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TAS5751M
SLASEC1B – MARCH 2016 – REVISED MAY 2018
TAS5751M - Digital Input Audio Power Amplifier with EQ and 3-Band AGL
1 Features
2 Applications
•
•
•
1
•
•
Audio Input/Output
– One-Stereo Serial Audio Input
– Supports 44.1-kHz and 48-kHz Sample Rates
(LJ/RJ/I²S)
– Supports 3-Wire I²S Mode (no MCLK required)
– Automatic Audio Port Rate Detection
– Supports BTL and PBTL Configuration
– POUT = 25 W at 10% THD+N
– PVDD = 20 V, 8 Ω, 1 kHz
Audio/PWM Processing
– Independent Channel Volume Controls With
Gain of 24 dB to Mute in 0.125-dB Steps
– Programmable Three-Band Automatic Gain
Limiting (AGL)
– 20 Programmable Biquads for Speaker EQ
and Other Audio-Processing Features
General Features
– 106-dB SNR, A-Weighted, Referenced to Full
Scale (0 dB)
– I²C Serial Control Interface w/ two Addresses
– Thermal, Short-Circuit, and Undervoltage
Protection
– Up to 90% Efficient
– AD, BD, and Ternary Modulation
– PWM Level Meter
Power vs PVDD
LCD TV, LED TV
Low-Cost Audio Equipment
3 Description
The TAS5751M device is an efficient, digital-input
audio amplifier for driving stereo speakers configured
as a bridge tied load (BTL). In parallel bridge tied
load (PBTL) in can produce higher power by driving
the parallel outputs into a single lower impedance
load. One serial data input allows processing of up to
two discrete audio channels and seamless integration
to most digital audio processors and MPEG
decoders. The device accepts a wide range of input
data and data rates. A fully programmable data path
routes these channels to the internal speaker drivers.
The TAS5751M device is a slave-only device
receiving all clocks from external sources. The
TAS5751M device operates with a PWM carrier
between a 384-kHz switching rate and a 288-kHz
switching rate, depending on the input sample rate.
Oversampling combined with a fourth-order noise
shaper provides a flat noise floor and excellent
dynamic range from 20 Hz to 20 kHz.
Device Information(1)
PART NUMBER
TAS5751M
BODY SIZE (NOM)
HTSSOP (48)
12.50 mm × 6.10 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Block Diagram
45
RL = 4 Ω
40
PACKAGE
DVDD
AVDD
Power-On Reset
(POR)
35
Internal Regulation and Power Distribution
MCLK Monitoring
and Watchdog
Output Power (W)
PVDD
RL = 8 Ω
30
MCLK
25
LRCK
20
Sensing & Protection
Serial Audio Port
(SAP)
SCLK
Sample Rate
Auto-Detect
SDIN
PLL
Digital Audio
Processor
(DAP)
Sample Rate
Converter
(SRC)
Internal Voltage Supplies
Open Loop Stereo
Stereo PWM Amplifier
Digital to PWM
Converter
(DPC)
2 Ch. PWM
Modulator
Noise Shaping
Temperature
Short Circuits
PVDD Voltage
Output Current
Click & Pop
Suppression
Fault Notification
AMP_OUT_A
AMP_OUT_B
AMP_OUT_C
AMP_OUT_D
15
10
Internal Register/State Machine Interface
5
Current Sourcing Limit
EVM Thermal Limit
I²C Control Port
0
8
12
16
PVDD (V)
20
24
SCL
SDA
DR_SD
PDN
RST
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TAS5751M
SLASEC1B – MARCH 2016 – REVISED MAY 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
7
1
1
1
2
3
5
Absolute Maximum Ratings ...................................... 5
ESD Ratings ............................................................ 5
Recommended Operating Conditions....................... 5
Thermal Characteristics ............................................ 6
Electrical Characteristics........................................... 6
Speaker Amplifier Characteristics............................ 7
Protection Characteristics ......................................... 7
Master Clock Characteristics .................................... 7
I²C Interface Timing Requirements ........................... 8
Serial Audio Port Timing Requirements.................. 8
Typical Characteristics .......................................... 10
Detailed Description ............................................ 17
7.1 Overview ................................................................. 17
7.2
7.3
7.4
7.5
7.6
7.7
8
Functional Block Diagram .......................................
Audio Signal Processing Overview .........................
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
Register Maps .........................................................
17
18
19
22
23
34
Application and Implementation ........................ 52
8.1 Application Information............................................ 52
8.2 Typical Applications ............................................... 53
9 Power Supply Recommendations...................... 58
10 Layout................................................................... 59
10.1 Layout Guidelines ................................................. 59
10.2 Layout Example .................................................... 60
11 Device and Documentation Support ................. 62
11.1 Trademarks ........................................................... 62
11.2 Electrostatic Discharge Caution ............................ 62
11.3 Glossary ................................................................ 62
12 Mechanical, Packaging, and Orderable
Information ........................................................... 62
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (March 2016) to Revision B
Page
•
Added PVDD to the Absolute Maximum Ratings table .......................................................................................................... 5
•
Moved the units values From the MAX value column to the UNITS column in the I²C Interface Timing Requirements
table ........................................................................................................................................................................................ 8
•
Changed text "Multiplex channel 2 to AMP_OUT_D" To: Multiplex channel 2 to AMP_OUT_D" in the Functions
column of Table 21 .............................................................................................................................................................. 49
Changes from Original (March 2016) to Revision A
•
2
Page
Moved from Product Preview to Production Data release. ................................................................................................... 1
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SLASEC1B – MARCH 2016 – REVISED MAY 2018
5 Pin Configuration and Functions
DCA Package
48-Pin HTSSOP With PowerPAD™
Top View
BSTRP_B
1
48
BSTRP_C
AMP_OUT_B
2
47
AMP_OUT_C
AMP_OUT_B
3
46
AMP_OUT_C
PGND
4
45
PGND
PGND
5
44
PGND
AMP_OUT_A
6
43
AMP_OUT_D
PVDD
7
42
PVDD
PVDD
8
41
PVDD
BSTRP_A
9
40
BSTRP_D
SSTIMER
10
39
GVDD_REG
PBTL
11
38
AVDD_REG
NC
12
37
NC
PowerPAD
NC
13
36
NC
PLL_GND
14
35
AGND
PLL_FLTM
15
34
DGND
PLL_FLTP
16
33
DVDD
AVDD_REF
17
32
TEST
AVDD
18
31
RST
ADR/FAULT
19
30
NC
MCLK
20
29
SCL
OSC_RES
21
28
SDA
OSC_GND
22
27
SDIN
DVDD_REG
23
26
SCLK
PDN
24
25
LRCLK
Not to scale
Pin Functions
PIN
NAME
NO.
TYPE (1)
DESCRIPTION
ADR/FAULT
19
DI/DO
Dual function terminal which sets the LSB of the I²C Address to 0 if pulled to GND, 1 if
pulled to AVDD. Also, if configured to be a fault output by the methods described in the
Fault Indication section, this terminal will be pulled low when an internal fault occurs.
AGND
35
P
Ground reference for analog circuitry (NOTE: This terminal should be connected to the
system ground)
AMP_OUT_A
6
AMP_OUT_B
AMP_OUT_C
2
3
46
AO
Speaker amplifier outputs
47
AMP_OUT_D
43
AVDD
18
P
Power supply for internal analog circuitry
AVDD_REF
17
P
Internal power supply (NOTE: This terminal is provided as a connection point for filtering
capacitors for this supply and must not be used to power any external circuitry)
AVDD_REG
38
P
Voltage regulator derived from AVDD supply (NOTE: This terminal is provided as a
connection point for filtering capacitors for this supply and must not be used to power
any external circuitry)
BSTRP_A
9
BSTRP_B
1
BSTRP_C
48
P
Connection points to for the bootstrap capacitors, which are used to create a power
supply for the gate drive for the high-side device
BSTRP_D
40
DGND
34
P
Ground reference for digital circuitry (NOTE: This terminal should be connected to the
system ground)
DVDD
33
P
Power supply for the internal digital circuitry
(1)
TYPE: A = analog; D = 3.3-V digital; P = power/ground/decoupling; I = input; O = output
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Pin Functions (continued)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION
DVDD_REG
23
P
Voltage regulator derived from DVDD supply (NOTE: This terminal is provided as a
connection point for filtering capacitors for this supply and must not be used to power
any external circuitry)
GVDD_REG
39
P
Voltage regulator derived from PVDD supply (NOTE: This terminal is provided as a
connection point for filtering capacitors for this supply and must not be used to power
any external circuitry)
LRCLK
25
DI
Word select clock for the digital signal that is active on the input data line of the serial
port
MCLK
20
DI
Master clock used for internal clock tree and sub-circuit/state machine clocking
P
Not connected inside the device (all "no connect" terminals should be connected to
system ground)
Ground reference for oscillator circuitry (NOTE: These terminals should be connected to
the system ground)
12
13
NC (2)
30
36
37
OSC_GND
22
P
OSC_RES
21
AO
Connection point for precision resistor used by internal oscillator circuit. Details for this
resistor are shown in the Typical Applications section
PBTL
11
DI
Places the power stage in BTL mode when pulled low, or in PBTL mode when pulled
high
PDN
24
DI
Places the device in power down when pulled low
—
Ground reference for power device circuitry (NOTE: This terminal should be connected
to the system ground)
4
5
PGND
44
45
PLL_FLTM
15
AO
Negative connection point for the PLL loop filter components
PLL_FLTP
16
AO
Positive connection point for the PLL loop filter components
PLL_GND
14
P
Ground reference for PLL circuitry (NOTE: This terminal should be connected to the
system ground)
P
Power supply for internal power circuitry
7
8
PVDD
41
42
RST
31
DI
Places the devices in reset when pulled low
SCL
29
DI
I²C serial control port clock
SCLK
26
DI
Bit clock for the digital signal that is active on the input data line of the serial data port
SDA
28
DI/DO
SDIN
27
DI
Data line to the serial data port
SSTIMER
10
AO
Connection point for the capacitor that is used by the ramp timing circuit, as described in
the SSTIMER Pin Functionality section
TEST
32
—
Used by TI for testing during device production (NOTE: This terminal should be
connected to system ground)
PowerPAD
—
P
Exposed metal pad on the underside of the device, which serves as an electrical
connection point for ground as well as a heat conduction path from the device into the
board (NOTE: This terminal should be connected to ground through a land pattern
defined in the Mechanical Data section)
(2)
4
I²C serial control port data
Although these pins are not connected internally, optimum thermal performance is realized when these pins are connected to the ground
plane. Doing so allows copper on the PCB to fill up to and including these pins, providing a path for heat to conduct away from the
device and into the surrounding PCB area.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage
Input voltage
MIN
MAX
UNIT
DVDD, AVDD, DR_VDD
–0.3
3.6
V
PVDD
–0.3
30
3.3-V digital input
–0.5
DVDD +. 0.5
5-V tolerant (2) digital input (except MCLK)
–0.5
DVDD + 2.5 (3)
–0.5
(3)
5-V tolerant MCLK input
AVDD + 2.5
V
AMP_OUT_x to GND
32 (4)
V
BSTRP_x to GND
39 (4)
V
PVDD
V
0
85
°C
–40
125
°C
Supply voltage for power stage
28
Operating free-air temperature
Storage temperature range, Tstg
(1)
(5) (6)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability.
