TDC1000-TDC7200EVM User’s Guide
User's Guide
Literature Number: SNIU021A
October 2014 – Revised November 2015
Contents
1
General Description.............................................................................................................. 5
2
EVM Package Contents ......................................................................................................... 7
3
Quick Start .......................................................................................................................... 9
4
Software Installation ........................................................................................................... 11
4.1
5
TDC1000-TDC7200EVM Setup and Operation ......................................................................... 13
5.1
5.2
6
Graphical User Interface (GUI) ........................................................................................... 11
EVM Connections .......................................................................................................... 13
Launching the Software ................................................................................................... 14
Troubleshooting ................................................................................................................. 20
6.1
6.2
6.3
Jumpers ..................................................................................................................... 20
LEDs ......................................................................................................................... 21
Driver Errors ................................................................................................................ 21
7
Firmware Upgrade .............................................................................................................. 24
8
Board Layout ..................................................................................................................... 27
......................................................................................................................... 35
10
Bill of Materials .................................................................................................................. 39
Revision History .......................................................................................................................... 44
9
Schematic
2
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List of Figures
3-1.
TDC1000-TDC7200EVM Evaluation Board .............................................................................. 9
4-1.
TDC1000-TDC7200EVM Installation Directory ......................................................................... 11
5-1.
Transducer Connected to Channel 1 (TX1/RX2)
5-2.
TDC1000_7200EVM Graph............................................................................................... 14
5-3.
Plot of TOF of Water in Test Cell
5-4.
5-5.
5-6.
5-7.
6-1.
6-2.
6-3.
7-1.
7-2.
8-1.
8-2.
8-3.
8-4.
8-5.
8-6.
8-7.
8-8.
9-1.
9-2.
9-3.
......................................................................
........................................................................................
EVM GUI - TDC1000 Tab .................................................................................................
EVM GUI – Debug Tab ....................................................................................................
TDC1000-TDC7200EVM Board Connected to Oscilloscope .........................................................
START and STOP Signals on Oscilloscope ...........................................................................
Jumpers .....................................................................................................................
TDC1000-TDC7200EVM LEDs...........................................................................................
Device Manager with COM Port Name ..................................................................................
Connection Error Pop-up Window .......................................................................................
USB Firmware Upgrade Window .........................................................................................
Top Overlay .................................................................................................................
Top Solder Mask ...........................................................................................................
Top Layer....................................................................................................................
Mid Layer 1..................................................................................................................
Mid Layer 2..................................................................................................................
Bottom Layer ................................................................................................................
Bottom Solder Mask .......................................................................................................
Board Dimensions ..........................................................................................................
TDC1000-TDC7200EVM Schematic 1 ..................................................................................
TDC1000-TDC7200EVM Schematic 2 ..................................................................................
TDC1000-TDC7200EVM Schematic 3 ..................................................................................
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List of Figures
13
15
16
16
17
18
20
21
22
24
25
27
28
29
30
31
32
32
33
35
36
37
3
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List of Tables
4
.....................................................................................................................
6-1.
Jumpers
10-1.
TDC1000-TDC7200EVM Bill of Materials ............................................................................... 39
List of Tables
20
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Chapter 1
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General Description
This guide details the use of the TDC1000-TDC7200EVM evaluation module (referred to as EVM for the
remainder of this document). The TDC1000 analog-front-end (AFE) is an ultrasonic analog-front-end for
Time-of-Flight (TOF) applications operating with ultrasound frequencies up to 4MHz.The TDC7200 is a
Time to Digital Converter (TDC) that performs the function of a stopwatch and measures the elapsed time
between up to five events.
In addition to the EVM, a Steminc 15mm 1Mhz transducer is included in the evaluation kit. It has been
provided for experimentation with liquid level applications and liquid identification/concentration
applications. This transducer is not suitable for flow meter applications. For instructions how to mount the
transducer on a tank, please refer to Application Note SNAA266 (http://www.ti.com/lit/pdf/snaa266).
The EVM can be used for many time-of-flight applications such as gas, water, and heat flow meter, fluid
level detection, concentration and fluid identification, and proximity or distance measurement. The EVM
allows for two ultrasonic transducer connections, and two RTD connections for temperature
measurements. It uses the on-board MSP430F5528 to process data and a user-friendly GUI interface to
display the data.
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General Description
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6
General Description
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Chapter 2
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EVM Package Contents
The TDC1000-TDC7200EVM evaluation kit comes with the following:
• On-board TDC7200 and TDC1000
• On-board MPS430 microcontroller
• Steminc 15mm 1Mhz transducer (SMD15T21R111WL)
• USB Mini-B to USB-A plug cable
The example in this document uses a "test cell" which is comprised of an acrylic container with an
ultrasonic transducer mounted on the side of the container. The acrylic container can be purchased from
Tap Plastics at http://www.tapplastics.com/product/plastics/plastic_containers/clear_plastic_boxes/222,
and/or STEMINC's transducer (p/n: SMD10T2R11) (http://www.steminc.com/PZT/en/piezo-ceramic-disc10x2mm-r-215-khz-wire-leads-smd10t2r111wl) can be mounted on the side of the test cell. For
instructions to assemble your own "Test cell" please refer to Application Note SNAA266
(http://www.ti.com/lit/pdf/snaa266).
