TAS5414
TAS5424
www.ti.com
SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
FOUR-CHANNEL AUTOMOTIVE DIGITAL AMPLIFIERS
FEATURES
•
•
•
•
•
•
•
•
•
•
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TAS5414 – Single-Ended Input
TAS5424 – Differential Input
Four-Channel Digital Power Amplifier
Four Analog Inputs, Four BTL Power Outputs
Typical Output Power per Channel at 10%
THD+N
– 28 W/Ch Into 4 Ω at 14.4 Vdc
– 45 W/Ch Into 2 Ω at 14.4 Vdc
– 58 W/Ch Into 4 Ω at 21 Vdc
– 116 W/Ch Into 2 Ω at 21 Vdc PBTL
Channels Can Be Paralleled (PBTL) for 1-Ω
Applications
THD+N < 0.02%, 1 kHz, 1 W Into 4 Ω
Patented Pop- and Click-Reduction
Technology
– Soft Muting With Gain Ramp Control
– Common-Mode Ramping
Patented AM Interference Avoidance
Patented Cycle-by-Cycle Current Limit
75-dB PSRR
Four-Address I2C Serial Interface for Device
Configuration and Control
Configurable Channel Gains: 12-dB, 20-dB,
26-dB, 32-dB
Load Diagnostic Functions:
– Output Open and Shorted Load
– Output-to-Power and -to-Ground Shorts
– Patented Tweeter Detection
Protection and Monitoring Functions:
– Short-Circuit Protection
– Load-Dump Protection to 50 V
– Fortuitous Open Ground and Power
Tolerant
– Patented Output DC Level Detection While
Music Playing
– Overtemperature Protection
– Over- and Undervoltage Conditions
– Clip Detection
36-Pin PSOP3 (DKD) Power SOP Package
•
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•
•
With Heat Slug Up for the TAS5414
44-Pin PSOP3 (DKD) Power SOP Package
With Heat Slug Up for the TAS5424
Designed for Automotive EMC Requirements
Pb-Free Soldering Supported
AECQ100 Compliant
ISO9000:2002 TS16949 Certified
–40°C to 105°C Ambient Temperature Range
APPLICATIONS
•
High-power OEM/retail head units and
amplifier modules where feature densities and
system configurations require reduction in
heat from the audio power amplifier
DESCRIPTION
The TAS5414 and TAS5424 are four-channel digital
audio amplifiers designed for use in automotive head
units and external amplifier modules. The TAS5414
and TAS5424 provide four channels at 23 W
continuously into 4 Ω at less than 1% THD+N from a
14.4-V supply. Each channel can also deliver 38 W
into 2 Ω at 1% THD+N. The TAS5414 uses
single-ended analog inputs, while the TAS5424
employs differential inputs for increased immunity to
common-mode system noise. The digital PWM
topology of the TAS5414 and TAS5424 provides
dramatic improvements in efficiency over traditional
linear amplifier solutions. This reduces the power
dissipated by the amplifier by a factor of ten under
typical music playback conditions. High efficiency is
accomplished without the need for complicated
power-supply schemes. Multiple TAS5414s or
TAS5424s can be synchronized to meet
high-channel-count applications.
The TAS5414 and TAS5424 incorporate all the
functionality needed to perform in the demanding
OEM applications area. They have built-in load
diagnostic functions for detecting and diagnosing
misconnected outputs to help to reduce test time
during the manufacturing process.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TAS5414
TAS5424
www.ti.com
SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
TAS5414 FUNCTIONAL BLOCK DIAGRAM
3.3 V–5 V
TAS5414-36 Pins
Pull-Up Resistors
System
mP
AVDD (6.5 V)
SDA
SCL
STANDBY
Supplies
and
References
D_BYP
A_BYP
DVDD (3.3 V)
2
I C
SGND
OverTemp
Warn/SD
FAULT
CLIP_OTW
REXT
VREF and IREF
I2C ADDR
“0” – “3”
Fault
and
Timing
Logic
Channel
Utilities
GND
CP
AVDD
Over/Under
Voltage
GND/SGND PGND
CPC_TOP
PVDD
Load Dump
OSC_SYNC
Charge
Pump
Osc
and
Clock
CPC_BOT
CP
Battery
8 VDC–22 VDC
Channel 1 of 4
MUTE
Load Diagnostics and Fault Monitors
Optional
DC Detect
Open/Short Diagnostic
OC Timer
AVSS
Clip Detect
FLV
RLV
FRV
RRV
Radio DSP
Signal Path
PVDD
Current
Limit
IN1_P
IN2_P
IN3_P
IN4_P
IN_M
OUT1_P
PreAmp
Tweeter
Detect
PWM
Gate
Driver
Feedback
OUT1_M
PGND
Channels 2, 3, 4: Same as Ch 1
B0198-01
2
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TAS5424
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SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
TAS5424 FUNCTIONAL BLOCK DIAGRAM
3.3 V–5 V
TAS5424-44 Pins
Pull-Up Resistors
System
mP
AVDD (6.5 V)
SDA
SCL
STANDBY
