TCA9617ADGKR

TCA9617ADGKR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VSSOP-8

  • 描述:

    IC V-LEVEL XLATR FM+ I2C 8VSSOP

  • 数据手册
  • 价格&库存
TCA9617ADGKR 数据手册
Product Folder Order Now Support & Community Tools & Software Technical Documents TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 TCA9617A Level-Translating FM+ I2C Bus Repeater 1 Features • • 1 • • • • • • • • • • • • 2 Applications 2 Two-Channel Bidirectional I C Buffer Support for Standard Mode, Fast Mode (400 kHz), and Fast Mode+ (1 Mhz) I2C Operation Operating Supply Voltage Range of 0.8 V to 5.5 V on A-Side Operating Supply Voltage Range of 2.2 V to 5.5 V on B-Side Voltage-Level Translation From 0.8 V to 5.5 V and 2.2 V to 5.5 V Footprint and Function Replacement for TCA9517 Active-High Repeater-Enable Input Open-Drain I2C I/O 5.5-V Tolerant I2C and Enable Input Support Mixed-Mode Signal Operation Lockup-Free Operation Support for Clock Stretching and Multiple Master Arbitration Across The Device Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 4000-V Human-Body Model (A114-A) – 1500-V Charged-Device Model (C101) • • • • Servers Routers (Telecom Switching Equipment) Industrial Equipment Products With Many I2C Slaves and/or Long PCB Traces 3 Description The TCA9617A is a BiCMOS dual bidirectional buffer intended for I2C bus and SMBus systems. It can provide bidirectional voltage-level translation (uptranslation and down-translation) between low voltages (down to 0.8 V) and higher voltages (2.2 V to 5.5 V) in mixed-mode applications. This device enables I2C and similar bus systems to be extended, without degradation of performance even during level shifting. The TCA9617A buffers both the serial data (SDA) and the serial clock (SCL) signals on the I2C bus, allowing two buses of 550-pF or greater bus capacitance to be connected in an I2C application. This device can also be used to isolate two halves of a bus for voltage and capacitance. Device Information(1) PART NUMBER TCA9617A PACKAGE BODY SIZE (NOM) VSSOP (8) 3.00 mm × 3.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Simplified Schematic VCCA 2 I C or SMBus Master (e.g. Processor) VCCB SCLA SDAA SCLB SDAB 2 I C slave devices TCA9617A EN GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 6.7 3 4 4 4 5 6 6 Absolute Maximum Ratings ..................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Timing Requirements ................................................ Typical Characteristics .............................................. Parameter Measurement Information .................. 7 Detailed Description .............................................. 9 8.1 Overview ................................................................... 9 8.2 Functional Block Diagram ....................................... 10 8.3 Feature Description................................................. 10 8.4 Device Functional Modes........................................ 11 9 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Application .................................................. 12 10 Power Supply Recommendations ..................... 15 11 Layout................................................................... 16 11.1 Layout Guidelines ................................................. 16 11.2 Layout Example .................................................... 16 12 Device and Documentation Support ................. 17 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resource............................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 17 13 Mechanical, Packaging, and Orderable Information ........................................................... 17 4 Revision History Changes from Revision A (July 2014) to Revision B Page • Changed the appearance of the DGK pin out image ............................................................................................................ 3 • Changed the Handling Ratings table to ESD Ratings table ................................................................................................... 4 • Moved Storage temperature range From the ESD Ratings to the Absolute Maximum Ratings table ................................... 