5-V tolerant inputs are PDN, RST, SCLK, LRCK, MCLK, SDIN, SDA, and SCL.
Maximum pin voltage should not exceed 6 V.
DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions.
For operation at PVDD levels greater than 18 V, the modulation limit must be set to 96.1 % or lower via the control port register 0x10.
26.4 V is the maximum recommended operating voltage for continuous operation of the TAS5751M device. Testing and characterization
of the device is performed up to and including 28 V to ensure “in system” design margin. Continuous operation at these levels is not
recommended. Operation above the maximum recommended voltage may result in reduced performance, errant operation, and
reduction in device reliability.
(2)
(3)
(4)
(5)
(6)
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±4000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
DVDD, AVDD
Digital, analog supply voltage
PVDD
Output power devices supply voltage
VIH
High-level input voltage
5-V tolerant
VIL
Low-level input voltage
5-V tolerant
TA
MIN
NOM
MAX
3
3.3
3.6
V
(1) (2)
V
8
26.4
UNIT
2
V
0.8
V
Operating ambient temperature range
0
85
°C
Operating junction temperature range
0
125
°C
RL
Load impedance
4
RL
Load impedance in PBTL
TJ
LO
(1)
(2)
(2)
Output-filter inductance
Minimum output inductance
under short-circuit condition
Ω
8
2
Ω
10
μH
For operation at PVDD levels greater than 18 V, the modulation limit must be set to 96.1 % or lower via the control port register 0x10.
26.4 V is the maximum recommended operating voltage for continuous operation of the TAS5751M device. Testing and characterization
of the device is performed up to and including 28 V to ensure “in system” design margin. Continuous operation at these levels is not
recommended. Operation above the maximum recommended voltage may result in reduced performance, errant operation, and
reduction in device reliability.
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6.4 Thermal Characteristics
DCA (48 PINS)
THERMAL METRIC (1)
Special Test
Case
JEDEC
Standard 2Layer PCB
JEDEC
Standard 4Layer PCB
TAS5751MEVM
UNITS
49.9
26.2
24.0
°C/W
θJA
Junction-to-ambient thermal resistance (2)
θJCtop
Junction-to-case (top) thermal resistance (3)
14.9
°C/W
θJB
Junction-to-board thermal resistance (4)
6.9
°C/W
(5)
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter (6)
θJCbot
Junction-to-case (bottom) thermal resistance (7)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
1.1
0.8
0.7
°C/W
10.8
6.8
1.7
°C/W
1.7
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
6.5 Electrical Characteristics
TA = 25°, PVDD_x = 24 V, DVDD = AVDD = 3.3 V, RL= 8 Ω, BTL BD mode, fS = 48 kHz (unless otherwise noted)
PARAMETER
VOH
High-level output voltage
VOL
Low-level output voltage
IIL
Low-level input current
ADR/SPK_FAULT and
SDA
Digital Inputs
IIH
High-level input current
IDD
3.3-V supply current
6
3.3-V supply voltage
(DVDD, AVDD)
TEST CONDITIONS
MIN
IOH = –4 mA
DVDD = AVDD = 3 V
2.4
TYP MAX
UNIT
V
IOL = 4 mA
DVDD = AVDD = 3 V
0.5
V
VI < VIL
DVDD = AVDD = 3.6 V
75
μA
VI > VIH
DVDD = AVDD = 3.6 V
75
μA
Normal mode
49
68
Reset (RST = low, PDN =
high)
23
38
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6.6
SLASEC1B – MARCH 2016 – REVISED MAY 2018
Speaker Amplifier Characteristics
PVDD = 18 V, BTL AD mode, AVDD = DVDD = 3.3 V, fS = 48 KHz, RL = 8 Ω, audio frequency = 1 kHz, AES17 filter, fPWM =
384 kHz, TA = 25°C (unless otherwise specified). All performance is in accordance with recommended operating conditions.
PARAMETER
TEST CONDITIONS
MIN
TYP
PVDD = 18 V,10% THD, 1-kHz input signal
PO
Power output per channel
PVDD = 18 V, 7% THD, 1-kHz input signal
20
PVDD = 12 V, 10% THD, 1-kHz input signal
9.5
PVDD = 12 V, 7% THD, 1-kHz input signal
9
PVDD = 8 V, 10% THD, 1-kHz input signal
4.2
PVDD = 8 V, 7% THD, 1-kHz input signal
THD+N
Total harmonic distortion + noise
Vn
Output integrated noise (rms)
Crosstalk
SNR
Signal-to-noise ratio
Output switching frequency
0.07%
PVDD = 12 V, PO = 1 W
0.03%
PVDD = 8 V, PO = 1 W
0.1%
A-weighted
44
μV
–82
dB
PO =1 W, f = 1 kHz (AD Mode), PVDD = 24 V
–62
dB
A-weighted, f = 1 kHz, maximum power at THD <
1%
106
dB
11.025/22.05/44.1-kHz data rate ±2%
288
48/24/12/8/16/32-kHz data rate ±2%
384
Normal mode
32
Reset (RST =
low, PDN =
high)
3
kHz
50
8
No load (PVDD)
rDS(on)
Drain-to-source resistance, LS
TJ = 25°C, includes metallization resistance
80
Drain-to-source resistance, HS
TJ = 25°C, includes metallization resistance
80
Internal pulldown resistor at the
output of each half-bridge
Connected when drivers are in the high-impedance
state to provide bootstrap capacitor charge.
(1)
W
PO = 1 W, f = 1 kHz (BD Mode), PVDD = 24 V
Supply current
RPD
UNIT
4
PVDD = 18 V, PO = 1 W
IPVDD
(1)
MAX
21.5
mA
mΩ
3
kΩ
This does not include bond-wire or pin resistance.
6.7 Protection Characteristics
TA = 25°, PVDD_x = V, DVDD = AVDD = 3.3 V, RL= 8 Ω, BTL BD mode, fS = 48 kHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Vuvp(fall)
Undervoltage protection limit
PVDD falling
5.4
V
Vuvp(rise)
Undervoltage protection limit
PVDD rising
5.8
V
OTE
Overtemperature error
150
°C
IOC
Overcurrent limit protection
4
A
IOCT
Overcurrent response time
150
ns
6.8 Master Clock Characteristics (1)
PVDD = 24 V, BTL BD mode, AVDD = DVDD = 3.3 V, fS = 48 kHz, RL = 8 Ω, audio frequency = 1 kHz, AES17 filter, fPWM =
384 kHz, TA = 25°C (unless otherwise specified). All performance is in accordance with recommended operating conditions
(unless otherwise specified).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
24.576
MHz
PLL INPUT PARAMETERS
fMCLKI
tr / tf(MCLK)
(1)
MCLK frequency
2.8224
MCLK duty cycle
40%
Rise/fall time for MCLK
50%
60%
5
ns
For clocks related to the serial audio port, please see Serial Audio Port Timing Requirements.
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6.9 I²C Interface Timing Requirements
MIN
NOM
MAX
UNIT
tw(RST)
Pulse duration, RST active
100
td(I²C_ready)
Time to enable I²C after RST goes high
13.5
ms
fSCL
Frequency, SCL
400
kHz
tw(H)
Pulse duration, SCL high
0.6
tw(L)
Pulse duration, SCL low
1.3
tr
Rise time, SCL and SDA
tf
Fall time, SCL and SDA
tsu1
Setup time, SDA to SCL
th1
Hold time, SCL to SDA
t(buf)
tsu2
μs
μs
μs
300
ns
300
ns
100
ns
0
ns
Bus free time between stop and start conditions
1.3
μs
Setup time, SCL to start condition
0.6
μs
th2
Hold time, start condition to SCL
0.6
μs
tsu3
Setup time, SCL to stop condition
0.6
μs
CL
Load capacitance for each bus line
400
pF
6.10 Serial Audio Port Timing Requirements
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CL ≤ 30 pF
MIN
TYP
1.024
MAX
UNIT
12.288
MHz
fSCLKIN
Frequency, SCLK 32 × fS, 48 × fS, 64 × fS
tsu1
Setup time, LRCK to SCLK rising edge
10
ns
th1
Hold time, LRCK from SCLK rising edge
10
ns
tsu2
Setup time, SDIN to SCLK rising edge
10
ns
th2
Hold time, SDIN from SCLK rising edge
10
ns
LRCK frequency
8
48
48
SCLK duty cycle
40%
50%
60%
LRCK duty cycle
40%
50%
60%
SCLK rising edges between LRCK rising edges
kHz
32
64
SCLK edges
–1/4
1/4
SCLK period
t(edge)
LRCK clock edge with respect to the falling edge of SCLK
tr/tf
Rise/fall time for SCLK/LRCK
8
ns
LRCK allowable drift before LRCK reset
4
MCLKs
RST
tw(RST)
2
2
I C Active
I C Active
td(I2C_ready)
System Initialization.