Supplies
and
References
D_BYP
A_BYP
DVDD (3.3 V)
2
I C
SGND
OverTemp
Warn/SD
FAULT
CLIP_OTW
REXT
VREF and IREF
I2C ADDR
“0” – “3”
Fault
and
Timing
Logic
Channel
Utilities
GND
CP
AVDD
Over/Under
Voltage
GND/SGND PGND
CPC_TOP
PVDD
Load Dump
OSC_SYNC
Charge
Pump
Osc
and
Clock
CPC_BOT
CP
Battery
8 VDC–22 VDC
Channel 1 of 4
MUTE
Load Diagnostics and Fault Monitors
Optional
DC Detect
Clip Detect
Open/Short Diagnostic
OC Timer
Signal Path
PVDD
Current
Limit
IN1_P
Audio
Input
IN1_M
OUT1_P
PreAmp
Tweeter
Detect
PWM
Gate
Driver
Feedback
OUT1_M
PGND
Channels 2, 3, 4: Same as Ch 1
B0198-02
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TAS5414
TAS5424
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SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
PIN ASSIGNMENTS AND FUNCTIONS
The pin assignments for the TAS5414 and TAS5424 are shown as follows.
TAS5414
DKD PACKAGE
(TOP VIEW)
OSC_SYNC
I2C_ADDR
SDA
SCL
FAULT
MUTE
STANDBY
D_BYP
CLIP_OTW
GND
SGND
REXT
A_BYP
IN1_P
IN2_P
IN_M
IN3_P
IN4_P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
TAS5424
DKD PACKAGE
(TOP VIEW)
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
PVDD
PVDD
OUT1_M
OUT1_P
PGND
OUT2_M
OUT2_P
CPC_TOP
CP
CPC_BOT
PGND
OUT3_M
OUT3_P
PGND
OUT4_M
OUT4_P
PVDD
PVDD
P0018-03
OSC_SYNC
I2C_ADDR
SDA
SCL
FAULT
MUTE
GND
STANDBY
D_BYP
CLIP_OTW
GND
SGND
REXT
A_BYP
IN1_P
IN1_M
IN2_P
IN2_M
IN3_P
IN3_M
IN4_P
IN4_M
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
PVDD
PVDD
PVDD
OUT1_M
OUT1_P
PGND
PGND
OUT2_M
OUT2_P
CPC_TOP
CP
CP_BOT
PGND
OUT3_M
OUT3_P
PGND
PGND
OUT4_M
OUT4_P
PVDD
PVDD
PVDD
P0055-01
4
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TAS5424
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SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
Table 1. TERMINAL FUNCTIONS
TERMINAL
DKD Package
NAME
TYPE (1)
DESCRIPTION
TAS5414 TAS5424
NO.
NO.
A_BYP
13
14
PBY
Bypass capacitor for the AVDD analog regulator
CLIP_OTW
9
10
DO
Open-drain CLIP, OTW, or logical OR of the CLIP and OTW outputs. It also reports
tweeter detection during tweeter mode.
CP
28
34
CP
Top of main storage capacitor for charge pump (bottom goes to PVDD)
CPC_BOT
27
33
CP
Bottom of flying capacitor for charge pump
CPC_TOP
29
35
CP
Top of flying capacitor for charge pump
D_BYP
8
9
PBY
Bypass pin for DVDD regulator output
FAULT
5
5
DO
Global fault output (open drain): UV, OV, OTSD, OCSD, DC
GND
10
7, 11
DG
Ground
I2C_ADDR
2
2
AI
I2C address bit
N/A
16
AI
Inverting analog input for channel 1 (TAS5424 only)
IN1_P
14
15
AI
Non-inverting analog input for channel 1
IN2_M
N/A
18
AI
Inverting analog input for channel 2 (TAS5424 only)
IN2_P
15
17
AI
Non-inverting analog input for channel 2
IN3_M
N/A
20
AI
Inverting analog input for channel 3 (TAS5424 only)
IN3_P
17
19
AI
Non-inverting analog input for channel 3
IN4_M
N/A
22
AI
Inverting analog input for channel 4 (TAS5424 only)
IN4_P
18
21
AI
Non-inverting analog input for channel 4
IN_M
16
N/A
ARTN
MUTE
6
6
AI
OSC_SYNC
1
1
DI/DO
OUT1_M
34
41
PO
– polarity output for bridge 1
OUT1_P
33
40
PO
+ polarity output for bridge 1
OUT2_M
31
37
PO
– polarity output for bridge 2
OUT2_P
30
36
PO
+ polarity output for bridge 2
OUT3_M
25
31
PO
– polarity output for bridge 3
OUT3_P
24
30
PO
+ polarity output for bridge 3
OUT4_M
22
27
PO
– polarity output for bridge 4
OUT4_P
21
26
PO
+ polarity output for bridge 4
PGND
23, 26,
32
28, 29,
32, 38,
39
PGND
Power GND
PVDD
19, 20,
35, 36
23, 24,
25, 42,
43, 44
PWR
PVDD supply
REXT
12
13
AI
Precision resistor pin to set clock frequency
SCL
4
4
DI
I2C clock input from system I2C master
SDA
3
3
DI/DO
I2C data I/O for communication with system I2C master
SGND
11
12
AG/DG
Signal ground (analog and digital signal ground)
STANDBY
7
8
DI
IN1_M
(1)
Signal return for the 4 analog channel inputs (TAS5414 only)
Gain ramp control: mute (low), play (high)
Oscillator sync input from master or output to slave amplifiers (20 MHz divided by 5,
6, or 7)
Active-low STANDBY pin. Standby (low), power up (high)
DI = digital input, DO = digital output, AI = analog input, ARTN = analog signal return, PWR = power supply, PGND = power ground,
PBY = power bypass, PO = power output, AG = analog ground, DG = digital ground, CP = charge pump.