4 • Deleted VCCA < VCCB from the Design Requirements list...................................................................................................... 12 Changes from Original (June 2013) to Revision A Page • Deleted " Powered-Off High-Impedance I2C Pins" from Features list .................................................................................... 1 • Added Applications. ............................................................................................................................................................... 1 • Added Handling Ratings table. ............................................................................................................................................... 4 • Added Thermal Information table. ......................................................................................................................................... 4 • Added Typical Characteristics section. .................................................................................................................................. 6 • Added Detailed Description section. ...................................................................................................................................... 9 • Added Application and Implementation section. ................................................................................................................. 12 • Added Power Supply Recommendations section. .............................................................................................................. 15 • Added Layout section. ......................................................................................................................................................... 16 2 Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A TCA9617A www.ti.com SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 5 Pin Configuration and Functions DGK Package 8-Pin VSSOP Top View VCCA 1 8 VCCB SCLA 2 7 SCLB SDAA 3 6 SDAB GND 4 5 EN Not to scale Pin Functions PIN NAME NO. DESCRIPTION VCCA 1 A-side supply voltage (0.8 V to 5.5 V) SCLA 2 I2C SCL line, A side. Connect to VCCA through a pull-up resistor. SDAA 3 I2C SDA line, A side. Connect to VCCA through a pull-up resistor. GND 4 Supply ground EN 5 Active-high repeater enable input SDAB 6 I2C SDA line, B side. Connect to VCCB through a pull-up resistor. SCLB 7 I2C SCL line, B side. Connect to VCCB through a pull-up resistor. VCCB 8 B-side and device supply voltage (2.2 V to 5.5 V) 6 Specifications 6.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCCB Supply voltage range –0.5 7 V VCCA Supply voltage range –0.5 7 V VI Enable input voltage range (2) –0.5 7 V VI/O I2C bus voltage range (2) –0.5 7 V IIK Input clamp current VI < 0 –50 IOK Output clamp current VO < 0 –50 IO Tstg (1) (2) Continuous output current Continuous current through VCC or GND Storage temperature range –65 mA ±50 mA ±100 mA 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A 3 TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 www.ti.com 6.2 ESD Ratings MIN VESD (1) (2) Electrostatic discharge MAX UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 0 4000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) 0 1500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCCA Supply voltage, A-side bus 0.8 VCCB V VCCB Supply voltage, B-side bus 2.2 5.5 V IOLA Low-level output current 30 mA IOLB Low-level output current 0.1 30 mA TA Operating free-air temperature –40 85 °C 6.4 Thermal Information TCA9617A THERMAL METRIC (1) DGK UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 171.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.2 °C/W RθJB Junction-to-board thermal resistance 93.6 °C/W ψJT Junction-to-top characterization parameter 7.9 °C/W ψJB Junction-to-board characterization parameter 91.9 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A TCA9617A www.ti.com SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 6.5 Electrical Characteristics VCCB = 2.2 V to 5.5 V, GND = 0 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER VIK VOL TEST CONDITIONS Input clamp voltage Low-level output voltage VCCB MIN II = –18 mA 2.2 V to 5.5 V SDAB, SCLB IOL =100uA or 30mA, VILA = 0 V 2.2 V to 5.5 V SDAA, SCLA IOL = 30mA SDAA, SCLA VIH High-level input voltage SDAB, SCLB 2.2 V to 5.5 V EN 0.48 TYP Low-level input voltage ICCB 0.1 0.2 