 address=0x3E) [reset=00h]
Bit
Field
Type
Reset
Description
7-0
SDOUT_HIZ2[7:0]
RW
00h
Force '0' output control for slots 15 down to 8. This register to be
programmed to zero in case the slot is not valid as per SBLK to
FSYNC ratio.
8.9.110 SDOUT_HIZ_3 (page=0x01 address=0x3F) [reset=00h]
Bit
7-0
Field
SDOUT_HIZ3[7:0]
Type
RW
Reset
Description
00h
Force '0' output control for slots 23 down to 16. This register to
be programmed to zero in case the slot is not valid as per SBLK
to FSYNC ratio.
8.9.111 SDOUT_HIZ_4 (page=0x01 address=0x40) [reset=00h]
Bit
7-0
Field
SDOUT_HIZ4[7:0]
Type
RW
Reset
Description
00h
Force '0' output control for slots 31 down to 24. This register to
be programmed to zero in case the slot is not valid as per SBLK
to FSYNC ratio.
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8.9.112 SDOUT_HIZ_5 (page=0x01 address=0x41) [reset=00h]
Bit
Field
Type
Reset
Description
7-0
SDOUT_HIZ5[7:0]
RW
00h
Force '0' output control for slots 39 down to 32. This register to
be programmed to zero in case the slot is not valid as per SBLK
to FSYNC ratio.
8.9.113 SDOUT_HIZ_6 (page=0x01 address=0x42) [reset=00h]
Bit
Field
Type
Reset
Description
7-0
SDOUT_HIZ6[7:0]
RW
00h
Force '0' output control for slots 47 down to 40. This register to
be programmed to zero in case the slot is not valid as per SBLK
to FSYNC ratio.
8.9.114 SDOUT_HIZ_7 (page=0x01 address=0x43) [reset=00h]
Bit
Field
7-0
Type
SDOUT_HIZ7[7:0]
RW
Reset
Description
00h
Force '0' output control for slots 55 down to 48. This register to
be programmed to zero in case the slot is not valid as per SBLK
to FSYNC ratio.
8.9.115 SDOUT_HIZ_8 (page=0x01 address=0x44) [reset=00h]
Bit
Field
7-0
Type
SDOUT_HIZ8[7:0]
RW
Reset
Description
00h
Force '0' output control for slots 63 down to 56. This register to
be programmed to zero in case the slot is not valid as per SBLK
to FSYNC ratio.
8.9.116 SDOUT_HIZ_9 (page=0x01 address=0x45) [reset=00h]
Bit
Field
Type
Reset
Description
7
SDOUT_FORCE_0_CNT_EN
RW
0h
Control over sending "0" to un-used slots
0h = All unused slots will have 'Hi-Z' transmitted
1h = Unused slots can transmit '0' base on programming in
registers 0x3D to 0x44 of Page 0x01
6-0
Reserved
RW
00h
Reserved
8.9.117 TG_EN (page=0x01 address=0x47) [reset=AB]
Bit
Field
Type
Reset
Description
7-2
Reserved
R
2Ah
1
TG_TH2
RW
1h
Thermal threshold 2
0h = Disabled
1h = Enabled
0
TG_TH1
RW
1h
Thermal threshold 1
0h = Disabled
1h = Enabled
Reserved
8.9.118 EDGE_CTRL (page=0x01 address=0x4C) [reset=00h]
Bit
Field
7-3
Reserved
2-1
EDGE_CTRL[1:0]
RW
Reserved
RW
0
72
Type
Reset
Description
0h
Reserved
0h
Output slew rate
00b = Auto adjust slew rate based on PVDD range
01b = Reserved
10b = Reserved
11b = Slow slew rate for full range of PVDD
0h
Reserved
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8.9.119 DG_DC_VAL1 (page=0x04 address=0x08) [reset=40h]
Programmable DG bits for a DC_VAL(dBFS) desired level.
Bit
Field
Type
Reset
Description
7-0
DG_DC_VAL [31:24]
RW
40h
dec2hex{256*round[10^(DC_VAL/20)*2^23]}
8.9.120 DG_DC_VAL2 (page=0x04 address=0x09) [reset=26h]
Programmable DG bits for a DC_VAL(dBFS) desired level.
Bit
Field
Type
Reset
Description
7-0
DG_DC_VAL [23:16]
RW
26h
dec2hex{256*round[10^(DC_VAL/20)*2^23]}
8.9.121 DG_DC_VAL3 (page=0x04 address=0x0A) [reset=40h]
Programmable DG bits for a DC_VAL(dBFS) desired level.
Bit
Field
Type
Reset
Description
7-0
DG_DC_VAL [15:8]
RW
40h
dec2hex{256*round[10^(DC_VAL/20)*2^23]}
8.9.122 DC_DG_VAL4 (page=0x04 address=0x0B) [reset=00h]
Programmable DG bits for a DC_VAL(dBFS) desired level.
