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TCAN330, TCAN332, TCAN334, TCAN337
TCAN330G, TCAN332G, TCAN334G, TCAN337G
SLLSEQ7E – DECEMBER 2015 – REVISED DECEMBER 2019
TCAN33x 3.3-V CAN Transceivers with CAN FD (Flexible Data Rate)
1 Features
3 Description
•
•
•
•
•
The TCAN33x family of devices is compatible with
the ISO 11898 High Speed CAN (Controller Area
Network) Physical Layer standard. TCAN330,
TCAN332, TCAN334 and TCAN337 are specified for
data rates up to 1 Mbps. Pending the release of the
updated version of ISO 11898-2 including CAN FD,
additional timing parameters defining loop delay
symmetry are specified for the TCAN330G,
TCAN332G, TCAN334G and TCAN337G devices.
The devices include many protection features
including driver and receiver Dominant Time Out
(DTO) providing CAN network robustness. Integrated
12 kV IEC-61000-4-2 ESD Contact Discharge
protection eliminates the need of additional
components for system level robustness.
•
•
•
•
•
•
•
3.3-V Single supply operation
Data rates up to 5 Mbps (TCAN33xG devices)
Compatible with ISO 11898-2
SOIC-8 and SOT-23 package options
Operatinles:
– Normal mode (all devices)
– Low power standby mode with wake
(TCAN334)
– Silent mode (TCAN330, TCAN337)
– Shutdown mode (TCAN330, TCAN334)
Wide common mode range of operation ±12 V
Bus pin fault protection of ±14 V
Total loop delay < 135 ns
Wide ambient operation temperature range:
–40°C to 125°C
Optimized behavior when unpowered:
– Bus and logic pins are high impedance (no
load to operating bus or application)
– Power up / down glitch free operation
Excellent EMC performance
Protection features:
– ESD Protection of bus terminals
– HBM ESD Protection exceeds ±25 kV
– IEC61000-4-2 ESD Contact discharge
protection exceeds ±12 kV
– Driver dominant time out (TXD DTO)
– Receiver dominant time out (RXD DTO)
– Fault output pin (TCAN337 only)
– Undervoltage protection on VCC
– Thermal shutdown protection
– Current limiting on bus pins
Device Information(1)
PART NUMBER
TCAN330/G
TCAN332/G
TCAN334/G
TCAN337/G
•
•
•
•
•
5-Mbps operation in CAN with flexible data rate
networks (TCAN33xG devices)
1-Mbps operation in highly loaded can networks
Industrial automation, control, sensors and drive
systems
Building, security and climate control automation
Telecom base station status and control
CAN Bus standards such as CANopen,
DeviceNet, NMEA2000, ARINC825, ISO11783,
CANaerospace
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
SOT-23 (8)
2.90 mm x 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Block Diagram
VCC
SHDN/NC/FAULT
Note C 5
3
FAULT LOGIC
Note B
VCC
VCC
VCC
DOMINANT
TIME OUT
TXD 1
UNDER
VOLTAGE
7
6
Note C
8
CANH
CANL
CONTROL
AND
MODE
LOGIC
Sleep Receiver
WAKE
DETECT
2 Applications
•
PACKAGE
BIAS UNIT
1
Note A
MUX
RXD
4
DOMINANT
TIME OUT
Normal Receiver
2
GND
Copyright © 2016, Texas Instruments Incorporated
A: Sleep Receiver and Wake Detect are device dependent options and are only available in TCAN334.
B: Fault Logic are only available in TCAN337.
C: Pin 5 and 8 functions are device dependent. Refer to Device Comparison Table.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TCAN330, TCAN332, TCAN334, TCAN337
TCAN330G, TCAN332G, TCAN334G, TCAN337G
SLLSEQ7E – DECEMBER 2015 – REVISED DECEMBER 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Device Options.......................................................
Pin Configuration and Functions .........................
Specifications.........................................................
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
1
1
1
2
3
3
4
5
Absolute Maximum Ratings ...................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 5
Thermal Information .................................................. 5
Electrical Characteristics........................................... 6
Switching Characteristics .......................................... 8
Typical Characteristics ............................................ 10
Typical Characteristics, TCAN330 Receiver........... 11
Typical Characteristics, TCAN330 Driver ............... 12
9 Parameter Measurement Information ................ 13
10 Detailed Description ........................................... 18
10.1
10.2
10.3
10.4
Overview ...............................................................
Functional Block Diagram .....................................
Feature Description...............................................
Device Functional Modes......................................
18
18
19
22
11 Application and Implementation........................ 26
11.1 Application Information.......................................... 26
11.2 Typical Application ............................................... 26
11.3 System Examples ................................................. 28
12 Power Supply Recommendations ..................... 29
13 Layout................................................................... 30
13.1 Layout Guidelines ................................................. 30
13.2 Layout Example .................................................... 31
14 Device and Documentation Support ................. 32
14.1
14.2
14.3
14.4
14.5
Related Links ........................................................
Support Resources ...............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
32
32
32
32
32
15 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
Changes from Revision D (April 2016) to Revision E
Page
•
Changed the Pin Configuration image appearance ............................................................................................................... 4
•
Changed the titles of Figure 21 and Figure 22..................................................................................................................... 14
Changes from Revision C (April 2016) to Revision D
•
Page
Changed From: ARNIC825 To ARINC825 in the Applications list ......................................................................................... 1
Changes from Revision B (April 2016) to Revision C
•
Page
Removed the Preview Note from TCAN337 and TCAN337G in the Device Options table.................................................... 3
Changes from Revision A (January 2016) to Revision B
Page
•
Removed the Preview Note from all device except for TCAN337 and TCAN337G in the Device Comparison table ........... 3
•
Changed FAULT Pin ICL MIN value From: 5 mA To: 4 mA in the Electrical Characteristics.................................................. 7
Changes from Original (December 2015) to Revision A
Page
•
Changed Features From: "Total Loop Delay < 150 ns" To: "Total loop delay < 135 ns" ...................................................... 1
•
Changed VIT(SLEEP) To: VIT(STB) and added Test conditions in the Electrical Characteristics ................................................. 7
•
Added –12 V < VCM < 12 V to tWK_FILTER in the Test Conditions of Switching Characteristics ............................................... 8
2
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TCAN330, TCAN332, TCAN334, TCAN337
TCAN330G, TCAN332G, TCAN334G, TCAN337G
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SLLSEQ7E – DECEMBER 2015 – REVISED DECEMBER 2019
5 Description (continued)
The use of single 3.3-V supply enables the transceivers to directly interface with 3.3-V CAN controllers/MCUs. In
addition, these devices are fully compatible with other 5-V CAN transceivers on the same bus.
These devices have excellent EMC performance due to matched Dominant and Recessive Common Modes.
Ultra low power Shutdown and Standby modes make these devices attractive for battery powered applications.
This family of devices is available in standard 8-pin SOIC packages for drop-in compatibility and in small SOT-23
packages for space-constrained applications.