0.7 × VCCA VCCB 0.7 × VCCB VCCB 0.7 × VCCB 5.5 2.2 V to 5.5 V 0.4 Both channels low, SDAA = SCLA = GND and SDAB = SCLB = open, or SDAA = SCLA = open and SDAB = SCLB = GND 2.2 V to 5.5 V 13 +4.5 Input leakage current +5.7 –1 +1 –10 +10 VI = VCCB – 0.2 V –1 +1 –1 +1 –10 +10 –1 +1 VI = VCCB –1 +1 VI = 0.2 V –25 VI = 0.2 V 2.2 V to 5.5 V VI = VCCA – 0.2 V EN CI CI Input capacitance Input/output capacitance EN VI = 3 V or 0 V SCLA, SCLB VI = 3 V or 0 V SDAA, SDAB VI = 3 V or 0 V 3.3 V 7 3.3 V 9 0V 9 3.3 V 14 0V 14 Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A µA +8.1 VI = 0.2 V, EN = 0 VI = VCCA SDAA, SCLA V mA VI = VCCB II V +7 5.5 V Both channels low, SDAA = SCLA = GND, IOLB = 100 µA SDAB, SCLB V 0.3 × VCCB Both Channels high, SDAA = SCLA = VCCA B-side pulled up to VCCB with pullup resistors Quiescent supply current V 0.3 × VCCA SDAB, SCLB Quiescent supply current for VCCA –1.2 0.58 EN ICCA UNIT 0.53 SDAA, SCLA VIL MAX μA pF pF 5 TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 www.ti.com 6.6 Timing Requirements VCCA = 0.8 V to 5.5 V, VCCB = 2.2 V to 5.5 V, GND = 0V, TA = –40°C to 85° (unless otherwise noted) (1) (2) PARAMETER tPLH Propagation delay tPHL Propagation delay FROM (INPUT) TO (OUTPUT) SDAB, SCLB SDAA, SCLA 137 VCCB > 3 V 61 94 250 69 93 144 SDAB, SCLB 68 90 140 30% 70% tsu Setup time, EN high before Start condition (5) (2) (3) (4) (5) 90 88 SDAA, SCLA tTHL (1) 55 61 SDAA, SCLA B side 70% A side 42 VCCB ≤ 3 V SDAB, SCLB Transition time A side TYP (3) MAX UNIT SDAB, SCLB B side (4) MIN SDAA, SCLA Transition time tTLH TEST CONDITIONS 88 ns 5.40 6.41 13.8 1.40 4.71 11.3 100 ns ns 37 30% ns ns ns Times are specified with loads of 240 Ω ±1% and 400 pF ±10% on B-side and 240 Ω ±1% and 200 pF ±10% on A-side. Different load resistance and capacitance alter the rise time, thereby changing the propagation delay and transition times. Times are specified with A-side signals pulled up to VCCA; VCCA = 0.9 V and B-side signals pulled up to VCCB; VCCB = 2.5 V. Typical values were measured with VCCA = 0.9 V and VCCB = 2.5 V at TA = 25°C, unless otherwise noted. TTLH is determined by the pullup resistance and load capacitance. EN should change state only when the global bus and the repeater port are in an idle state. 6.7 Typical Characteristics Port A V OL (V) Port B VOL (V) TA = 85 C TA = 25 C TA = -40 C TA = -40 C TA = 25 C TA = 85 C Port A I OL (mA) VCCA = 0.9 V VCCB = 2.2 V Port B IOL (mA) VCCA = 0.9 V Figure 1. Port A VOL vs IOL 6 VCCB = 2.2 V Figure 2. Port B VOL vs IOL Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A TCA9617A www.ti.com SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 7 Parameter Measurement Information VCCA VCCB RPUA RPUB VCCA VCCB VIN VOUT Open Drain Driver DUT 1M CLA CLB Figure 3. Test Circuit for Open-Drain Output from A to B VCCA VCCB RPUA RPUB VCCA VCCB VOUT VIN DUT Open Drain Driver 1M CLA CLB A. VCCA = 0.9 V B. VCCB = 2.5 V C. RPUA = RPUB = 240 Ω on the A-side and the B-side D. CLA = 200 pF on A-side and CLB = 400 pF on B-side (includes probe and jig capacitance) E. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns F. The outputs are measured one at a time, with one transition per measurement. Figure 4. Test Circuit for Open-Drain Output from B to A Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A 7 TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 www.ti.com Parameter Measurement Information (continued) tPHL,AB tTHL,B 0.7 * VCC 0.3 * VCC VOLB VOLA A-side tPLH,AB tTLH,B B-side 0.7 * VCC 0.3 * VCC VOLB VOLA Figure 5. Propagation Delay And Transition Times (A to B) tPHL,BA tTHL,A 0.7 * VCC 0.3 * VCC A-side B-side tPLH,BA tTLH,A 0.7 * VCC 0.3 * VCC 0.4 V Figure 6. Propagation Delay And Transition Times (B to A) 8 Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A TCA9617A www.ti.com SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 8 Detailed Description 8.1 Overview The TCA9617A is a BiCMOS dual bidirectional buffer intended for I2C bus and SMBus systems. As with the standard I2C system, pullup resistors are required to provide the logic high levels on the buffered bus. The TCA9617A has standard open-drain configuration of the I2C bus. The size of these pullup resistors depends on the system, but each side of the repeater must have a pullup