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TAS5424
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SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
–0.3 to 30
V
–1 to 50
V
PVDD
DC supply voltage range
Relative to PGND
PVDDMAX
Pulsed supply voltage range
t ≤ 100 ms exposure
PVDDRAMP
Supply voltage ramp rate
Voltage rising up to PVDDMAX
IPVDD
Externally imposed dc supply current per PVDD or PGND pin
IPVDD_MAX
Pulsed supply current per PVDD pin (one shot)
IO
Maximum allowed dc current per output pin
IO_MAX (1)
Pulsed output current per output pin (single pulse)
t < 100 ms
±17
A
IIN_MAX
Maximum current, all digital and analog input pins (2)
DC or pulsed
±1
mA
IMUTE_MAX
Maximum current on MUTE pin
DC or pulsed
±20
mA
IIN_ODMAX
Maximum sinking current for open-drain pins
7
mA
VLOGIC
Input voltage range for logic pin relative to SGND (SCL and
SDA pins)
Supply voltage range:
6.5 V < PVDD < 24 V
–0.3 to 7
V
VI2C_ADDR
Input voltage range for I2C_ADDR pin relative to SGND
Supply voltage range:
6.5 V < PVDD < 24 V
–0.3 to 7
V
VSTANDBY
Input voltage range for STANDBY pin
Supply voltage range:
6.5 V < PVDD < 24V
–0.3 to 5.8
V
VOSC_SYNC
Input voltage range for OSC_SYNC pin relative to SGND
Supply voltage range:
6.5 V < PVDD < 24 V
–0.3 to 3.6
V
VAIN_MAX
Maximum instantaneous input voltage (per pin), analog input
pins
Supply voltage range:
6.5 V < PVDD < 24 V
6.5
V
VAIN_AC_MAX_5414
Maximum ac coupled input voltage for TAS5414 (2), analog
input pins
Supply voltage range:
6.5 V < PVDD < 24 V
1.9
Vrms
VAIN_AC_MAX_5424
Maximum ac coupled differential input voltage for TAS5424 (2), Supply voltage range:
analog input pins
6.5 V < PVDD < 24 V
3.8
(1.9 per
pin)
Vrms
VAIN_DC
Input voltage range for analog pin relative to AGND (INx pins)
–0.3 to 6.5
V
TJ
Maximum operating junction temperature range
–55 to 150
°C
Tstg
Storage temperature range
–55 to 150
°C
TSOLDER
Lead temperature during soldering 1,6 mm (1/16 inch) from
case for 10 seconds
260
°C
Power dissipation
Continuous power dissipation
80
W
(1)
(2)
t < 100 ms
Supply voltage range:
6.5 V < PVDD < 24 V
Tcase = 70°C
25
V/ms
±12
A
17
A
±13.5
A
Pulsed current ratings are maximum survivable currents externally applied to the TAS5414 and TAS5424. High currents may be
encountered during reverse battery, fortuitous open ground, and fortuitous open supply fault conditions.
See Application Information section for information on analog input voltage and ac coupling.
THERMAL CHARACTERISTICS
6
PARAMETER
VALUE
UNIT
RθJC
Junction-to-case (heat slug) thermal
resistance
1
°C/W
RθJA
Junction-to-ambient thermal resistance
This device is not intended to be used without a heatsink. Therefore, RθJA
is not specified. See the Thermal Information section.