6 Device Options
DEVICE
PIN 5
PIN 8
DERATE
TCAN330
SHDN
S
1 Mbps
Shutdown and silent modes
DESCRIPTION
TCAN332
NC
NC
1 Mbps
Normal mode only
TCAN334
SHDN
STB
1 Mbps
Shutdown and standby with wake
TCAN337
FAULT
S
1 Mbps
Fault output and silent mode
TCAN330G
SHDN
S
5 Mbps
Shutdown and silent modes
TCAN332G
NC
NC
5 Mbps
Normal mode only
TCAN334G
SHDN
STB
5 Mbps
Shutdown and standby with wake
TCAN337G
FAULT
S
5 Mbps
Fault output and silent mode
Copyright © 2015–2019, Texas Instruments Incorporated
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3
TCAN330, TCAN332, TCAN334, TCAN337
TCAN330G, TCAN332G, TCAN334G, TCAN337G
SLLSEQ7E – DECEMBER 2015 – REVISED DECEMBER 2019
www.ti.com
7 Pin Configuration and Functions
TCAN330 D, DCN Packages
8-Pin SOIC, SOT-23
Top View
TCAN334 D, DCN Packages
8-Pin SOIC, SOT-23
Top View
TX D
1
8
S
GND
2
7
CA NH
VCC
3
6
CA NL
RX D
4
5
SHDN
TX D
1
8
STB
GND
2
7
CA NH
VCC
3
6
CA NL
RX D
4
5
SHDN
No t to scale
No t to scale
TCAN332 D, DCN Packages
8-Pin SOIC, SOT-23
Top View
TCAN337 D, DCN Packages
8-Pin SOIC, SOT-23
Top View
TX D
1
8
NC
GND
2
7
CA NH
VCC
3
6
CA NL
RX D
4
5
NC
TX D
1
8
S
GND
2
7
CA NH
VCC
3
6
CA NL
RX D
4
5
FA ULT
No t to scale
No t to scale
Pin Functions
PIN
NAME
I/O
DESCRIPTION
I
CAN transmit data input (LOW for dominant and HIGH for recessive bus states),
integrated pull up
TCAN330
TCAN332
TCAN334
TCAN337
TXD
1
1
1
1
GND
2
2
2
2
GND
VCC
3
3
3
3
Supply
RXD
4
4
4
4
O
CAN receive data output (LOW for dominant and HIGH for recessive bus
states), tri-state
SHDN
5
—
5
—
I
Drive high for shutdown mode. Internal pull-down.
NC
—
5
—
—
NC
FAULT
—
—
—
5
O
Open drain fault output pin.
CANL
6
6
6
6
I/O
Low level CAN bus line
CANH
7
7
7
7
I/O
High level CAN bus line
S
8
—
—
8
I
NC
—
8
—
—
NC
STB
—
—
8
—
I
4
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Ground connection
3.3-V supply voltage
No Connect – Not internally connected
Drive high for silent mode, integrated pull down
No Connect – Not internally connected
Drive high for low power standby mode, integrated pull down
Copyright © 2015–2019, Texas Instruments Incorporated
Product Folder Links: TCAN330 TCAN332 TCAN334 TCAN337 TCAN330G TCAN332G TCAN334G TCAN337G
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TCAN330G, TCAN332G, TCAN334G, TCAN337G
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SLLSEQ7E – DECEMBER 2015 – REVISED DECEMBER 2019
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
MAX
UNIT
Supply Voltage range, VCC
–0.3
5
V
Voltage at any bus terminal (CANH or CANL), V(BUS)
–14
14
V
Logic input terminal voltage range V(Logic_Input)
–0.3
5
V
Logic output terminal voltage range, V(Logic_Output)
–0.3
5
V
8
mA
150
°C
150
°C
Logic output current, IO(LOGIC)
Operating junction temperature range, TJ
–40
Storage temperature, Tstg
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to ground terminal.
8.2 ESD Ratings
VALUE
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001 (1)
V(ESD)
(1)
(2)
Electrostatic discharge
All pins except CANH and
CANL
±4000
Pins CANH and CANL
±25000
Charged-device model (CDM), per JEDEC
specification JESD22-C101 (2)
All pins
±1500
IEC 61400-4-2 Contact Discharge
CANH and CANL terminals to
GND
±12000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VCC
Supply voltage
IOH(LOGIC)
Logic terminal HIGH level output current
IOL(LOGIC)
Logic terminal LOW level output current
TA
Operational free-air temperature
NOM
MAX
3
UNIT
3.6
–2
2
–40
V
mA
125
°C
8.4 Thermal Information
THERMAL METRIC (1)
TCAN33x
TCAN33x
D (SOIC)
DCN (SOT-23)
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
114.4
154.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
58.7
76.6
°C/W
RθJB
Junction-to-board thermal resistance
55.2
49.2
°C/W
ψJT
Junction-to-top characterization parameter
11.7
11.9
°C/W
ψJB
Junction-to-board characterization parameter
54.6
49.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
65
65
mW
175
175
°C
5
5
°C
PD
Average power dissipation
TSD
Thermal shutdown temperature
THYS
Thermal shutdown hysteresis
(1)
VCC = 3.3 V, TJ = 27°C, RL = 60 Ω, SHDN, S and
STB at 0 V, Input to TXD at 500 kHz, 50% duty cycle
square wave, CL(RXD) = 15 pF
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2015–2019, Texas Instruments Incorporated
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SLLSEQ7E – DECEMBER 2015 – REVISED DECEMBER 2019
www.ti.com
8.5 Electrical Characteristics
over operating free-air temperature range, TJ = –40°C to 150°C. All typical values are at 25°C and supply voltages of VCC =
3.3 V, RL = 60 Ω, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Supply
Dominant
Supply current Normal Mode
ICC
See Figure 18. TXD = 0 V, RL = 60 Ω,
CL = open, S, STB and SHDN = 0 V.
Typical Bus Load.
55
See Figure 18. TXD = 0 V, RL = 50 Ω,
CL = open, S, STB and SHDN = 0 V.
High Bus Load.
60
Dominant with
bus fault
See Figure 18. TXD = 0 V, S, STB and
SHDN = 0 V, CANH = -12 V, RL = open,
CL = open
180
Recessive
See Figure 18. TXD = VCC, RL = 50 Ω,
CL = open, S, STB and SHDN = 0 V
3.5
See Figure 18. TXD = VCC, RL = 50 Ω,
CL = open, S = VCC
2.5
TA < 85°C, STB at VCC, RXD floating,
TXD at VCC
15
STB at VCC, RXD floating, TXD at VCC
20
TA < 85°C, SHDN at VCC, RXD floating,
TXD at VCC
1
SHDN = VCC, RXD floating, TXD at VCC
2.5
Supply Current: Silent Mode
Supply Current: Standby Mode
Supply Current: Shutdown Mode
mA
Rising under voltage detection on VCC for protected
mode
UV(VCC)
2.6
2
2.5
V
Falling under voltage detection on VCC for protected
mode
VHYS(UVVCC)
2.2
µA
1.65
Hysteresis voltage on UV(VCC)
200
mV
Driver
CANH
VO(D)
Bus output voltage (dominant)
VO(R)
Bus output voltage (recessive)
VOD(D)
CANL
Differential output voltage (dominant)
See Figure 31 and Figure 19, TXD = 0
V, S, STB and SHDN = 0 V, RL = 60 Ω,
CL = open
Differential output voltage (recessive)
V(SYM)
Output symmetry (dominant and recessive)
(CANHREC + CANLREC – CANHDOM – CANLDOM)
IOS(DOM)
Short-circuit steady-state output current, Dominant
IOS(REC)
(1)
6
Short-circuit steady-state output current, Recessive
VCC
0.5
1.25
See Figure 31 and Figure 19, TXD =
VCC, STB, SHDN = 0 V, S = 0 V or VCC
(1)
, RL = open (no load)
V
1.6
See Figure 31 and Figure 19, TXD = 0
V, S, STB and SHDN = 0 V, 45 Ω ≤ RL <
50 Ω, CL = open
1.5
3
–120
12
TA < 85°C, See Figure 31 and Figure 19,
TXD = VCC, S, STB and SHDN = 0 V, RL
= open (no load), CL = open
–50
50
See Figure 31 and Figure 19, TXD =
VCC, S, STB and SHDN = 0 V, RL =
open (no load), CL = open
–50
100
See Figure 31 and Figure 19, S, STB
and SHDN = 0 V, RL = 60 Ω, CL = open
–400
400
See Figure 26, V(CANH) = –12 V, CANL =
open, TXD = 0 V
–200
3
V
mV
mV
mA
See Figure 26, V(CANL) = 12 V, CANH =
open, TXD = 0 V
See Figure 26, –12 V ≤ VBUS ≤ 12 V,
VBUS = CANH = CANL, TXD = VCC
V
1.85
See Figure 31 and Figure 19, TXD = 0
V, S, STB and SHDN = 0 V, 50 Ω ≤ RL ≤
65 Ω, CL = open
See Figure 31 and Figure 19, TXD =
VCC, S, STB and SHDN = 0 V, RL = 60
Ω, CL = open
VOD(R)
2.45
200
–5
5
mA
The bus output voltage (recessive) will be the same if the device is in normal mode with S terminal LOW or if the device is in silent
mode with the S terminal is HIGH.
