TCA9509
SCPS225D – AUGUST 2011 – REVISED TCA9509
APRIL 2021
SCPS225D – AUGUST 2011 – REVISED APRIL 2021
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TCA9509 Level-Translating I2C and SMBUS Bus Repeater
1 Features
3 Description
•
•
•
This TCA9509 integrated circuit is an I2C bus/SMBus
Repeater for use in I2C/SMBus systems. It can
also provide bidirectional voltage-level translation (uptranslation/down-translation) between low voltages
(down to 0.9 V) and higher voltages (2.7 V to 5.5
V) in mixed-mode applications. This device enables
I2C and similar bus systems to be extended, without
degradation of performance even during level shifting.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Two-channel bidirectional buffer
I2C bus and SMBus compatible
Operating supply voltage range of
2.7 V to 5.5 V on B side
Operating voltage range of 0.9 V to 5.5 V on
A side
Voltage-level translation from
0.9 V to 5.5 V and 2.7 V to 5.5 V
Active-high repeater-enable input
Requires no external pullup resistors on
lower-voltage port-A
Open-drain I2C I/O
5.5-V Tolerant I2C and enable input support mixedmode signal operation
Lockup-free operation
Accommodates standard mode and fast mode I2C
devices and multiple controllers
Supports arbitration and clock stretching across
Repeater
Powered-off high-impedance I2C bus pins
Supports 400-kHz fast I2C bus operating speeds
Available in
– 1.6-mm × 1.6-mm, 0.4-mm height, 0.5-mm
pitch QFN package
– 3-mm × 3-mm Industry standard MSOP
package
Latch-up performance exceeds 100 mA Per JESD
78, class II
ESD protection exceeds JESD 22
– 2000-V Human-body model (A114-A)
– 1000-V Charged-device model (C101)
2 Applications
•
•
•
•
Servers
Routers (Telecom Switching Equipment)
Industrial Equipment
Products with many I2C targets and or long PCB
Traces
The TCA9509 buffers both the serial data (SDA) and
the serial clock (SCL) signals on the I2C bus, thus
allowing 400-pF bus capacitance on the B-side. This
device can also be used to isolate two halves of a bus
for voltage and capacitance.
The TCA9509 has two types of drivers – A-side
drivers and B-side drivers. All inputs and B-side I/Os
are overvoltage tolerant to 5.5 V. The A-side I/Os
are overvoltage tolerant to 5.5 V when the device is
unpowered (VCCB and/or VCCA = 0 V).
Device Information(1)
PART NUMBER
TCA9509
(1)
PACKAGE
BODY SIZE (NOM)
VSSOP (8)
3.00 mm × 3.00 mm
X2QFN (8)
1.60 mm × 1.60 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
3.3 V
1.1 V
VCCA
SDA
SCL
BUS
CONTROLLER
400 kHz
1.1 V
10 kW
VCCB
10 kW
SDAA SDAB
SDA
SCLA SCLB
TCA9509
SCL
TARGET
400 kHz
10 kW
EN
BUS A
BUS B
Simplified Schematic
An©IMPORTANT
NOTICEIncorporated
at the end of this data sheet addresses availability, warranty, changes, use in
safety-critical
applications,
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2021 Texas Instruments
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Description (continued).................................................. 3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................5
7.4 Thermal Information....................................................6
7.5 Electrical Characteristics.............................................6
7.6 Timing Requirements.................................................. 7
7.7 I2C Interface Timing Requirements.............................7
8 Parameter Measurement Information............................ 9
9 Detailed Description......................................................10
9.1 Overview................................................................... 10
9.2 Functional Block Diagram......................................... 10
9.3 Feature Description...................................................11
9.4 Device Functional Modes..........................................11
10 Application and Implementation................................ 12
10.1 Application Information........................................... 12
10.2 Typical Application.................................................. 12
11 Power Supply Recommendations..............................15
12 Layout...........................................................................16
12.1 Layout Guidelines................................................... 16
12.2 Layout Example...................................................... 16
13 Device and Documentation Support..........................17
13.1 Receiving Notification of Documentation Updates..17