2
Enable via I C.
T0421-01
NOTE: On power up, hold the TAS5751M RST LOW for at least 100 μs after DVDD has reached 3 V.
NOTE: If RST is asserted LOW while PDN is LOW, then RST must continue to be held LOW for at least 100 μs after PDN is
deasserted (HIGH).
Figure 1. Reset Timing
8
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tw(H)
tw(L)
tf
tr
SCL
tsu1
th1
SDA
T0027-01
Figure 2. SCL and SDA Timing
SCL
t(buf)
th2
tsu3
tsu2
SDA
Start
Condition
Stop
Condition
T0028-01
Figure 3. Start and Stop Conditions Timing
tr
tf
SCLK
(Input)
t(edge)
th1
tsu1
LRCLK
(Input)
th2
tsu2
SDIN
T0026-04
Figure 4. Serial Audio Port Timing
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6.11 Typical Characteristics
6.11.1 Typical Characteristics - Stereo BTL Mode
45
RL = 4 Ω
2.0 BTL Mode
RL = 8Ω
TA = 25°C
55
40
RL = 8 Ω
50
Idle Channel Noise (uV)
Output Power (W)
35
30
25
20
15
45
40
35
30
10
25
5
Current Sourcing Limit
EVM Thermal Limit
8
0
8
12
16
20
10
12
24
14
16
18
Supply Voltage (V)
20
22
24
G012
PVDD (V)
Figure 5. Output Power vs Supply Voltage
Figure 6. Idle Channel Noise vs Supply Voltage
10
10
2.0 BTL Mode
PVDD = 12V
RL = 8Ω
TA = 25°C
2.0 BTL Mode
PVDD = 12V
RL = 6Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
PO = 1W
PO = 2.5W
PO = 5W
0.001
20
100
PO = 1W
PO = 2.5W
PO = 5W
1k
Frequency (Hz)
10k
0.001
20k
20
100
1k
Frequency (Hz)
10k
G005
G003
Figure 7. THD+N vs Frequency
Figure 8. THD+N vs Frequency
10
10
2.0 BTL Mode
PVDD = 12V
RL = 4Ω
TA = 25°C
2.0 BTL Mode
PVDD = 18V
RL = 8Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
PO = 1W
PO = 2.5W
PO = 5W
0.001
20
100
PO = 1W
PO = 5W
PO = 10W
1k
Frequency (Hz)
10k
20k
0.001
20
100
1k
Frequency (Hz)
10k
G004
Figure 9. THD+N vs Frequency
10
20k
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G008
Figure 10. THD+N vs Frequency
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Typical Characteristics - Stereo BTL Mode (continued)
10
10
2.0 BTL Mode
PVDD = 18V
RL = 6Ω
TA = 25°C
2.0 BTL Mode
PVDD = 18V
RL = 4Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
PO = 1W
PO = 5W
PO = 10W
0.001
20
100
PO = 1W
PO = 5W
PO = 10W
1k
Frequency (Hz)
10k
0.001
20k
20
100
1k
Frequency (Hz)
10k
20k
G007
G006
Figure 11. THD+N vs Frequency
Figure 12. THD+N vs Frequency
10
10
2.0 BTL Mode
PVDD = 24V
RL = 8Ω
TA = 25°C
2.0 BTL Mode
PVDD = 24V
RL = 6Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
PO = 1W
PO = 5W
PO = 10W
0.001
20
100
PO = 1W
PO = 5W
PO = 10W
1k
Frequency (Hz)
10k
0.001
20k
20
100
1k
Frequency (Hz)
10k
20k
G011
G010
Figure 13. THD+N vs Frequency
Figure 14. THD+N vs Frequency
10
10
2.0 BTL Mode
PVDD = 24V
RL = 4Ω
TA = 25°C
2.0 BTL Mode
PVDD = 12V
RL = 8Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
PO = 1W
PO = 5W
PO = 10W
0.001
20
100
f = 20Hz
f = 1kHz
f = 6kHz
1k
Frequency (Hz)
10k
20k
0.001
0.01
G009
Figure 15. THD+N vs Frequency
0.1
1
Output Power (W)
10
20
G015
Figure 16. THD+N vs Output Power
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Typical Characteristics - Stereo BTL Mode (continued)
10
10
2.0 BTL Mode
PVDD = 12V
RL = 6Ω
TA = 25°C
2.0 BTL Mode
PVDD = 12V
RL = 4Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
f = 20Hz
f = 1kHz
f = 6kHz
0.001
0.01
0.1
1
Output Power (W)
10
f = 20Hz
f = 1kHz
f = 6kHz
0.001
0.01
20
0.1
1
Output Power (W)
10
20
G014
G013
Figure 17. THD+N vs Output Power
Figure 18. THD+N vs Output Power
10
10
2.0 BTL Mode
PVDD = 18V
RL = 8Ω
TA = 25°C
2.0 BTL Mode
PVDD = 18V
RL = 6Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
f = 20Hz
f = 1kHz
f = 6kHz
0.001
0.01
0.1
1
Output Power (W)
10
f = 20Hz
f = 1kHz
f = 6kHz
0.001
0.01
20
0.1
1
Output Power (W)
10
20
G018
G017
Figure 19. THD+N vs Output Power
Figure 20. THD+N vs Output Power
10
10
2.0 BTL Mode
PVDD = 18V
RL = 4Ω
TA = 25°C
2.0 BTL Mode
PVDD = 24V
RL = 8Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
f = 20Hz
f = 1kHz
f = 6kHz
0.001
0.01
0.1
1
Output Power (W)
10
f = 20Hz
f = 1kHz
f = 6kHz
20
0.001
0.01
G016
Figure 21. THD+N vs Output Power
12
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1
Output Power (W)
10
20
G021
Figure 22. THD+N vs Output Power
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Typical Characteristics - Stereo BTL Mode (continued)
10
10
2.0 BTL Mode
PVDD = 24V
RL = 6Ω
TA = 25°C
2.0 BTL Mode
PVDD = 24V
RL = 4Ω
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.1
0.01
0.01
f = 20Hz
f = 1kHz
f = 6kHz
0.001
0.01
0.1
1
Output Power (W)
10
f = 20Hz
f = 1kHz
f = 6kHz
20
0.001
0.01
0.1
1
Output Power (W)
10
20
G020
G019
Figure 24. THD+N vs Output Power
100
100
90
90
80
80
70
70
60
60
Efficiency (%)
Efficiency (%)
Figure 23. THD+N vs Output Power
50
40
50
40
30
30
PVDD = 12V
PVDD = 18V
PVDD = 24V
20
10
0
0
5
10
PVDD = 12V
PVDD = 18V
PVDD = 24V
20
2.0 BTL Mode
RL = 8Ω
TA = 25°C
15
20
25
30
Total Output Power (W)
35
10
0
40
0
5
10
2.0 BTL Mode
RL = 4Ω
TA = 25°C
15
20
25
30
Total Output Power (W)
35
40
G023
Total Output Power includes power delivered from both amplifier
outputs. For instance, 40 W of total output power means 2 × 20
W, with 20 W delivered by one channel and 20 W delivered by
the other channel.
Figure 25. Efficiency vs Total Output Power
G022
Total Output Power includes power delivered from both amplifier
outputs. For instance, 40 W of total output power means 2 × 20
W, with 20 W delivered by one channel and 20 W delivered by
the other channel.