Bit
Field
Type
Reset
Description
7-0
DG_DC_VAL [7:0]
RW
00h
dec2hex{256*round[10^(DC_VAL/20)*2^23]}
8.9.123 LIM_TH_MAX1 (page=0x04 address=0x0C) [reset=68h]
Programmable bits to set limiter maximum threshold to a LIM_TH_MAX(V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_TH_MAX[31:24]
RW
68h
dec2hex{256*round [LIM_TH_MAX*2^18]}
8.9.124 LIM_TH_MAX2 (page=0x04 address=0x0D) [reset=00h]
Programmable bits to set limiter maximum threshold to a LIM_TH_MAX(V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_TH_MAX[23:16]
RW
00h
dec2hex{256*round [LIM_TH_MAX*2^18]}
8.9.125 LIM_TH_MAX3 (page=0x04 address=0x0E) [reset=00h]
Programmable bits to set limiter maximum threshold to a LIM_TH_MAX(V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_TH_MAX[15:8]
RW
00h
dec2hex{256*round [LIM_TH_MAX*2^18]}
8.9.126 LIM_TH_MAX4 (page=0x04 address=0x0F) [reset=00h]
Programmable bits to set limiter maximum threshold to a LIM_TH_MAX(V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_TH_MAX[7:0]
RW
00h
dec2hex{256*round [LIM_TH_MAX*2^18]}
8.9.127 LIM_TH_MIN1 (page=0x04 address=0x10) [reset=28h]
Programmable bits to set limiter maximum threshold to a LIM_TH_MIN(V) value.
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Bit
Field
Type
Reset
Description
7-0
LIM_TH_MIN[31:24]
RW
28h
dec2hex{256*round [LIM_TH_MIN*2^18]}
8.9.128 LIM_TH_MIN2 (page=0x04 address=0x11) [reset=00h]
Programmable bits to set limiter maximum threshold to a LIM_TH_MIN(V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_TH_MIN[23:16]
RW
00h
dec2hex{256*round [LIM_TH_MIN*2^18]}
8.9.129 LIM_TH_MIN3 (page=0x04 address=0x12) [reset=00h]
Programmable bits to set limiter maximum threshold to a LIM_TH_MIN(V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_TH_MIN[15:8]
RW
00h
dec2hex{256*round [LIM_TH_MIN*2^18]}
8.9.130 LIM_TH_MIN4 (page=0x04 address=0x13) [reset=00h]
Programmable bits to set limiter maximum threshold to a LIM_TH_MIN(V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_TH_MIN[7:0]
RW
0h
dec2hex{256*round [LIM_TH_MIN*2^18]}
8.9.131 LIM_INF_PT1 (page=0x04 address=0x14) [reset=56h]
Programmable bits to set limiter inflection point to a value of LIM_INF_PT(V).Sets limiter inflection point.
Bit
Field
Type
Reset
Description
7-0
LIM_INF_PT[31:24]
RW
56h
dec2hex{256*round [LIM_IN_PT*2^18]}}
8.9.132 LIM_INF_PT2 (page=0x04 address=0x15) [reset=66h]
Programmable bits to set limiter inflection point to a value of LIM_INF_PT(V).Sets limiter inflection point.
Bit
Field
Type
Reset
Description
7-0
LIM_INF_PT[23:16]
RW
66h
dec2hex{256*round [LIM_IN_PT*2^18]}}
8.9.133 LIM_INF_PT3 (page=0x04 address=0x16) [reset=66h]
Programmable bits to set limiter inflection point to a value of LIM_INF_PT(V).Sets limiter inflection point.
Bit
Field
Type
Reset
Description
7-0
LIM_INF_PT[15:8]
RW
66h
dec2hex{256*round [LIM_IN_PT*2^18]}}
8.9.134 LIM_INF_PT4 (page=0x04 address=0x17) [reset=00h]
Programmable bits to set limiter inflection point to a value of LIM_INF_PT(V).Sets limiter inflection point.
Bit
Field
Type
Reset
Description
7-0
LIM_INF_PT[7:0]
RW
0h
dec2hex{256*round [LIM_IN_PT*2^18]}}
8.9.135 LIM_SLOPE1 (page=0x04 address=0x18) [reset=10h]
Programmable bits to set limiter slope to a LIM_SLOPE (V/V) value.
74
Bit
Field
Type
Reset
Description
7-0
LIM_SLOPE[31:24]
RW
10h
dec2hex{256*round [LIM_SLOPE*2^20]}
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8.9.136 LIM_SLOPE2 (page=0x04 address=0x19) [reset=00h]
Programmable bits to set limiter slope to a LIM_SLOPE (V/V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_SLOPE[23:16]
RW
00h
dec2hex{256*round [LIM_SLOPE*2^20]}
8.9.137 LIM_SLOPE3 (page=0x04 address=0x1A) [reset=00h]
Programmable bits to set limiter slope to a LIM_SLOPE (V/V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_SLOPE[15:8]
RW
00h
dec2hex{256*round [LIM_SLOPE*2^20]}
8.9.138 LIM_SLOPE4 (page=0x04 address=0x1B) [reset=00h]
Programmable bits to set limiter slope to a LIM_SLOPE (V/V) value.