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EVM Package Contents
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EVM Package Contents
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Chapter 3
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Quick Start
1. Download the TDC1000-TDC7200EVM software
2. Install the GUI. For detailed information, see Chapter 4.
3. Fill the test cell with water; ensure the water level is above the transducer. Description of this test cell
can be found in Chapter 2.
4. Connect the transducer to TX1 (J5, pin 8) and GND (J5, pin 7). For more information, see Section 5.1.
5. Connect the EVM board with a mini USB cable (J2).
6. Launch the GUI.
7. On the GRAPH tab, press the START GRAPH button.
8. The time of flight should be read in the TDC AVG VALUE section, and should be around 39.7 us (this
result is only applicable if using the test cell discussed in Chapter 2) .
Figure 3-1. TDC1000-TDC7200EVM Evaluation Board
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Quick Start
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Quick Start
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Chapter 4
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Software Installation
4.1
Graphical User Interface (GUI)
Installing the TDC1000-TDC7200EVM GUI software:
1. Download the TDC1000-TDC7200EVM_Installer-v??.zip into a known directory. This software can be
found in http://www.ti.com/tool/tdc1000-tdc7200evm.
2. Make sure that the EVM has the latest firmware. For detail information, refer to Chapter 7.
3. Run the setup.exe file located in [Unzip location]\TDC1000_7200EVM_Installerv??.zip\TDC1000_7200EVM_Installer\Installer\Volume.
4. Follow the pop-up screen instructions by clicking the Next button to install the software.
Figure 4-1. TDC1000-TDC7200EVM Installation Directory
5. When the installation is done, click Finish.
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Graphical User Interface (GUI)
12
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Chapter 5
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TDC1000-TDC7200EVM Setup and Operation
5.1
EVM Connections
1. Connect the USB cable (J2) from the EVM to the PC.
2. Obtain a test cell (see image below) with an attached transducer. Fill the test cell with water until it is
above the transducer. Description of this test cell can be found in Chapter 2.
3. Attach the transducer wires to the terminals TX1/RX2 (J5, pin 8) and GND (J5, pin 7) on the EVM
board (see Figure 5-1).
Figure 5-1. Transducer Connected to Channel 1 (TX1/RX2)
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Launching the Software
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Launching the Software
1. Run the TDC1000_TDC7200EVM GUI software by clicking on Start >> All Programs >> Texas
Instruments >> TDC1000_7200.
Figure 5-2. TDC1000_7200EVM Graph
2. The message at the bottom of Figure 5-2, "Read All No Errors", indicates that the GUI is up and
running and all the registers and hardware connection are correct; otherwise, refer to Chapter 6 to
troubleshoot.
3. Go to the GRAPH tab on the TDC1000-7200EVM GUI and click START GRAPH. The time of flight
(TOF) displays in the TDC AVG VALUE window (see Figure 5-3). Note: the default settings work
correctly for the test cell discussed in Chapter 2.
4. If the substance under test experiences any disturbance, either by impurities being added or by
shaking the container, the graph represents this as a change on TOF.
14
TDC1000-TDC7200EVM Setup and Operation
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Figure 5-3. Plot of TOF of Water in Test Cell
5. Follow these steps to verify the TOF of the GUI on the oscilloscope:
(a) In the GUI, click on the "TDC1000" tab, then click to enable "CONTINUOUS TRIGGER". Refer to
Figure 5-4. The message "Start Continuous Trigger successful!!" should appear at the bottom of the
GUI.
(b) Connect the oscilloscope to the following connector:
(i) START (J4)
(ii) STOP (J3)
(iii) COMP_IN (J7)
(c) If the signal on the oscilloscope is flickering, ensure that the "ENABLE POWER CYCLE" is disabled
on the DEBUG tab. Refer to Figure 5-5.
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Launching the Software
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Figure 5-4. EVM GUI - TDC1000 Tab
Figure 5-5. EVM GUI – Debug Tab
16
TDC1000-TDC7200EVM Setup and Operation
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Figure 5-6. TDC1000-TDC7200EVM Board Connected to Oscilloscope
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Figure 5-7. START and STOP Signals on Oscilloscope
6. Observe the START (yellow), STOP (Green), and COMP_IN (purple) signals on the oscilloscope and
measure the time difference between the rising edge of the START signal to the rising edge of the
STOP signal. Verify the time difference matches the TDC AVG VALUE on the GUI.