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SLLSEQ7E – DECEMBER 2015 – REVISED DECEMBER 2019
Electrical Characteristics (continued)
over operating free-air temperature range, TJ = –40°C to 150°C. All typical values are at 25°C and supply voltages of VCC =
3.3 V, RL = 60 Ω, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Receiver
VIT
Input threshold voltage, normal modes and selective
wake modes
VHYS
Hysteresis voltage for input threshold, normal
modes and selective wake modes
VCM
Common Mode Range: normal and silent modes
VIT(STB)
IIOFF(LKG)
Input Threshold, standby mode
Power-off (unpowered) bus input leakage current
500
900
mV
See Figure 20 and Table 7
120
–12
12
–2 V < VCM < 7 V
See Figure 20 and Table 7
400
1150
mV
–12 V < VCM < 12 V
See Figure 20 and Table 7
400
1350
mV
TA < 85°C, CANH = CANL = 3.3 V, VCC
to GND via 0-Ω and 47-kΩ resistor
6
CANH = CANL = 3.3 V, VCC to GND via
0-Ω and 47-kΩ resistor
12
V
µA
CI
Input capacitance to ground (CANH or CANL)
20
CID
Differential input capacitance
10
RID
Differential input resistance
TXD = VCC, Normal Mode
30
80
RIN
Input resistance (CANH or CANL)
TXD = VCC, Normal mode
15
40
RIN(M)
Input resistance matching: [1 – (RIN(CANH) /
RIN(CANL))] × 100 %
V(CANH) = V(CANL)
–3%
3%
pF
kΩ
TXD Terminal (CAN Transmit Data Input)
VIH
HIGH level input voltage
VIL
LOW level input voltage
2
IIH
HIGH level input leakage current
TXD = VCC = 3.6 V
IIL
LOW level input leakage current
ILKG(OFF)
Unpowered leakage current
I(CAP)
Input Capacitance
V
0.8
V
3
µA
–2.5
0
TXD = 0 V, VCC = 3.6 V
–4
0
0
µA
TXD = 3.6 V, VCC = 0 V
–2
0
2.5
µA
2.5
pF
RXD Terminal (CAN Receive Data Output)
VOH
HIGH level output voltage
See Figure 20, IO = –2 mA
VOL
LOW level output voltage
See Figure 20, IO = 2 mA
ILKG(OFF)
Unpowered leakage current
RXD = 3.6 V, VCC = 0 V
0.8 x VCC
–1
V
0.2
0.4
V
0
1
µA
STB/S/SHDN Terminals
VIH
HIGH level input voltage
VIL
LOW level input voltage
2
IIH
HIGH level input leakage current
STB, S, SHDN = VCC = 3.6 V
–3
IIL
LOW level input leakage current
STB, S, SHDN = 0 V, VCC = 3.6 V
ILKG(OFF)
Unpowered leakage current
STB, S, SHDN = 3.6 V, VCC = 0 V
V
0.8
V
0
10
µA
–4
0
1
µA
–3
0
5
µA
FAULT Pin (Fault Output), TCAN337 only
ICH
Output current high level
FAULT = VCC, See Figure 28
ICL
Output current low level
FAULT = 0.4 V, See Figure 28
Copyright © 2015–2019, Texas Instruments Incorporated
–10
4
µA
12
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mA
7
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SLLSEQ7E – DECEMBER 2015 – REVISED DECEMBER 2019
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8.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Device Switching Characteristics
tPROP(LOOP)
Total loop delay, driver input (TXD) to
receiver output (RXD), recessive to
dominant and dominant to recessive
See Figure 23, S, STB and SHDN = 0 V,
RL = 60 Ω, CL = 100 pF, CL(RXD) = 15 pF
100
135
ns
tPROP(LOOP)
Total Loop delay in highly loaded
network
See Figure 23, S, STB and SHDN = 0 V,
RL = 120 Ω, CL = 200 pF,
CL(RXD) = 15 pF
120
180
ns
tBUS_SYM_2
2 Mbps transmitted recessive bit width
tREC_SYM_2
2 Mbps received recessive bit width
ΔtSYM_2
2 Mbps receiver timing symmetry
(tREC_SYM_2 - tBUS_SYM_2)
tBUS_SYM_5
5 Mbps transmitted recessive bit width
tREC_SYM_5
5 Mbps received recessive bit width
ΔtSYM_5
5 Mbps receiver timing symmetry
(tREC_SYM_5 - tBUS_SYM_5)
tMODE
Mode change time
See Figure 21 and Figure 22.
RL = 60 Ω, CL = 100 pF,
CL(RXD) = 15 pF
tUV_RE-ENABLE
Re-enable time after UV event
Time for device to return to normal
operation from UV(VCC) under voltage
event
tWK_FILTER
Bus time to meet Filtered Bus
Requirements for Wake Up Request
See Figure 33, Standby mode.
–12 V < VCM < 12 V
See Figure 24, S or STB = 0 V, RL = 60
Ω, CL = 100 pF, CL(RXD) = 15 pF,
tBIT = 500 ns
TCAN330G, TCAN332G, TCAN334G
and TCAN337G only
435
530
ns
400
550
ns
–65
40
ns
See Figure 24, S or STB = 0 V, RL = 60
Ω, CL = 100 pF, CL(RXD) = 15 pF,
tBIT = 200 ns
TCAN330G, TCAN332G, TCAN334G
and TCAN337G only
155
210
ns
120
220
ns
–45
15
ns
10
µs
1000
µs
4
µs
5
0.5
Driver Switching Characteristics
tpHR
Propagation delay time, HIGH TXD to
Driver Recessive
tpLD
Propagation delay time, LOW TXD to
Driver Dominant
tsk(p)
Pulse skew (|tpHR - tpLD|)
tr
Differential output signal rise time
tf
Differential output signal fall time
tTXD_DTO
Driver dominant time out
25
ns
5
17
9
See Figure 25,
RL = 60 Ω, CL = 100 pF
(1)
20
See Figure 19, S, STB and SHDN = 0 V.
RL = 60 Ω, CL = 100 pF,
1.2
2.6
3.8
ms
Receiver Switching Characteristics
tpRH
Propagation delay time, bus recessive
input to high RXD output
tpDL
Propagation delay time, bus dominant
input to RXD low output
tr
Output signal rise time (RXD)
tf
Output signal fall time (RXD)
tRXD_DTO
Receiver dominant time out
(1)
(2)
8
(2)
62
See Figure 20, CL(RXD) = 15 pF CANL =
1.5 V, CANH = 3.5 V
56
ns
7
6
See Figure 27, CL(RXD) = 15 pF
1.6
3
5
ms
The TXD dominant time out (tTXD_DTO) disables the driver of the transceiver once the TXD has been dominant longer than tTXD_DTO,
which releases the bus lines to recessive, preventing a local failure from locking the bus dominant. The driver may only transmit
dominant again after TXD has been returned HIGH (recessive). While this protects the bus from local faults, locking the bus dominant, it
limits the minimum data rate possible. The CAN protocol allows a maximum of eleven successive dominant bits (on TXD) for the worst
case, where five successive dominant bits are followed immediately by an error frame. This, along with the tTXD_DTO minimum, limits the
minimum bit rate. The minimum bit rate may be calculated by: Minimum Bit Rate = 11/ tTXD_DTO = 11 bits / 1.2 ms = 9.2 kbps.