13.2 Support Resources................................................. 17
13.3 Trademarks............................................................. 17
13.4 Electrostatic Discharge Caution..............................17
13.5 Glossary..................................................................17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (December 2017) to Revision D (April 2021)
Page
• Changed the terms master and slave To controller and target in the data sheet............................................... 1
• Changed ICC Quiescent supply current for VCCB MIN value from 0.5 mA to 0.20 mA and the TYP value from
0.9 mA to 0.5 mA in the Electrical Characteristics table..................................................................................... 6
• Changed text From: "Multiple B-sides of TCA9509 s..." To: "Multiple B-sides of TCA9509..."......................... 13
Changes from Revision B (January 2012) to Revision C (December 2017)
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1
• Added junction temperature to the Absolute Maximum Ratings ........................................................................5
• Changed thermal information for RVH and DGK packages .............................................................................. 6
• Changed VILC, added Test Conditions with new MIN and TYP values in the Electrical Characteristics table.... 6
• Updated Bus A (0.9-V to 5.5-V Bus) Waveform..................................................................................................7
• Updated Bus B (2.7-V to 5.5-V Bus) Waveform..................................................................................................7
Changes from Revision A (October 2011) to Revision B (January 2012)
Page
• Added DGK package and package information to datasheet. ...........................................................................1
Changes from Revision * (August 2011) to Revision A (October 2011)
Page
• Corrected VCCA operating voltage lower limit, to 0.9 V at multiple instances in document.................................1
• Changed Operating Supply Voltage Range value error in FEATURES for B side. Changed from (0.9 V to 5.5
V on B side) to (2.7 V to 5.5 V on B side)........................................................................................................... 1
• Changed Operating Voltage Range value error in FEATURES for A side. Changed (2.7 V to VCCB – 1 V on A
side) to (0.9 V to VCCB – 1 V on A side)..............................................................................................................1
2
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5 Description (continued)
The bus port B drivers are compliant with SMBus I/O levels, while the A-side uses a current sensing mechanism
to detect the input or output LOW signal which prevents bus lock-up. The A-side uses a 1 mA current source
for pull-up and a 200 Ω pull-down driver. This results in a LOW on the A-side accommodating smaller voltage
swings. The output pull-down on the A-side internal buffer LOW is set for approximately 0.2 V, while the input
threshold of the internal buffer is set about 50 mV lower than that of the output voltage LOW. When the A-side
I/O is driven LOW internally, the LOW is not recognized as a LOW by the input. This prevents a lock-up condition
from occurring. The output pull-down on the B-side drives a hard LOW and the input level is set at 0.3 of SMBus
or I2C-bus voltage level which enables B side to connect to any other I2C-bus devices or buffer.
The TCA9509 drivers are not enabled unless VCCA is above 0.8 V and VCCB is above 2.5 V. The enable (EN) pin
can also be used to turn the drivers on and off under system control. Caution should be observed to only change
the state of the EN pin when the bus is idle.
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VCCA
8
VCCB
6 Pin Configuration and Functions
1
6
7
SCLB
TCA9509
2
6
SDAB
SDAA
3
5
EN
GND
4
SCLA
Figure 6-1. RVH Package, 8-Pin X2QFN, Top View
VCCA
1
8
VCCB
SCLA
2
7
SCLB
SDAA
3
6
SDAB
GND
4
5
EN
Not to scale
Figure 6-2. DGK Package, 8-Pin VSSOP, Top View
Table 6-1. Pin Functions
PIN
4
NAME
NO.
I/O
DESCRIPTION
VCCA
1
Supply
SCLA
2
I/O
Serial clock bus, A side.
SDAA
3
I/O
Serial data bus, A side.
GND
4
Supply
EN
5
Input
SDAB
6
I/O
Serial data bus, B side. Connect to VCCB through a pull-up resistor.
Serial clock bus, B side. Connect to VCCB through a pull-up resistor.