Figure 26. Efficiency vs Total Output Power
0
0
2.0 BTL Mode
PO = 1W
PVDD = 12V
RL = 8Ω
TA = 25°C
−10
−20
Right to Left
Left to Right
−20
Right to Left
Left to Right
−30
Crosstalk (dB)
−30
Crosstalk (dB)
2.0 BTL Mode
PO = 1W
PVDD = 12V
RL = 4Ω
TA = 25°C
−10
−40
−50
−60
−40
−50
−60
−70
−70
−80
−80
−90
−90
−100
−100
20
100
1k
Frequency (Hz)
10k
20k
20
100
1k
Frequency (Hz)
10k
20k
G025
Figure 27. Crosstalk vs Frequency
G024
Figure 28. Crosstalk vs Frequency
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Typical Characteristics - Stereo BTL Mode (continued)
0
0
2.0 BTL Mode
PO = 1W
PVDD = 18V
RL = 8Ω
TA = 25°C
−10
−20
Right to Left
Left to Right
−20
Right to Left
Left to Right
−30
Crosstalk (dB)
−30
Crosstalk (dB)
2.0 BTL Mode
PO = 1W
PVDD = 18V
RL = 4Ω
TA = 25°C
−10
−40
−50
−60
−40
−50
−60
−70
−70
−80
−80
−90
−90
−100
−100
20
100
1k
Frequency (Hz)
10k
20k
20
100
1k
Frequency (Hz)
10k
20k
G027
G026
Figure 29. Crosstalk vs Frequency
Figure 30. Crosstalk vs Frequency
0
0
2.0 BTL Mode
PO = 1W
PVDD = 24V
RL = 8Ω
TA = 25°C
−10
−20
Right to Left
Left to Right
−20
Right to Left
Left to Right
−30
Crosstalk (dB)
−30
Crosstalk (dB)
2.0 BTL Mode
PO = 1W
PVDD = 24V
RL = 4Ω
TA = 25°C
−10
−40
−50
−60
−40
−50
−60
−70
−70
−80
−80
−90
−90
−100
−100
20
100
1k
Frequency (Hz)
10k
20k
20
100
1k
Frequency (Hz)
10k
20k
G029
G028
Figure 31. Crosstalk vs Frequency
Figure 32. Crosstalk vs Frequency
6.11.2 Typical Characteristics - Mono PBTL Mode
80
10
PBTL Mode
PBTL Mode
PVDD = 12V
f = 1kHz
TA = 25°C
RL = 4Ÿ
70
TA = 25ƒC
60
1
THD+N (%)
Power (W)
50
40
0.1
30
20
0.01
2 Layer Continuous Power
10
RL = 4Ÿ
4 Layer Continuous Power
RL = 2Ÿ
Instantaneous Power
0
8
10
12
14
16
18
20
22
24
0.001
0.01
Supply Voltage (V)
1
10
100
Output Power (W)
C039
Figure 33. Output Power vs Supply Voltage (PBTL Mode)
14
0.1
C032
Figure 34. Total Harmonic Distortion + Noise vs Output
Power (PBTL Mode)
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Typical Characteristics - Mono PBTL Mode (continued)
10
10
PBTL Mode
PVDD = 24V
f = 1kHz
TA = 25°C
PBTL Mode
PVDD = 18V
f = 1kHz
TA = 25°C
1
THD+N (%)
THD+N (%)
1
0.1
0.1
0.01
0.01
RL = 4Ÿ
RL = 4Ÿ
RL = 2Ÿ
0.001
0.01
0.1
1
10
0.001
0.01
100
RL = 2Ÿ
0.1
1
10
100
Output Power (W)
Output Power (W)
C029
C033
Figure 35. Total Harmonic Distortion + Noise vs Output
Power (PBTL Mode)
10
Figure 36. Total Harmonic Distortion + Noise vs Output
Power (PBTL Mode)
10
RL = 2Ÿ
PBTL Mode
PO = 1W
PVDD = 12V
TA = 25ƒC
RL = 6Ÿ
RL = 4Ÿ
RL = 6Ÿ
1
THD+N (%)
1
THD+N (%)
RL = 2Ÿ
PBTL Mode
PO = 1W
PVDD = 18V
TA = 25ƒC
RL = 4Ÿ
0.1
0.1
0.01
0.01
0.001
0.001
20
200
2k
20k
20
200
Frequency (Hz)
2k
20k
Frequency (Hz)
C037
Figure 37. Total Harmonic Distortion + Noise vs Frequency
(PBTL Mode)
10
C038
Figure 38. Total Harmonic Distortion + Noise vs Frequency
(PBTL Mode)
100
RL = 2Ÿ
PBTL Mode
PO = 1W
PVDD = 24V
TA = 25ƒC
RL = 4Ÿ
90
RL = 6Ÿ
80
1
PBTL Mode
RL = 4Ÿ
TA = 25ƒC
Efficiency (%)
THD+N (%)
70
0.1
60
50
40
30
0.01
20
PVDD = 12V
PVDD = 18V
10
PVDD = 24V
0.001
0
20
200
2k
20k
0
Frequency (Hz)
20
40
60
80
Total Output Power (W)
C041
Figure 39. Total Harmonic Distortion + Noise vs Frequency
(PBTL Mode)
C035
Total Output Power includes power delivered from both amplifier
outputs. For instance, 40 W of total output power means 2 × 20
W, with 20 W delivered by one channel and 20 W delivered by
the other channel.
Figure 40. Efficiency vs Output Power (PBTL Mode)
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Typical Characteristics - Mono PBTL Mode (continued)
100
80
PBTL Mode
90
RL = 4Ÿ
70
TA = 25ƒC
80
50
60
Power (W)
Efficiency (%)
60
PBTL Mode
RL = 6Ÿ
TA = 25ƒC
70
50
40
40
30
30
20
20
PVDD = 12V
2 Layer Continuous Power
10
PVDD = 18V
10
4 Layer Continuous Power
PVDD = 24V
0
Instantaneous Power
0
0
10
20
30
40
8
50
10
12
14
16
18
20
22
24
Supply Voltage (V)
Total Output Power (W)
C039
C034
Total Output Power includes power delivered from both amplifier
outputs. For instance, 40 W of total output power means 2 × 20
W, with 20 W delivered by one channel and 20 W delivered by
the other channel.
Figure 42. Power vs Supply Voltage (PBTL Mode)
Figure 41. Efficiency vs Output Power (PBTL Mode)
80
PBTL Mode
TA = 25ƒC
Idle Channel Noise ( V)
60
40
20
RL = 4Ÿ
RL = 6Ÿ
RL = 8Ÿ
0
8
10
12
14
16
18
20
22
24
Supply Voltage (V)
C036
Figure 43. Idle Channel Noise vs Supply Voltage (PBTL Mode)
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7 Detailed Description
7.1 Overview
The TAS5751M device is an efficient, digital-input audio amplifier for driving stereo speakers configured as a
bridge tied load (BTL). In parallel bridge tied load (PBTL) in can produce higher power by driving the parallel
outputs into a single lower impedance load. One serial data input allows processing of up to two discrete audio
channels and seamless integration to most digital audio processors and MPEG decoders. The device accepts a
wide range of input data and data rates. A fully programmable data path routes these channels to the internal
speaker drivers.
The TAS5751M device is a slave-only device receiving all clocks from external sources. The TAS5751M device
operates with a PWM carrier between a 384-kHz switching rate and a 288-kHz switching rate, depending on the
input sample rate. Oversampling combined with a fourth-order noise shaper provides a flat noise floor and
excellent dynamic range from 20 Hz to 20 kHz.
7.2 Functional Block Diagram
DVDD
Power-On Reset
(POR)
AVDD
Internal Regulation and Power Distribution
MCLK Monitoring
and Watchdog
MCLK
LRCK
PVDD
Open Loop Stereo
Stereo PWM Amplifier
Digital to PWM
Converter
(DPC)
Sensing & Protection
Serial Audio Port
(SAP)
SCLK
Sample Rate
Auto-Detect
SDIN
PLL
Digital Audio
Processor
(DAP)
Sample Rate
Converter
(SRC)
Internal Voltage Supplies
2 Ch. PWM
Modulator
Noise Shaping
Temperature
Short Circuits
PVDD Voltage
Output Current
Click & Pop
Suppression
Fault Notification
AMP_OUT_A
AMP_OUT_B
AMP_OUT_C
AMP_OUT_D
Internal Register/State Machine Interface
I²C Control Port
SCL
SDA
DR_SD
PDN
RST
Figure 44. TAS5751M Functional Block Diagram
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7.3 Audio Signal Processing Overview
DC Block and LR Mixer
Equalizer
Multi Band AGL
0x59
Full Band AGL
Master Volume
0x3B - 0x3C, 0x40
Biquad
0x5E
0x72, 0x73
0x26
L
Biquad
0x27 - 0x2F, 0x58
Input
Mixer L
AGL 1
Low Band
0x51
0x8
Biquad
0x44 - 0x45, 0x48
10 Biquads
0x5A
0x3E - 0x3F, 0x43
0x07 - 0x57, 0x56
Mixer L
L
Vol 1
Biquad
0x5F
0x76, 0x77
AGL 2
High Band
0x9
0x42 - 0x41, 0x47
Vol 2
0x52
Biquad
0x31 - 0x39, 0x5D
0x30
R
Biquad
Input
Mixer R
10 Biquads
AGL 4
Full Band
Master Volume,
Pre Scale,
Post Scale
R
0x5B, 0x5C
Mixer R
2 Biquads
0x60, 0x61
AGL 3
Mid Band
2 Biquads
Figure 45. TAS5751M Audio Process Flow
18
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7.4 Feature Description
7.4.1 Clock, Autodetection, and PLL
The TAS5751M device is an I²S slave device. The TAS5751M device accepts MCLK, SCLK, and LRCK. The
digital audio processor (DAP) supports all the sample rates and MCLK rates that are defined in the Clock Control
Register.
The TAS5751M device checks to verify that SCLK is a specific value of 32 fS, 48 fS, or 64 fS. The DAP only
supports a 1 × fS LRCK. The timing relationship of these clocks to SDIN is shown in subsequent sections. The
clock section uses MCLK or the internal oscillator clock (when MCLK is unstable, out of range, or absent) to
produce the internal clock (DCLK) running at 512 times the PWM switching frequency.
The DAP can autodetect and set the internal clock control logic to the appropriate settings for all supported clock
rates as defined in the Clock Control Register.
The TAS5751M device has robust clock error handling that uses the built-in trimmed oscillator clock to quickly
detect changes/errors. Once the system detects a clock change/error, the system mutes the audio (through a
single-step mute) and then forces PLL to limp using the internal oscillator as a reference clock. Once the clocks
are stable, the system autodetects the new rate and reverts to normal operation. During this process, the default
volume is restored in a single step (also called hard unmute). The ramp process can be programmed to ramp
back slowly (also called soft unmute) as defined in the Volume Configuration Register.
7.4.2 PWM Section
The TAS5751M DAP device uses noise-shaping and customized nonlinear correction algorithms to achieve high
power efficiency and high-performance digital audio reproduction. The DAP uses a fourth-order noise shaper to
increase dynamic range and SNR in the audio band. The PWM section accepts 24-bit PCM data from the DAP
and outputs two BTL PWM audio output channels.
The PWM section has individual-channel dc-blocking filters that can be enabled and disabled. The filter cutoff
frequency is less than 1 Hz.
The PWM section has an adjustable maximum modulation limit of 93.8% to 99.2%. For PVDD > 18 V the
modulation index must be limited to 96.1% for safe and reliable operation.