Bit
Field
Type
Reset
Description
7-0
LIM_SLOPE[7:0]
RW
00h
dec2hex{256*round [LIM_SLOPE*2^20]}
8.9.139 TF_HLD1 (page=0x04 address=0x1C) [reset=00h]
Programmable bits for thermal fold-back hold count set to a TF_HLD[s] value.
Bit
Field
Type
Reset
Description
7-0
TF_ HOLD_CNT[31:24]
RW
00h
dec2hex[256*round (TF_HLD*9600)]
8.9.140 TF_HLD2 (page=0x04 address=0x1D) [reset=00h]
Programmable bits for thermal fold-back hold count set to a TF_HLD[s] value.
Bit
Field
Type
Reset
Description
7-0
TF_HOLD_CNT23:16]
RW
00h
dec2hex[256*round (TF_HLD*9600)]
8.9.141 TF_HLD3 (page=0x04 address=0x1E) [reset=64h]
Programmable bits for thermal fold-back hold count set to a TF_HLD[s] value.
Bit
Field
Type
Reset
Description
7-0
TF_HOLD_CNT[15:8]
RW
64h
dec2hex[256*round (TF_HLD*9600)]
8.9.142 TF_HLD4 (page=0x04 address=0x1F) [reset=00h]
Programmable bits for thermal fold-back hold count set to a TF_HLD[s] value.
Bit
Field
Type
Reset
Description
7-0
TF_HOLD_CNT[7:0]
RW
00h
dec2hex[256*round (TF_HLD*9600)]
8.9.143 TF_RLS1 (page=0x04 address=0x20) [reset=40h]
Programmable bits for thermal fold-back limiter release rate set to a value TF_RLS[dB/100us].
Bit
Field
Type
Reset
Description
7-0
TF_REL_RATE[31:24]
RW
40h
dec2hex{256*round[10^(TF_RLS/20)*2^22]}
8.9.144 TF_RLS2 (page=0x04 address=0x21) [reset=BDh]
Programmable bits for thermal fold-back limiter release rate set to a value TF_RLS[dB/100us].
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Bit
Field
Type
Reset
Description
7-0
TF_REL_RATE[23:16]
RW
BDh
dec2hex{256*round[10^(TF_RLS/20)*2^22]}
8.9.145 TF_RLS3 (page=0x04 address=0x22) [reset=B8h]
Programmable bits for thermal fold-back limiter release rate set to a value TF_RLS[dB/100us].
Bit
7-0
Field
Type
TF_REL_RATE[15:8]
RW
Reset
Description
B8h
dec2hex{256*round[10^(TF_RLS/20)*2^22]}
8.9.146 TF_RLS4 (page=0x04 address=0x23) [reset=00h]
Programmable bits for thermal fold-back limiter release rate set to a value TF_RLS[dB/100us].
Bit
Field
Type
Reset
Description
7-0
TF_REL_RATE[7:0]
RW
0h
dec2hex{256*round[10^(TF_RLS/20)*2^22]}
8.9.147 TF_SLOPE1 (page=0x04 address=0x24) [reset=04h]
Programmable bits for thermal fold-back limiter attenuation slope set to value TF_SLOPE(V/0C).
Input level is assumed 0dB and gain is 21dB. An extra 3dB (total of 24dB) is due to rms to peak conversion.
Bit
Field
Type
Reset
Description
7-0
TF_LIMS[31:24]
RW
04h
dec2hex{256*round {[TF_SLOPE/(10^24/20)]*2^23}
8.9.148 TF_SLOPE2 (page=0x04 address=0x25) [reset=08h]
Programmable bits for thermal fold-back limiter attenuation slope set to value TF_SLOPE(V/0C).
Input level is assumed 0dB and gain is 21dB. An extra 3dB (total of 24dB) is due to rms to peak conversion.
Bit
Field
Type
Reset
Description
7-0
TF_LIMS[23:16]
RW
08h
dec2hex{256*round {[TF_SLOPE/(10^24/20)]*2^23}
8.9.149 TF_SLOPE3 (page=0x04 address=0x26) [reset=89h]
Programmable bits for thermal fold-back limiter attenuation slope set to value TF_SLOPE(V/0C).
Input level is assumed 0dB and gain is 21dB. An extra 3dB (total of 24dB) is due to rms to peak conversion.
Bit
Field
Type
Reset
Description
7-0
TF_LIMS[15:8]
RW
89h
dec2hex{256*round {[TF_SLOPE/(10^24/20)]*2^23}
8.9.150 TF_SLOPE4 (page=0x04 address=0x27) [reset=00h]
Programmable bits for thermal fold-back limiter attenuation slope set to value TF_SLOPE(V/0C).
Input level is assumed 0dB and gain is 21dB. An extra 3dB (total of 24dB) is due to rms to peak conversion.
Bit
Field
Type
Reset
Description
7-0
TF_LIMS[7:0]
RW
0h
dec2hex{256*round {[TF_SLOPE/(10^24/20)]*2^23}
8.9.151 TF_TEMP_TH1 (page=0x04 address=0x28) [reset=39h]
Programmable bits for thermal fold-back temperature threshold set to TF_TEMP(0C) value.