SCLB
7
I/O
VCCB
8
Supply
Thermal
Attach Pad
-
-
A-side supply voltage (0.9 V to 5.5 V)
Supply ground
Active-high repeater enable input
B-side and device supply voltage (2.7 V to 5.5 V)
Thermal Attach Pad is not electrically connected and it is recommended to be attached to
GND for best thermal performance. This is for the RVH package only.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCCB
Supply voltage
MIN
MAX
UNIT
–0.5
6
V
VCCA
Supply voltage
–0.5
6
V
VI
Enable input voltage(2)
–0.5
6
V
VI/O
I2C
6
V
IIK
Input clamp current
VI < 0
–20
IOK
Output clamp current
VO < 0
–20
Pd
Max power dissipation
TJ
Junction temperature
Tstg
Storage temperature
(1)
(2)
bus
voltage(2)
–0.5
–65
mA
100
mW
125
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC
JS-001(1)
UNIT
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
VCCA
Supply voltage, A-side bus
0.9(1)
5.5
V
VCCB
Supply voltage, B-side bus
2.7
5.5
V
VIH
High-level input voltage
SDAA, SCLA
0.7 × VCCA
VCCA
SDAB, SCLB
0.7 × VCCB
5.5
EN
0.7 × VCCA
5.5
–0.5
0.3
SDAA, SCLA
VIL
Low-level input voltage
IOL
Low-level output current
TA
Operating free-air temperature
(1)
SDAB, SCLB
–0.5
0.3 × VCCB
EN
–0.5
0.3 × VCCA
V
V
SDAA, SCLA
10
µA
SDAB, SCLB
6
mA
85
°C
–40
Low-level supply voltage
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7.4 Thermal Information
TCA9509
THERMAL
METRIC(1)
RVH (X2QFN)
DGK (VSSOP)
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance(2)
160.3
222.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
66.4
109.5
°C/W
RθJB
Junction-to-board thermal resistance
115.9
144.5
°C/W
ψJT
Junction-to-top characterization parameter
0.8
34.5
°C/W
ψJB
Junction-to-board characterization parameter
116.2
142.7
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
80.5
n/a
°C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
The package thermal impedance is calculated in accordance with JESD 51-7.
7.5 Electrical Characteristics
VCCB = 2.7 V to 5.5 V, VCCA = 0.9 V to (VCCB-1), TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
Input clamp voltage
VOL
II = –18 mA
SDAA, SCLA
IOL = 10 μA,
VILA = VILB = 0 V,
VCCA = 0.9 to 1.2 V
SDAA, SCLA
IOL = 20 μA,
VILA = VILB = 0 V,
1.2V < VCCA ≤ (VCCB – 1 V)
Low-level output voltage
VOL – VILc
Low-level input voltage below
low-level output voltage
SDAA, SCLA
VILc
SDA and SCL low-level input
voltage contention
SDAA, SCLA
VOLB
Low-level output voltage
SDAB, SCLB
ICC
Quiescent supply current for VCCA
ICC
Quiescent supply current for VCCB
SDAB, SCLB
II
Input leakage current
SDAA, SCLA
EN
IOH
6
High-level output leakage
current
SDAB, SCLB
SDAA, SCLA
MIN
TYP
–1.5
0.18
MAX
UNIT
–0.5
V
0.25
V
0.2
0.3
50
VCCA ≥ 1.5 V and VCCB ≥ 3.15 V
mV
110
150
50
100
0.1
0.2
All port A Static high
0.25
0.45
0.9
All port A Static low
1.25
All port B Static high
0.2
0.5
1.1
VCCA < 1.5 V or VCCB < 3.15 V
IOL = 6 mA
mV
VI = VCCB
±1
VI = 0.2 V
10
VI = VCCA
±1
VI = 0.2 V
10
VI = VCCB
±1
VI = 0.2 V
–10
10
VO = 3.6 V
CIOA
I/O capacitance of A-side
SCLA, SDAA
VI = 0 V
CIOB
I/O capacitance of B-side
SCLB, SDAB
VI = 0 V
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10
6.5
5.5
V
mA
mA
μA
μA
7
pF
6.2
pF
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7.6 Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted)
MIN
condition(1)
tsu
Setup time, EN high before Start
th
Hold time, EN high after Stop condition(1)
(1)
MAX
UNIT
100
ns
100
ns
EN should change state only when the global bus and the repeater port are in an idle state.