7. Find the width of the test cell with the following equations:
•
•
•
18
d: distance
t: time of flight (TOF)
v: speed of sound through the medium (water = 1484m/s at 20C.)
For example, the TOF of the test cell filled with water is 39.755 us, so d = (39.755us*1484 m/s) / 2
= 29.5 mm. The test cell is therefore 29.5 mm wide.
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Chapter 6
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Troubleshooting
6.1
Jumpers
Table 6-1. Jumpers
Jumpers
Description
JP1
Connects VDD_TDC7200 to V3p3
JP2
Connects AVCC1 to V3p3
JP3
Connects AVDD to VDD
JP4
Connects V3p3 to VIO
JP5
Trigger source selector: MPS430 trigger or TDC7200 trigger
JP6
Oscillator source selector: i.e. CPU clock or external oscillator
For default operation, place jumpers on the following:
1. JP1.P3 and JP1.P4 - OSC
2. JP2.P2 and JP2.P3 - TRIG-CPU
3. JP3.P1 and JP3.P2 - AVDD
4. JP4.P1 and JP4.P2 – VIO
5. JP5.P1 and JP5.P2 – TDC7200 trigger
6. JP6.P3 and JP6.P4 – on-board OSCILLATOR as the clock source
Figure 6-1. Jumpers
20
Troubleshooting
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LEDs
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6.2
LEDs
Figure 6-2. TDC1000-TDC7200EVM LEDs
1. The Power LED (D4) and Link (D2) are ON if the board is powered.
2. If the D4 and D2 are OFF, check the physical connection to the PC.
3. The LINK LED is ON if there is an established communication with the PC.
(a) If the LINK LED is blinking when the EVM is connected to the PC without the GUI running, then
the crystal oscillator has a fault.
(b) If the LINK LED is OFF, check the physical connection to the PC then verify if the correct firmware
has been downloaded if the jumpers have been connected correctly.
Note: The LINK LED blinks during graphing mode.
6.3
Driver Errors
If there is a driver error when running the GUI, check the Device Manager for COM port name
TDC1000_7200_EVM.
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Figure 6-3. Device Manager with COM Port Name
If you do not see TDC1000_7200_EVM and instead see MSP430-USB Example, complete the following
steps:
1. Open the Device Manager and find the MSP430-USB Example device.
2. Right-click and choose Update Driver Software.
3. Select Browse my Computer for driver installation. Navigate and select the folder containing the
TDC1000_7200_EVM_DRIVER.inf file.
4. Close the setup window when the installation is complete. The Device Manager should now display
TDC1000_7200_EVM followed by a COM port number. Take note of this number as it will be required
to connect to the board from the GUI.
22
Troubleshooting
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Chapter 7
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Firmware Upgrade
Note: This section is only necessary if the firmware needs to be changed. The TDC1000-TDC7200EVM
comes preloaded with firmware already.
To change the firmware, complete the following steps:
1. Connect the TDC1000-TDC7200EVM to a PC.
2. Open the TDC1000-7200EVM GUI then go to the DEBUG tab. Press OK if a connection error window
pops up. Click on the Update Firmware button.
Figure 7-1. Connection Error Pop-up Window
3. The MSP430 USB Firmware Upgrade windows pops up. Click Next to proceed on the first prompt;
read and accept the license agreement and click Next to continue.
24
Firmware Upgrade
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Figure 7-2. USB Firmware Upgrade Window
4. Disconnect and reconnect the LaunchPad to PC while holding down the BSL button.
5. Select the Select Firmware button and browse to the firmware file.
6. Click on the Upgrade Firmware button to program the EVM. Close the application when done and
restart the TDC1000_7200EVM GUI.