76
Bit
Field
Type
Reset
Description
7-0
TF_TEMP_TH[31:24]
RW
39h
dec2hex{256*round [TF_TEMP*(2^15)]}
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8.9.152 TF_TEMP_TH2 (page=0x04 address=0x29) [reset=80h]
Programmable bits for thermal fold-back temperature threshold set to TF_TEMP(0C) value.
Bit
Field
Type
Reset
Description
7-0
TF_TEMP_TH[23:16]
RW
80h
dec2hex{256*round [TF_TEMP*(2^15)]}
8.9.153 TF_TEMP_TH3 (page=0x04 address=0x2A) [reset=00h]
Programmable bits for thermal fold-back temperature threshold set to TF_TEMP(0C) value.
Bit
Field
Type
Reset
Description
7-0
TF_TEMP_TH[15:8]
RW
00h
dec2hex{256*round [TF_TEMP*(2^15)]}
8.9.154 TF_TEMP_TH4 (page=0x04 address=0x2B) [reset=00h]
Programmable bits for thermal fold-back temperature threshold set to TF_TEMP(0C) value.
Bit
Field
Type
Reset
Description
7-0
TF_TEMP_TH[7:0]
RW
0h
dec2hex{256*round [TF_TEMP*(2^15)]}
8.9.155 TF_MAX_ATTN1 (page=0x04 address=0x2C) [reset=2Dh]
Programmable bits for thermal fold-back maximum gain reduction set to TF_ATTN(dB) value of attenuation.
Bit
Field
Type
Reset
Description
7-0
TF_MAX_ATTN[31:24]
RW
2Dh
dec2hex{256*round [(10^(-TF_ATTN/20)*2^23]}
8.9.156 TF_MAX_ATTN2 (page=0x04 address=0x2D) [reset=6Ah]
Programmable bits for thermal fold-back maximum gain reduction set to TF_ATTN(dB) value of attenuation.
Bit
Field
Type
Reset
Description
7-0
TF_MAX_ATTN(23:16]
RW
6Ah
dec2hex{256*round [(10^(-TF_ATTN/20)*2^23]}
8.9.157 TF_MAX_ATTN3 (page=0x04 address=0x2E) [reset=86h]
Programmable bits for thermal fold-back maximum gain reduction set to TF_ATTN(dB) value of attenuation.
Bit
Field
Type
Reset
Description
7-0
TF_MAX_ATTN[15:7]
RW
86h
dec2hex{256*round [(10^(-TF_ATTN/20)*2^23]}
8.9.158 TF_MAX_ATTN4 (page=0x04 address=0x2F) [reset=00h]
Programmable bits for thermal fold-back maximum gain reduction set to TF_ATTN(dB) value of attenuation.
Bit
7-0
Field
Type
TF_MAX_ATTN[7:0]
RW
Reset
Description
0h
dec2hex{256*round [(10^(-TF_ATTN/20)*2^23]}
8.9.159 LD_CFG0 (page=0x04 address=0x40) [reset=03h]
Programmable bits for load diagnostic resistance upper threshold set to a LD_RES_UT(Ω) value.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_UT[31:24]
RW
03h
dec2hex{256*round (LDG_RES_UT*(5/16)*2^14)}
8.9.160 LD_CFG1 (page=0x04 address=0x41) [reset=20h]
Programmable bits for load diagnostic resistance upper threshold set to a LD_RES_UT(Ω) value.
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Bit
Field
Type
Reset
Description
7-0
LDG_RES_UT[23:16]
RW
20h
dec2hex{256*round (LDG_RES_UT*(5/16)*2^14)}
8.9.161 LD_CFG2 (page=0x04 address=0x42) [reset=00h]
Programmable bits for load diagnostic resistance upper threshold set to a LD_RES_UT(Ω) value.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_UT[15:7]
RW
00h
dec2hex{256*round (LDG_RES_UT*(5/16)*2^14)}
8.9.162 LD_CFG3 (page=0x04 address=0x43) [reset=00h]
Programmable bits for load diagnostic resistance upper threshold set to a LD_RES_UT(Ω) value.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_UT[7:0]
RW
0h
dec2hex{256*round (LDG_RES_UT*(5/16)*2^14)}
8.9.163 LD_CFG4 (page=0x04 address=0x44) [reset=00h]
Programmable bits for load diagnostic resistance lower threshold set to a LD_RES_LT(Ω) value.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_LT[31:24]
RW
0h
dec2hex{256*round (LDG_RES_LT*(5/16)*2^14)}
8.9.164 LD_CFG5 (page=0x04 address=0x45) [reset=20h]
Programmable bits for load diagnostic resistance lower threshold set to a LD_RES_LT(Ω) value.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_LT[23:16]
RW
20h
dec2hex{256*round (LDG_RES_LT*(5/16)*2^14)}
8.9.165 LD_CFG6 (page=0x04 address=0x46) [reset=00h]
Programmable bits for load diagnostic resistance lower threshold set to a LD_RES_LT(Ω) value.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_LT[15:8]
RW
00h
dec2hex{256*round (LDG_RES_LT*(5/16)*2^14)}
8.9.166 LD_CFG7 (page=0x04 address=0x47) [reset=00h]
Programmable bits for load diagnostic resistance lower threshold set to a LD_RES_LT(Ω) value.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_LT[7:0]
RW
0h
dec2hex{256*round (LDG_RES_LT*(5/16)*2^14)}
8.9.167 CLD_EFF_1 (page=0x04 address=0x48) [reset=6Ch]
Programmable bits for Class D efficiency for LV_EN relative threshold. It is expressed as a fraction (EFF) and
default is 0.85.