7.7 I2C Interface Timing Requirements
TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
tPHL
Propagation delay
port A to port B
port B to port A
tPLH
port A to port B
Propagation delay
trise
port B to port A
port A
Transition time
port B
Transition time
tfall
port A
port B
tPLH2
Propagation delay
port A to port B
50% of initial low on
Port A to 1.5 V on
Port B
fMAX
Maximum switching
frequency
(1)
VCCA
(INPUT)
VCCB
(OUTPUT)
1.9 V
5V
EN High
1.9 V
5V
EN High
1.9 V
5V
EN High
1.9 V
5V
EN High
1.9 V
5V
TEST CONDITIONS
MIN
123.1
88.1
TYP(1)
MAX
127.2 132.8
88.8
89.8
122.6
125.7 131.7
123
124.1 126.9
40.1
40.9
41.9
57.3
57.5
58.4
14.5
16.4
17.9
18.7
19.4
20.2
176
177.3
178
400
UNIT
ns
ns
ns
ns
ns
KHz
Typical values were measured with VCCA = VCCB = 2.7 V at TA = 25°C, unless otherwise noted.
0.5 V/DIV
9th CLOCK PULSE — ACKNOWLEDGE
SCL
SDA
VOL OF CONTROLLER
VOL OF TCA9509
Figure 7-1. Bus A (0.9-V to 5.5-V Bus) Waveform
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2 V/DIV
9th CLOCK PULSE — ACKNOWLEDGE
SCL
SDA
Figure 7-2. Bus B (2.7-V to 5.5-V Bus) Waveform
8
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8 Parameter Measurement Information
VCCI
VCCO
1.35 kW
DUT
IN
OUT
Input
CL
PIN
CL
SCLA, SDAA (A-side)
50 pF
SDAB, SCLB (B-side)
50 pF
1 MW
VCC
Input
50%
50%
0V
Output
70%
30%
tf
A.
B.
C.
D.
E.
70%
30%
VCC
VOL
tr
RT termination resistance should be equal to ZOUT of pulse generators.
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
The outputs are measured one at a time, with one transition per measurement.
tPLH and tPHL are the same as tpd.
Figure 8-1. Test Circuit and Voltage Waveforms
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9 Detailed Description
9.1 Overview
This TCA9509 integrated circuit is an I2C bus/SMBus Repeater for use in I2C/SMBus systems. It can also
provide bidirectional voltage-level translation (up-translation/down-translation) between low voltages (down to
0.9 V) and higher voltages (2.7 V to 5.5 V) in mixed-mode applications. This device enables I2C and similar bus
systems to be extended, without degradation of performance even during level shifting.
The TCA9509 buffers both the serial data (SDA) and the serial clock (SCL) signals on the I2C bus, thus allowing
400-pF bus capacitance on the B-side. This device can also be used to isolate two halves of a bus for voltage
and capacitance.
The TCA9509 has two types of drivers – A-side drivers and B-side drivers. All inputs and B-side I/O’s are
overvoltage tolerant to 5.5V. The A-side I/O’s are overvoltage tolerant to 5.5 V when the device is unpowered
(VCCB and/or VCCA = 0V).
9.2 Functional Block Diagram
VCCA
VCCB
1
8
VCCA
1 mA
SDAA
6
3
SDAB
VCCA
1 mA
7
2
SCLA
SCLB
5
EN
4
GND
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9.3 Feature Description
9.3.1 Two-Channel Bidirectional Buffer
The TCA9509 is a two-channel bidirectional buffer with level-shifting capabilities, featuring an integrated current
source on the A-side.
9.3.2 Integrated A-Side Current Source
The A-side ports of the TCA9509 feature an integrated 1 mA current source, eliminating the need for external
pull-up resistors on SDAA and SCLA.