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Firmware Upgrade
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Chapter 8
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Board Layout
Figure 8-1. Top Overlay
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Figure 8-2. Top Solder Mask
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Board Layout
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Figure 8-3. Top Layer
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Figure 8-4. Mid Layer 1
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Figure 8-5. Mid Layer 2
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Figure 8-6. Bottom Layer
Figure 8-7. Bottom Solder Mask
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Figure 8-8. Board Dimensions
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Board Layout
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Board Layout
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2
4
6
8
10
J6
DNP
1
3
5
7
9
14
12
10
8
6
4
2
GPIO4
GPIO3
GPIO2
GPIO1
1
2
3
4
EP
IO5
IO6
IO7
IO8
9
GND
142-0701-201
J8
GND
JP3
1
2
V3p3
1
2
GND
VIO
R38
1.00k
RTD2
RTD1
GND
GND
GND
GND
GND
1
GND
OUT
GND
R50
51.1
0
R49
GND
2
JP6
5
3
1
R45 33
VCOM
STOP
START
TP9
DNP
OSC_SOURCE_SEL
6
4
2
R48
33
3 OSC_OUT
ExtClock
ASEMB-8.000MHZ-LY-T
8MHz
STANDBY
VDD
Y2
300pF
CPU_CLK_OUT
1
4
RX2
300pF
C43
capacitances onto RX1&RX2
C42
RX1
0.01µF
C28
SH-JP6
C41
0.1µF
C38
0.1µF
60 ohm
FB3
C40
0.01µF
60 ohm
FB2
C37
0.01µF
Place filter caps
to VDD pins
GND
VDD_TDC1000
C46
10µF
R36
10.0Meg
R35
10.0Meg
GND
TX1
TX2
SPI_MISO
SPI_MOSI
C41& 42 must be close to TDC1000 RX
SPI_SCLK
pins. Place minimal parasitic
TDC1000_SPI_CSB
SH-JP4 VIO
JP4
SH-JP3 VDD
GND
Place the ground TP
close to VDD jumper
JP
TP11
AVDD
R41
0
OSC_ENABLE
R42
0
EXT_OSC
0.1µF
0.01µF
GND
C45
C44
60 ohm
FB4
TDC1000_CHSEL
GPIO7
GPIO6
GPIO5
V3p3
GND
RTD1
RTD2
AVDD
TX1/RX2 or RX2
TX1/RX2 or TX1
TX2/RX1or RX1
TX2/RX1or TX2
GPIO7
GPIO6
TDC1000_CHSEL
USB_5V
5
6
7
8
TPD8E003DQDR
IO1
IO2
IO3
IO4
U11
PPPC052LJBN-RC
Pin 1 and pin 10 of the connector
must be marked on the PC board
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
GND
13
11
9
7
5
3
1
J5
Pin 1 and pin 14 of the connector
must be marked on the PC board
200
200
R32
START
R30
8
9
10
RTD1
RTD2
RREF
VDD
VDD
23
24
VIO
22
STOP
14
STOP
3
VCOM
13
START
SDO
SDI
SCLK
CSB
21
20
18
19
CLKIN
CLK
25
28
TX1
27
TX2
RX1
1
RX2
CLK
2
COMPIN
7
COMPIN
TP17
DNP
TDC1000_ENABLE
GND
DNP
DNP
TP14
DNP
TP13
GND
C34
0.1µF
TDC1000_RESET
TDC1000_CHSEL
TDC1000_ERRB
GND
C33
0.01µF
V3p3
START
C26
0.1µF
V3p3
C25
0.01µF
2
1
6
2
1
6
GND
NC
NC
Y1
Y0
GND
NC
NC
Y1
Y0
8
3
VCOM
GND
4
5
7
8
3
GND
4
5
7
COMPIN
CDCLVC1102PW
1G
CLKIN
VDD
U8
CDCLVC1102PW
1G
CLKIN
VDD
U7
TDC7200_TRIGGER
V3p3
V3p3
V3p3
V3p3
V5p0
10.0k
J3
DNP
5
3
4
V5p0
V5p0
V+
V-
GND
J4
DNP
GND
V5p0
V+
V-
GND
1
1
TP6
GND
142-0701-201
J7
GND
1
R46
50
TP10
GND
C31
1µF
CPU_CMP_OUT
COMPIN_OUT
10pF
C47
GND
TP16
TP18
C30
0.1µF
V5p0
GND
C29
0.1µF
VCOM_OUT
TP15
R39
50
DNP
BUFF_PGA
TP8
Buffered STOP and START tra ces
from the buffers to the connectors
must be completely symmetrical to
avoid introducing timing delay
GND
U9
LMH6601MG
1.00k