7.4.3 PWM Level Meter
The structure in Figure 46 shows the PWM level meter that can be used to study the power profile.
Post-DAP Processing
1–a
–1
Z
Ch1
ABS
a
rms
32-Bit Level
ADDR = 0x6B
2
I C Registers
(PWM Level Meter)
1–a
–1
Z
Ch2
ABS
a
rms
32-Bit Level
ADDR = 0x6C
B0396-01
Figure 46. PWM Level Meter Structure
7.4.4 Automatic Gain Limiter (AGL)
The AGL scheme has three AGL blocks. One ganged AGL exists for the high-band left/right channels, the midband left/right channels, and the low-band left/right channels.
The AGL input/output diagram is shown in Figure 47.
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Output Level (dB)
Feature Description (continued)
1:1 Transfer Function
Implemented Transfer Function
T
Input Level (dB)
M0091-04
Professional-quality dynamic range compression automatically adjusts volume to flatten volume level.
• Each AGL has adjustable threshold levels.
• Programmable attack and decay time constants
• Transparent compression: compressors can attack fast enough to avoid apparent clipping before engaging,
and decay times can be set slow enough to avoid pumping.
Figure 47. Automatic Gain Limiter
Alpha Filter Structure
S
a
–1
w
Z
T = 9.23 format, all other AGL coefficients are 3.23 format
Figure 48. AGL Structure
Table 1. AGL Structure
α, ω
T
αa, ωa / αd, ωd
AGL 1
0x3B
0x40
0x3C
AGL 2
0x3E
0x43
0x3F
AGL 3
0x47
0x41
0x42
AGL 4
0x48
0x44
0x45
7.4.5 Headphone/Line Amplifier
An integrated ground centered DirectPath combination headphone amplifier and line driver is integrated in the
TAS5729MD. This headphone/line amplifier can be used independently from the device speaker amplifier
modes, with analog single-ended inputs DR_INA and DR_INB, linked to the respective analog outputs
DR_OUTA, and DR_OUTB. A basic diagram of the headphone/line amplifier is shown in Figure 49.
20
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Figure 49. Headphone/Line Amplifier
The DR_SDI pin can be used to turn on or off the headphone amplifier and line driver. The DirectPath amplifier
makes use of the provided positive and negative supply rails generated by the IC. The output voltages are
centered at zero volts with the capability to swing to the positive rail or negative rail; combining this capability
with the built-in click and pop reduction circuit, the DirectPath amplifier requires no output dc blocking capacitors.
7.4.6 Fault Indication
ADR/FAULT is an input pin during power up. This pin can be programmed after RST to be an output by writing 1
to bit 0 of I²C register 0x05. In that mode, the ADR/FAULT pin has the definition shown in Table 2.
Any fault resulting in device shutdown is signaled by the ADR/FAULT pin going low (see Table 2). A latched
version of this pin is available on D1 of register 0x02. This bit can be reset only by an I²C write.
Table 2. ADR/FAULT Output States
ADR/FAULT
DESCRIPTION
0
Overcurrent (OC) or undervoltage (UVP) error or overtemperature error (OTE) or overvoltage
error
1
No faults (normal operation)
7.4.7 SSTIMER Pin Functionality
The SSTIMER pin uses a capacitor connected between this pin and ground to control the output duty cycle when
exiting all-channel shutdown. The capacitor on the SSTIMER pin is slowly charged through an internal current
source, and the charge time determines the rate at which the output transitions from a near-zero duty cycle to the
desired duty cycle. This allows for a smooth transition that minimizes audible pops and clicks. When the part is
shut down, the drivers are placed in the high-impedance state and transition slowly down through an internal 3kΩ resistor, similarly minimizing pops and clicks. The shutdown transition time is independent of the SSTIMER
pin capacitance. Larger capacitors increase the start-up time, while smaller capacitors decrease the start-up
time. The SSTIMER pin can be left floating for BD modulation.
7.4.8 Device Protection System
7.4.8.1 Overcurrent (OC) Protection With Current Limiting
The TAS5751M device has independent, fast-reacting current detectors on all high-side and low-side powerstage FETs. The detector outputs are closely monitored to prevent the output current from increasing beyond the
overcurrent threshold defined in the Protection Characteristics table.
If the output current increases beyond the overcurrent threshold, the device shuts down and the outputs
transition to the off or high impedance (Hi-Z) state. The device returns to normal operation once the fault
condition (i.e., a short circuit on the output) is removed. Current-limiting and overcurrent protection are not
independent for half-bridges. That is, if the bridge-tied load between half-bridges A and B causes an overcurrent
fault, half-bridges A, B, C, and D shut down.
7.4.8.2 Overtemperature Protection
The TAS5751M device has an overtemperature-protection system. If the device junction temperature exceeds
150°C (nominal), the device enters thermal shutdown, where all half-bridge outputs enter the high-impedance
(Hi-Z) state, and ADR/FAULT asserts low if the device is configured to function as a fault output. The TAS5751M
device recovers automatically once the junction temperature of the device drops approximately 30°C.
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7.4.8.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
The UVP and POR circuits of the TAS5751M device fully protect the device in any power-up/down and brownout
situation. While powering up, the POR circuit resets the overload circuit (OLP) and ensures that all circuits are
fully operational when the PVDD and AVDD supply voltages reach 7.6 V and 2.7 V, respectively. Although PVDD
and AVDD are independently monitored. For PVDD, if the supply voltage drops below the UVP threshold, the
protection feature immediately sets all half-bridge outputs to the high-impedance (Hi-Z) state and asserts
ADR/FAULT low.
7.5 Device Functional Modes
The TAS5751M device is a digital input class-d amplifier with audio processing capabilities. The TAS5751M
device has numerous modes to configure and control the device.
7.5.1 Serial Audio Port Operating Modes
The serial audio port in the TAS5751M device supports industry-standard audio data formats, including I²S, Leftjustified(LJ) and Right-justified(RJ) formats. To select the data format that will be used with the device can
controlled by using the serial data interface registers 0x04. The default is 24bit, I²S mode. The timing diagrams
for the various serial audio port are shown in the Serial Interface Control and Timing section
7.5.2 Communication Port Operating Modes
The TAS5751M device is configured via an I²C communication port. The I²C communication protocol is detailed
in the 7.7 I²C Serial Control Port Requirements and Specifications section.
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Device Functional Modes (continued)
7.5.3 Speaker Amplifier Modes
The TAS5751M device can be configured as:
• Stereo Mode
• Mono Mode
7.5.3.1 Stereo Mode
Stereo mode is the most common option for the TAS5751M. TAS5751M can be connected in 2.0 mode to drive
stereo channels. Detailed application section regarding the stereo mode is discussed in the Stereo Bridge Tied
Load Application section.
7.5.3.2 Mono Mode
Mono mode is described as the operation where the two BTL outputs of amplifier are placed in parallel with one
another to provide increase in the output power capability. This mode is typically used to drive subwoofers, which
require more power to drive larger loudspeakers with high-amplitude, low-frequency energy. Detailed application
section regarding the mono mode is discussed in the Mono Parallel Bridge Tied Load Application section.
7.6 Programming
7.6.1 I²C Serial Control Interface
The TAS5751M device has a bidirectional I²C interface that is compatible with the Inter IC (I²C) bus protocol and
supports both 100-kHz and 400-kHz data transfer rates for single- and multiple-byte write and read operations.
This is a slave-only device that does not support a multimaster bus environment or wait-state insertion. The
control interface is used to program the registers of the device and to read device status.
The DAP supports the standard-mode I²C bus operation (100 kHz maximum) and the fast I²C bus operation
(400 kHz maximum). The DAP performs all I²C operations without I²C wait cycles.
7.6.1.1 General I²C Operation
The I²C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a
system. Data is transferred on the bus serially, one bit at a time. The address and data can be transferred in byte
(8-bit) format, with the most-significant bit (MSB) transferred first. In addition, each byte transferred on the bus is
acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master
device driving a start condition on the bus and ends with the master device driving a stop condition on the bus.
The bus uses transitions on the data pin (SDA) while the clock is high to indicate start and stop conditions. A
high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal data-bit
transitions must occur within the low time of the clock period. These conditions are shown in Figure 50. The
master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another
device and then waits for an acknowledge condition. The TAS5751M device holds SDA low during the
acknowledge clock period to indicate an acknowledgment. When this occurs, the master transmits the next byte
of the sequence. Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible
devices share the same signals via a bidirectional bus using a wired-AND connection. An external pullup resistor
must be used for the SDA and SCL signals to set the high level for the bus.
SDA
R/
A
W
7-Bit Slave Address
7
6
5
4
3
2
1
0
8-Bit Register Address (N)
7
6
5
4
3
2
1
0
8-Bit Register Data For
Address (N)
A
7
6
5
4
3
2
1
8-Bit Register Data For
Address (N)
A
0
7
6
5
4
3
2
1
A
0
SCL
Start
Stop
T0035-01
Figure 50. Typical I²C Sequence
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Programming (continued)
No limit exists for the number of bytes that can be transmitted between start and stop conditions. When the last
word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is
shown in Figure 50.
The 7-bit address for the TAS5751M device is 0101 010 (0x54) or 0101 011 (0x56) as defined by ADR/FAULT
(external pulldown for 0x54 and pullup for 0x56).
7.6.1.2 I²C Slave Address
The ADR/FAULT is an input pin during power-up and after each toggle of RST, which is used to set the I²C subaddress of the device. The ADR/FAULT can also operate as a fault output after power-up is complete and the
address has been latched in.
At power-up, and after each toggle of RST, the pin is read to determine its voltage level. If the pin is left floating,
an internal pull-up will set the I²C sub-address to 0x56. This will also be the case if an external resistor is used to
pull the pin up to AVDD. To set the sub-address to 0x54, an external resistor (specified in Typical Applications )
must be connected to the system ground.