Bit
Field
Type
Reset
Description
7-0
ClassD Efficiency [31:24]
RW
6Ch
dec2hex[256*round (EFF*2^23)]
8.9.168 CLD_EFF_2 (page=0x04 address=0x49) [reset=CCh]
Programmable bits for Class D efficiency for LV_EN relative threshold. It is expressed as a fraction (EFF) and
default is 0.85.
78
Bit
Field
Type
Reset
Description
7-0
ClassD Efficiency [23:16]
RW
CCh
dec2hex[256*round (EFF*2^23)]
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8.9.169 CLD_EFF_3 (page=0x04 address=0x4A) [reset=CDh]
Programmable bits for Class D efficiency for LV_EN relative threshold. It is expressed as a fraction (EFF) and
default is 0.85.
Bit
Field
Type
Reset
Description
7-0
ClassD Efficiency [15:8]
RW
CDh
dec2hex[256*round (EFF*2^23)]
8.9.170 CLD_EFF_4 (page=0x04 address=0x4B) [reset=00h]
Programmable bits for Class D efficiency for LV_EN relative threshold. It is expressed as a fraction (EFF) and
default is 0.85.
Bit
Field
Type
Reset
Description
7-0
ClassD Efficiency [7:0]
RW
00h
dec2hex[256*round (EFF*2^23)]
8.9.171 LDG_RES1 (page=0x04 address=0x4C) [reset=00h]
Diagnostic mode load resistance measured value expresed in Ω. Read value is 0xUUVVXXYY and the last byte
will be dropped.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_VAL[31:24]
R
0h
(16/5)*{hex2dec (0xUUVVXX)]/2^14}
8.9.172 LDG_RES2 (page=0x04 address=0x4D) [reset=00h]
Diagnostic mode load resistance measured value expresed in Ω. Read value is 0xUUVVXXYY and the last byte
will be dropped.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_VAL[23:16]
R
0h
(16/5)*{hex2dec (0xUUVVXX)]/2^14}
8.9.173 LDG_RES3 (page=0x04 address=0x4E) [reset=00h]
Diagnostic mode load resistance measured value expresed in Ω. Read value is 0xUUVVXXYY and the last byte
will be dropped.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_VAL[15:7]
R
0h
(16/5)*{hex2dec (0xUUVVXX)]/2^14}
8.9.174 LDG_RES4 (page=0x04 address=0x4F) [reset=00h]
Diagnostic mode load resistance measured value expresed in Ω. This last byte will be dropped.
Bit
Field
Type
Reset
Description
7-0
LDG_RES_VAL[7:0]
R
0h
Drop this byte
8.9.175 INIT_3 (page=0xFD address=0x3E) [reset=45h]
Bit
Field
Type
Reset
Description
7-4
Reserved
RW
4h
Reserved
3-0
OPT_DMIN[3:0]
RW
5h
DMIN optimization settings
8.10 SDOUT Equations
The following equations will alow to convert data read on SDOUT.
PVDD (V)= 23* [Hex2Dec(SDOUTdata)]/2^PVDD_SlotLength
(6)
By default, PVDD_SlotLength = 8.
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VBAT1S (V)= 8* [Hex2Dec(SDOUTdata)]/2^VBAT1S_SlotLength
(7)
By default, VBAT1S_SlotLength = 8.
TEMP (0C)= 256*[Hex2Dec(SDOUTdata)]/2^TEMP_SlotLength - 95
(8)
TEMP_SlotLength = 8.
80
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and
TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
9.1 Application Information
The TAS2780 is a digital input Class-D audio power amplifier with integrated I/V sense. I2S audio data is
supplied by host processor. The device provides I/V data in I2S format. I2C bus is used for configuration and
control.
9.2 Typical Application
Figure 9-1. Typical Application - Digital Audio Input
Table 9-1. Recommended External Components
COMPONENT
DESCRIPTION
SPECIFICATION
Type
VBAT1S Decoupling Capacitor - VBAT1S
External Supply (PWR_MODE0/1/3)
C1
VBAT1S Decoupling Capacitor
PVDD Decoupling Capacitor
UNIT
10
µF
10
V
Capacitance, 20% Tolerance
1
µF
Rated Voltage
10
V
Capacitance, 20% Tolerance
100
nF
Rated Voltage
10
V
Type
C3
MAX
Rated Voltage
Type
C2
TYP
X7R
Capacitance, 20% Tolerance
Type
VBAT1S Decoupling Capacitor - VBAT1S
Internally Generated (PWR_MODE2)
MIN
X7R
X7R
X7R
Capacitance, 20% Tolerance
22
µF
Rated Voltage
30
V
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Table 9-1. Recommended External Components (continued)
COMPONENT
DESCRIPTION
SPECIFICATION
MIN
Type
C4
PVDD Decoupling Capacitor
Capacitance, 20% Tolerance
AVDD Decoupling Capacitor
X7R
Capacitance, 20% Tolerance
4.7
µF
6
V
X7R
Capacitance, 20% Tolerance
1
Rated Voltage
IOVDD Decoupling Capacitor
1
Capacitance, 20% Tolerance
100
nF
6
Impedance at 100MHz
EMI filter inductors are optional. TAS2780
device support filter less Class-D operation.