9.3.3 Standard Mode and Fast Mode Support
The TCA9509 supports standard mode as well as fast mode I2C. The maximum system operating frequency will
depend on system design and delays added by the repeater.
9.4 Device Functional Modes
Table 9-1 lists the functional modes for the TCA9509.
Table 9-1. Function Table
INPUT
EN
FUNCTION
L
Outputs disabled
H
SDAA = SDAB
SCLA = SCLB
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10 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
10.1 Application Information
The TCA9509 is 5-V tolerant, so it does not require any additional circuitry to translate between 0.9-V to 5.5-V
bus voltages and 2.7-V to 5.5-V bus voltages.
When the B-side of the TCA9509 is pulled low by a driver on the I2C bus and the falling edge goes below 0.3
VCCB, it causes the internal driver on the A-side to turn on, causing the A-side to pull down to about 0.2 V (VOL).
When the A-side of the TCA9509 falls, a comparator detects the falling edge and causes the internal driver on
the B-side to turn on and pull the B-side pin down to ground. In order to illustrate what would be seen in a
typical application, refer to Figure 7-1. If the bus controller in Figure 10-1 were to write to the target through the
TCA9509, waveforms shown in Figure 7-2 would be observed on the B bus. This looks like a normal I2C bus
transmission, except that the high level may be as low as 0.9 V, and the turn on and turn off of the acknowledge
signals are slightly delayed.
On the A-side bus of the TCA9509, the clock and data lines would have a positive offset from ground equal to
the VOL of the TCA9509. After the eighth clock pulse, the data line is pulled to the VOL of the controller device,
which is close to ground in this example. At the end of the acknowledge, the level rises only to the low level set
by the driver in the TCA9509 for a short delay, while the B-bus side rises above 0.3 VCCB and then continues
high. It is important to note that any arbitration or clock stretching events require that the low level on the A-bus
side at the input of the TCA9509 (VIL) be at or below VILC to be recognized by the TCA9509 and then transmitted
to the B-bus side.
10.2 Typical Application
3.3 V
1.2 V
5k
5k
VCCA VCCB
TCA9509
SDA
SDAA SDAB
SDA
SCL
BUS
CONTROLLER
400 kHz
SCLA SCLB
SCL
EN
TARGET
400 kHz
Figure 10-1. Typical Application, A-side Connected to controller
10.2.1 Design Requirements
A typical application is shown in Figure 10-1. In this example, the system controller is running on a 1.2-V I2C
bus, and the target is connected to a 3.3-V bus. Both buses run at 400 kHz. Controller devices can be placed on
either bus. For the level translating application, the following should be true: VCCA ≤ (VCCB – 1 V)
• VCCA = 0.9 V to 5.5 V
• VCCB = 2.7 to 5.5 V
• A-side ports must not be connected together
• Pullup resistors should not be placed on the A-side ports
12
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10.2.2 Detailed Design Procedure
10.2.2.1 Clock Stretching Support
The TCA9509 can support clock stretching, but care needs to be taken to minimize the overshoot voltage
presented during the hand-off between the target and controller. This is best done by increasing the pull-up
resistor value on B-side ports.
10.2.2.2 VILC and Pulldown Strength Requirements
For the TCA9509 to function correctly, all devices on the A-side must be able to pull the A-side below the voltage
input low contention level (VILC). This means that the VOL of any device on the A-side must be below VILC min.
The VOL can be adjusted by changing the IOLthrough the device which is set by the pull-up resistance value.
The pull-up resistance on the A-side must be carefully selected to ensure that the logic levels will be transferred
correctly to the B-side.
3.3 V
5k
1.8 V
5k
VCCB VCCA
TCA9509
SDA
SCL
BUS
CONTROLLLER
400 kHz
SDAB SDAA
SDA
SCLB
SCL
SCLA
TARGET
400 kHz
EN
BUS B
1.65 V
3.3 V
VCCB VCCA
TCA9509
SDAB SDAA
SDA
SCLB
SCL
SCLA
TARGET
400 kHz
EN
BUS A
BUS C
Figure 10-2. Typical Star Application
Multiple B-sides of TCA9509 can be connected in a star configuration, allowing all nodes to communicate with
each other. The A-sides should not be connected together when used in a star/parallel configuration.