As mentioned, the pin can also be reconfigured as an output driver via I²C for fault monitoring. Use System
Control Register 2 (0x05) to set ADR/FAULT pin to be used as a fault output during fault conditions.
7.6.1.2.1 I²C Device Address Change Procedure
1. Write to device address change enable register, 0xF8 with a value of 0xF9A5 A5A5.
2. Write to device register 0xF9 with a value of 0x0000 00XX, where XX is the new address.
3. Any writes after that should use the new device address XX.
7.6.1.3 Single- and Multiple-Byte Transfers
The serial control interface supports both single-byte and multiple-byte read/write operations for subaddresses
0x00 to 0x1F. However, for the subaddresses 0x20 to 0xFF, the serial control interface supports only multiplebyte read/write operations (in multiples of 4 bytes).
During multiple-byte read operations, the DAP responds with data, a byte at a time, starting at the subaddress
assigned, as long as the master device continues to respond with acknowledges. If a particular subaddress does
not contain 32 bits, the unused bits are read as logic 0.
During multiple-byte write operations, the DAP compares the number of bytes transmitted to the number of bytes
that are required for each specific subaddress. For example, if a write command is received for a biquad
subaddress, the DAP must receive five 32-bit words. If fewer than five 32-bit data words have been received
when a stop command (or another start command) is received, the received data is discarded.
Supplying a subaddress for each subaddress transaction is referred to as random I²C addressing. The
TAS5751M device also supports sequential I²C addressing. For write transactions, if a subaddress is issued
followed by data for that subaddress and the 15 subaddresses that follow, a sequential I²C write transaction has
taken place, and the data for all 16 subaddresses is successfully received by the TAS5751M device. For I²C
sequential-write transactions, the subaddress then serves as the start address, and the amount of data
subsequently transmitted before a stop or start is transmitted determines how many subaddresses are written.
As was true for random addressing, sequential addressing requires that a complete set of data be transmitted. If
only a partial set of data is written to the last subaddress, the data for the last subaddress is discarded. However,
all other data written is accepted; only the incomplete data is discarded.
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Programming (continued)
7.6.1.4 Single-Byte Write
As shown in Figure 51, a single-byte data-write transfer begins with the master device transmitting a start
condition followed by the I²C device address and the read/write bit. The read/write bit determines the direction of
the data transfer. For a data-write transfer, the read/write bit is a 0. After receiving the correct I²C device address
and the read/write bit, the DAP responds with an acknowledge bit. Next, the master transmits the address byte or
bytes corresponding to the internal memory address being accessed. After receiving the address byte, the
TAS5751M device again responds with an acknowledge bit. Next, the master device transmits the data byte to
be written to the memory address being accessed. After receiving the data byte, the TAS5751M device again
responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the singlebyte data-write transfer.
Start
Condition
Acknowledge
A6
A5
A4
A3
A2
A1
A0
Acknowledge
R/W ACK A7
A6
A5
2
A4
A3
A2
A1
Acknowledge
A0 ACK D7
D6
Subaddress
I C Device Address and
Read/Write Bit
D5
D4
D3
D2
D1
D0 ACK
Stop
Condition
Data Byte
T0036-01
Figure 51. Single-Byte Write Transfer
7.6.1.5 Multiple-Byte Write
A multiple-byte data-write transfer is identical to a single-byte data-write transfer except that multiple data bytes
are transmitted by the master device to the DAP as shown in Figure 52. After receiving each data byte, the
TAS5751M device responds with an acknowledge bit.
Start
Condition
Acknowledge
A6
A5
A1
A0 R/W ACK A7
A6
A5
2
A4
A3
Subaddress
I C Device Address and
Read/Write Bit
A1
Acknowledge
Acknowledge
Acknowledge
Acknowledge
A0 ACK D7
D0 ACK D7
D0 ACK D7
D0 ACK
First Data Byte
Other Data Bytes
Last Data Byte
Stop
Condition
T0036-02
Figure 52. Multiple-Byte Write Transfer
7.6.1.6 Single-Byte Read
As shown in Figure 53, a single-byte data-read transfer begins with the master device transmitting a start
condition, followed by the I²C device address and the read/write bit. For the data read transfer, both a write
followed by a read are actually done. Initially, a write is done to transfer the address byte or bytes of the internal
memory address to be read. As a result, the read/write bit becomes a 0. After receiving the TAS5751M address
and the read/write bit, TAS5751M device responds with an acknowledge bit. In addition, after sending the
internal memory address byte or bytes, the master device transmits another start condition followed by the
TAS5751M address and the read/write bit again. This time, the read/write bit becomes a 1, indicating a read
transfer. After receiving the address and the read/write bit, the TAS5751M device again responds with an
acknowledge bit. Next, the TAS5751M device transmits the data byte from the memory address being read. After
receiving the data byte, the master device transmits a not-acknowledge followed by a stop condition to complete
the single-byte data-read transfer.
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Programming (continued)
Repeat Start
Condition
Start
Condition
Acknowledge
A6
A5
A1
A0 R/W ACK A7
Acknowledge
A6
2
A5
A4
A0 ACK
A6
A5
A1
A0 R/W ACK D7
D6
2
I C Device Address and
Read/Write Bit
Subaddress
I C Device Address and
Read/Write Bit
Not
Acknowledge
Acknowledge
D1
D0 ACK
Stop
Condition
Data Byte
T0036-03
Figure 53. Single-Byte Read Transfer
7.6.1.7 Multiple-Byte Read
A multiple-byte data-read transfer is identical to a single-byte data-read transfer except that multiple data bytes
are transmitted by the TAS5751M device to the master device as shown in Figure 54. Except for the last data
byte, the master device responds with an acknowledge bit after receiving each data byte.
Repeat Start
Condition
Start
Condition
Acknowledge
A6
A0 R/W ACK A7
2
I C Device Address and
Read/Write Bit
Acknowledge
A6
A6
A0 ACK
A5
2
Acknowledge
Acknowledge
Acknowledge
Not
Acknowledge
A0 R/W ACK D7
D0 ACK D7
D0 ACK D7
D0 ACK
I C Device Address and
Read/Write Bit
Subaddress
First Data Byte
Other Data Bytes
Last Data Byte
Stop
Condition
T0036-04
Figure 54. Multiple-Byte Read Transfer
7.6.2 Serial Interface Control and Timing
7.6.2.1 Serial Data Interface
Serial data is input on SDIN. The PWM outputs are derived from SDIN. The TAS5751M DAP accepts serial data
in 16-bit, 20-bit, or 24-bit left-justified, right-justified, and I²S serial data formats.
7.6.2.2 I²S Timing
I²S timing uses LRCK to define when the data being transmitted is for the left channel and when the data is for
the right channel. LRCK is low for the left channel and high for the right channel. A bit clock running at 32 × fS,
48 × fS, or 64 × fS is used to clock in the data. A delay of one bit clock exists from the time the LRCK signal
changes state to the first bit of data on the data lines. The data is written MSB-first and is valid on the rising edge
of bit clock. The DAP masks unused trailing data bit positions.
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Programming (continued)
2
2-Channel I S (Philips Format) Stereo Input
32 Clks
LRCLK (Note Reversed Phase)
32 Clks
Right Channel
Left Channel
SCLK
SCLK
MSB
24-Bit Mode
23 22
LSB
9
8
5
4
5
4
1
0
1
0
1
0
MSB
LSB
23 22
9
8
5
4
19 18
5
4
1
0
15 14
1
0
1
0
20-Bit Mode
19 18
16-Bit Mode
15 14
T0034-01
NOTE: All data presented in two's-complement form with MSB first.
Figure 55. I²S 64-fS Format
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Programming (continued)
2
2-Channel I S (Philips Format) Stereo Input/Output (24-Bit Transfer Word Size)
LRCLK
24 Clks
24 Clks
Left Channel
Right Channel
SCLK
SCLK
MSB
24-Bit Mode
23 22
MSB
LSB
17 16
9
8
5
4
13 12
5
4
1
0
9
1
0
3
2
1
0
LSB
23 22
17 16
9
8
5
4
19 18
13 12
5
4
1
0
15 14
9
1
0
3
2
1
20-Bit Mode
19 18
16-Bit Mode
15 14
8
8
T0092-01
NOTE: All data presented in two's-complement form with MSB first.
Figure 56. I²S 48-fS Format
2
2-Channel I S (Philips Format) Stereo Input
LRCLK
16 Clks
16 Clks
Left Channel
Right Channel
SCLK
SCLK
MSB
16-Bit Mode
15 14 13 12
MSB
LSB
11 10
9
8
5
4
3
2
1
0
LSB
15 14 13 12
11 10
9
8
5
4
3
2
1
T0266-01
NOTE: All data presented in two's-complement form with MSB first.
Figure 57. I²S 32-fS Format
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Programming (continued)
7.6.2.3 Left-Justified
Left-justified (LJ) timing uses LRCK to define when the data being transmitted is for the left channel and when
the data is for the right channel. LRCK is high for the left channel and low for the right channel. A bit clock
running at 32 × fS, 48 × fS, or 64 × fS is used to clock in the data. The first bit of data appears on the data lines at
the same time LRCK toggles. The data is written MSB-first and is valid on the rising edge of the bit clock. The
DAP masks unused trailing data bit positions.
2-Channel Left-Justified Stereo Input
32 Clks
32 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
23 22
LSB
9
8
5
4
5
4
1
0
1
0
1
0
MSB
LSB
23 22
9
8
5
4
19 18
5
4
1
0
15 14
1
0
1
0
20-Bit Mode
19 18
16-Bit Mode
15 14
T0034-02
NOTE: All data presented in two's-complement form with MSB first.