DC Resistance
PFFB feature is recommended if ferrite
bead EMI filters are used.
DC Current
V
120
Ω
0.095
7
EMI filter capacitors are optional. Design
must use Lf2, Lf3 if Cf1, Cf2 are used
Capacitance
RF
Filter resistor for noise reduction
Resistor, 20% Tolerance
CF
Filter capacitor for noise reduction
Capacitance, 20% Tolerance
Cf1, Cf2 (optional)
V
X7R
Rated Voltage
Lf1, Lf2 (optional)
µF
6
Type
Bootstrap Capacitors
V
X7R
Capacitance, 20% Tolerance
Rated Voltage
C8, C9
µF
6
Type
C7
V
Type
Type
DREG Decoupling Capacitor
UNIT
nF
30
Rated Voltage
C6
MAX
100
Rated Voltage
C5
TYP
X7R
A
1
nF
1
kΩ
10/RF(kΩ)
Rated Voltage
30
Ω
nF
V
9.3 Design Requirements
For this design example, use the parameters shown in Section 9.2.
Table 9-2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Audio Input
Digital Audio, I2S
Current and Voltage Data Stream
Digital Audio, I2S
Mono or Stereo Configuration
Mono
Max Output Power at 1% THD+N,
RL = 4 Ω
25 W
9.4 Detailed Design Procedure
9.4.1 Mono/Stereo Configuration
In applications the device is assumed to be operating in mono mode. See Section 8.3.1 for information on
changing the I2C address of the TAS2780 to support stereo operation. Mono or stereo configuration does not
impact the device performance.
9.4.2 EMI Passive Devices
The TAS2780 supports spread spectrum to minimize EMI. It is allowed to include passive devices on the
Class-D outputs. The passive devices Lf1, Lf2, Cf1 and Cf2 from Figure 9-1 have recommended specifications
provided in Table 9-1. The passive devices of the output filter have to be properly selected to maintain the
stability of the amplifier. See Section 8.4.5 for details.
9.5 Application Curves
At TA = 25 0C, fSPK_AMP = 384 kHz, input signal fIN = 1kHz - Sine, Load = 4Ω + 15μH, unless otherwise noted.
82
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-55
0
VBAT
VBAT
VBAT
VBAT
-20
=
=
=
=
3.8 V, PVDD = 18 V
3.8 V, PVDD = 12 V
5 V, PVDD = 18 V
5 V, PVDD = 21 V
VBAT = 5 V, PVDD = 18 V
VBAT = 3.4 V, PVDD = 21 V
VBAT = 5 V, PVDD = 21 V
-60
-65
THD+N (dB)
THD+N (dB)
-70
-40
-60
-75
-80
-85
-90
-80
-95
-100
-100
0.001
0.01
0.1
POUT (W)
1
10
-105
50
20
PWR_MODE1
80
70
70
60
60
Efficiency (%)
Efficiency (%)
90
80
50
40
30
20
10
0
0.02
12
18
18
21
V,
V,
V,
V,
0.1
POUT
VBAT
VBAT
VBAT
VBAT
1
(W)
=
=
=
=
3.8 V, AVDD = 1.8 V
3.8 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
10
20K
PWR_MODE1
25
50
40
30
PVDD
PVDD
PVDD
PVDD
20
10
0
0.02
PWR_MODE1
Figure 9-4. Efficiency vs Output Power
10K
Figure 9-3. THD+N vs Output Power
90
=
=
=
=
1000
Frequency (Hz)
POUT= 15 W
Figure 9-2. THD+N vs Output Power
PVDD
PVDD
PVDD
PVDD
100
0.1
=
=
=
=
12
18
18
21
V,
V,
V,
V,
VBAT
VBAT
VBAT
VBAT
1
POUT (W)
=
=
=
=
3.8 V, AVDD = 1.8 V
3.8 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
5 V, AVDD = 1.8 V
10
25
PWR_MODE0
Figure 9-5. Efficiency vs Output Power
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10 Initialization Set Up
10.1 Initial Device Configuration - Power Up and Software Reset
The following I2C sequence needs to be used:
•
•
At power up, when SDZ = 1 (out of Hardware Shutdown into Software Shutdown);
when device is in Software Shutdown or Active mode and user runs a Software Reset command: bit[0] of
register 0x01 = 1.