resistor. The device is designed to work with Standard mode, Fast mode and Fast Mode+ I2C devices. The TCA9617A B-side drivers operate from 2.2 V to 5.5 V. The output low level for this internal buffer is approximately 0.5 V, but the input voltage must be 70 mV or more below the output low level when the output is externally driven low. The higher-voltage low signal is called a buffered low. When the B-side I/O is driven low internally, the low is not recognized as a low by the input. This feature prevents a lockup condition from occurring when the input low condition is released. This type of design on the B side prevents it from being used in series with another TCA9617A B-side or other buffers that incorporate a static or dynamic offset voltage. This is because these devices do not recognize buffered low signals as a valid low and do not propagate it as a buffered low again. The TCA9617A A-side drivers operate from 0.8 V to 5.5 V and do not have the buffered low feature (or the static offset voltage). This means that a low signal on the B side translates to a nearly 0-V low on the A side, which accommodates smaller voltage swings of low-voltage logic. The output pulldown on the A side drives a hard low, and the input level is set to 0.3 VCCA to accommodate the need for a lower low level in systems where the lowvoltage-side supply voltage is as low as 0.8 V. The A side of two or more TCA9617As can be connected together to allow a star topology, with the A side on the common bus. Also, the A side can be connected directly to any other buffer with static or dynamic offset voltage. Multiple TCA9617As can be connected in series, A side to B side, with no buildup in offset voltage with only time-of-flight delays to consider. The TCA9617A includes a power-up circuit that keeps the output drivers turned off until VCCB is above 2.0 V and VCCA is above 0.7 V. VCCA is only used to provide references for the A-side input comparators and the powergood-detect circuit. The TCA9617A internal circuitry and all I/Os are powered by the VCCB pin; however, due to ESD protection requirements on the SCLA and SDAA, it is required to power-up VCCB prior to VCCA. IF SDA and SCL (on A-side or B-side) are pulled up to a positive voltage before VCCB is powered, there can be significant current leakage into the SCA and SCL pins that could cause them to be pulled down. The SDA and SCL lines shall not be pulled up to a voltage higher than VCCB, even when the device is powered down. After power up and with the EN high, the A side falling below 0.7 VCCA turns on the corresponding B-side driver (either SDA or SCL) and drives the B-side down momentarily to 0 V before settling to approximately 0.5 V. When the A-side rises above 0.3 VCCA, the B-side pulldown driver is turned off and the external pullup resistor pulls the pin high. If the B side falls first and goes below 0.7 VCCB, the A-side driver is turned on and drives the A-side to 0 V. When the B-side rises above 0.45 V, the A-side pulldown driver is turned off and the external pullup resistor pulls the pin high. Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A 9 TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 www.ti.com 8.2 Functional Block Diagram SDAA VCCA VCCB 1 8 3 6 2 7 SDAB SCLA SCLB VCCB 5 Pullup Resistor EN 4 GND Copyright © 2017, Texas Instruments Incorporated 8.3 Feature Description 8.3.1 Bidirectional Level Translation The TCA9617A can provide bidirectional voltage level translation (up-translation and down-translation) between low voltages (down to 0.8 V) and higher voltages (2.2 V to 5.5 V) in mixed-mode applications. 8.3.2 VOL B-side Offset Voltage Figure 8 depicts the offset voltage on the B side of the device. As shown in Figure 8 the slave releases and the B-side rises, and it will rise to 0.5 V and stay there until the A-side rises above 0.3 VCCA. This effect can cause the low level signal to have a "pedestal." Once the voltage on the A-side crosses 0.3 VCCA, the B-side will continue to rise to VCCB. Due to nature of the B-side pedestal and the static offset voltage, there will be a slight overshoot (point 2) as the B-side rises from being externally driven low to the 0.5 V offset. The TCA9617A is designed to control this behavior provided the system is designed with rise times greater than 20 ns. Therefore, care should be taken to limit the pullup strength when devices with rise time accelerators are present on the B side. Excessive overshoot on the B-side pedestal may cause devices with rise time accelerators to trip prematurely if the accelerator thresholds are below 0.3 VCCB. Since the A-side does not have a static offset low voltage, no pedestal is seen on the A-side as shown in Figure 7. 