The RXD timeout (tRXD_DTO) disables the RXD output in the case that the bus has been dominant longer than tRXD_DTO, which releases
RXD pin to the recessive state (high), thus preventing a dominant bus failure from permanently keeping the RXD pin low. The RXD pin
will automatically resume normal operation once the bus has been returned to a recessive state. While this protects the protocol
controller from a permanent dominant state, it limits the minimum data rate possible. The CAN protocol allows a maximum of eleven
successive dominant bits (on RXD) for the worst case, where five successive dominant bits are followed immediately by an error frame.
This, along with the tRXD_DTO minimum, limits the minimum bit rate. The minimum bit rate may be calculated by: Minimum Bit Rate = 11 /
tRXD_DTO = 11 bits / 1.6 ms = 6.9 kbps.
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TXD fault stuck dominant, example PCB
failure or bad software
tTXD_DTO
TXD (driver)
Fault is repaired & transmission
capability restored
Driver disabled freeing bus for other nodes
%XV ZRXOG EH ³VWXFN GRPLQDQW´ EORFNLQJ FRPPXQLFDWLRQ IRU WKH
whole network but TXD DTO prevents this and frees the bus for
communication after the time tTXD_DTO.
Normal CAN
communication
CAN
Bus
Signal
tTXD_DTO
Communication from
other bus node(s)
Communication from
repaired node
FAULT is signaled to link layer / protocol.
Fault indication is removed.
TXDDTO
Flag
RXD
(receiver)
Communication from
other bus node(s)
Communication from
local node
Communication from
repaired local node
Figure 1. Example Timing Diagram for TXD DTO and FAULT Pin
Normal CAN
communication
Fault is repaired and normal
communication returns
Bus Fault stuck dominant, example CANH
short to supply and CAN L short to GND.
RXD WITH RXD
DTO
CAN Bus
Signal
RXD
(reciever)
RXD mirrors
bus
tRXD_DTO
RXD output is returned recessive (high) and
FAULT is signaled to link layer / protocol.
FAULT cleared
signal is given
RXDDTO
FLAG
Figure 2. Example Timing Diagram for RXD DTO and FAULT Pin
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8.7 Typical Characteristics
21
Driver Low-Level Output Current (mA)
0.16
Supply Current (RMS) (mA)
20.8
20.6
20.4
20.2
20
19.8
19.6
19.4
200
400
600
Frequency (kbps)
VCC = 3.3 V
60 Ω Load
800
0.1
0.08
0.06
0.04
0.02
1000
0
1
2
3
VO(CANL) - Low-Level Output Voltage (V)
D001
Normal Mode
Temp = 25°C
VO = 0.5 to 3.3 V
VCC = 3.3 V
Figure 3. Supply Current (RSM) vs Frequency
Normal Mode
4
D002
Temp = 25°C
Figure 4. Driver Low-Level Output Current vs Low-level
Output Voltage
160
3.0
RL = Open
RL = 60 :
140
2.5
120
Dominant Voltage (V)
Driver High-Level Output Current (mA)
0.12
0
0
100
80
60
40
2.0
1.5
1.0
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
0.5
20
0
0
1
2
3
VO(CANH) - High-Level Output Voltage (V)
VO = 0.5 to 3.3 V
VCC = 3.3 V
Normal Mode
4
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0.0
-40
-25
-10
D003
Temp = 25°C
Figure 5. Driver High-Level Output Current vs High-level
Output Voltage
10
RL = Open
RL = 60 :
0.14
VO = 0.5 to 3.3 V
VCC = 3.3 V
5
20 35 50 65 80
Free-Air Temperature (qC)
Normal Mode
60 Ω Load
95
110 125
D004
Temp = 25°C
Figure 6. Dominant Voltage (VOD) vs Free-Air Temperature
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68
61
67
60
Propagation Delay Time (ns)
Propagation Delay Time (ns)
8.8 Typical Characteristics, TCAN330 Receiver
66
65
64
63
62
61
60
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
59
58
-40
-20
0
20
40
60
80
100
Free-Air Temperature (qC)
120
58
57
56
55
53
-40
140
-20
0
D005
20
40
60
80
100
Free-Air Temperature (qC)
120
140
D006
Figure 8. Receiver Bus Dominant Input to Low RXD Output
Propagation Delay Time vs Free-Air Temperature
9
6.6
8
6.5
6.4
Receiver Fall Time (ns)
7
6
5
4
3
2
-20
0
20
40
60
80
100
Free-Air Temperature (qC)
120
6.2
6.1
6
5.9
5.8
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
5.6
140
D007
Figure 9. Receiver Rise Time vs Free-Air Temperature
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6.3
5.7
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
1
0
-40
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
54
Figure 7. Receiver Bus Recessive Input to High RXD Output
Propagation Delay Time vs Free-Air Temperature
Receiver Rise Time (ns)
59
5.5
-40
-20
0
20
40
60
80
100
Free-Air Temperature (qC)
120
140
D008
Figure 10. Receiver Fall Time vs Free-Air Temperature
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35
35
30
30
Prapagation Delay Time (ns)
Prapagation Delay Time (ns)
8.9 Typical Characteristics, TCAN330 Driver
25
20
15
10
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
5
0
-40
-20
0
20
40
60
80
100
Free-Air Temperature (qC)
120
Differential Output Signal Fall Time (ns)
Differential Output Signal Rise Time (ns)
20
15
10
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
5
-20
0
20
40
60
80
100
Free-Air Temperature (qC)
120
0
20
40
60
80
100
Free-Air Temperature (qC)
120
140
D010
5
4
3
2
1
20
40
60
80
100
Free-Air Temperature (qC)
120
140
D013
Figure 15. Pulse Skew (|tpHR - tpLD|) vs Free-Air Temperature
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10
8
6
4
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
2
-20
0
20
40
60
80
100
Free-Air Temperature (qC)
120
140
D012
Figure 14. Differential Output Signal Fall Time vs Free-Air
Temperature
Total Loop Delay Recessive to Dominant (ns)
6
0
12
D011
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
-20
14
0
-40
140
9
Pulse Skew (ns)
-20
Figure 12. Driver Low TXD Input to Driver Dominant Output
Propagation Delay Time vs Free-Air Temperature
Figure 13. Differential Output Signal Rise Time vs Free-Air
Temperature
12
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
16
25
0
-40
10
D009
30
7
15
0
-40
140
35
8
20
5
Figure 11. Driver High TXD Input to Driver Recessive Output
Propagation Delay Time vs Free-Air Temperature
0
-40
25
100
90
80
70
60
50
40
30
20
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
10
0
-40
-20
0
20
40
60
80
100
Free-Air Temperature (qC)
120
140
D014
Figure 16. Total Loop Delay Recessive to Dominant
tPROP(LOOP1) vs Free-Air Temperature
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Total Loop Delay Dominant to Recessive (ns)
Typical Characteristics, TCAN330 Driver (continued)
98
96
94
92
90
88
86
84
VCC = 3 V
VCC = 3.3 V
VCC = 3.6 V
82
80
-40
-20
0
20
40
60
80
100
Free-Air Temperature (qC)
120
140
D015
Figure 17. Total Loop Delay Dominant to Recessive tPROP(LOOP2) vs Free-Air Temperature
9 Parameter Measurement Information
CANH
TXD
RL
CL
CANL
Figure 18. Supply Test Circuit
CANH
TXD
VCC
TXD
RL
CANL
CL
VO(CANH)
VO(CANL)
VOD
50%
50%
tpLD
VOD
0V
tpHR
90%
0.9V
0.5V
10%
tR
tF
Figure 19. Driver Test Circuit and Measurement
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Parameter Measurement Information (continued)
CANH
+
VID
IO
RXD
1.5 V
0.9 V
0.5 V
0V
VID
+
±
VO
CL_RXD
CANL
tpDL
tpRH
VOH
90%
VO(RXD)
50%
±
10%
VOL
tF
tR
Figure 20. Receiver Test Circuit and Measurement
CANH
VIH
VIH
TXD
0V
CL
RL
SHDN/S/STB
S
50%
50%