°C/W
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TAS5424
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SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
RECOMMENDED OPERATING CONDITIONS
PVDDOP
(1)
DC supply voltage range relative to PGND
2
PVDDI2C
DC supply voltage range for I C reporting
MIN
TYP
MAX
8
14.4
22
V
6
14.4
26.5
V
(2)
Analog audio input signal level (TAS5414)
AC-coupled input voltage
0
VAIN_5424 (2)
Analog audio input signal level (TAS5424)
AC-coupled input voltage
0
fAUDIO_TW
Audio frequency for tweeter detect
TA
Ambient temperature
VAIN_5414
(3)
Vrms
0.5–2(3)
Vrms
25
kHz
–40
105
°C
–40
115
°C
10
An adequate heat sink is required
to keep TJ within specified range
UNIT
0.25–1
20
TJ
Junction temperature
RL
Nominal speaker load impedance
2
4
VPU
Pullup voltage supply (for open-drain logic outputs)
3
3.3 or 5
5.5
V
10
50
100
kΩ
1
5
10
kΩ
100
kΩ
RPU_EXT
External pullup resistor on open-drain logic outputs
RPU_I2C
I2C pullup resistance on SDA and SCL pins
Resistor connected between
open-drain logic output and VPU
supply
Ω
2
RI2C_ADD
Total resistance of voltage divider for I C address
slave 1 or slave 2, connected between D_BYP and
SGND pins
RREXT
External resistance on REXT pin
20.2
kΩ
CD_BYP
External capacitance on D_BYP pin
10
120
nF
CA_BYP
External capacitance on A_BYP pin
10
120
nF
CIN
External capacitance to analog input pin in series
with input signal
CFLY
Flying capacitor on charge pump
0.47
1
1.5
μF
CP
Charge pump capacitor
0.47
1
1.5
μF
CMUTE
Capacitance on MUTE pin
3.3
330
nF
COSCSYNC_MAX
Allowed loading capacitance on OSC_SYNC pin
5
pF
(1)
(2)
(3)
10
1% tolerance required
19.8
20
μF
1
The Recommended Operating Conditions table specifies only that the device is functional in the given range. See the Electrical
Characteristics table for specified performance limits.
Signal input for full unclipped output with gains of 32 dB, 26 dB, 20 dB, and 12 dB
Maximum recommended input voltage is determined by the gain setting.
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TAS5424
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ELECTRICAL CHARACTERISTICS
Test conditions (unless otherwise noted): TCase = 25°C, PVDD = 14.4 V, RL = 4 Ω, fS = 417 kHz, Rext = 20 kΩ, master mode
operation (see application diagram)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
240
300
UNIT
OPERATING CURRENT
IPVDD_IDLE
IPVDD_Hi-Z
IPVDD_STBY
All four channels running in MUTE mode
PVDD idle current
All four channels in Hi-Z mode
80
STANDBY mode, TJ ≤ 85°C
PVDD standby current
2
20
mA
μA
OUTPUT POWER
4 Ω, PVDD = 14.4V, THD+N ≤ 1%, 1 kHz, Tc = 75°C
4 Ω, PVDD = 14.4V, THD+N = 10%, 1 kHz, Tc = 75°C
23
25
4 Ω, PVDD = 14.4V, square wave, 1 kHz, Tc = 75°C
43
4 Ω, PVDD = 21 V, THD+N = 1%, 1 kHz, Tc = 75°C
4 Ω, PVDD = 21 V, THD+N = 10%, 1 kHz, Tc = 75°C
POUT
47
50
2 Ω, PVDD = 14.4V, THD+N = 1%, 1 kHz, Tc = 75°C
Output power per channel
2 Ω, PVDD = 14.4V, THD+N = 10%, 1 kHz, Tc = 75°C
W
45
2 Ω, PVDD = 14.4 V, square wave 1 kHz, Tc = 75°C
70
PBTL 2-Ω operation, PVDD = 21 V, THD+N = 10%,
1 kHz, Tc = 75°C
116
90
4 channels operating, 23W output power/ch, L = 10 μH,
TJ ≤ 85°C
Power efficiency
58
38
40
PBTL 1-Ω operation, PVDD = 14.4 V, THD+N = 10%,
1 kHz, Tc = 75°C
EFFP
28
90%
AUDIO PERFORMANCE
Noise voltage at output
G = 26 dB, zero input, AES17 filter, and A-weighting
Crosstalk
Channel crosstalk
1W, G = 26 dB, 1 kHz
60
75
dB
CMRR5424
Common-mode rejection ratio (TAS5424)
1 kHz, 1 Vrms referenced to SGND, G = 26 dB
60
75
dB
PSRR
Power supply rejection ratio
G = 26 dB, PVDD = 14.4 Vdc + 1 Vrms, f = 1 kHz
60
75
THD+N
Total harmonic distortion + noise