10 Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A TCA9617A www.ti.com SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 Feature Description (continued) 8.3.3 High to Low Transition Characteristics When the A side of the bus is driven to 0.7 VCCA, the B side driver will turn on. This will drive the B-side to 0 V for a short period (see Figure 8) and then the B-side will rise to the static offset voltage of 0.5 V (VOL of TCA9617A). This effect, called an inverted pedestal, allows the B-side to drive to logic low much faster than driving to the static offset. Driving to the static offset voltage requires that the fall time be slowed to prevent ringing. th 9 Clock Pulse – Acknowledge SCL SDA Figure 7. Bus A (0.8 V to 5.5 V Bus) Waveform Inverted Pedestal th 9 Clock Pulse – Acknowledge SCL Pedestal SDA GND VOL of TCA9617A VOL of Slave Figure 8. Bus B (2.2 V to 5.5 V Bus) Waveform 8.4 Device Functional Modes The TCA9617A has an active-high enable (EN) input with an internal pull-up to VCCB, which allows the user to select when the repeater is active. This can be used to isolate a badly behaved slave on power-up reset. It should never change state during an I2C operation, because disabling during a bus operation may hang the bus, and enabling part way through the bus cycles could confuse the I2C parts being enabled. The EN input should change state only when the global bus and repeater port are in the idle state to prevent system failures. Table 1. Function Table INPUT EN FUNCTION L Outputs disabled H SDAA = SDAB SCLA = SCLB Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A 11 TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 www.ti.com 9 Application and Implementation 9.1 Application Information A typical application is shown in Figure 9. In this example, the system master is running on a 0.9-V I2C bus, and the slave is connected to a 2.5-V bus. Both buses are running at 400 kHz. Decoupling capacitors are required but are not shown in Figure 14 for simplicity. The TCA9617A is 5-V tolerant so no additional circuits are required to translate between 0.8-V to 5.5-V bus voltages and 2.7-V to 5.5-V bus voltages. When the A side of the TCA9617A is pulled low by a driver on the I2C bus, a comparator detects the falling edge when it goes below 0.7 VCCA and cause the internal driver on the B side to turn on. The B-side will first pull down to 0 V and then settle to 0.5 V. When the B side of the TCA9617A falls below 0.45 V, the TCA9617A will detect the falling edge, turn on the internal driver on the A side and pull the A-side pin down to ground. In order to illustrate what would be seen for an A to B transition refer to Figure 11, and for a B to A transition see Figure 10. On the B-side bus of the TCA9617A, the clock and data lines will have a positive offset from ground equal to the VOL of the TCA9617A. After the eighth clock pulse, the data line is pulled to the VOL of the slave device, which is close to ground in this example. At the end of the acknowledge, the level rises only to the low level set by the driver of the TCA9617A for a short delay (approximately 0.5 V), while the A-side bus rises above 0.3 VCCA and then continues high. Although the TCA9617 has a single application, the device can exist in multiple configurations. Figure 9 shows the standard configuration for the TCA9617. Multiple TCA9617s can be connected either in star configuration (Figure 12) or in series configuration (Figure 13). The design requirements , detailed design procedure, and application curves in Standard Application are valid for all three configurations. 