CANL
VI
SHDN/S/STB
0V
0V
tMODE
tMODE
RXD
+
VO
VOH
CL_RXD
RXD
±
CANH - CANL
50%
500mV
VOL
Figure 21. tMODE Test Circuit and Measurement, from Normal to Shutdown, Standby or Silent Mode
VIH
VIH
TXD
CANH
VI
TXD
TXD
CL
RL
0V
200 ns
0V
200 ns
CANL
VI
SHDN/S/STB
VIH
VIH
SHDN/S/STB
50%
S
50%
RXD
VO
0V
0V
+
tMODE
tMODE
CL_RXD
VOH
VOH
±
RXD
900 mV
50%
CANH - CANL
VOL
Figure 22. tMODE Test Circuit and Measurement, from Shutdown, Standby or Silent to Normal Mode
14
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Parameter Measurement Information (continued)
CANH
VCC
TXD
VI
CL
RL
50%
TXD
CANL
0V
tPROP(LOOP2)
tPROP(LOOP1)
RXD
+
VO
VOH
CL_RXD
50%
RXD
±
VOL
Figure 23. tPROP(LOOP) Test Circuit and Measurement
VI
70%
TXD
30%
30%
CANH
0V
5 x tBIT
TXD
VI
tBIT
RL
CANL
900mV
CANH - CANL
500mV
RXD
tBUS_SYM
VO
CL_RXD
VOH
70%
RXD
30%
tREC_SYM
VOL
Figure 24. Loop Delay Symmetry Test Circuit and Measurement
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Parameter Measurement Information (continued)
CANH
VIH
TXD
TXD
CL
RL
0V
VOD
VOD(D)
CANL
0.9 V
VOD
0.5 V
0V
tTXD_DTO
Figure 25. TXD Dominant Time Out Test Circuit and Measurement
200 s
IOS
CANH
TXD
VBUS
IOS
VBUS
CANL
VBUS
0V
or
0V
VBUS
VBUS
Figure 26. Driver Short-Circuit Current Test and Measurement
VID(D)
CANH
+
VID
RXD
VID
0.9 V
0.5 V
0V
+
±
CANL
CL_RXD
VO
±
VOH
RXD
50%
0V
tRXD_DTO
Figure 27. RXD Dominant Timeout Test Circuit and Measurement
16
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Parameter Measurement Information (continued)
IFAULT
FAULT
TXD
DTO
RXD
DTO
+
±
Thermal
Shutdown
GND
UV
Lockout
Figure 28. FAULT Test and Measurement
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10 Detailed Description
10.1 Overview
This family of CAN transceivers is compatible with the ISO11898-2 High-Speed CAN (controller area network)
physical layer standard. They are designed to interface between the differential bus lines in CAN and the CAN
protocol controller.
10.2 Functional Block Diagram
SHDN / NC / FAULT
Note C
VCC
5
3
FAULT LOGIC
VCC
Note B
VCC
VCC
1
7
BIAS UNIT
TXD
DOMINANT
TIME OUT
Under
Voltage
CANH
6
CANL
S / NC / STB
8
Note C
CONTROL and
MODE
LOGIC
Sleep Receiver
Note A
WAKE
DETECT
MUX
4
RXD
Normal Receiver
DOMINANT
TIME OUT
2
GND
18
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A.
Sleep Receiver and Wake Detect are device dependent options and are only available in TCAND334.
B.
Fault Logic is only available in TCAND337.
C.
Pin 5 and 8 functions are device dependent. Refer to Device Options.
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10.3 Feature Description
10.3.1 TXD Dominant Timeout (TXD DTO)
During normal mode (the only mode where the CAN driver is active), the TXD DTO circuit prevents the
transceiver from blocking network communication in the event of a hardware or software failure where TXD is
held dominant longer than the timeout period tTXD_DTO. The DTO circuit timer starts on a falling edge on TXD.
The DTO circuit disables the CAN bus driver if no rising edge is seen before the timeout period expires. This
frees the bus for communication between other nodes on the network. The CAN driver is re-activated when a
recessive signal is seen on TXD pin, thus clearing the TXD DTO condition. The receiver and RXD pin still reflect
the CAN bus, and the bus pins are biased to recessive level during a TXD dominant timeout.
10.3.2 RXD Dominant Timeout (RXD DTO)
All devices have a RXD DTO circuit that prevents a bus stuck dominant fault from permanently driving the RXD
output dominant (low) when the bus is held dominant longer than the timeout period tRXD_DTO. The RXD DTO
timer starts on a falling edge on RXD (bus going dominant). If no rising edge (bus returning recessive) is seen
before the timeout constant of the circuit expires (tRXD_DTO), the RXD pin returns high (recessive). The RXD
output is re-activated to mirror the bus receiver output when a recessive signal is seen on the bus, clearing the
RXD dominant timeout. The CAN bus pins are biased to the recessive level during a RXD DTO.
10.3.3 Thermal Shutdown
If the junction temperature of the device exceeds the thermal shutdown threshold, the device turns off the CAN
driver circuits thus blocking the TXD-to-bus transmission path. The shutdown condition is cleared when the
junction temperature of the device drops below the thermal shutdown temperature of the device. If the fault
condition that caused the thermal shutdown is still present, the temperature may rise again and the device will
enter thermal shut down again. Prolonged operation with thermal shutdown conditions may affect device
reliability. The thermal shutdown circuit includes hysteresis to avoid oscillation of the driver output.
During thermal shutdown the CAN bus drivers are turned off, thus no transmission is possible from TXD to the
bus. The CAN bus pins are biased to recessive level during a thermal shutdown and the receiver to RXD path
remains operational.
10.3.4 Undervoltage Lockout and Unpowered Device
The VCC supply terminal has under voltage detection which will place the device in protected mode if the supply
drops below the UVLO threshold. This protects the bus during an under voltage event on VCC by placing the bus
into a high impedance biased to ground state and the RXD terminal into a tri-stated (high impedance) state.
During undervoltage the device does not pass any signals from the bus. If the device is in normal mode and VCC
supply is lost the device will transition to a protected mode.
The device is designed to be an "ideal passive" or “no load” to the CAN bus if the device is unpowered. The bus
terminals (CANH, CANL) have low leakage currents when the device is unpowered, so the device does not load
the bus. This is critical if some nodes of the network are unpowered while the rest of the of network remains
operational. Logic pins also have low leakage currents when the device is unpowered, so the device does not
load other circuits which may remain powered.
Table 1. Undervoltage Protection 3.3-V Single Supply Devices
VCC
DEVICE STATE
BUS
RXD
GOOD
BAD
Operational
Per Operating Mode
Per Operating Mode
Protected
Common mode bias to GND
UNPOWERED
High Impedance
Unpowered
High Impedance (no load)
High Impedance
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10.3.5 Fault Pin (TCAN337)
If one or more of the faults (TXD-Dominant Timeout, RXD dominant Timeout, Thermal Shutdown or
Undervoltage Lockout) occurs, the FAULT pin (open-drain) turns off, resulting in a high level when externally
pulled up to VCC supply.
VCC
P
FAULT
Input
TXD
DTO
FAULT
RXD
DTO
Thermal
Shutdown
UV
Lockout
GND
Figure 29. FAULT Pin Function Diagram and Application
10.3.6 Floating Pins
The device has internal pull ups and pull downs on critical terminals to place the device into known states if the
pin floats. See Table 1 for details on pin bias conditions.
Table 2. Pin Bias
PIN
PULL UP or PULL DOWN
COMMENT
TXD
Pull up
Weakly biases TXD toward recessive to prevent bus blockage or TXD DTO
triggering.