P = 1 W, G = 26 dB, f = 1 kHz, 0°C ≤ TJ ≤ 75°C
Switching frequency
Switching frequency selectable for AM interference
avoidance
fS
RAIN
Analog input resistance
Internal shunt resistance on each input pin
VIN_CM
Common-mode input voltage (non-clipping)
AC-coupled common-mode input voltage (zero
differential input)
VCM_INT
Internal common-mode input bias voltage
Internal bias applied to IN_M pin
G
Voltage gain (VO/VIN)
Source impedance = 0 Ω
GCH
Channel-to-channel variation
Any gain commanded
tCM
Output-voltage common-mode ramping time
tGAIN
Gain ramping time
60
100
μV
VNOISE
dB
0.02%
0.1%
336
357
378
392
417
442
470
500
530
60
80
100
kΩ
1.3
Vrms
3.25
V
11
12
13
19
20
21
25
26
27
31
32
33
–1
0
1
External CMUTE = 330 nF
kHz
dB
dB
35
ms
30
ms
PWM OUTPUT STAGE
RDSon
FET Drain-to-source resistance
Not including bond wire resistance, TJ = 25°C
VO_OFFSET
Output offset voltage
Zero input signal and G = 26 dB
75
95
mΩ
±10
±25
mV
23.7
26.3
V
PVDD OVER VOLTAGE (OV) PROTECTION
VOV
PVDD over voltage shutdown
22.1
LOAD DUMP (LD) PROTECTION
VLD_SD_SET
Load-dump shutdown voltage
26.6
29
32
V
VLD_SD_CLEAR
Recovery voltage for load-dump shutdown
23.5
26.4
28.4
V
PVDD UNDER VOLTAGE (UV) PROTECTION
8
VUV_SET
PVDD under voltage shutdown
6.5
7
7.5
V
VUV_CLEAR
Recovery voltage for PVDD UV
7
7.5
8
V
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ELECTRICAL CHARACTERISTICS (continued)
Test conditions (unless otherwise noted): TCase = 25°C, PVDD = 14.4 V, RL = 4 Ω, fS = 417 kHz, Rext = 20 kΩ, master mode
operation (see application diagram)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
AVDD
VA_BYP
A_BYP pin voltage
6.5
V
VA_BYP_UV_SET
A_BYP UV voltage
4.8
V
VA_BYP_UV_CLEAR
Recovery voltage A_BYP UV
5.3
V
D_BYP pin voltage
3.3
V
DVDD
VD_BYP
POWER-ON RESET (POR)
VPOR
Maximum PVDD voltage for POR; I2C
active above this voltage
VPOR_HY
PVDD recovery hysteresis voltage for POR
6
V
0.1
V
1.24
V
REXT
VREXT
Rext pin voltage
CHARGE PUMP (CP)
VCPUV_SET
CP undervoltage
4.8
V
VCPUV_CLEAR
Recovery voltage for CP UV
5.2
V
OVERTEMPERATURE (OV) PROTECTION
TOTW1_CLEAR
TOTW1_SET /
TOTW2_CLEAR
TOTW2_SET /
TOTW3_CLEAR
Junction temperature for overtemperature
warning
TOTW3_SET /
TOTWD_CLEAR
TOTSD
Junction temperature for overtemperature
shutdown
102
115
128
112
125
138
122
135
148
132
145
158
142
155
168
°C
CURRENT LIMITING PROTECTION
ILIM1
Current limit 1 (load current)
Load < 4 Ω
5.5
7.3
9
A
ILIM2
Current limit 2 (load current), I2C setting
current limit level 2
Load < 2 Ω
8.5
11
13.5
A
9.5
11.3
13
A
11.5
14.3
17
A
325
540
750
mA
OVERCURRENT (OC) SHUTDOWN PROTECTION
IMAX1
Maximum current 1 (peak output current)
IMAX2
Maximum current 2 (peak output current)
Any short to supply, ground, or other channels
TWEETER DETECT
ITH_TW
Load current threshold for tweeter detect
ILIM_TW
Load current limit for tweeter detect
2
A
STANDBY MODE
VIH_STBY
STANDBY input voltage for logic-level high
2
5.5
VIL_STBY
STANDBY input voltage for logic-level low
0
0.7
V
ISTBY_PIN
STANDBY pin current
0.2
μA
0.1
V
MUTE MODE
Output attenuation
MUTE pin ≤ 0.9Vdc, VIN = 1 Vrms on all inputs
VTH_DCD_POS
DC detect positive threshold default value
VTH_DCD_NEG
DC detect negative threshold default value
tDCD
DC detect step response time for four
channels
GMUTE
85
dB
PVDD = 14.4 Vdc, register 0x0E = 8EH
6.5
V
PVDD = 14.4 Vdc, register 0x0F = 3DH
–6.5
V
DC DETECT
4.3
s
CLIP_OTW REPORT
VOH_CLIPOTW
VOL_CLIPOTW
CLIP_OTW pin output voltage for logic level
high (open-drain logic output)
CLIP_OTW pin output voltage for logic level
low (open-drain logic output)
2.4
V
External 47-kΩ pullup resistor to 3 V–5.5 V
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0.5