R37
10pF
C35
1
TP7
GND
1
TP5
U12
LMH6601MG
1.00k
R44
10pF
C39
5
3
4
142-0701-201
START_OUT
33
R33
TDC1000_MCU_START
10.0k
R47
142-0701-201
STOP_OUT
33
R29
TDC1000_MCU_STOP
R40
Component value = DNP means do not populate
SH-JP5
JP5
TRIGGER_SOURCE_SEL
MSP430_TRIGGER
TRIGGER_IN
R43
10.0k
V3p3
TP12
Interstage Passive Filters:
Configured for 1MHz
C32
51pF
C27
51pF
U10
TDC1000PW
C36
1000pF
GND
VCOM
1.00k
R34
5.36k
R31
5
PGAIN
4
LNAOUT
6
PGAOUT
EN
TRIGGER
RESET
CHSEL
ERRB
15
16
17
11
12
GND
26
STOP
6
2
Buffered STOP and START tra ces
from the buffers to the MCU must
be completely symmetrical to avoid
introducing timing delay
3
2
1
2
3
4
5
2
3
4
5
6
2
All the labels appearing on pin 2, 4, 6, 8, 10,
12 and 14 must be marked on the PC board
2
3
4
5
2
3
4
5
Directly connected STOP and START tra ces from
TDC71000 to TDC7200 must be completely
symmetrical and as short as possible to avoid
introducing timing delay
Chapter 9
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Schematic
Figure 9-1. TDC1000-TDC7200EVM Schematic 1
Schematic
35
VBUS
DM
DP
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GND
C19
0.1µF
6
1
2
GND
IO3
IO4
TPD4E004DRYR
VCC
IO1
IO2
U5
GND
V18
G
G
3
4
5
1
3
GND
C8
0.22µF
GND
33
33
1
R24
1.5k
GND
R28
1.2M
R22
R21
GND
GND
BSL
SW1
PUR
33
2
GND
1
2
3
4
5
USB
C20
220pF
VUSB
GND
1
2
J2
R26
33k
GND
C14
0.1µF
GND
GND
C12
0.1µF
53
54
VBUS
VUSB
AVCC1
DVCC1
DVCC2
VBUS
VUSB
V18
VCORE
PUR
PU.0/DP
PU.1/DM
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
VBUS
GND
C22
22µF
V5p0
GND
D4
Green
R19
1.0k
GND
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
D5
1SMB5922BT3G
7.5V
GND
C23
1µF
GND
1
4
3
65
49
14
56
16
39
64
59
60
61
62
63
1
2
3
4
5
6
7
8
41
42
43
44
45
46
47
48
26
27
28
29
30
31
32
33
GND
GND
VIN
3
GND
ON/OFF
IN
GND
CBYP
OUT
4
5
2
GND
6.8pF
C15
GND
D3
D2
GND
C9
2200pF
R14
33k
V3p3
261
R12
261
R9
C24
0.01µF
GND
LP2980IM5X-ADJ
VOUT
5
JTAG_RST
JTAG_TEST
JTAG_TDO
JTAG_TDI
JTAG_TMS
JTAG_TCK
ADJ
ON/OFF
U3
CPU_CMP
PEAK_DET
GPIO5
GPIO3
GPIO4
GPIO1
GPIO2
33.0
EN_EX_VDD
EX_VDD_FAULTB
R51
U6
LP2985AIM5-3.3/NOPB
1
C18
10µF
QFN PAD
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
RST/NMI/SBWTDIO
TEST/SBWTCK
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
744043220
L1
Board Power
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
U2
MSP430F5528IRGC
C13
0.1µF
11
15
40
55
17
51
50
52
V18
VCORE
PUR
DP
DM
9
10
57
58
12
13
34
35
36
37
38
18
19
20
21
22
23
24
25
Component value = DNP means do not populate
GND
0
V3p3
SH-JP2
JP2
R13
R11
DNP
CPU_SCLK
CPU_MOSI
OSC_ENABLE
GPIO6
33
CPU_CLK
C6
30pF
R7
R6
C11
0.22µF
VUSB
30pF
C10
0.47µF
VCORE
C7
ABMM-24.000MHZ-B2-T
24.000MHz
2
4
Y1
SPI_MOSI
SPI_MISO
SPI_SCLK
USB Physical Interface
GND
Place holes on the SPI
lines for probing
TDC1000_MCU_STOP
TDC1000_MCU_START
MSP430_TRIGGER
AFE SPI uses MCU
GPIO7
USCI_B0 SPI
MSP_TDC_INT
9
8
Schematic
6
7
36
2
STOP is connected to TA0.0, as this has quickest
responding ISR. In this way STOP pulses can be
closer together.
START is conne cted to TA0.1, which is slower.
This produces a delay to timestamp, but this can
be compensated.
TRIGGER is on TA0.2, used to reset counter so
there are no rollover issues.