###### Pre-Reset Configuration
w 70 00 01 #Page 0x01
w 70 37 3A #Bypass
w 70 00 FD #Page 0xFD
w 70 0D 0D #Access page
w 70 06 C1 #Set Dmin
w 70 00 01 #Page 0x01
w 70 19 C0 #Force modulation
w 70 00 FD #Page 0xFD
w 70 0D 0D #Access page
w 70 06 D5 #Set Dmin
###### Software Reset
w 70 00 00 #Page 0x00
w 70 7F 00 #Book 0x00
w 70 01 01 #Software Reset
d 01 #1 ms Delay
###### Post-Reset Configuration
w 70 00 01 #Page 0x01
w 70 37 3A #Bypass
w
w
w
w
70
70
70
70
00
0D
06
06
FD
0D
C1
D5
#Page 0xFD
#Access page
#Set Dmin
#Set Dmin
10.2 Initial Device Configuration - PWR_MODE0
The following I2C sequence is an example of initializing the device in PWR_MODE0.
w 70 00 00 # Page 0x00
w 70 0E 44 #TDM tx vsns transmit enable with slot 4
w 70 0F 40 #TDM tx isns transmit enable with slot 0
w
w
w
w
w
70
70
70
70
70
00
21
17
19
35
01
00
C8
00
74
#Page 0x01
#Disable Comparator Hysterisis
#SARBurstMask=0
#LSR Mode
#Noise minimized
w
w
w
w
70
70
70
70
00
0D
3E
0D
FD
0D
4A
00
#Page 0xFD
#Access Page 0xFD
#Optimal Dmin
#Remove access Page 0xFD
w
w
w
w
70
70
70
70
00
03
71
02
00
A8
03
80
#Page 0x00
#PWR_MODE0 selected
#PVDD UVLO set to 2.76V
#Play audio, power up with playback, IV enabled
10.3 Initial Device Configuration - PWR_MODE1
The following I2C sequence is an example of initializing the device in PWR_MODE1.
w 70 00 00 # Page 0x00
w 70 0E 44 #TDM tx vsns transmit enable with slot 4
w 70 0F 40 #TDM tx isns transmit enable with slot 0
84
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w
w
w
w
w
70
70
70
70
70
00
17
21
19
35
01
C8
00
00
74
#Page 0x01
#SARBurstMask=0
#Disable Comparator Hysterisis
#LSR Mode
#Noise minimized
w
w
w
w
70
70
70
70
00
0D
3E
0D
FD
0D
4A
00
#Page 0xFD
#Access Page 0xFD
#Optimal Dmin
#Remove access Page 0xFD
w 70 00 00 #Page 0x00
w 70 02 00 #Play audio, power up with playback, IV enabled
10.4 Initial Device Configuration - PWR_MODE2
The following I2C sequence is an example of initializing the device in PWR_MODE2.
w 70 00 00 #Page 0x00
w 70 0E 44 #TDM tx vsns transmit enable with slot 4
w 70 0F 40 #TDM tx isns transmit enable with slot 0
w
w
w
w
w
70
70
70
70
70
00
17
19
21
35
01
C0
00
00
74
#Page 0x01
#SARBurstMask=0
#LSR Mode
#Disable Comparator Hysterisis
#Noise minimized
w
w
w
w
70
70
70
70
00
0D
3E
0D
FD
0D
4A
00
#Page 0xFD
#Access Page 0xFD
#Optimal Dmin
#Remove access Page 0xFD
w
w
w
w
w
70
70
70
70
70
00
03
04
71
02
00
E8
A1
0E
80
#Page 0x00
#PWR_MODE2
#Int LDO mode
#PVDD UVLO 6.5V
#Power up audio playback with I,V enabled
10.5 Initial Device Configuration - PWR_MODE3
The following I2C sequence is an example of initializing the device in PWR_MODE3, for ultrasonic applications.
w 70 00 00 #Page 0x00
w 70 0E 44 #TDM tx vsns transmit enable with slot 4
w 70 0F 40 #TDM tx isns transmit enable with slot 0
w
w
w
w
70
70
70
70
00
17
19
21
01
C8
00
00
#Page 0x01
#SARBurstMask=0
#LSR Mode
#Disable Comparator Hysterisis
w
w
w
w
70
70
70
70
00
0D
3E
0D
FD
0D
4A
00
#Page 0xFD
#Access Page 0xFD
#Optimal Dmin
#Remove access Page 0xFD
w
w
w
w
70
70
70
70
00
03
73
02
00
68
E0
00
#Page 0x00
#PWR_MODE3
#DEM dither disable
#Play audio, power up with playback, IV enabled
10.6 Device Configuration - 44.1 kHz
The following I2C sequence is an example of initializing a TAS2780 device into 44.1 kHz sampling rate.
###### Configure Channel
w 70 60 21 # SBLK to Fs ratio = 256 / 8 TDM Slots
w 70 08 39 # 44.1KHz, Auto TDM off, Frame start High to Low
w 70 09 03 # Offset = 1, Sync on BCLK falling edge
w 70 0A 0A # TDM slot by address, Word = 24 bit, Frame = 32 bit
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w 70 0C 20 # Right Ch = TDM slot 2, Left Ch = TDM slot 0
w 70 0D 33 # TX bus keeper, Hi-Z, Offset 1, TX on Falling edge
10.7 Over Power Protection - OCP Programming
The following I2C sequence will program the over current protection in the case 2.7V ≤ VBAT1S≤ 2.9V.
w 70 00
w 70 0D
w 70 5C
w 70 3A
r 70 3B
#Record
w 70 3B
w 70 0D
w 70 00
FD #
0D #
C0 #
7D #
01 #
the value read from register 3B: XY
XZ # Z=Y-2
00 #
00 #
10.8 DSP Loopback
The following I2C sequence will enable the DSP loopback for echo reference.
