TCA5405RUGR

TCA5405 SCPS228 – MARCH 2011 www.ti.com Low Voltage 5-Bit Self-Timed, Single-Wire Output Expander Check for Samples: TCA5405 FEATURES 1 • • • • • • Operating Power-Supply Voltage Range of 1.65 V to 3.6 V Five Independent Push-Pull Outputs Single Input (DIN) Controls State of All Outputs High-Current Drive Outputs Maximum Capability for Directly Driving LEDs Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) APPLICATIONS • • • • • Cell Phones PDAs Portable Media Players MP3 Players Portable Instrumentation RUG PACKAGE (TOP VIEW) 8 1 2 7 6 3 4 5 PIN # NAME COMMENTS 1 VCC Supply Voltage 2 DIN Data Input 3 GND Ground 4 Q0 GPO 5 Q1 GPO 6 Q2 GPO 7 Q3 GPO 8 Q4 GPO DESCRIPTION The TCA5405 is a 5-bit output expander controlled using a single wire input. This device is ideal for portable applications as it has a wide VCC range of 1.65V to 3.6 V. The TCA5405 uses a self-timed serial data protocol with a single data input driven by a master device synchronized to an internal clock of that device. During a Setup phase, the bit period is sampled, then the TCA5405 generates its own internal clock synchronized to that of the Master device to sample the input over a five-bit-period Data Transfer phase and writes the bit states on the parallel outputs after the last bit is sampled. The TCA5405 is available in an 8-pin 1.5mm x 1.5mm RUG uQFN package. ORDERING INFORMATION TA –40°C to 85°C (1) PACKAGE (1) uQFN – RUG Tape and Reel ORDERABLE PART NUMBER TOP-SIDE MARKING TCA5405RUGR 6Y Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TCA5405 SCPS228 – MARCH 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. APPLICATION DIAGRAM VCC Master I/O Q4 Q3 Q2 Q1 Q0 TCA5405 DIN Figure 1. TCA5405 Application Diagram ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.0 V VI Input voltage range (2) –0.5 4.0 V (2) –0.5 UNIT VO Output voltage range 4.0 V IIK Input clamp current VI < 0 ±20 mA IOK Output clamp current VO < 0 ±20 mA IOL Continuous output low current VO = 0 to VCC 50 mA IOH Continuous output high current VO = 0 to VCC 50 mA 200 mA Continuous current through GND ICC Continuous current through VCC ΘJA Package thermal impedance (3) TSTG Storage temperature range (1) (2) (3) 160 RUG package –65 243 °C/W 150 °C Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT VCC Supply voltage 1.65 3.6 V VIH High-level input voltage DIN 0.7 × VCC VCC + 0.5 V VIL Low-level input voltage DIN –0.3 0.3 × VCC V IOH High-level output current Q0–Q4 20 mA IOL Low-level output current Q0–Q4 20 mA TA Operating free-air temperature 85 °C 2 –40 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s) :TCA5405 TCA5405 SCPS228 – MARCH 2011 www.ti.com ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range, VCC = 1.65 V to 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN –1.2 VIK Input diode clamp voltage II = –18 mA 1.65 V to 3.6 V VPOR Power on reset voltage VI = VCC or GND, IO = 0 1.65 V to 3.6 V II DIN VI = VCC or GND 1.65 V to 3.6 V ICC_STBY Standby Supply Current VI on DIN = VCC or GND, IO = 0 1.65 V to 3.6 V ICC_ACTIVE Active current during startup and data transfer CI DIN VI = VCC or GND VOH OUT-port high-level output voltage IOH = –20 mA TYP MAX 1 1.4 V ±0.1 µA 2 µA 400 µA 7 pF V 1 1.65 V to 3.6 V 6 1.65 V 1.1 2.3 V 1.7 3.6 V 2.5 V 1.65 V VOL OUT-port low-level output voltage IOL = 20 mA UNIT 0.6 2.3 V 0.3 3.6 V 0.25 V TIMING REQUIREMENTS over recommended operating free-air temperature range, VCC = 1.65 V to 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN tPER DIN period 1.65 V to 3.6 V trise DIN rise time 1.65 V to 3.6 V tfall DIN fall time 1.65 V to 3.6 V fMIN Maximum switching frequency on DIN 1.65 V to 3.6 V fMAX Minimum switching frequency on DIN 1.65 V to 3.6 V 0.001 TYP MAX ms 