C21
2.2µF
V3p3
C16
2.2µF
GND
R17
51.1k
GND
MEAS
GND
R18
102k
Radj
Orange
Green
LINK
TP4
V3p3
AVDD
MSP_TDC7200_EN
TDC1000_ENABLE
TDC1000_CHSEL
TDC1000_RESET
TDC1000_ERRB
CPU_CLK_OUT
TDC7200_SPI_CSB
TDC1000_SPI_CSB
0
GND
R23
100k
V5p0
0
R16
3
4
1
JTAG_TEST
R15
GND
R5
DNP
DNP
DNP
13
11
9
7
5
3
1
GND
ILIM
OUT
TPS2553DBV-1
EN
FAULT
IN
U4
TSW-107-07-G-D
14
12
10
8
6
4
2
6
2
5
GND
0
R27
GND
GND
R20
240k
JTAG_TCK
JTAG_TMS
JTAG_TDI
JTAG_TDO
CPU_CMP_OUT
USB_5V
Choose proper resistor
values to comply with
the MSP430 ADC input
requirements
R8
DNP
EN_EX_VDD
R25
1.0Meg
EX_VDD_FAULTB
V3p3
C17
1µF
GND
R10
DNP
JTAG_RST
GND
Place Cap as
close as possible DNPC5
to the MCU pin
DNPC4
D1
1N4148W-7-F
JTAG Programming Interface
J1
CPU_CMP
PEAK_DET
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Figure 9-2. TDC1000-TDC7200EVM Schematic 2
SNIU021A – October 2014 – Revised November 2015
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MSP_TDC_INT
R2
10.0k
V3p3
33
R1
1
8
11
9
10
12
SNIU021A – October 2014 – Revised November 2015
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Copyright © 2014–2015, Texas Instruments Incorporated
TDC7200PW
ENABLE
INT
CS
DOUT
DIN
SCLK
FLAG
U1
GND
C1
0.01µF
GND
TRIGG
START
STOP
CLOCK
VREG
VDD
GND
GND
7
2
3
4
5
13
14
C2
0.1µF
VDD_TDC7200
33
R3
60 ohm
FB1
SH-JP1
TDC7200_TRIGGER
START
STOP
V3p3
Component value = DNP means do not populate
DNP TP3
DNP TP20
DNP TP21
TDC7200_SPI_CSB
MSP_TDC7200_EN
DNP
TP2
SPI_MISO
SPI_MOSI
SPI_SCLK
DNP TP19
6
Place caps close
to the pin
GND
TP1 JP1
2
1
Place the TP close to the
TDC7200 Power JP
R4
DNP
CLK
CPU_CLK
GND
C3
1µF
Place cap close
to the pin
www.ti.com
Figure 9-3. TDC1000-TDC7200EVM Schematic 3
Schematic
37
www.ti.com
38
Schematic
SNIU021A – October 2014 – Revised November 2015
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Chapter 10
SNIU021A – October 2014 – Revised November 2015
Bill of Materials
Table 10-1. TDC1000-TDC7200EVM Bill of Materials
Designator
Description
!PCB1
Printed Circuit Board
C1, C24, C44
CAP, CERM, 0.01 uF,
25 V, +/-10%, X7R,
0603
C2, C26, C29, C30,
C34, C38, C41, C45
Value
Manufacturer
Part Number
Any
SV601098
0.01 uF
MuRata
GRM188R71E103KA01
D
CAP, CERM, 0.1 uF, 10
V, +/-10%, X5R, 0402
0.1 uF
TDK
C1005X5R1A104K
C3, C23, C31
CAP, CERM, 1 uF, 25
V, +/-10%, X7R, 0603
1 uF
MuRata
GRM188R71E105KA12
D
C6, C7
CAP, CERM, 30 pF, 100
V, +/-5%, C0G/NP0,
0603
30 pF
MuRata
GRM1885C2A300JA01
D
C8, C11
CAP, CERM, 0.22 uF,
25 V, +/-10%, X5R,
0603
0.22 uF
AVX
06033D224KAT2A
C9
CAP, CERM, 2200 pF,
50 V, +/-10%, X7R,
0603
2200 pF
Kemet
C0603X222K5RACTU
C10
CAP, CERM, 0.47 uF,
16 V, +/-10%, X7R,
0603
0.47 uF
MuRata
GRM188R71C474KA88
D
C12, C13, C14, C19
CAP, CERM, 0.1 uF,
100 V, +/-10%, X7R,
0603
0.1 uF
MuRata
GRM188R72A104KA35
D
C15
CAP, CERM, 6.8 pF, 50
V, +/-4%, C0G/NP0,
0603
6.8 pF
AVX
06035A6R8CAT2A
C16, C21
CAP, CERM, 2.2 uF, 16
V, +/-10%, X7R, 0805
2.2 uF
Kemet
C0805C225K4RACTU
C17
CAP, CERM, 1 uF, 16
V, +/-10%, X5R, 0805
1 uF
AVX
0805YD105KAT2A
C18, C46
CAP, CERM, 10 uF, 10
V, +/-10%, X5R, 0805
10 uF
Kemet
C0805C106K8PACTU
C20
CAP, CERM, 220 pF, 50
V, +/-1%, C0G/NP0,
0603
220 pF
AVX
06035A221FAT2A
C22
CAP, CERM, 22 uF, 16
V, +/-20%, X5R, 1206
22 uF
AVX
1206YD226MAT2A
C25, C33, C37, C40
CAP, CERM, 0.01 uF,
10 V, +/-10%, X5R,
0402
0.01 uF
MuRata
GRM155R61A103KA01
D
C27, C32
CAP, CERM, 51 pF, 100