#####DSP Echo Reference Loopback
w 70 00 00 #Page 0x00
w 70 7F 00
w 70 16 C0 #Audio TX slot programmed to 0
w 70 0E 00 #Disable V sense
w 70 0F 00 #Disable I sense
86
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11 Power Supply Recommendations
The power sequence between the supply rails can be applied in any order as long as SDZ pin is held low.
Once all supplies are stable the SDZ pin can be set high to initialize the part. After a hardware or software reset
additional commands to the device should be delayed for at least 1 ms to allow the OTP memory to load (see
section Section 10).
When VBAT1S is internally generated (see Section 11.1) it is recommended that the device enters Software
Shutdown mode before entering Hardware Shutdown mode. This ensures that VBAT1S pin is discharged using
the internal 5 kOhms pull down resistor (not present in Hardware Shutdown mode).
11.1 Power Supply Modes
The TAS2780 can operate with both VBAT1S and PVDD as supplies or with only PVDD or VBAT1S as supply.
The table below shows different power supply modes of operation depending on the user need.
Table 11-1. Device Configuration and Power Supply Modes
Supply Power Mode
Output
Switching
Mode
Supply
Condition
VBAT1S
Mode
PWR_MODE0
High Power on
PVDD
PVDD>VBAT1S
External
VBAT1S_MODE=0 PVDD is the only supply used to deliver
CDS_MODE[1:0]=10 output power.
PWR_MODE1
Y Bridge - High
Power on
VBAT1S
External
VBAT1S is used to deliver output
VBAT1S_MODE=0 power based on level and headroom
configured. When audio signal crosses
CDS_MODE[1:0]=00
a programmed threshold Class-D output
is switched over PVDD.
Internal
PVDD is the only supply. VBAT1S is
delivered by an internal LDO and used
VBAT1S_MODE=1 to supply at signals close to idle channel
CDS_MODE[1:0]=11 levels. When audio signal levels crosses
-100dBFS (default), Class-D output
switches to PVDD.
External
The device can be forced to work out
VBAT1S_MODE=0 of a low power rail mode of operation.
For example this can be used for a low
CDS_MODE[1:0]=01
power ultrasonic chirp when audio is not
played.
PWR_MODE2
PWR_MODE3
Y Bridge - Low
Power on
VBAT1S
VBAT1S
PVDD
PVDD
VBAT1S
Device
Configurations
Use Case and Device Functionality
When VBAT1S is external (PWR_MODE0, PWR_MODE1), if PVDD falls below (VBAT1S + 2.5 V) level, the
Y-bridge will stop switching between supplies and will remain on the PVDD supply.
In PWR_MODE2 user needs to ensure that PVDD supply level is at least 2.5 V above the VBAT1S voltage
generated internally in order to take advantage of Y bridge mode of operation. To enable voltage protection the
under voltage threshold of PVDD supply should be set above 7.3 V by using register bits PVDD_UVLO[5:0].
This will ensure that, with an internally generated VBAT1S of 4.8 V, PVDD supply is at least 2.5 V higher than
VBAT1S.
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12 Layout
12.1 Layout Guidelines
All supply rails should be bypassed by low-ESR ceramic capacitors as shown and described in Section 9.2.
To create a low impedance connection to PGND, DGND and GND and minimize the ground noise, ground
planes with multiple conductive epoxy filled vias should be used in layout.
Specific layout design recommendations should be followed for this device:
•
•
•
•
•
•
•
•
Use wide traces for signals that carry high current: PVDD, VBAT1S, PGND, DGND, GND and the speaker
OUT_P, OUT_N.
PGND pin should be directly connected and shorted to the ground plane.
DGND pin should be directly connected to the ground plane.
Connect VSNS_P and VSNS_N as close as possible to the speaker.
VSNS_P and VSNS_N should be connected between the EMI ferrite filter and the speaker if EMI ferrites are
used at the outputs.
VSNS_P and VSNS_N routing should be separated and shielded from switching signals (interface signals,
speaker outputs, bootstrap pins).
Place bootstrap capacitors as close as possible to the BST pins.
Place decoupling capacitors of PVDD and VBAT1S as close as possible to the pins (see Figure 12-1).
12.2 Layout Example
The figure below describes the placement of critical components as assigned in Figure 9-1.
Figure 12-1. Layout and Component Placement - Top Layer
88
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Figure 12-2. Layout and Component Placement - Bottom Layer
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13 Device and Documentation Support
13.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.2 Community Resources
13.3 Trademarks
All trademarks are the property of their respective owners.
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14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TAS2780RYAR
ACTIVE
VQFN-HR
RYA
30
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
TAS2780
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of