DocuSign Envelope ID: 32AFA687-3144-4E1A-8137-AC3CEC0E8C2F
Statement on Restriction of Hazardous Substances (“RoHS”) for TI Products
TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to
comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863
(effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).
To the best of TI’s knowledge, TI products that are declared as RoHS Compliant
Do not contain restricted substances above the maximum threshold values shown in Table 1
OR
Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb) as shown
in Table 2. (For externally purchased components, other RoHS exemptions may apply):
TABLE 1
Substance
Threshold
EU RoHS Directive
Cadmium (Cd)
0.01% (100ppm)
2002/95/EC amended 2011/65/EU
Lead (Pb)
0.1% (1000ppm)
2002/95/EC amended 2011/65/EU
Mercury (Hg)
0.1% (1000ppm)
2002/95/EC amended 2011/65/EU
Hexavalent Chromium (Cr6)
0.1% (1000ppm)
2002/95/EC amended 2011/65/EU
Polybrominated biphenyls (PBBs)
0.1% (1000ppm)
2002/95/EC amended 2011/65/EU
Polybrominated diphenylethers (PBDEs)
0.1% (1000ppm)
2002/95/EC amended 2011/65/EU
Bis(2-ethylhexyl) phthalate (DEHP)
0.1% (1000ppm)
EU 2015/863, enforced 22 Jul 2019
Butyl benzyl phthalate (BBP)
0.1% (1000ppm)
EU 2015/863, enforced 22 Jul 2019
Dibutyl phthalate (DBP)
0.1% (1000ppm)
EU 2015/863, enforced 22 Jul 2019
Diisobutyl phthalate (DIBP)
0.1% (1000ppm)
EU 2015/863, enforced 22 Jul 2019
TABLE 2
EU RoHS
Exemption
7(a)
7(c)-i
15(a)
15
1
Description
Category
Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by
weight or more lead)
Electrical and electronic components containing lead in a glass or ceramic other than
dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic
matrix compound
Lead in solders to complete a viable electrical connection between the semiconductor
die and carrier within integrated circuit flip chip packages where at least one of the
following criteria applies:
- A semiconductor technology node of 90 nm or larger;
- A single die of 300 mm2 or larger in any semiconductor node;
- Stacked die packages with die of 300 mm2 or larger, or silico interposers of 300 mm2 or
larger
Lead in solders to complete a viable electrical connection between the semiconductor
die and carrier within integrated circuit flip chip packages
2002/95/EC amended
2011/65/EU
2002/95/EC amended
2011/65/EU
2011/65/EU amended
(EU) 2019/172:
Categories 1 to 7 & 10
2011/65/EU amended
(EU) 2019/172:
Categories 8, 9 & 11
Revised: June 2023
DocuSign Envelope ID: 32AFA687-3144-4E1A-8137-AC3CEC0E8C2F
Do not exceed the IEC 62474 database (formerly the Joint Industry Guide –JIG101).
Meet the China Management Methods for controlling Pollution by Electronic Information Products
(“China RoHS”). For products containing lead, the China RoHS EFUP is 50 years
(www.ti.com/leadfree).
TI defines “RoHS Compliant” products as follows:
RoHS = Yes: Means TI semiconductor products that are compliant with the current RoHS
requirement that the maximum concentration values of the ten substances listed in RoHS Annex II
do not exceed 0.1% by weight in homogeneous materials (0.01% for Cd). Where designed to be
soldered at high temperatures, TI semiconductor products labeled as “RoHS Compliant” are suitable
for use in specified lead-free processes. TI may also reference these types of semiconductor
products as “Pb-Free.”
RoHS = Exempt: Means TI semiconductor products that contain lead (Pb) above the RoHS Annex
II threshold, but that fall within one of the specific RoHS exemptions listed above. TI products with
this designation contain below the regulatory thresholds for all RoHS restricted substances except
Lead (Pb), which may be found in materials such as leadframe plating or solder balls. EU RoHS
status can be checked at www.ti.com/productcontent.
RoHS = No: TI products not designated as “RoHS Compliant” are below the regulatory thresholds
for all RoHS Annex II substances except Lead (Pb), which may be found in materials such as
leadframe plating or solder balls where a RoHS exemption cannot be claimed. EU RoHS status can
be checked at www.ti.com/productcontent
Note: Although not publicly available, the existence and/or concentrations of TI proprietary materials in
TI semiconductor products are in full compliance with regulatory requirements in effect as of the
date below.
TI’s semiconductor products, as well as most module products are considered “components” under
RoHS. Therefore, the CE marking, declaration of conformity, and internal product control provisions set
forth in Article 7 of RoHS do not apply.
Evaluation modules (EVMs): As of July 22, 2019, TI EVMs are in compliance with all RoHS Article 7
requirements.
Signature:
Name/Title:
Heather Hendershot, Director, Worldwide SC Quality
6/22/2023
Date:
2
Revised: June 2023
DocuSign Envelope ID: 32AFA687-3144-4E1A-8137-AC3CEC0E8C2F
Important Information/Disclaimer
TI bases its material content information on information provided by third-party suppliers and has taken, and continues
to take, reasonably diligent steps to provide any required or available information. TI may not have conducted
destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain
information to be proprietary, and thus certain information may not be available for release by TI. The material content
information is provided by TI "as is."
For additional information, please contact TI customer support.
IMPORTANT NOTICE FOR SEMICONDUCTOR PRODUCTS
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements,
improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to
discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before
placing orders and should verify that such information is current and complete. All semiconductor products (also
referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order
acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the
warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques
are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing
of all parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their
products and applications using TI components. To minimize the risks associated with Buyers’ products and
applications, Buyers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright,
mask work right, or other intellectual property right relating to any combination, machine, or process in which TI
components or services are used. Information published by TI regarding third-party products or services does not
constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information
may require a license from a third party under the patents or other intellectual property of the third party, or a license
from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction
is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not
responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that
component or service voids all express and any implied warranties for the associated TI component or service and is
an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety- related
requirements concerning its products, and any use of TI components in its applications, notwithstanding any
applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the
necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor
failures and their consequences lessen the likelihood of failures that might cause harm and take appropriate remedial
actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI
components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such
components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet
applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized
officers of the parties have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed
and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any
military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that
Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use.
In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Further
information can be found at www.ti.com or by contacting support@ti.com.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
3
Revised: June 2023
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