9.2 Typical Application 9.2.1 Standard Application 0.9 V 240 2.5 V 240 820 VCCA Master 1 MHz 820 VCCB SDAA SDAB SCLA SCLB TCA9617A Slave 1 MHz EN BUS A BUS B Figure 9. Bidirectional Voltage Level Translator 9.2.1.1 Design Requirements For the level-translating application, the following should be true: • VCCA = 0.8 V to 5.5 V • VCCB = 2.2 V to 5.5 V • IOL > IO 12 Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A TCA9617A www.ti.com SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 Typical Application (continued) 9.2.1.2 Detailed Design Procedure 9.2.1.2.1 Pullup Resistor Sizing For the TCA9617A to function correctly, all devices on the B-side must be able to pull the B-side below the voltage input low contention level (0.45 V). This means that the VOL of any device on the B-side must be below 0.4 V to ensure proper operation. The VOL of a device can be adjusted by changing the IOL through the device which is set by the pull-up resistor value. The pull-up resistor on the B-side must be carefully selected to ensure that logic levels will be transferred correctly to the A-side. The B-side pull-up resistor sizing must also ensure that the rise time is greater than 20 ns. Shorter rise times will increase the pedestal overshoot shown in point 2 of Figure 10. 9.2.1.3 Application Curves 2 2 1 1 Figure 10. B-side Pedestal Figure 11. B-side Inverted Pedestal Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A 13 TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 www.ti.com Typical Application (continued) 9.2.2 Star Application Multiple TCA9617A A sides can be connected in a star configuration, allowing all nodes to communicate with each other. VCCA 240 VCCB 240 820 820 VCCA VCCB SDAA SCLA SDAB SCLB TCA9617A Master 1 MHz Slave 1 MHz EN 820 820 VCCA VCCB SDAA SCLA SDAB SCLB TCA9617A Slave 1 MHz EN BUS B 820 820 VCCA VCCB SDAA SCLA SDAB SCLB TCA9617A Slave 1 MHz EN Figure 12. Typical Star Application 9.2.2.1 Design Requirements Refer to Design Requirements. 9.2.2.2 Detailed Design Procedure Refer to Detailed Design Procedure. 9.2.2.3 Application Curves Refer to Application Curves. 14 Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A TCA9617A www.ti.com SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 Typical Application (continued) 9.2.3 Series Application Multiple TCA9617As can be connected in series as long as the A side is connected to the B side. I2C bus slave devices can be connected to any of the bus segments. The number of devices that can be connected in series is limited by repeater delay/time-of-flight considerations on the maximum bus speed requirements. VCCA 240 VCCB 240 820 VCCA 820 VCCA VCCB 820 VCCB 820 VCCA 820 VCCB SDAA SDAB SDAA SDAB SDAA SDAB SDA SCLA SCLB SCLA SCLB SCLA SCLB SCL Master 1 MHz 820 TCA9617A TCA9617A TCA9617A EN EN EN Slave 1 MHz Figure 13. Typical Series Application 9.2.3.1 Design Requirements Refer to Design Requirements. 9.2.3.2 Detailed Design Procedure Refer to Detailed Design Procedure. 9.2.3.3 Application Curves Refer to Application Curves. 10 Power Supply Recommendations For VCCA, an 0.8-V to 5.5-V power supply is required. For VCCB, a 2.2-V to 5.5-V power supply is required. VCCB should always be higher than VCCA. VCCB cannot be lower than VCCA even when the device is disabled. During power-up, VCCB must rise before VCCA. Standard decoupling capacitors are recommended. These capacitors typically range from 0.1 µF to 1 µF, but the ideal capacitance depends on the amount of noise from the power supply. Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A 15 TCA9617A SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 www.ti.com 11 Layout 11.1 Layout Guidelines The recommended decoupling capacitors should be placed as close to the VCCA and VCCB pins of the TCA9617A as possible. 11.2 Layout Example Polygonal Copper Pour VIA to GND Plane Decoupling capacitors 1 VCCA 2 SCLA VCCB 8 SCLB 7 TCA9617A 3 SDAA 4 GND SDAB 6 EN 5 Figure 14. Layout Schematic 16 Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A TCA9617A www.ti.com SCPS244B – JUNE 2013 – REVISED DECEMBER 2018 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: TCA9617A 17 PACKAGE OPTION ADDENDUM www.ti.com 30-May-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TCA9617ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -40 to 85 (7EA, DWK) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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TCA9617ADGKR
  •  国内价格
  • 1+5.10840
  • 10+4.13640
  • 30+3.65040
  • 100+3.16440
  • 500+2.87280

库存:467