V, +/-5%, C0G/NP0,
0603
51 pF
MuRata
GRM1885C2A510JA01
D
C28
CAP, CERM, 0.01 uF,
25 V, +/-5%, C0G/NP0,
0603
0.01 uF
TDK
C1608C0G1E103J
SNIU021A – October 2014 – Revised November 2015
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Bill of Materials
39
www.ti.com
Table 10-1. TDC1000-TDC7200EVM Bill of Materials (continued)
40
Designator
Description
Value
Manufacturer
Part Number
C35, C39, C47
CAP, CERM, 10 pF, 50
V, +/-5%, C0G/NP0,
0603
10 pF
AVX
06035A100JAT2A
C36
CAP, CERM, 1000 pF,
50 V, +/- 5%, C0G/NP0,
0603
1000 pF
TDK
C1608C0G1H102J
C42, C43
CAP, CERM, 300 pF, 50
V, +/-5%, C0G/NP0,
0603
300 pF
MuRata
GRM1885C1H301JA01
D
D2, D4
LED, Green, SMD
Green
Lite-On
LTST-C190GKT
D3
LED, Orange, SMD
Orange
Lite-On
LTST-C190KFKT
D5
Diode, Zener, 7.5 V, 550
mW, SMB
7.5 V
ON Semiconductor
1SMB5922BT3G
FB1, FB2, FB3, FB4
0.8A Ferrite Bead, 60
ohm @ 100MHz, SMD
60 ohm
Taiyo Yuden
BK1608HS600-T
H1, H2, H3, H4
Bumpon, Cylindrical,
0.312 X 0.200, Black
3M
SJ61A1
J2
MINI USB 2.0 SMT
TYPE AB 5 CONTACTS
R/A, SMD
Wurth Elektronik eiSos
651-305-142-821
J5
Receptacle, 7x2, 2.54
mm, R/A, TH
Samtec
SSW-107-02-G-D-RA
J8
Connector, TH, SMA
Emerson Network
Power
142-0701-201
JP1, JP2, JP3, JP4
Header, TH, 100mil,
2x1, Gold plated, 230
mil above insulator
Samtec
TSW-102-07-G-S
JP5
Header, TH, 100mil,
3x1, Gold plated, 230
mil above insulator
Samtec
TSW-103-07-G-S
JP6
Header, TH, 100mil,
3x2, Gold plated, 230
mil above insulator
Samtec
TSW-103-07-G-D
L1
Inductor, Shielded Drum
Core, Ferrite, 22 uH, 0.7
A, 0.155 ohm, SMD
Wurth Elektronik eiSos
744043220
LBL1
Thermal Transfer
Printable Labels, 0.650"
W x 0.200" H - 10,000
per roll
Brady
THT-14-423-10
R1, R3, R6, R7, R21,
R22, R29, R33, R45,
R48
RES, 33 ohm, 5%,
0.063W, 0402
33
Vishay-Dale
CRCW040233R0JNED
R2, R40, R43, R47
RES, 10.0k ohm, 1%,
0.1W, 0603
10.0k
Yageo America
RC0603FR-0710KL
R9, R12
RES, 261 ohm, 1%,
0.1W, 0603
261
Vishay-Dale
CRCW0603261RFKEA
R13, R15, R16, R27,
R41, R42, R49
RES, 0 ohm, 5%, 0.1W,
0603
0
Vishay-Dale
CRCW06030000Z0EA
R14, R26
RES, 33k ohm, 5%,
0.1W, 0603
33k
Vishay-Dale
CRCW060333K0JNEA
R17
RES, 51.1k ohm, 1%,
0.1W, 0603
51.1k
Vishay-Dale
CRCW060351K1FKEA
R18
RES, 102k ohm, 1%,
0.1W, 0603
102k
Vishay-Dale
CRCW0603102KFKEA
R19
RES, 1.0k ohm, 5%,
0.1W, 0603
1.0k
Vishay-Dale
CRCW06031K00JNEA
Bill of Materials
22 uH
SNIU021A – October 2014 – Revised November 2015
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Table 10-1. TDC1000-TDC7200EVM Bill of Materials (continued)
Designator
Description
Value
Manufacturer
Part Number
R20
RES, 240k ohm, 5%,
0.1W, 0603
240k
Vishay-Dale
CRCW0603240KJNEA
R23
RES, 100k ohm, 5%,
0.1W, 0603
100k
Vishay-Dale
CRCW0603100KJNEA
R24
RES, 1.5k ohm, 5%,
0.063W, 0402
1.5k
Vishay-Dale
CRCW04021K50JNED
R25
RES, 1.0Meg ohm, 5%,
0.1W, 0603
1.0 Meg
Vishay-Dale
CRCW06031M00JNEA
R28
RES, 1.2Meg ohm, 5%,
0.1W, 0603
1.2 M
Vishay-Dale
CRCW06031M20JNEA
R30, R32
RES, 200 ohm, 0.1%,
0.1W, 0603
200
Susumu Co Ltd
RG1608P-201-B-T5
R31
RES, 5.36k ohm, 1%,
0.1W, 0603
5.36k
Vishay-Dale
CRCW06035K36FKEA
R34, R37, R38, R44
RES, 1.00k ohm, 1%,
0.1W, 0603
1.00k
Vishay-Dale
CRCW06031K00FKEA
R35, R36
RES, 10.0Meg ohm, 1%,
0.1W, 0603
10.0 Meg
Vishay-Dale
CRCW060310M0FKEA
R39, R46
RES, 0 ohm, 5%, 0.1W,
0603
50
Vishay-Dale
CRCW06030000Z0EA
R50
RES, 51.1 ohm, 1%,
0.1W, 0603
51.1
Vishay-Dale