V
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SLOS514A – FEBRUARY 2007 – REVISED JULY 2007
ELECTRICAL CHARACTERISTICS (continued)
Test conditions (unless otherwise noted): TCase = 25°C, PVDD = 14.4 V, RL = 4 Ω, fS = 417 kHz, Rext = 20 kΩ, master mode
operation (see application diagram)
PARAMETER
tDELAY_CLIPDET
TEST CONDITIONS
MIN
TYP
CLIP_OTW signal delay when output
clipping detected
MAX
20
UNIT
μs
FAULT REPORT
VOH_FAULT
VOL_FAULT
FAULT pin output voltage for logic-level
high (open-drain logic output)
2.4
FAULT pin output voltage for logic-level low
(open-drain logic output)
External 47-kΩ pullup resistor to 3 V–5.5 V
V
0.5
OPEN/SHORT DIAGNOSTICS
RS2P, RS2G
Maximum resistance to detect a short from
OUT pin(s) to PVDD or ground
ROPEN_LOAD
Minimum load resistance to detect open
circuit
Including speaker wires
300
RSHORTED_LOAD
Maximum load resistance to detect short
circuit
Including speaker wires
0.5
Voltage on I2C_ADDR pin for address 0
Connect to SGND
0%
0%
15%
Voltage on I2C_ADDR pin for address 1
External resistors in series between D_BYP and SGND
as a voltage divider
25%
35%
45%
Voltage on I2C_ADDR pin for address 2
55%
65%
75%
Voltage on I2C_ADDR pin for address 3
Connect to D_BYP
85%
100%
100%
tHOLD_I2C
Power-on hold time before I2C
communication
STANDBY high
fSCL
SCL clock frequency
VIH_SCL
SCL pin input voltage for logic-level high
VIL_SCL
SCL pin input voltage for logic-level low
200
Ω
800
1300
Ω
1
1.5
Ω
I2C ADDRESS DECODER
tLATCH_I2CADDR
VI2C_ADDR
Time delay to latch I2C address after POR
μs
300
VD_BYP
I2C
RPU_I2C = 5-kΩ pullup, supply voltage = 3.3 V or 5 V
VOH_SDA
SDA pin output voltage for logic-level high
I2C read, RI2C = 5-kΩ pullup,
supply voltage = 3.3 V or 5 V
VOL_SDA
SDA pin output voltage for logic-level low
I2C read, 3-mA sink current
1
ms
100
kHz
2.1
5.5
V
–0.5
1.1
V
2.4
V
0
0.4
V
2
VIH_SDA
SDA pin input voltage for logic-level high
I C write, RI2C = 5-kΩ pullup,
supply voltage = 3.3 V or 5 V
2.1
5.5
V
VIL_SDA
SDA pin input voltage for logic-level low
I2C write, RI2C = 5-kΩ pullup,
supply voltage = 3.3 V or 5 V
–0.5
1.1
V
Ci
Capacitance for SCL and SDA pins
10
pF
3.6
V
0.5
V
3.6
V
0.8
V
OSCILLATOR
VOH_OSCSYNC
OSC_SYNC pin output voltage for
logic-level high
2.4
I2C_ADDR pin set to MASTER mode
VOL_OSCSYNC
OSC_SYNC pin output voltage for
logic-level low
VIH_OSCSYNC
OSC_SYNC pin input voltage for logic-level
high
VIL_OSCSYNC
fOSC_SYNC
10
OSC_SYNC pin input voltage for logic-level
low
OSC_SYNC pin clock frequency
2
I2C_ADDR pin set to SLAVE mode
I2C_ADDR pin set to MASTER mode, fS = 500 kHz,
maximum capacitive loading = 5 pF
3.76
4.0
4.24
I2C_ADDR pin set to MASTER mode, fS = 417 kHz,
maximum capacitive loading = 5 pF
3.13
3.33
3.63
I2C_ADDR pin set to MASTER mode, fS = 357 kHz,
maximum capacitive loading = 5 pF
2.68
2.85
3.0
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2
TIMING REQUIREMENTS FOR I C INTERFACE SIGNALS
over recommended operating conditions (unless otherwise noted)
MAX
UNIT
tr
Rise time for both SDA and SCL signals
PARAMETER
1000
ns
tf
Fall time for both SDA and SCL signals
300
ns
tw(H)
SCL pulse duration, high
4
μs
tw(L)
SCL pulse duration, low
4.7
μs
tsu2
Setup time for START condition
4.7
μs
th2
START condition hold time after which first clock pulse is generated
4
μs
tsu1
Data setup time
250
ns
th1
Data hold time
0 (1)
ns
tsu3
Setup time for STOP condition
4
μs
t(buf)
Time between a STOP and START condition
CB
Load capacitance for each bus line
(1)
MIN
TYP
μs
4.7
400
pF
A device must internally provide a hold time of at least 300 ns for the SDA signal to bridge the undefined region of the falling edge of
SCL.