Figure 58. Left-Justified 64-fS Format
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Programming (continued)
2-Channel Left-Justified Stereo Input (24-Bit Transfer Word Size)
24 Clks
24 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
23 22
21
LSB
17 16
9
8
5
4
13 12
5
4
1
0
9
1
0
1
0
MSB
LSB
21
17 16
9
8
5
4
19 18 17
13 12
5
4
1
0
15 14 13
9
1
0
23 22
1
0
20-Bit Mode
19 18 17
16-Bit Mode
15 14 13
8
8
T0092-02
NOTE: All data presented in two's-complement form with MSB first.
Figure 59. Left-Justified 48-fS Format
2-Channel Left-Justified Stereo Input
16 Clks
16 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
16-Bit Mode
15 14 13 12
LSB
11 10
9
8
5
4
3
2
1
0
MSB
15 14 13 12
LSB
11 10
9
8
5
4
3
2
1
0
T0266-02
NOTE: All data presented in two's-complement form with MSB first.
Figure 60. Left-Justified 32-fS Format
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Programming (continued)
7.6.2.4 Right-Justified
Right-justified (RJ) timing uses LRCK to define when the data being transmitted is for the left channel and when
the data is for the right channel. LRCK is high for the left channel and low for the right channel. A bit clock
running at 32 × fS, 48 × fS, or 64 × fS is used to clock in the data. The first bit of data appears on the data 8 bitclock periods (for 24-bit data) after LRCK toggles. In RJ mode, the LSB of data is always clocked by the last bit
clock before LRCK transitions. The data is written MSB-first and is valid on the rising edge of bit clock. The DAP
masks unused leading data bit positions.
2-Channel Right-Justified (Sony Format) Stereo Input
32 Clks
32 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
LSB
23 22
19 18
15 14
1
0
19 18
15 14
1
0
15 14
1
0
MSB
LSB
23 22
19 18
15 14
1
0
19 18
15 14
1
0
15 14
1
0
20-Bit Mode
16-Bit Mode
T0034-03
All data presented in two's-complement form with MSB first.
Figure 61. Right-Justified 64-fS Format
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Programming (continued)
2-Channel Right-Justified Stereo Input (24-Bit Transfer Word Size)
24 Clks
24 Clks
Left Channel
Right Channel
LRCLK
SCLK
SCLK
MSB
24-Bit Mode
23 22
LSB
19 18
15 14
6
5
2
1
0
19 18
15 14
6
5
2
1
0
15 14
6
5
2
1
0
LSB
MSB
23 22
19 18
15 14
6
5
2
1
0
19 18
15 14
6
5
2
1
0
15 14
6
5
2
1
0
20-Bit Mode
16-Bit Mode
T0092-03
All data presented in two's-complement form with MSB first.
Figure 62. Right-Justified 48-fS Format
All data presented in two's-complement form with MSB first.
Figure 63. Right-Justified 32-fS Format
7.6.3 26-Bit 3.23 Number Format
All mixer gain coefficients are 26-bit coefficients using a 3.23 number format. Numbers formatted as 3.23
numbers mean that the binary point has 3 bits to the left and 23 bits to the right. This is shown in Figure 64.
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Programming (continued)
2
–23
2
2
Bit
–5
Bit
–1
Bit
0
2 Bit
1
2 Bit
Sign Bit
S_xx.xxxx_xxxx_xxxx_xxxx_xxxx_xxx
M0125-01
Figure 64. 3.23 Format
The decimal value of a 3.23 format number can be found by following the weighting shown in Figure 64. If the
most significant bit is logic 0, the number is a positive number, and the weighting shown yields the correct
number. If the most significant bit is a logic 1, then the number is a negative number. In the case every bit must
be inverted, a 1 added to the result, and then the weighting shown in Figure 65 applies to obtain the magnitude
of the negative number.
1
0
2 Bit
2 Bit
1
2
–1
Bit
0
(1 or 0) ´ 2 + (1 or 0) ´ 2 + (1 or 0) ´ 2
2
–1
–4
Bit
+ ....... (1 or 0) ´ 2
2
–4
–23
Bit
+ ....... (1 or 0) ´ 2
–23
M0126-01
Figure 65. Conversion Weighting Factors—3.23 Format to Floating Point
Gain coefficients, entered via the I²C bus, must be entered as 32-bit binary numbers. The format of the 32-bit
number (4-byte or 8-digit hexadecimal number) is shown in Figure 66.
Fraction
Digit 6
Sign
Bit
Integer
Digit 1
Fraction
Digit 1
Fraction
Digit 2
Fraction
Digit 3
Fraction
Digit 4
Fraction
Digit 5
u u u u
u u S x
x. x x x
x x x x
x x x x
x x x x
x x x x
x x x x 0
Coefficient
Digit 8
Coefficient
Digit 7
Coefficient
Digit 6
Coefficient
Digit 5
Coefficient
Digit 4
Coefficient
Digit 3
Coefficient
Digit 2
Coefficient
Digit 1
u = unused or don’t care bits
Digit = hexadecimal digit
M0127-01
Figure 66. Alignment of 3.23 Coefficient in 32-Bit I²C Word
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Table 3. Sample Calculation for 3.23 Format
db
Linear
Decimal
Hex (3.23 Format)
0
1
8,388,608
80 0000
5
1.77
14,917,288
00E3 9EA8
–5
0.56
4,717,260
0047 FACC
X
L = 10(X / 20)
D = 8,388,608 × L
H = dec2hex (D, 8)
Table 4. Sample Calculation for 9.17 Format
db
Linear
Decimal
0
1
131,072
2 0000
5
1.77
231,997
3 8A3D
–5
0.56
73,400
1 1EB8
D = 131,072 × L
H = dec2hex (D, 8)
X
(X / 20)
L = 10
Hex (9.17 Format)
7.7 Register Maps
7.7.1 Register Summary
SUBADDRESS
REGISTER NAME
NO. OF
BYTES
CONTENTS
DEFAULT
VALUE
A u indicates unused bits.
0x00
Clock control register
1
Description shown in subsequent section
0x6C
0x01
Device ID register
1
Description shown in subsequent section
0x40
0x02
Error status register
1
Description shown in subsequent section
0x00
0x03
System control register 1
1
Description shown in subsequent section
0xA0
0x04
Serial data interface register
1
Description shown in subsequent section
0x05
0x05
System control register 2
1
Description shown in subsequent section
0x40
0x06
Soft mute register
1
Description shown in subsequent section
0x00
0x07
Master volume
2
Description shown in subsequent section
0x03FF (mute)
0x08
Channel 1 vol
2
Description shown in subsequent section
0x00C0 (0 dB)
0x09
Channel 2 vol
2
Description shown in subsequent section
0x00C0 (0 dB)
0x0A
Channel 3 vol
2
Description shown in subsequent section
0x00C0 (0 dB)
0x0B
Reserved
2
Reserved (1)
0x03FF
0x0C
2
Reserved
(1)
0x00C0
0x0D
1
Reserved (1)
0xC0
0x0E
Volume configuration register
1
Description shown in subsequent section
0xF0
0x0F
Reserved
1
Reserved (1)
0x97
0x10
Modulation limit register
1
Description shown in subsequent section
0x01
0x11
IC delay channel 1
1
Description shown in subsequent section
0xAC
0x12
IC delay channel 2
1
Description shown in subsequent section
0x54
0x13
IC delay channel 3
1
Description shown in subsequent section
0xAC
0x14
IC delay channel 4
1
Description shown in subsequent section
0x54
0x15
Reserved
1
Reserved (1)
0xAC
0x16
0x54
0x17
(1)
34
0x00
0x18
PWM Start
0x0F
0x19
PWM Shutdown Group Register
1
Description shown in subsequent section
0x30
0x1A
Start/stop period register
1
Description shown in subsequent section
0x68
0x1B
Oscillator trim register
1
Description shown in subsequent section
0x82
Do not access reserved registers.