100 ns 100 1 Product Folder Link(s) :TCA5405 ns MHz 10 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated UNIT 10 kHz 3 TCA5405 SCPS228 – MARCH 2011 www.ti.com PRINCIPLES OF OPERATION The TCA5405 single-wire bus device has a single-bit Data Line Bus input and has five independent parallel push-pull buffered outputs. A single input is used to control the output state for the writing to these five outputs. This single-wire serial interface is similar to a UART type interface but operates over a wide range of values for the bit period. The TCA5405 uses a self-timed serial data protocol with a single data input driven by a master device synchronized to an internal clock of that device. During a Setup phase, the bit period is sampled, then the TCA5405 generates its own internal clock synchronized to that of the Master device to sample the input over a five-bit-period Data Transfer phase and writes the bit states on the parallel outputs after the last bit is sampled. The Master output bit must be transmitted via a Totem-pole output structure to ensure proper interpretation of the incoming serial burst. The single-wire unidirectional interface operation is defined in Figure 2. INTERFACE TIMING Master System Clock t PER S0 DIN S1 S2 S3 D4 D3 Period Sense Startup Phase D2 D1 D0 Data Transfer Phase Internally Generated Clock Get D4 Q4-Q0 Get D3 Get D2 Get D1 Previous Value Get D0 New Value Figure 2. Definition of Single-Wire Interface To function correctly, the bit period (tPER) of the DIN signal must be constant over the entire data transaction. Therefore, DIN should be driven by a stable periodic signal internal to the Master device (see Figure 2 - Master System Clock). The bit period can be any value between 1µS and 10mS. The TCA5405 first detects the falling transition on DIN at the beginning of the S0 period to signal the start of an incoming data burst. Next, over the period of S1 and S2, between the two rising edges on DIN, a timer measures the duration of S1/S2 to calculate the bit period of the incoming signal. After that, the TCA5405 uses that value to generate its own internal clock which it uses to sample DIN as near as possible to the center of the subsequent D4-D0 bit periods. After bit D0 is sampled, the five sampled values are sent to the Q4-Q0 outputs. At the end of the D0 bit period, if DIN is not already high, it must be set high to signal the end of the transaction and to prepare for the next one. 4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s) :TCA5405 TCA5405 SCPS228 – MARCH 2011 www.ti.com TYPICAL CHARACTERISTICS TA = 25°C (unless otherwise noted) 500 1500 450 1350 1200 VCC = 3.3 V 350 ICC - Supply Current - nA ICC - Supply Current - mA 400 300 VCC = 2.5 V 250 200 VCC = 1.8 V 150 900 VCC = 2.5 V 750 600 450 100 300 50 150 -15 10 35 TA - Temperature - °C 60 VCC = 1.8 V 0 -40 0 -40 VCC = 3.3 V 1050 85 Figure 3. Active Current vs Temperature -15 10 35 TA - Temperature - °C 60 85 Figure 4. Standby Supply Current vs Temperature 500 1500 450 1350 TA = 25°C ICC - Supply Current - nA ICC - Supply Current - mA 350 TA = 85°C 300 TA = -40°C 250 200 150 1050 750 600 50 150 1.8 2.1 2.4 2.7 VCC - Supply Voltage - V 3 3.3 0 1.5 3.6 Figure 5. Active Supply Current vs Supply Voltage 1.8 2.1 2.4 2.7 VCC - Supply Voltage - V 3 3.3 3.6 Figure 6. Standby Supply Current vs Supply Voltage 50 60 VI = 1.8 V VI = 1.65 V 45 54 TA = -40°C 35 TA = 25°C 30 TA = 85°C 25 20 15 36 24 18 5 6 500 600 TA = 85°C 30 12 200 300 400 VOL - Output Low Voltage - mV TA = 25°C 42 10 100 TA = -40°C 48 ISINK - Sink Current - mA 40 ISINK - Sink Current - mA TA = -40°C 450 300 0 1.5 TA = 25°C 900 100 0 0 TA = 85°C 1200 400 0 0 Figure 7. I/O Sink Current vs Output Low Voltage VCC = 1.65V 100 200 300 