tw(H)
tw(L)
tf
tr
SCL
tsu1
th1
SDA
T0027-01
Figure 1. SCL and SDA Timing
SCL
t(buf)
th2
tsu2
tsu3
SDA
Start
Condition
Stop
Condition
T0028-01
Figure 2. Timing for Start and Stop Conditions
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TYPICAL CHARACTERISTICS
THD+N
vs
POWER at 1kHz
THD+N
vs
FREQUENCY at 1 Watt
10
10
21 VDC, 4 Ω
14.4 VDC, 4 Ω
1
0.1
THD+N − Total Harmonic Distrotion + Noise − %
THD+N − Total Harmonic Distrotion + Noise − %
100
14.4 VDC, 2 Ω
21 VDC, 2 Ω, PBTL
0.01
0.1
1
10
14.4 VDC, 4 Ω
0.01
21 VDC, 4 Ω
100
1k
G002
G001
Figure 3.
Figure 4.
TAS5424
COMMON-MODE REJECTION RATIO
vs
FREQUENCY
CROSSTALK
vs
FREQUENCY
0
−20
−40
−40
Crosstalk − dBV
−50
−60
−70
−60
−80
−100
−80
−90
10
−120
100
1k
10k 20k
−140
10
100
1k
10k 20k
f − Frequency − Hz
f − Frequency − Hz
G004
G003
Figure 5.
12
10k 20k
f − Frequency − Hz
−30
CMRR − Common−Mode Rejection Ratio − dBV
14.4 VDC, 2 Ω
0.1
0.001
10
100 200
PO − Output Power − W
1
Figure 6.
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TYPICAL CHARACTERISTICS (continued)
IMD SMPTE 19 kHz, 20 kHz 1:1
NOISE FFT
−60
−70
−20
−80
−40
Voltage − dBV
IMD SMPTE 19 kHz, 20 kHz 1:1 − dBV
0
−60
−90
−80
−100
−100
−110
−120
10
100
1k
10k
−120
10
30k
100
f − Frequency − Hz
1k
10k
30k
f − Frequency − Hz
G005
G006
Figure 7.
Figure 8.
EFFICIENCY,
FOUR CHANNELS AT 4 Ω EACH
DEVICE POWER DISSIPATION
FOUR CHANNELS AT 4 Ω EACH
100
12
90
10
80
Power Dissipation − W
Efficiency − %
70
60
50
40
30
20
8
6
4
2
10
0
0
0
4
8
12
16
20
24
28
32
0
P − Power Per Channel − W
G007
Figure 9.
5
10
15
20
P − Power Per Channel − W
G008
Figure 10.
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TAS5424
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TYPICAL CHARACTERISTICS (continued)
DC DETECT VOLTAGE
vs
REGISTER 0E VALUES
20
18
DC Detect Voltage − V
16
14
PVDD = 20 V
PVDD = 14.4 V
12
10
8
PVDD = 8 V
6
4
2
0
65
6a
6f
74 79
7e
83
88 8d 92 97 9c a1
Register 0E − Hex
a6
ab b0 b5
ba
bf
c4
c9
G009
Figure 11.
DC DETECT VOLTAGE
vs
REGISTER 0F VALUES
0
−2
DC Detect Voltage − V
−4
PVDD = 8 V
−6
−8
PVDD = 14.4 V
−10
−12
−14
PVDD = 20 V
−16
−18
−20
00
05 0a
0f
14
19
1e
23 28 2d 32 37 3c
Register 0F − Hex
41
46 4b 50
55
5a
5f
64
G010
Figure 12.
14
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DESCRIPTION OF OPERATION
OVERVIEW
The TAS5414 and TAS5424 are single-chip, four-channel, analog-input audio amplifiers for use in the
automotive environment. The design uses an ultra-efficient class-D technology developed by Texas Instruments,
but with changes needed by the automotive industry. This technology allows for reduced power consumption,
reduced heat, and reduced peak currents in the electrical system. The TAS5414 and TAS5424 realize an audio
sound system design with smaller size and lower weight than traditional class-AB solutions.