STB
Pull down
Weakly biases STB terminal towards normal mode.
S
Pull down
Weakly biases S terminal towards normal mode.
SHDN
Pull down
Weakly biases SHDN terminal towards normal mode.
The internal bias should not be relied on by design, especially in noisy environments, but should be considered a
fall back protection. Special care needs to be taken when the device is used with MCUs using open drain
outputs. TXD is weakly internally pulled up. The TXD pull up strength and CAN bit timing require special
consideration when this device is used with an open drain TXD output on the microprocessor's CAN controller.
An adequate external pull up resistor must be used to ensure that the TXD output of the microprocessor
maintains adequate bit timing input to the CAN transceiver.
10.3.7 CAN Bus Short Circuit Current Limiting
The device has several protection features that limit the short circuit current when a CAN bus line is shorted.
These include CAN driver current limiting (dominant and recessive). The device has TXD dominant time out
which prevents permanently having the higher short circuit current of dominant state in case of a system fault.
During CAN communication the bus switches between dominant and recessive states, thus the short circuit
current may be viewed either as the current during each bus state or as a DC average current. For system
current and power considerations in the termination resistors and common mode choke ratings the average short
circuit current should be used. The percentage dominant is limited by the TXD dominant time out and CAN
protocol which has forced state changes and recessive bits such as bit stuffing, control fields, and interframe
space. These ensure there is a minimum recessive amount of time on the bus even if the data field contains a
high percentage of dominant bits.
20
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The short circuit current of the bus depends on the ratio of recessive to dominant bits and their respective short
circuit currents. The average short circuit current may be calculated with the following formula:
IOS(AVG) = %Transmit x [(%REC_Bits x IOS(SS)_REC ) + (%DOM_Bits x IOS(SS)_DOM)] + [%Receive x IOS(SS)_REC]
(1)
Where:
• IOS(AVG) is the average short circuit current
• %Transmit is the percentage the node is transmitting CAN messages
• %Receive is the percentage the node is receiving CAN messages
• %REC_Bits is the percentage of recessive bits in the transmitted CAN messages
• %DOM_Bits is the percentage of dominant bits in the transmitted CAN messages
• IOS(SS)_REC is the recessive steady state short circuit current
• IOS(SS)_DOM is the dominant steady state short circuit current
The short circuit current and possible fault cases of the network should be taken into consideration when sizing
the power ratings of the termination resistance and other network components.
10.3.8 ESD Protection
The bus pins of the TCAN33x family possess on-chip ESD protection against ±25-kV human body model (HBM)
and ±12-kV IEC61000-4-2 contact discharge. The IEC-ESD test is far more severe than the HBM-ESD test. The
50% higher charge capacitance, CS, and 78% lower discharge resistance, RD of the IEC model produce
significantly higher discharge currents than the HBM-model.
As stated in the IEC 61000-4-2 standard, contact discharge is the preferred test method; although IEC air-gap
testing is less repeatable than contact testing, air discharge protection levels are inferred from the contact
discharge test results.
RD
50M
(1M)
High-Voltage
Pulse
Generator
330Ω
(1.5k)
CS
150pF
(100pF)
Device
Under
Test
Current - A
RC
40
35
30
25
20
15
10
5
0
10kV IEC
10kV HBM
0
50
100
150
200
250
300
Time - ns
Figure 30. HBM and IEC-ESD Models and Currents in Comparison (HBM Values in Parenthesis)
10.3.9 Digital Inputs and Outputs
All the devices in this family are single 3.3-V nominal supply devices. The digital logic input and output levels for
these devices have TTL threshold levels.
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10.4 Device Functional Modes
10.4.1 CAN Bus States
The CAN bus has two logical states during operation: recessive and dominant. See Figure 31 and Figure 32.
Recessive bus state is when the high resistive internal input resistors of each node's receiver bias the bus to a
common mode of about 1.85 V across the bus termination resistors. Recessive is equivalent to logic high and is
typically a differential voltage on the bus of about 0 V. Recessive state is also the idle state.
Dominant bus state is when the bus is driven differentially by one or more drivers. Current is induced to flow
through the termination resistors and generate a differential voltage on the bus. Dominant is equivalent to logic
low and is a differential voltage on the bus greater than the minimum threshold for a CAN dominant. A dominant
state overwrites the recessive state.
During arbitration, multiple CAN nodes may transmit a dominant bit at the same time. In this case the differential
voltage of the bus will be greater than the differential voltage of a single driver.
The host microprocessor of the CAN node will use the TXD terminal to drive the bus and will receive data from
the bus on the RXD pin.
Transceivers with low power Standby Mode have a third bus state where the bus terminals are weakly biased to
ground via the high resistance internal resistors of the receiver. See Figure 31 and Figure 32.
Standby and Shutdown
Modes
Typical Bus Voltage
Normal and Silent Modes
CANH
CANH
1.85 V
Vdiff
Bias
Unit
Vdiff
CANL
A
RXD
B
CANL
Recessive
Dominant
Recessive
Figure 31. Bus States (Physical Bit
Representation)
Time, t
A.
Normal and Silent Modes
B.
Standby and Shutdown Modes
Figure 32. Simplified Recessive Common Mode
Bias Unit and Receiver
The devices have four main operating modes:
1. Normal mode (all devices)
2. Silent mode (TCAN330, TCAN337)
3. Standby mode with wake (TCAN334)
4. Shutdown mode (TCAN330, TCAN334)
Table 3. CAN Transceivers with Silent Mode
(1)
(2)
22
S
Device MODE
DRIVER
RECEIVER
HIGH
Reduced Power Silent
(Listen) Mode
Disabled (OFF) (1)
Enabled (ON)
LOW/NC
Normal Mode
Enabled (ON)
Enabled (ON)
RXD PIN
Mirrors Bus State (2)
See Figure 31 for bus state.
Mirrors bus state: low if CAN bus is dominant, high if CAN bus is recessive.
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Table 4. CAN Transceivers with Standby Mode with Wake
STB
(1)
(2)
(3)
Device MODE
DRIVER
HIGH
Ultra Low Current Standby
Mode
Disabled (OFF) (1)
LOW/NC
Normal Mode
Enabled (ON)
RECEIVER
RXD Terminal
High (Recessive) until
Low Power Receiver and
WUP, then filtered mirrors
Bus Monitor Enabled (ON)
of Bus State (2)
Enabled (ON)
Mirrors Bus State
(3)
See Figure 31 for bus state.
Standby Mode RXD behavior: See Figure 33.
Mirrors bus state: low if CAN bus is dominant, high if CAN bus is recessive.
Table 5. CAN Transceivers with Shutdown Mode
(1)
(2)
SHDN
Device MODE
DRIVER
RECEIVER
RXD Terminal
HIGH
Lowest Current
Disabled (OFF) (1)
Disabled (OFF)
High (Recessive)
LOW/NC
Normal Mode
Enabled (ON)
Enabled (ON)
Mirrors Bus State
(2)
See Figure 31 for bus state.
Mirrors bus state: low if CAN bus is dominant, high if CAN bus is recessive.
10.4.2 Normal Mode
This is the normal operating mode of the device. The CAN driver and receiver are fully operational and CAN
communication is bi-directional. The driver is translating a digital input on TXD to a differential output on CANH
and CANL. The receiver is translating the differential signal from CANH and CANL to a digital output on RXD.
10.4.3 Silent Mode
This is the silent or receive only mode of the device. The CAN driver is disabled but the receiver is fully
operational. CAN communication is unidirectional and only flows from the CAN bus through the receive path of
the transceiver to the CAN protocol controller via the RXD output pin. The receiver is translating the differential
signal from CANH and CANL to a digital output on RXD.