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TCA9509
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SCPS225D – AUGUST 2011 – REVISED APRIL 2021
1.2 V
3.3 V
5k
SDA
SCL
BUS
CONTROLLER
400 kHz
1.65 V
5k
VCCA VCCB
VCCB VCCA
TCA9509
TCA9509
SDAA SDAB
SDAB SDAA
SDA
SCLA
SCLB
SCL
SCLB
EN
SCLA
TARGET
400 kHz
EN
BUS A
BUS B
BUS C
Figure 10-3. Typical Series Application, Two B-Sides Connected Together
1.65 V
3.3 V
5.0 V
5k
SDA
SCL
BUS
CONTROLLER
400 kHz
VCCA VCCB
VCCA VCCB
TCA9509
TCA9509
SDAA SDAB
SDAA SDAB
SDA
SCLA
SCLA
SCL
SCLB
EN
BUS A
5k
SCLB
TARGET
400 kHz
EN
BUS B
BUS C
Figure 10-4. Typical Series Application, A-side Connected to B-Side
To further extend the I2C bus for long traces/cables, multiple TCA9509 devices can be connected in series as
long as the A-side is connected to the B-side and VCCA ≤ (VCCB – 1 V) must also be met. Series connections can
also be made by connecting both B-sides together while following power supply rule VCCA ≤ (VCCB – 1 V). I2C
bus target devices can be connected to any of the bus segments. The number of devices that can be connected
in series is limited by repeater delay/time-of-flight considerations on the maximum bus speed requirements.
14
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11 Power Supply Recommendations
VCCB and VCCA can be applied in any sequence at power up. The TCA9509 includes a power-up circuit that
keeps the output drivers turned off until VCCB is above 2.5 V and the VCCA is above 0.8 V. After power up and
with the EN high, a low level on the B-side (below 0.3 × VCCB) turns the corresponding A-side driver (either SDA
or SCL) on and drives the A-side down to approximately 0.2 V. When the B-side rises above 0.3 × VCCB, the
A-side pull-down driver is turned off and the external pull-up resistor pulls the pin high. When the A-side falls
first and goes below 0.3 × VCCA, the B-side driver is turned on and the B-side pulls down to 0 V. The A-side
pull-down is not enabled unless the A-side voltage goes below 0.4 V. If the A-side low voltage does not go below
0.5 V, the B-side driver turns off when the A-side voltage is above 0.7 × VCCA. If the A-side low voltage goes
below 0.4 V, the A-side pull-down driver is enabled, and the A-side is able to rise to only 0.5 V until the B-side
rises above 0.3 × VCCB.
A 100 nF a decoupling capacitor should be placed as close to the VCCA and VCCB pins in order to provide proper
filtering of supply noise.
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SCPS225D – AUGUST 2011 – REVISED APRIL 2021
12 Layout
12.1 Layout Guidelines
There are no special layout procedures required for the TCA9509.
It is recommended that the decoupling capacitors be placed as close to the VCC pins as possible.
12.2 Layout Example
To VCCA Plane
0402 Cap
0402 Cap
= Via to GND Plane
VCCA
VCCB
SCLA
SCLB
SDAA
SDAB
GND
EN
To VCCB Plane
Figure 12-1. Example Layout
16
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SCPS225D – AUGUST 2011 – REVISED APRIL 2021
13 Device and Documentation Support
13.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
13.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
13.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
13.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TCA9509DGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
NIPDAUAG | SN
Level-1-260C-UNLIM
-40 to 85
(7KO, 7KQ)
Samples
TCA9509MRVHR
ACTIVE
X2QFN
RVH
8
5000
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
7K
Samples
TCA9509RVHR
ACTIVE
X2QFN
RVH
8
5000
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
7K
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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