The TAS5414 and TAS5424 are composed of eight elements:
• Preamplifier
• PWM
• Gate drive
• Power FETs
• Diagnostics
• Protection
• Power supply
• I2C serial communication bus
Preamplifier
The preamplifier of the TAS5414 and TAS5424 is a high-input-impedance, low-noise, low-offset-voltage input
stage with adjustable gain. The high input impedance of the TAS5414 and TAS5424 allows the use of low-cost
1-μF input capacitors while still achieving extended low-frequency response. The preamplifier is powered by a
dedicated, internally regulated supply, which gives it excellent noise immunity and channel separation. Also
included in the preamp are:
1. Mute Pop-and-Click Control—An audio input signal is reshaped and amplified as a step when a mute is
applied at the crest or trough of the signal. Such a step is perceived as a loud click. This is avoided in the
TAS5414 and TAS5424 by ramping the gain gradually when a mute or play command is received.
Another form of click and pop can be caused by the start or stopping of switching in a class-D amplifier.
The TAS5414 and TAS5424 incorporate a patented method to reduce the pop energy during the
switching startup and shutdown sequence. Fault conditions require rapid protection response by the
TAS5414 and the TAS5424, which do not have time to ramp the gain down in a pop-free manner. The
device transitions into Hi-Z mode when an OV, UV, OC, OT, or DC fault is encountered. Also, activation
of the STANDBY pin may not be pop-free.
2. Gain Control—The four gain settings are set in the preamplifier via I2C control registers. The gain is set
outside of the global feedback resistors of the TAS5414 and the TAS5424, thus allowing for stability in the
system under all load conditions and gain settings.
3. DC Offset Reduction Circuitry—Circuitry has been incorporated to reduce the dc offset. DC offset in
high-gain amplifiers can produce audible clicks and pops when the amplifier is started or stopped. The
offset reduction circuitry can be disabled or enabled via I2C.
Pulse-Width Modulator (PWM)
The PWM converts the analog signal from the preamplifier into a switched signal of varying duty cycle. This is
the critical stage that defines the class-D architecture. In the TAS5414 and TAS5424, the modulator is an
advanced design with high bandwidth, low noise, low distortion, excellent stability, and full 0–100% modulation
capability. The patented PWM uses clipping recovery circuitry to eliminate the deep saturation characteristic of
PWMs when the input signal exceeds the modulator waveform.
Gate Drive
The gate driver accepts the low-voltage PWM signal and level shifts it to drive a high-current, full-bridge, power
FET stage. The TAS5414 and TAS5424 use patent-pending techniques to avoid shoot-through and are
optimized for EMI and audio performance.
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DESCRIPTION OF OPERATION (continued)
Power FETs
The BTL output for each channel comprises four rugged N-channel 30-V FETs, each of which has an RDSon of
75 mΩ for high efficiency and maximum power transfer to the load. These FETs are designed to handle large
voltage transients during load dump.
Load Diagnostics
The TAS5414 and TAS5424 incorporate load diagnostic circuitry designed to help pinpoint the nature of output
misconnections during installation. The TAS5414 and the TAS5424 include functions for detecting and
determining the status of output connections. The following diagnostics are supported:
• Short to GND
• Short to PVDD
• Short across load (R < 1 Ω, typical)
• Open load (R > 800 Ω, typical)
• Tweeter detection
The presence of any of the short or open conditions is reported to the system via I2C register read. The tweeter
detect status can be read from the CLIP_OTW pin when properly configured.
1. Output Short and Open Diagnostics—The TAS5414 and TAS5424 contain circuitry designed to detect
shorts and open conditions on the outputs. The load diagnostic function can only be invoked when the
output is in the Hi-Z mode. There are four phases of test during load diagnostics and two levels of test. In
the full level, all channels must be in the Hi-Z state. All four phases are tested on each channel, all four
channels at the same time. When fewer than four channels are in Hi-Z, the reduced level of test is the
only available option. In the reduced level, only short to PVDD and short to GND can be tested. Load
diagnostics can occur at power up before the amplifier is moved out of Hi-Z mode. If the amplifier is
already in play mode, it must Mute and then Hi-Z before the load diagnostic can be performed. By
performing the mute function, the normal pop- and click-free transitions occur before the diagnostics
begin. The diagnostics are performed as shown in Figure 13. Figure 14 shows the impedance ranges for
the open-load and shorted-load diagnostics. The results of the diagnostic are read from the diagnostic
register for each channel via I2C. Note: Do not send a command via I2C to register 0x0C during the load
diagnostic test.
Hi-Z
Channel Synchronization
Playback
/
Mute
OUT1_M
Phase1
Phase2
Phase3
Phase4
S2G
S2P
OL
SL
OUT1_P
VSpeaker
(OUT1_P – OUT1_M)
100 ms
~50 ms
~50 ms
~50 ms
~50 ms
100 ms
150 ms
~50 ms
~50 ms
~50 ms
~50 ms
150 ms