10.4.4 Standby Mode with Wake
This is the low power mode of the device. The CAN driver and main receiver are turned off and bi-directional
CAN communication is not possible. The low power receiver and bus monitor are enabled to allow for RXD Wake
Requests via the CAN bus. A wake up request will be output to RXD (driven low) as shown in Figure 33. The
local CAN protocol microprocessor should monitor RXD for transitions (high to low) and reactivate the device to
normal mode based on the RXD Wake Request. The CAN bus pins are weakly pulled to GND during this mode,
see Figure 32.
10.4.5 Bus Wake via RXD Request (BWRR) in Standby Mode
The TCAN334 with low power standby mode, offers a wake up from the CAN bus mechanism called bus wake
via RXD Request (BWRR) to indicate to a host microprocessor that the bus is active and it should wake up and
return to normal CAN communication.
This device uses the multiple filtered dominant wake-up pattern (WUP) from ISO11898-5 to qualify bus traffic into
a request to wake the host microprocessor. The bus wake request is signaled to the microprocessor by a falling
edge and low corresponding to a “filtered” bus dominant on the RXD terminal (BWRR).
The wake up pattern (WUP) consists of a filtered dominant bus, then a filtered recessive bus time followed by a
second filtered bus time. Once the WUP is detected the device will start issuing wake up requests (BWRR) on
the RXD terminal every time a filtered dominant time is received from the bus. The first filtered dominant initiates
the WUP and the bus monitor waits on a filtered recessive; other bus traffic does not reset the bus monitor. Once
a filtered recessive is received, the bus monitor waits on a filtered dominant and again; other bus traffic does not
reset the bus monitor. Immediately upon receiving of the second filtered dominant, the bus monitor recognizes
the WUP and transitions to BWRR mode. In this mode, RXD is driven low for all dominant bits lasting for longer
than tWK_FILTER. The RXD output during BWRR matches the classical 8-pin CAN devices, such as the
TCANA1040A-Q1 device, that used the single filtered dominant on the bus as the wake up request mechanism
from ISO11898-5.
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For a dominant or recessive to be considered filtered, the bus must be in that state for more than tWK_FILTER time.
Due to variability in the tWK_FILTER the following scenarios are applicable. Bus state times less than tWK_FILTER(MIN)
are never detected as part of a WUP and thus no BWRR is generated. Bus state times between tWK_FILTER(MIN)
and tWK_FILTER(MAX) may be detected as part of a WUP and a BWRR may be generated. Bus state times more
than tWK_FILTER(MAX) are always detected as part of a WUP and thus a BWRR is always generated.
See Figure 33 for the timing diagram of the WUP. The pattern, tWK_FILTER time used for the WUP and BWRR
prevent noise and bus stuck dominant faults from causing false wake requests. If the device is switched to
normal mode, or an under voltage event occurs on VCC the BWRR will be lost.
Wake Up Pattern (WUP)
Filtered
Dominant
Waiting for
Filtered
Recessive
Filtered
Recessive
Wake Request via RXD
Waiting for
Filtered
Dominant
Filtered
Dominant
Bus
Bus VDiff
• tWK_FILTER
• tWK_FILTER
• tWK_FILTER
• tWK_FILTER
RXD
Figure 33. Wake Up Pattern (WUP) and Bus Wake via RXD Request (BWRR)
10.4.6 Shutdown Mode
This is the lowest power mode of all of the devices. The CAN driver and receiver are turned off and bi-directional
CAN communication is not possible. It is not possible to receive a remote wake request via the CAN bus in this
mode. The CAN bus pins are pulled to GND during this mode as shown in Figure 31.
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10.4.7 Driver and Receiver Function Tables
Table 6. Driver Function Table
DEVICE MODE
Normal
(1)
(2)
(3)
TXD (1) INPUT
BUS OUTPUTS (2)
DRIVEN BUS STATE
CANH
CANL
L
H
L
Dominant
Biased Recessive
H or Open
Z
Z
Silent
X
Z
Z
Biased Recessive
Standby
X
Z
Z
Weak Pull to GND
Shutdown
X
Z
Z
Weak Pull to GND
(3)
H = high level, L = low level, X = irrelevant.
H = high level, L = low level, Z = high Z receiver bias.
For Bus state and bias see Figure 31 and Figure 32.
Table 7. Receiver Function Table Normal and Standby Modes
DEVICE MODE
Normal or Silent
Standby
(1)
CAN DIFFERENTIAL INPUTS
V(ID) = V(CANH) – V(CANL)
BUS STATE
RXD PIN (1)
V(ID) ≥ 0.9 V
Dominant
L
0.5 V < V(ID) < 0.9 V
?
?
V(ID) ≤ 0.5 V
Recessive
H
V(ID) ≥ 1.15 V
Dominant
0.4 V < V(ID) < 1.15 V
?
See Figure 33
V(ID) ≤ 0.4 V
Recessive
Shutdown
Any
Recessive
H
Any
Open (V(ID) ≈ 0 V)
Open
H
I = high level, L = low level, ? = indeterminate.
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11 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
11.1 Application Information
11.1.1 Bus Loading, Length and Number of Nodes
The ISO 11898 standard specifies a data rate up to 1 Mbps, maximum CAN bus cable length of 40 m, maximum
drop line (stub) length of 0.3 m and a maximum of 30 nodes. However, with careful network design, the system
may have longer cables, longer stub lengths, and many more nodes to a bus. Many CAN organizations and
standards have scaled the use of CAN for applications outside the original ISO 11898 standard. They have made
system level trade-offs for data rate, cable length, and parasitic loading of the bus. Examples of some of these
specifications are ARINC825, CANopen, CAN Kingdom, DeviceNet and NMEA200.
A high number of nodes requires a transceiver with high input impedance and wide common mode range such
as the TCAN33x CAN family. ISO 11898-2 specifies the driver differential output with a 60-Ω load (two 120- Ω
termination resistors in parallel) and the differential output must be greater than 1.5 V. The TCAN33x devices are
specified to meet the 1.5-V requirement with a 50-Ω load across a common mode range of –12 V to 12 V
through a 330-Ω coupling network. This network represents the bus loading of 120 TCAN33x transceivers based
on their minimum differential input resistance of 40 kΩ.
For CAN network design, margin must be given for signal loss across the system and cabling, parasitic loadings,
network imbalances, ground offsets and signal integrity, thus a practical maximum number of nodes may be
lower. Bus length may also be extended beyond the original ISO 11898 standard of 40 m by careful system
design and data rate tradeoffs. For example, CANopen network design guidelines allow the network to be up to
1 km with changes in the termination resistance, cabling, number of nodes and data rate.
This flexibility in CAN network design is one of the key strengths of the various extensions and additional
standards that have been built on the original ISO 11898 CAN standard.
11.2 Typical Application
VCC
SHDN/
FAULT
VIN
VIN
VOUT
3-V Voltage
Regulator
VCC
S / STB
3
5
TCAN33x
8
CAN Transceiver
7
CANH
3-V MCU
(e.g. TPSxxxx)
RXD
TXD
RXD
TXD
4
1
6
2
GND
CANL
Optional:
Terminating
Node
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Figure 34. Typical 3.3-V Application
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Typical Application (continued)
11.2.1 Design Requirements
11.2.1.1 CAN Termination
The ISO 11898 standard specifies the interconnect to be a twisted-pair cable (shielded or unshielded) with 120-Ω
characteristic impedance (ZO). Resistors equal to the characteristic impedance of the line should be used to
terminate both ends of the cable to prevent signal reflections. Unterminated drop lines (stubs) connecting nodes
to the bus should be kept as short as possible to minimize signal reflections. The termination may be on the
cable or in a node, but if nodes may be removed from the bus the termination must be carefully placed so that it
is not removed from the bus.