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Register Maps (continued)
SUBADDRESS
0x1C
REGISTER NAME
BKND_ERR register
0x1D–0x1F
NO. OF
BYTES
1
DEFAULT
VALUE
CONTENTS
Description shown in subsequent section
(1)
0x57
1
Reserved
0x20
Input MUX register
4
Description shown in subsequent section
0x0001 7772
0x00
0x21
Reserved
4
Reserved (1)
0x0000 4303
0x22
4
0x0000 0000
0x23
4
0x0000 0000
0x24
4
0x0000 0000
0x25
PWM MUX register
4
Description shown in subsequent section
0x0102 1345
0x26
ch1_bq[0]
20
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
0x27
0x28
0x29
0x2A
0x2B
0x2C
ch1_bq[1]
ch1_bq[2]
ch1_bq[3]
ch1_bq[4]
ch1_bq[5]
ch1_bq[6]
20
20
20
20
20
20
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Register Maps (continued)
SUBADDRESS
0x2D
0x2E
0x2F
0x30
0x31
0x32
0x33
0x34
0x35
36
REGISTER NAME
ch1_bq[7]
ch1_bq[8]
ch1_bq[9]
ch2_bq[0]
ch2_bq[1]
ch2_bq[2]
ch2_bq[3]
ch2_bq[4]
ch2_bq[5]
NO. OF
BYTES
20
20
20
20
20
20
20
20
20
CONTENTS
DEFAULT
VALUE
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
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Register Maps (continued)
SUBADDRESS
0x36
0x37
0x38
0x39
REGISTER NAME
ch2_bq[6]
ch2_bq[7]
ch2_bq[8]
ch2_bq[9]
NO. OF
BYTES
20
20
20
20
DEFAULT
VALUE
CONTENTS
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
0x3A
Reserved
4
Reserved (1)
0x3B
AGL1 softening filter alpha
8
u[31:26], ae[25:0]
0x0008 0000
u[31:26], oe[25:0]
0x0078 0000
Description shown in subsequent section
0x0000 0100
Description shown in subsequent section
0xFFFF FF00
AGL1 softening filter omega
0x3C
AGL1 attack rate
AGL1 release rate
8
0x0080 0000 0000
0000
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Register Maps (continued)
SUBADDRESS
REGISTER NAME
0x3D
0x3E
AGL2 softening filter alpha
NO. OF
BYTES
AGL2 attack rate
Reserved (1)
8
u[31:26], ae[25:0]
0x0008 0000
u[31:26], oe[25:0]
0x0078 0000
8
AGL2 release rate
u[31:26], at[25:0]
0x0008 0000
u[31:26], rt[25:0]
0xFFF8 0000
0x40
AGL1 attack threshold
4
T1[31:0] (9.23 format)
0x0800 0000
0x41
AGL3 attack threshold
4
T1[31:0] (9.23 format)
0x0074 0000
0x42
AGL3 attack rate
8
Description shown in subsequent section
0x0008 0000
AGL3 release rate
Description shown in subsequent section
0xFFF8 0000
0x43
AGL2 attack threshold
4
T2[31:0] (9.23 format)
0x0074 0000
0x44
AGL4 attack threshold
4
T1[31:0] (9.23 format)
0x0074 0000
0x45
AGL4 attack rate
8
0x0008 0000
AGL4 release rate
0xFFF8 0000
0x46
AGL control
4
Description shown in subsequent section
0x0002 0000
0x47
AGL3 softening filter alpha
8
u[31:26], ae[25:0]
0x0008 0000
u[31:26], oe[25:0]
0x0078 0000
u[31:26], ae[25:0]
0x0008 0000
u[31:26], oe[25:0]
0x0078 0000
AGL3 softening filter omega
0x48
AGL4 softening filter alpha
8
AGL4 softening filter omega
0x49
Reserved
4
Reserved
(1)
0x4A
4
0x1212 1010 E1FF
FFFF F95E 1212
0x4B
4
0x0000 296E
0x4C
4
0x0000 5395
0x4D
4
0x0000 0000
0x4E
4
0x0000 0000
0x4F
PWM switching rate control
4
u[31:4], src[3:0]
0x0000 0008
0x50
Bank switch control
4
Description shown in subsequent section
0x0F70 8000
0x51
Ch 1 output mixer
12
Ch 1 output mix1[2]
0x0080 0000
Ch 1 output mix1[1]
0x0000 0000
Ch 1 output mix1[0]
0x0000 0000
0x52
Ch 2 output mixer
12
Ch 2 output mix2[2]
0x0080 0000
Ch 2 output mix2[1]
0x0000 0000
Ch 2 output mix2[0]
38
DEFAULT
VALUE
8
AGL2 softening filter omega
0x3F
CONTENTS
0x0000 0000
0x53
16
Reserved (1)
0x0080 0000 0000
0000 0000 0000
0x54
16
Reserved (1)
0x0080 0000 0000
0000 0000 0000
0x56
Output post-scale
4
u[31:26], post[25:0]
0x0080 0000
0x57
Output pre-scale
4
u[31:26], pre[25:0] (9.17 format)
0x0002 0000
0x58
ch1_bq[10]
20
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
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Register Maps (continued)
SUBADDRESS
0x59
0x5A
0x5B
0x5C
0x5D
0x5E
0x5F
0x60
0x61
0x62
REGISTER NAME
ch1_cross_bq[0]
ch1_cross_bq[1]
ch1_cross_bq[2]
ch1_cross_bq[3]
ch2_bq[10]
ch2_cross_bq[0]
ch2_cross_bq[1]
ch2_cross_bq[2]
ch2_cross_bq[3]
IDF post scale
NO. OF
BYTES
20
20
20
20
20
20
20
20
20
4
DEFAULT
VALUE
CONTENTS
u[31:26], b0[25:0]
0x0080 0000
ch1_cross_bq[1]
0x0000 0000
ch1_cross_bq[2]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
u[31:26], b0[25:0]
0x0080 0000
u[31:26], b1[25:0]
0x0000 0000
u[31:26], b2[25:0]
0x0000 0000
u[31:26], a1[25:0]
0x0000 0000
u[31:26], a2[25:0]
0x0000 0000
Description shown in subsequent section
0x0000 0080
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Register Maps (continued)
SUBADDRESS
NO. OF
BYTES
REGISTER NAME
0x63–0x69
Reserved
4
0x6A
CONTENTS
Reserved (1)
0x0000 0000
0x007F 7CED
4
0x0000 8312
0x6B
Left channel PWM level meter
4
Data[31:0]
0x6C
Right channel PWM level meter
4
Data[31:0]
0x6D
Reserved
8
Reserved (1)
0x6E–0x6F
DEFAULT
VALUE
0x0000 0000
0x0000 0000 0000
0000
4
0x0000 0000
0x70
ch1 inline mixer
4
u[31:26], in_mix1[25:0]
0x0080 0000
0x71
inline_AGL_en_mixer_ch1
4
u[31:26], in_mixagl_1[25:0]
0x0000 0000
0x72
ch1 right_channel mixer
4
u[31:26], right_mix1[25:0]
0x0000 0000
0x73
ch1 left_channel_mixer
4
u[31:26], left_mix_1[25:0]
0x0080 0000
0x74
ch2 inline mixer
4
u[31:26], in_mix2[25:0]
0x0080 0000
0x75
inline_AGL_en_mixer_ch2
4
u[31:26], in_mixagl_2[25:0]
0x0000 0000
0x76
ch2 left_chanel mixer
4
u[31:26], left_mix1[25:0]
0x0000 0000
0x77
ch2 right_channel_mixer
4
u[31:26], right_mix_1[25:0]
0x0080 0000
0x78–0xF7
Reserved
(1)
0x0000 0000
0xF8
Update device address key
4
Dev Id Update Key[31:0] (Key =
0xF9A5A5A5)
0x0000 0054
0xF9
Update device address
4
u[31:8],New Dev Id[7:0] (New Dev Id = 0x54
for TAS5751M)
0x0000 0054
4
Reserved (1)
0x0000 0000
0xFA–0xFF
All DAP coefficients are 3.23 format unless specified otherwise.
Registers 0x3B through 0x46 should be altered only during the initialization phase.
7.7.2 Detailed Register Descriptions
7.7.2.1 Clock Control Register (0x00)
The clocks and data rates are automatically determined by the TAS5751M. The clock control register contains
the autodetected clock status. Bits D7–D5 reflect the sample rate. Bits D4–D2 reflect the MCLK frequency.
Table 5. Clock Control Register (0x00)
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
–
–
–
–
–
fS = 32-kHz sample rate
0
0
1
–
–
–
–
–
Reserved
0
1
0
–
–
–
–
–
Reserved
0
1
1
–
–
–
–
–
fS = 44.1/48-kHz sample rate (1)
1
0
0
–
–
–
–
–
fS = 16-kHz sample rate
1
0
1
–
–
–
–
–
fS = 22.05/24-kHz sample rate
1
1
0
–
–
–
–
–
fS = 8-kHz sample rate
1
1
1
–
–
–
–
–
fS = 11.025/12-kHz sample rate
–
–
–
0
0
0
–
–
MCLK frequency = 64 × fS (2)
–
–
–
0
0
1
1
–
MCLK frequency = 128 × fS (2)
0
0
0
0
1
0
0
0
MCLK frequency = 192 × fS (3)
–
–
–
0
1
1
–
–
MCLK frequency = 256 × fS (1) (4)
(1)
(2)
(3)
(4)
40
FUNCTION
Default values are in bold.
Only available for 44.1-kHz and 48-kHz rates
Rate only available for 32/44.1/48-KHz sample rates
Not available at 8 kHz
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SLASEC1B – MARCH 2016 – REVISED MAY 2018
Table 5. Clock Control Register (0x00) (continued)
D7
D6
D5
D4
D3
D2
D1
D0
–
–
–
1
0
0
–
–
MCLK frequency = 384 × fS
FUNCTION
–
–
–
1
0
1
–
–
MCLK frequency = 512 × fS
–
–
–
1
1
0
–
–
Reserved
–
–
–
1
1
1
–
–
Reserved
–
–
–
–
–
–
0
–
Reserved
–
–
–
–
–
–
–
0
Reserved
7.7.2.2 Device ID Register (0x01)
The device ID register contains the ID code for the firmware revision.
Table 6. General Status Register (0x01)
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
(1)
FUNCTION
Identification code
(1)
Default values are in bold.
7.7.2.3 Error Status Register (0x02)
The error bits are sticky and are not cleared by the hardware. This means that the software must clear the
register (write zeroes) and then read them to determine if they are persistent errors.
Error definitions:
• MCLK error: MCLK frequency is changing. The number of MCLKs per LRCLK is changing.
• SCLK error: The number of SCLKs per LRCLK is changing.
• LRCLK error: LRCLK frequency is changing.
• Frame slip: LRCLK phase is drifting with respect to internal frame sync.
Table 7. Error Status Register (0x02)
D7
D6
D5
D4
D3
D2
D1
D0
1
-
–
–
–
–
–
–
MCLK error
–
1
–
–
–
–
–
–
PLL autolock error
–
–
1
–
–
–
–
–
SCLK error
–
–
–
1
–
–
–
–
LRCLK error
–
–
–
–
1
–
–
–
Frame slip
–
–
–
–
–
1
–
–
Clip indicator
–
–
–
–
–
–
1
–
Overcurrent, overtemperature, overvoltage, or undervoltage error
0
0
0
0
0
0
0
0
Reserved
0
0
0
0
0
0
0
0
No errors
(1)
FUNCTION
(1)
Default values are in bold.
7.7.2.4 System Control Register 1 (0x03)
System control register 1 has several functions:
Bit D7:
If 0, the dc-blocking filter for each channel is disabled.
If 1, the dc-blocking filter (–3 dB cutoff
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