400 VOL - Output Low Voltage - mV 500 Figure 8. I/O Sink Current vs Output Low Voltage VCC = 1.8 V Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s) :TCA5405 600 5 TCA5405 SCPS228 – MARCH 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) TA = 25°C (unless otherwise noted) 110 90 VI = 2.5 V VI = 3.3 V 99 81 TA = -40°C TA = 25°C 63 TA = 85°C 54 45 36 27 66 44 33 9 11 200 300 400 VOL - Output Low Voltage - mV 500 TA = 85°C 55 22 100 TA = 25°C 77 18 0 0 TA = -40°C 88 ISINK - Sink Current - mA ISINK - Sink Current - mA 72 0 0 600 100 200 300 400 VOL - Output Low Voltage - mV Figure 9. I/O Sink Current vs Output Low Voltage VCC = 2.5V 500 600 Figure 10. I/O Sink Current vs Output Low Voltage VCC = 3.3V 0.4 110 VI = 3.6 V 99 0.35 TA = -40°C VOL - Output Low Voltage - V 88 ISINK - Sink Current - mA TA = 25°C 77 TA = 85°C 66 55 44 33 0.3 VCC = 1.8 V VCC = 2.5 V 0.25 VCC = 3.3 V 0.2 0.15 0.1 22 0.05 11 0 0 100 200 300 400 VOL - Output Low Voltage - mV 500 0 -40 600 -15 Figure 11. I/O Sink Current vs Output Low Voltage VCC =3.6V 10 35 TA - Temperature - °C 60 85 Figure 12. I/O Low Voltage vs Temperature VCC = 3.3V at 20 mA 50 40 VI = 1.8 V VI = 1.65 V 45 36 TA = -40°C 32 28 TA = 85°C 24 20 16 30 20 15 8 10 4 5 100 200 300 VCC - VOH - mV 400 500 600 0 0 Figure 13. I/O Source Current vs Output High Voltage VCC = 1.65V 6 TA = 85°C 25 12 0 0 TA = -40°C TA = 25°C 35 ISRC - mA ISRC - mA 40 TA = 25°C Submit Documentation Feedback 100 200 300 VCC - VOH - mV 400 500 600 Figure 14. I/O Source Current vs Output High Voltage VCC = 1.8V Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s) :TCA5405 TCA5405 SCPS228 – MARCH 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) TA = 25°C (unless otherwise noted) 70 80 VI = 3.3 V VI = 2.5 V 63 72 TA = -40°C 56 TA = 25°C 42 TA = 85°C 35 TA = 85°C 48 40 28 32 21 24 14 16 7 8 0 0 TA = 25°C 56 ISRC - mA ISRC - mA 49 TA = -40°C 64 0 100 200 300 VCC - VOH - mV 400 500 600 0 Figure 15. I/O Source Current vs Output High Voltage VCC = 2.5V 100 200 300 VCC - VOH - mV 400 500 600 Figure 16. I/O Source Current vs Output High Voltage VCC = 3.3V 0.4 80 VI = 3.6 V 72 0.35 TA = -40°C 64 VCC = 1.8 V 0.3 ISRC - mA VCC - VOH - mV TA = 25°C 56 TA = 85°C 48 40 32 0.25 VCC = 2.5 V 0.2 VCC = 3.3 V 0.15 24 0.1 16 0.05 8 0 0 100 200 300 VCC - VOH - mV 400 500 600 0 -40 Figure 17. I/O Source Current vs Output High Voltage VCC = 3.6V -15 10 35 TA - Temperature - °C 60 Figure 18. I/O High Voltage vs Temperature VCC = 3.3V at 20 mA Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s) :TCA5405 85 7 PACKAGE OUTLINE RUG0008A X2QFN - 0.4 mm max height SCALE 7.500 PLASTIC QUAD FLATPACK - NO LEAD 1.55 1.45 B A PIN 1 INDEX AREA 1.55 1.45 C 0.4 MAX SEATING PLANE 0.05 0.00 0.08 C SYMM 2X 0.35 0.25 2X 4 3 2X 1 (0.15) TYP 0.45 0.35 5 SYMM 4X 0.5 1 PIN 1 ID (45 X0.1) 2X 7 4X 8 6X 0.4 0.3 0.25 0.15 0.3 0.2 0.1 0.05 C A C B 4222060/A 05/14/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT RUG0008A X2QFN - 0.4 mm max height PLASTIC QUAD FLATPACK - NO LEAD 2X (0.3) 2X (0.6) 8 6X (0.55) 1 7 4X (0.25) SYMM 4X (0.5) (1.3) 2X (0.2) 3 5 (R0.05) TYP 4 SYMM (1.35) LAND PATTERN EXAMPLE SCALE:25X 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4222060/A 05/14/2015 NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com EXAMPLE STENCIL DESIGN RUG0008A X2QFN - 0.4 mm max height PLASTIC QUAD FLATPACK - NO LEAD 2X (0.3) 2X (0.6) 8 6X (0.55) 1 7 4X (0.25) SYMM 4X (0.5) (1.3) 2X (0.2) 3 5 4 SYMM (1.35) SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICKNESS SCALE:25X 4222060/A 05/14/2015 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TCA5405RUGR ACTIVE X2QFN RUG 8 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 6Y (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of