11.2.2 Detailed Design Procedure
Termination is typically a 120-Ω resistor at each end of the bus. If filtering and stabilization of the common mode
voltage of the bus is desired, then split termination may be used (see Figure 8). Split termination uses two 60-Ω
resistors with a capacitor in the middle of these resistors to ground. Split termination improves the
electromagnetic emissions behavior of the network by eliminating fluctuations in the bus common mode voltages
at the start and end of message transmissions.
Care should be taken in the power ratings of the termination resistors used. Typically the worst case condition
would be if the system power supply was shorted across the termination resistance to ground. In most cases the
current flow through the resistor in this condition would be much higher than the transceiver's current limit.
Node 1
Node 2
Node 3
MCU or DSP
MCU or DSP
MCU or DSP
CAN
Controller
CAN
Controller
CAN
Controller
CAN Transceiver
CAN Transceiver
CAN Transceiver
Node n
(with termination)
MCU or DSP
CAN
Controller
CAN Transceiver
RTERM
RTERM
Figure 35. Typical CAN Bus
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Typical Application (continued)
Standard Termination
Split Termination
CANH
CANH
RTERM/2
CAN
Transceiver
CAN
Transceiver
RTERM
CSPLIT
RTERM/2
CANL
CANL
Figure 36. CAN Bus Termination Concepts
11.2.3 Application Curves
1 Mbps
60 Ω Load
Temp = 25°C
VCC = 3.3 V
Figure 37. TXD, CANH/L and RXD Waveforms
5 Mbps
60 Ω Load
Temp = 25°C
VCC = 3.3 V
Figure 38. TXD, CANH/L and RXD Waveforms
11.3 System Examples
11.3.1 ISO11898 Compliance of TCAN33x Family of 3.3-V CAN Transceivers Introduction
Many users value the low power consumption of operating their CAN transceivers from a 3.3-V supply. However,
some are concerned about the interoperability with 5 V supplied transceivers on the same bus. This report
analyzes this situation to address those concerns.
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System Examples (continued)
11.3.2 Differential Signal
CAN is a differential bus where complementary signals are sent over two wires and the voltage difference
between the two wires defines the logical state of the bus. The differential CAN receiver monitors this voltage
difference and outputs the bus state with a single ended logic level output signal.
NOISE MARGIN
900 mV Threshold
RECEIVER DETECTION WINDOW
75% SAMPLE POINT
500 mV Threshold
NOISE MARGIN
Figure 39. Typical Differential Output Waveform
The CAN driver creates the differential voltage between CANH and CANL in the dominant state. The dominant
differential output of the TCAN33x is greater than 1.5 V and less than 3 V across a 60-Ω load as defined by the
ISO11898 standard. These are the same limiting values for 5 V supplied CAN transceivers. The bus termination
resistors drive the recessive bus state and not the CAN driver.
A CAN receiver is required to output a recessive state when less than 500 mV of differential voltage exists on the
bus, and a dominant state when more than 900 mV of differential voltage exists on the bus. The CAN receiver
must do this with common-mode input voltages from –2 V to 7 V. The TCAN33x family receivers meet these
same input specifications as 5 V supplied receivers.
11.3.3 Common-Mode Signal and EMC Performance
A common-mode signal is an average voltage of the two signal wires that the differential receiver rejects. The
common-mode signal comes from the CAN driver, ground noise, and coupled bus noise. Since the bias voltage
of the recessive state of the device is dependent on VCC, any noise present or variation of VCC has an effect on
this bias voltage seen by the bus. The TCAN33x family has the recessive bias voltage set higher than 0.5 x VCC
to match common mode in recessive mode to dominant mode. This results in superior EMC performance.
12 Power Supply Recommendations
To ensure reliable operation at all data rates and supply voltages, each supply should be decoupled with a 100nF ceramic capacitor located as close to the VCC supply pins as possible. The TPS76333 is a linear voltage
regulator suitable for the 3.3 V supply.
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13 Layout
13.1 Layout Guidelines
TCAN33x family of devices incorporates integrated IEC 61000-4-2 ESD protection. Should the system requires
additional protection against ESD, EFT or surge, additional external protection and filtering circuitry may be
needed.
In order for the PCB design to be successful, start with design of the protection and filtering circuitry. Because
ESD and EFT transients have a wide frequency bandwidth from approximately 3 MHz to 3 GHz, high frequency
layout techniques must be applied during PCB design.
Design the bus protection components in the direction of the signal path. Do not force the transient current to
divert from the signal path to reach the protection device. Below is a list of layout recommendations when
designing a CAN transceiver into an application.
• Transient Protection on CANH and CANL: Transient Voltage Suppression (TVS) and capacitors (D1, C5 and
C7 shown in Figure 40) can be used for additional system level protection. These devices must be placed as
close to the connector as possible. This prevents the transient energy and noise from penetrating into other
nets on the board.
• Bus Termination on CANH and CANL: Figure 40 shows split termination where the termination is split into two
resistors, R5 and R6, with the center or split tap of the termination connected to ground through capacitor C6.
Split termination provides common mode filtering for the bus. When termination is placed on the board
instead of directly on the bus, care must be taken to ensure the terminating node is not removed from the
bus, as this causes signal integrity issues if the bus is not properly terminated on both ends.
• Decoupling Capacitors on VCC: Bypass and bulk capacitors must be placed as close as possible to the supply
pins of transceiver (examples are C2 and C3).
• Ground and power connections: Use at least two vias for VCC and ground connections of bypass capacitors
and protection devices to minimize trace and via inductance.
• Digital inputs and outputs: To limit current of digital lines, serial resistors may be used. Examples are R1, R2,
R3 and R4.
• Filtering noise on digital inputs and outputs: To filter noise on the digital I/O lines, a capacitor may be used
close to the input side of the I/O as shown by C1, C8 and C4.
• Fault Output Pin (TCAN337 only): Because the FAULT output pin is an open drain output, an external pullup
resistor is required to pull the pin voltage high for normal operation (R7).
• TXD input pin: If an open-drain host processor is used to drive the TXD pin of the device, an external pullup
resistor between 1 kΩ and 10 kΩ must be used to help drive the recessive input state of the device (weak
internal pullup resistor).
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13.2 Layout Example
TXD
R1
R3
C4
GND
2
7
R5
6
R6
4
5
R4
C8
VCC
J1
3
D1
R2
C6
C7
RXD
C3
C2
VCC
U1
TCAN33x
S/STB
C5
8
C1
1
SHDN
R7
FAULT
Figure 40. Layout Example
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14 Device and Documentation Support
14.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 8. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TCAN330
Click here
Click here
Click here
Click here
Click here
TCAN332
Click here
Click here
Click here
Click here
Click here
TCAN334
Click here
Click here
Click here
Click here
Click here
TCAN337
Click here
Click here
Click here
Click here
Click here
TCAN330G
Click here
Click here
Click here
Click here
Click here
TCAN332G
Click here
Click here
Click here
Click here
Click here
TCAN334G
Click here
Click here
Click here
Click here
Click here
TCAN337G
Click here
Click here
Click here
Click here
Click here
14.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
14.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
14.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
14.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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6-Feb-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TCAN330D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC330
TCAN330DCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
330
TCAN330DCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
330
TCAN330DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC330
TCAN330GD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC330
TCAN330GDCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
330
TCAN330GDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
330
TCAN330GDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC330
TCAN332D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC332
TCAN332DCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
332
TCAN332DCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
332
TCAN332DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC332
TCAN332GD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC332
TCAN332GDCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
332
TCAN332GDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
332
TCAN332GDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC332
TCAN334D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC334
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2020
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TCAN334DCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
334
TCAN334DCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
334
TCAN334DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC334
TCAN334GD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC334
TCAN334GDCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
334
TCAN334GDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
334
TCAN334GDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC334
TCAN337D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC337
TCAN337DCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
337
TCAN337DCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
337
TCAN337DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC337
TCAN337GD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC337
TCAN337GDCNR
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
337
TCAN337GDCNT
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
337
TCAN337GDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-40 to 125
TC337
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2020
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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