CRCW060351R1FKEA
R51
RES, 33.0 ohm, 1%,
0.1W, 0603
33.0
Vishay-Dale
CRCW060333R0FKEA
SH-JP1, SH-JP2, SHJP3, SH-JP4, SH-JP5,
SH-JP6
Shunt, 100mil, Gold
plated, Black
1x2
3M
969102-0000-DA
SW1
Switch, Tactile, SPSTNO, 0.05A, 12 V, TH
C&K Components
PTS635SL50LFS
TP1, TP6, TP8, TP11,
TP16, TP18
Test Point, TH,
Compact, Black
Black
Keystone
5006
TP5, TP7, TP10, TP15
Test Point, Miniature,
Red, TH
Red
Keystone
5000
U1
STOPWATCH IC FOR
TIME MEASUREMENT
BETWEEN TWO
EVENTS, PW0014A
Texas Instruments
TDC7200PW
U2
Mixed Signal
MicroController,
RGC0064B
Texas Instruments
MSP430F5528IRGC
U3
Micropower 50 mA Ultra
Low-Dropout Adjustable
Voltage Regulator, 5-pin
SOT-23
Texas Instruments
LP2980IM5X-ADJ
U4
PRECISION
ADJUSTABLE
CURRENT-LIMITED
POWERDISTRIBUTION
SWITCHES, DBV0006A
Texas Instruments
TPS2553DBV-1
U5
ESD-Protection Array for
High-Speed Data
Interfaces, 4 Channels, 40 to +85 degC, 6-pin
SON (DRY), Green
(RoHS & no Sb/Br)
Texas Instruments
TPD4E004DRYR
SNIU021A – October 2014 – Revised November 2015
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Bill of Materials
41
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Table 10-1. TDC1000-TDC7200EVM Bill of Materials (continued)
42
Designator
Description
Manufacturer
Part Number
U6
Micropower 150 mA
Low-Noise Ultra LowDropout Regulator, 5-pin
SOT-23, Pb-Free
Texas Instruments
LP2985AIM5-3.3/NOPB
U7, U8
3.3 V and 2.5 V
LVCMOS HighPerformance Clock
Buffer Family, PW0008A
Texas Instruments
CDCLVC1102PW
U9, U12
2.4V R-R Out CMOS
Video Op Amp with
Shutdown
Texas Instruments
LMH6601MG
U10
TDC1000 Precision AFE
for Time of Flight,
PW0028A
Texas Instruments
TDC1000PW
U11
ESD Array For Portable
Space-Saving
Applications, 8
Channels, -40 to +85
degC, 8-pin WSON
(DQD), Green (RoHS &
no Sb/Br)
Texas Instruments
TPD8E003DQDR
Y1
Crystal, 24.000 MHz, 18
pF, SMD
Abracon Corportation
ABMM-24.000MHZ-B2-T
Y2
OSC, 8 MHz, 1.8 - 3.3
V, SMD
Abracon Corportation
ASEMB-8.000MHZ-LY-T
C4, C5
CAP, CERM, 2200 pF,
50 V, +/-10%, X7R,
0603
2200 pF
Kemet
C0603X222K5RACTU
D1
Diode, Ultrafast, 100 V,
0.15 A, SOD-123
100 V
Diodes Inc.
1N4148W-7-F
FID1, FID2, FID3
Fiducial mark. There is
nothing to buy or mount.
N/A
N/A
J1
Header, TH, 100mil,
7x2, Gold plated, 230
mil above insulator
Samtec Inc.
TSW-107-07-G-D
J3, J4, J7
Connector, TH, SMA
Emerson Network
Power
142-0701-201
J6
Connector, Receptacle,
100mil, 5x2, Gold
plated, R/A, TH
Sullins Connector
Solutions
PPPC052LJBN-RC
R4, R11
RES, 0 ohm, 5%, 0.1W,
0603
0
Vishay-Dale
CRCW06030000Z0EA
R5, R8, R10
RES, 1.05k ohm, 1%,
0.1W, 0603
1.05k
Vishay-Dale
CRCW06031K05FKEA
Bill of Materials
Value
LMH6601MG
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Bill of Materials
43
Revision History
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Revision History
Changes from Original (October 2014) to A Revision .................................................................................................... Page
•
Added info about transducer that is now included in the EVM kit. .................................................................. 5
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
44
Revision History
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Copyright © 2014–2015, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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